Double-polishing machine carrier cleaning equipment and cleaning process thereof
阅读说明:本技术 一种双抛机载具清洗设备及其清洗工艺 (Double-polishing machine carrier cleaning equipment and cleaning process thereof ) 是由 祝斌 刘姣龙 裴坤羽 武卫 刘建伟 刘园 孙晨光 王彦君 由佰玲 常雪岩 杨春雪 于 2020-06-01 设计创作,主要内容包括:本发明提供一种双抛机载具清洗设备及其清洗工艺,至少具有用于清洗所述载具的清洗单元、用于承载并控制所述载具移动的升降单元、用于加速清洗的超声单元和用于控制所述清洗单元和所述升降单元运行的控制单元,其中,所述升降单元被置于所述清洗单元一侧并使所述载具被置入所述清洗单元或从所述清洗单元中被移出;所述超声单元分设于所述清洗单元内侧和外侧;所述清洗单元、所述升降单元和所述超声单元均与所述控制单元连接。本发明还提出一种双抛机载具清洗工艺。本发明可自动清洗双抛机载具表面形成SiO<Sub>2</Sub>结晶颗粒,不仅可提高半导体硅片抛光质量、提高使用寿命,清洗效果好且清洗效率高。(The invention provides a double-throwing machine carrier cleaning device and a cleaning process thereof, which at least comprise a cleaning unit for cleaning a carrier, a lifting unit for bearing and controlling the carrier to move, an ultrasonic unit for accelerating cleaning and a control unit for controlling the cleaning unit and the lifting unit to operate, wherein the lifting unit is arranged on a cleaning unitA side and allowing the carrier to be placed into or removed from the cleaning unit; the ultrasonic units are respectively arranged on the inner side and the outer side of the cleaning unit; the cleaning unit, the lifting unit and the ultrasonic unit are all connected with the control unit. The invention also provides a cleaning process for the double-polishing machine carrier. The invention can automatically clean the surface of the double-polishing machine carrier to form SiO 2 The crystal particles can improve the polishing quality of the semiconductor silicon wafer and prolong the service life, and have good cleaning effect and high cleaning efficiency.)
1. A cleaning device for a carrier of a double-throw machine is characterized by at least comprising a cleaning unit for cleaning the carrier, a lifting unit for bearing and controlling the carrier to move, an ultrasonic unit for accelerating cleaning and a control unit for controlling the operation of the cleaning unit and the lifting unit, wherein the lifting unit is arranged on one side of the cleaning unit and enables the carrier to be placed into or removed from the cleaning unit; the ultrasonic units are respectively arranged on the inner side and the outer side of the cleaning unit; the cleaning unit, the lifting unit and the ultrasonic unit are all connected with the control unit.
2. The carrier cleaning apparatus for a double-throw machine as claimed in claim 1, wherein the cleaning unit comprises a frame body and a cleaning tank arranged inside the frame body and provided with an opening at the upper end, and a fixing tool for fixing the carrier and suspending the carrier is arranged inside the cleaning tank.
3. The double-throw machine carrier cleaning equipment as claimed in claim 2, wherein one end of the fixing tool is capable of fixedly placing a plurality of carriers arranged in parallel, and the other end of the fixing tool is connected with the lifting unit.
4. The double-throw machine carrier cleaning device as claimed in claim 2 or 3, wherein the cleaning tank is provided with a tank cover adapted to an upper port thereof; the lower end of the cleaning tank is provided with a water outlet, and the bottom of the cleaning tank is an inclined plane which faces one side of the water outlet.
5. The double-throw machine carrier cleaning equipment as claimed in claim 4, wherein a plurality of heating rods are arranged at the bottom of the cleaning tank and used for heating the cleaning agent in the cleaning tank and keeping the temperature of the cleaning agent in the cleaning tank constant.
6. The cleaning device for the carrier of the double-throw machine as claimed in any one of claims 2 to 3 and 5, wherein the lifting unit comprises a slide rail, a lead screw arranged in parallel with the slide rail, a slide block matched with the lead screw and a driving motor for driving the slide block to move, the slide block is connected with the fixed tool, and the driving motor drives the slide block to drive the fixed tool carrying the carrier to move on the slide rail along the height direction of the slide rail; the control unit is arranged on one side of the frame body and is staggered with the lifting unit.
7. The double-throw machine carrier cleaning equipment as claimed in claim 6, wherein the ultrasonic unit is provided with an ultrasonic vibrating plate, an ultrasonic generator and an ultrasonic transducer, the ultrasonic vibrating plate is arranged on the inner wall of the cleaning tank which is oppositely arranged, and is arranged in parallel with the carrier; the ultrasonic generator is arranged on the outer side of the frame body; the ultrasonic transducers are symmetrically arranged on the ultrasonic vibrating plate and are all arranged towards the direction of the carrier; the ultrasonic vibration plate and the side wall of the cleaning tank are also provided with sealing strips, and the sealing strips are matched with the ultrasonic vibration plate in structure.
8. The double-polisher carrier cleaning apparatus as recited in claim 7 further comprising a liquid level control unit for controlling cleaning agent to enter and exit the cleaning tank, the liquid level control unit disposed in the cleaning tank near an upper port of the cleaning tank; the ultrasonic unit and the liquid level control unit are connected with the control unit.
9. A cleaning process for a carrier of a double-throw machine, which adopts the cleaning equipment as claimed in any one of claims 1 to 8, and is characterized by comprising the following steps: executing a plurality of carriers on the lifting unit; executing the lifting unit and placing the carrier in the cleaning unit within a set temperature for cleaning for a certain time; and after the cleaning is finished, the lifting unit is executed to take the carrier out of the cleaning unit.
10. The double-throw machine carrier cleaning process according to claim 9, wherein the cleaning temperature in the cleaning unit is 30-40 ℃; the cleaning time is 5-15 min.
Technical Field
The invention belongs to the technical field of polishing and cleaning of semiconductor silicon wafers, and particularly relates to a double-polishing-machine carrier cleaning device and a cleaning process thereof.
Background
With the development of semiconductor technology, semiconductor silicon wafers are gradually developed into large-sized and thin wafers, the size of a semiconductor reaches 280-320mm, and a special carrier is required to be placed for polishing the silicon wafers so that the silicon wafers can be polished on both sides in a polishing machine. In the polishing process of a semiconductor silicon wafer, a double polishing carrier for bearing the silicon wafer is one of important auxiliary devices for polishing the silicon wafer, and is mainly responsible for bearing and fixing the silicon wafer and directly related to whether the silicon wafer is polished or not. The polishing solution used by the double polishing machine mainly comprises SiO2、NH4The colloid formed by OH is easy to form SiO on the inner part of the double-polishing machine and the surface of a carrier of the double-polishing machine2Crystallization, which requires timely removal of these SiO2Crystallizing the particles; if SiO is formed on the surface of the carrier of the double polishing machine2Crystallization, during the rotary polishing process, the surface of the silicon wafer can be seriously scratched; while these SiO2The service life of the double-throwing machine carrier can be greatly shortened by the crystallized particles, and the production cost is improved.
Disclosure of Invention
The invention provides a cleaning device and a cleaning process for a double-polishing machine carrier, in particular to the cleaning of a bearing device for double-side polishing of a semiconductor silicon wafer, which solves the problem of how to automatically clean SiO formed on the surface of the double-polishing machine carrier2The technical problem of crystal particles can not only improve the polishing quality of the semiconductor silicon chip and prolong the service life, but also has good cleaning effect and high cleaning efficiency.
In order to solve the technical problems, the invention adopts the technical scheme that:
a cleaning device for a carrier of a double-throw machine at least comprises a cleaning unit for cleaning the carrier, a lifting unit for carrying and controlling the carrier to move, an ultrasonic unit for accelerating cleaning and a control unit for controlling the operation of the cleaning unit and the lifting unit, wherein the lifting unit is arranged at one side of the cleaning unit and enables the carrier to be placed into or removed from the cleaning unit; the ultrasonic units are respectively arranged on the inner side and the outer side of the cleaning unit; the cleaning unit, the lifting unit and the ultrasonic unit are all connected with the control unit.
Further, the cleaning unit includes the support body and arranges in the inboard washing tank that just upper end opening set up of support body the washing tank inboard is equipped with and is used for fixing the carrier makes the unsettled fixed frock that sets up of carrier.
Furthermore, a plurality of carriers arranged in parallel can be fixedly placed at one end of the fixing tool, and the other end of the fixing tool is connected with the lifting unit.
Furthermore, the cleaning tank is provided with a tank cover matched with the upper port of the cleaning tank; the lower end of the cleaning tank is provided with a water outlet, and the bottom of the cleaning tank is an inclined plane which faces one side of the water outlet.
Furthermore, a plurality of heating rods are arranged at the bottom of the cleaning tank and used for heating the cleaning agent in the cleaning tank and enabling the temperature of the cleaning agent in the cleaning tank to be constant.
Furthermore, the lifting unit is provided with a slide rail, a lead screw arranged in parallel with the slide rail, a slide block matched with the lead screw and a driving motor for driving the slide block to move, the slide block is connected with the fixed tool, and the driving motor drives the slide block to drive the fixed tool carrying the carrier to move on the slide rail and move along the height direction of the slide rail; the control unit is arranged on one side of the frame body and is staggered with the lifting unit.
Further, the ultrasonic unit is provided with an ultrasonic vibrating plate, an ultrasonic generator and an ultrasonic transducer, wherein the ultrasonic vibrating plate is arranged on the inner wall of the cleaning tank which is oppositely arranged and is arranged in parallel with the carrier; the ultrasonic generator is arranged on the outer side of the frame body; the ultrasonic transducers are symmetrically arranged on the ultrasonic vibrating plate and are all arranged towards the direction of the carrier; the ultrasonic vibration plate and the side wall of the cleaning tank are also provided with sealing strips, and the sealing strips are matched with the ultrasonic vibration plate in structure.
The cleaning device is characterized by further comprising a liquid level control unit for controlling the cleaning agent to enter and exit the cleaning tank, wherein the liquid level control unit is arranged in the cleaning tank and close to the upper port of the cleaning tank; the ultrasonic unit and the liquid level control unit are connected with the control unit.
A double-polishing machine carrier cleaning process adopts the cleaning equipment, and comprises the following steps: executing a plurality of carriers on the lifting unit; executing the lifting unit and placing the carrier in the cleaning unit within a set temperature for cleaning for a certain time; and after the cleaning is finished, the lifting unit is executed to take the carrier out of the cleaning unit.
Further, the cleaning temperature in the cleaning unit is 30-40 ℃; the cleaning time is 5-15 min.
Compared with the prior art, the cleaning equipment and the cleaning process thereof designed by the invention are suitable for cleaning various double-side polishing carriers with different specifications, and not only can completely clean SiO on the surfaces of the carriers2The crystal particles are completely removed, the cleaning is uniform, the organic matter protective coating on the surface of the carrier is not influenced, the cleaning effect is good, the service life of the carrier is prolonged, the quality of the polished semiconductor silicon wafer can be improved, the product percent of pass is improved, and the production cost is reduced; the structure can synchronously clean a plurality of carriers, has high cleaning efficiency, does not leak liquid and has high automation degree.
Drawings
Fig. 1 is a schematic structural diagram of a carrier of a double-throw machine according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention;
FIG. 3 is a side view of a cleaning apparatus according to an embodiment of the present invention;
FIG. 4 is a top view of a cleaning apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a fixing tool according to an embodiment of the present invention;
fig. 6 is a side view of a fixture according to an embodiment of the present invention.
In the figure:
100. carrier 110, body 120 and placing groove
130. A first liquid through hole 140, a second liquid through hole 150 and a round through hole
160.
220.
232.
250. A
280.
320.
400.
510. Ultrasonic
540. Sealing strip 600, liquid level control unit 610, liquid level controller
700. Operation table
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments.
In the present embodiment, as shown in fig. 1, a
Specifically, for
The first liquid through holes 130 are arranged close to the two adjacent placing grooves 120, the long inner corner edges of the first liquid through holes are located on the symmetrical diameters between the two adjacent placing grooves 120, namely the first liquid through holes 130 are symmetrically arranged relative to the axial diameter between the two adjacent placing grooves 120, the structure can ensure that the stress of the body 110 between the two adjacent placing grooves 120 is uniformly dispersed, so that the polishing stress of the body 110 to the silicon wafer in the polishing process is uniform, the deformation range of the silicon wafer is small, the quality of the silicon wafer is ensured, and the yield is improved. In view of the limitation of the structural space, and in order to disperse the stress concentration of the body 110 and eliminate the risk of non-uniform deformation, two second liquid through holes 140 with a triangular structure need to be arranged on two sides of the first liquid through hole 130, and the second liquid through holes 140 are symmetrically arranged relative to the long diagonal side of the first liquid through hole 130; preferably, the second liquid through hole 140 is an obtuse triangle, the shorter side of the obtuse triangle is arranged close to the first diamond liquid through hole 130, and the longer side of the obtuse triangle is arranged far away from the first diamond liquid through hole 130. The silicon wafer obtained by polishing the carrier has good surface quality, stable product quality, high production efficiency and high yield.
Furthermore, an obtuse angle of the first liquid through hole 130 and an obtuse angle of the second liquid through hole 140 are arranged in a mode of opposite vertex, and due to the fact that stress at the vertex angle is concentrated and cracks can occur along the vertex angle after vibration, a small circular through hole 150 needs to be arranged between the obtuse angles of the first liquid through hole 130 and the second liquid through hole 140 which are arranged in each group of through hole assemblies in an opposite vertex mode to be separated, so that deformation risks of the through hole assemblies are reduced, deformation resistance is improved, and two circular through holes 150 are further arranged in each group of through hole assemblies.
In order to further ensure the distribution uniformity of the polishing solution used during the double-sided polishing of the silicon wafer, a central hole 160 is also arranged at the center-common region of the three placing grooves 110, i.e. the center of the body 110, and the central hole 160 not only can be used as a liquid through hole, but also can reduce the stress concentration at the interconnection center of the placing grooves 120 and improve the stress uniformity thereof. Because the space of the interconnection center of the placing grooves 120 is limited, only the center hole 160 with an isosceles triangle structure needs to be arranged, and the center of gravity of the center hole 160 is overlapped with the center of the circle of the body 110, so that the polishing solution can be further ensured to flow at the connection position of the three placing grooves 120, namely, at the center of the circle of the body 110, the deformation at the center of the circle can be reduced to the maximum extent, and the stress at the center of the circle is uniform.
The present embodiment provides a cleaning apparatus for a double-throw machine carrier, as shown in fig. 2, fig. 3 and fig. 4, which is mainly used for cleaning the double-
Specifically, the
As shown in fig. 5 to 6, a plurality of
After the state of the cleaning apparatus is confirmed, the operator manually hangs the
Preferably, the
The
The upper section of the
The
The
Further, the ultrasonic wave emitted from the
The
The liquid level control unit 600 is configured to further protect the
A double-polishing machine carrier cleaning process adopts the cleaning equipment and comprises the following steps:
s1: the cleaning apparatus status is confirmed and a plurality of
Specifically, before each cleaning, it is necessary to confirm the state of the cleaning apparatus, refill the cleaning agent (industrial pure water), and confirm that the liquid level of the cleaning agent (industrial pure water) of the double-polisher carrier cleaning machine is not above the highest liquid level of the
S2: the lifting
Specifically, after the mounting is completed, the start button is pressed, and the
Furthermore, the cleaning agent can more easily dissolve SiO at a certain temperature2The crystal particles are removed, and the cleaning effect is better. However, considering that the surface of the double-
In the cleaning process, the higher the power density of the ultrasonic wave, the stronger the cavitation effect, the faster the speed, and the better the cleaning effect. However, considering that the long-term high power density cleaning will cause "cavitation" corrosion on the object surface and reduce the service life of the
In this embodiment, industrial pure water is used as the cleaning agent, and ultrasonic waves are used as the cleaning power, so as to ensure that the SiO on the surface of the
S3: after the cleaning is completed, the
Specifically, after cleaning, the
When the double-
Repeating the steps and then cleaning the next round.
The cleaning equipment and the cleaning process thereof designed by the invention are suitable for cleaning double-side polishing carriers with various specifications, and not only can completely clean SiO on the surfaces of the carriers2The crystal particles are completely removed, the cleaning is uniform, the organic matter protective coating on the surface of the carrier is not influenced, the cleaning effect is good, the service life of the carrier is prolonged, the quality of the polished semiconductor silicon wafer can be improved, the product percent of pass is improved, and the production cost is reduced; the structure can synchronously clean a plurality of carriers, has high cleaning efficiency, does not leak liquid and has high automation degree.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
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