阅读说明：本技术 用于检测激光射束的焦点位置的方法和设备 (Method and device for detecting the focal position of a laser beam ) 是由 D·布拉斯奎兹-桑切斯 N·韦肯曼 F·奥皮茨 G·施珀尔 于 2018-12-11 设计创作，主要内容包括：本发明涉及用于检测激光射束的焦点位置、尤其激光加工头(10)中的加工激光射束的焦点位置的方法和设备,所述设备具有：布置在朝向焦点(20)会聚的激光射束(12)中的光学元件(26),用于使至少一个背射(30)从激光射束路径中耦合输出；和传感器组件(36),用于在焦点(20)的区域中沿着所述激光射束的传播方向检测所述激光射束(12)的射束特性,所述传感器组件在沿着所述传播方向相对彼此偏移的至少两个位置处测量所述激光射束(12)的耦合输出的反射(30),用于确定当前的焦点位置。(The invention relates to a method and a device for detecting a focal position of a laser beam, in particular of a machining laser beam in a laser machining head (10), having: an optical element (26) arranged in the laser beam (12) converging toward the focal point (20) for coupling out at least one back reflection (30) from the laser beam path; and a sensor assembly (36) for detecting a beam characteristic of the laser beam (12) along a propagation direction of the laser beam in the region of the focal point (20), the sensor assembly measuring reflections (30) of the coupled-out of the laser beam (12) at least two positions offset relative to one another along the propagation direction for determining a current focal point position.)

1. An apparatus for detecting a focal position of a laser beam, in particular of a machining laser beam in a laser machining head (10), having:

-an optical element (26) arranged in the laser beam (12) converging towards the focal point (20) for coupling out at least one back reflection (30) from the laser beam path; and

-a sensor assembly (36) for detecting a beam characteristic of the laser beam (12) along a propagation direction of the laser beam in the region of the focal point (20), the sensor assembly measuring reflections (30) of the coupled-out of the laser beam (12) at least two positions offset relative to each other along the propagation direction for determining a current focal point position.

2. The apparatus according to claim 1, characterized in that the sensor assembly (36) has at least one spatially resolved detector (40).

3. The apparatus according to claim 2, characterized in that the spatially resolved detector (40) is arranged to be movable along a beam propagation direction (44) of the back-reflection (30).

4. The device according to claim 2, characterized in that the back reflection (30) coupled out from the laser beam path can be diverted onto the spatially resolved detector (40) by means of a deflection element (42) which is arranged so as to be movable along a beam propagation direction (44) of the back reflection (30).

5. The apparatus according to claim 2, characterized in that the spatially resolved detector (40) is arranged obliquely with respect to the beam propagation direction (44) of the back-reflection (30).

6. The apparatus according to claim 5, wherein the spatially resolved detector (40) is movable into a plurality of states which are tilted with respect to a beam propagation direction (44) of the back-reflection (30).

7. Device according to claim 1, characterized in that the sensor assembly (36) has a non-spatially resolved sensor or detector (40'), in particular a power detector, preferably a photodiode, the position of which can be varied in relation to the back-reflection (30) in the propagation direction (44) thereof in order to measure the intensity of the back-reflection (30) near the beam axis of the back-reflection at different positions.

8. Device according to claim 1, characterized in that one or more coupled-out back reflections (30) are subdivided by means of deflection units (60, 64) into a plurality of sub-back reflections (30.1, 30.2; 30.9) whose optical paths from the last face of the focusing optics (18) to the sensors or detectors (40, 40 ") of the sensor assembly differ from one another.

9. Device according to claim 8, characterized in that the deflecting element (60, 64) consists of one or more planar plates, so that by means of a plurality of faces it is possible to steer simultaneously a plurality of back-rays (30.n), each of which is associated with a position on the beam axis, onto the sensor or detector (40, 40 ") of the sensor assembly.

10. The apparatus according to claim 8 or 9, characterized in that the sensors or detectors (40, 40 ") of the sensor assembly (36) are spatially resolved sensors.

11. The device according to claim 10, characterized in that the spatially resolved sensor is a CCD, in particular a camera sensor or a line scan sensor, the orientation of which corresponds to the beam propagation direction of the one or more subdivided back-rays (30).

12. Device according to claim 1 or 2, characterized in that the outcoupled back-reflection (30) is subdivided into at least two sub-back-reflections by at least one beam splitter (46) and diverted onto at least two sensors or detectors (40.1, 40.2) of the sensor assembly (36).

13. Apparatus according to claim 1 or 2, characterized in that the sensor assembly (36) comprises a scattering medium (50) arranged along the optical axis (28') of the back reflection (30), wherein for observing the beam caustic, scattered light emitted by the back reflection (30) can be imaged onto a detector (54) by means of imaging optics (52).

14. Method for detecting a focal position of a laser beam, in particular of a machining laser beam in a laser machining head (10), having the following steps:

-coupling out at least one back reflection (30) from the laser beam path by means of an optical element (26) arranged in the laser beam (12) converging towards the focal point (20);

-detecting a beam characteristic of the laser beam (12) along a propagation direction of the laser beam in the region of the focal point (20) by means of a sensor assembly (36); and

-measuring back reflection (30) of the coupled-out of the laser beam (12) at least two positions offset with respect to each other along the propagation direction for determining a current focus position.

15. Method according to claim 14, characterized in that the intensity of the back-reflection (30) in the vicinity of the beam axis of the back-reflection is measured at different positions as a beam characteristic of the laser beam (12) by means of a non-spatially resolved sensor or detector (40') of the sensor assembly (36), the position of which can be varied relative to the back-reflection in the propagation direction (44) of the back-reflection (30).

16. The method according to claim 14, characterized in that a beam diameter of the back-reflection (30) is detected as a beam characteristic of the laser beam (12).

17. A method according to claim 16, characterized by moving a spatially resolved detector (40) into a plurality of states tilted with respect to a beam propagation direction (44) of the back-reflection (30) in order to detect the diameter of the back-reflected beam at a plurality of positions shifted with respect to each other along the propagation direction.

18. Method according to claim 14, 15 or 16, characterized in that the coupled-out back-reflection (30) is subdivided by means of a deflection unit (60, 64) into a plurality of sub-back-reflections (30.1, 30.2; 30.9) whose optical paths from the last face of the focusing optics (18) to the sensor or detector (40, 40 ") of the sensor assembly (36) differ from one another, so that each of the plurality of back-reflections (30.n) is associated with a position on the beam axis.

19. The method according to claim 14, characterized in that the back-reflection (30) guides the back-reflection (30) through a scattering medium (50) of the sensor assembly (36) and, as a beam characteristic of the laser beam (12), scattered light emitted by the back-reflection (30) is imaged by means of imaging optics (52) onto a detector (54) for observing a beam caustic.

Technical Field

The invention relates to a method and a device for detecting the focal position of a laser beam, in particular of a machining laser beam in a laser machining head. The method and the device are used for monitoring and adjusting the focal position in the laser processing head during the processing of laser material.

Background

One problem in the processing of laser materials is the so-called "thermal lens" (thermally induced refractive power change), which is attributed to the heating of the optical elements for laser beam guidance and focusing by the laser power, in particular in the region of several kw, and to the temperature dependence of the refractive index of the optical glass. The thermal lens causes a focal point shift along the beam propagation direction during the processing of the laser material, which has a negative effect during the processing of the workpiece. Therefore, in order to ensure the processing quality, it is desirable to control the focal position by measuring the focal position. Therefore, there is a need to detect the respective focus position and compensate for the focus position movement, i.e. to provide a fast and accurate focus position adjustment.

Different methods and devices are known for determining the focal position of a laser beam. The problem is to integrate these methods and devices into the laser processing head in order to ensure accurate focus position measurements in real time during the laser material processing process.

The international standard ISO11146 specifies a method for measuring laser radiation, in particular a test method for laser radiation parameters. In this case, it is shown, inter alia, how beam specifications, such as beam width (diameter), divergence angle, beam propagation coefficient, diffraction index and beam quality, are measured. In order to determine the focal position, i.e. the position of the minimum diameter of the beam, the beam diameter is determined at least ten positions along the beam path. The change in beam diameter is mathematically described by a so-called beam caustic (Strahlkaustik) depending on the beam propagation direction. The focal point position and all other laser beam parameters are determined by matching the measured beam diameter to the beam caustic.

Current prior art integrates focus position adjustment into a laser material processing head in order to track the focus position in real time during laser material processing.

In order to be able to compensate for the fluctuation in the focal position due to the thermal lens, as described in JP 2000094173 a, the scale (Ausma β) of the thermal lens during processing the workpiece is detected by measuring the temperature of the lens with a temperature sensor. The control device then drives the drive motor in such a way that the lens is moved in the beam propagation direction in such a way that the focal point position is correctly oriented relative to the workpiece to be machined.

According to DE 102015106618B 4, the focal position is adjusted on the basis of the laser power using a corresponding characteristic curve which describes the focal point movement in relation to the laser power.

With such methods and devices, which enable adjustment of the focal position without measuring the actual focal position, although improvements in the machining quality can be achieved with little constructional technical expenditure, high accuracy in the adjustment of the focal position cannot be achieved, and consequently machining quality meeting extremely high quality requirements cannot be achieved.

DE 102011054941B 3 describes a device for correcting thermally induced focal position shifts. The device is equipped with a sensor for determining a current focal position of the laser beam, a calculation unit for comparing the current focal position with a target focal position and for outputting correction data to a correction unit, which varies at least one optical element as a function of the correction data for adjusting the focal position. For this purpose, the back reflection (rickreflex) of the laser beam on the cover glass is imaged by means of a focusing lens and an objective for the laser beam onto a sensor, which is arranged at the focal position. Here, the return imaging (rickabbilung) is accompanied by partly significant imaging errors due to the focusing lens, which adversely affect the accuracy of the measurement and thus the focus position adjustment.

DE 102011007176 a1 describes a device for focusing a laser beam on a workpiece, comprising at least one transmissive optical element, which is arranged at an oblique angle with respect to a plane perpendicular to the beam axis of the laser beam, and a spatially resolved detector for detecting the laser radiation reflected back at the transmissive optical element. The image evaluation device determines the size or diameter of the reflected laser radiation on the detector from the image detected by the detector, for example a CCD chip, from which the focal position can be determined in turn for focal position adjustment.

The focal position is determined here with a large construction technical outlay. For this purpose, a small portion of the laser beam to be measured is coupled out and evaluated by the sensor unit at the position of the focal point and perpendicular to the beam propagation direction. If a change in the focal position occurs in such a device due to the thermal lens, the focal position sensor detects the change in the beam diameter. The calculation unit of the sensor unit, which is connected downstream of the focal point position sensor, then determines the actual focal point position by comparing the measured beam diameter with the known defocus area of the laser beam, which is determined by reference measurements. Thermal lenses not only cause the focal point to move, but also cause the beam quality to deteriorate due to imaging errors. This leads to a change in the overall beam caustic, i.e. also in the focal diameter. Therefore, finding the focus position by comparison with a reference value is not very accurate.

DE 19630607C 1 describes a device for monitoring the energy of a laser beam. A portion is coupled out of the laser beam and directed toward the detector through a window that is tilted with respect to the laser beam axis. The detector is arranged in an imaging plane of an optical device that images the laser beam onto the substrate, which imaging plane corresponds to the surface of the substrate.

Furthermore, DE 102010039633 a1 discloses a device for determining the focal position of a focused laser beam for laser material machining along a laser beam axis, which device comprises: a selection device having a selection element arranged spaced apart from the laser beam axis for selecting a sub-beam of the focused laser beam which extends at an angle to the laser beam axis; a detection device having a sensor element arranged in the beam path of the selected sub-beam spaced apart from the laser beam axis for detecting the intensity of the selected sub-beam; and an evaluation device for determining the focal position of the laser beam. In this case, the device detects the maximum intensity of the selected partial beam when the focal position of the laser beam coincides with a reference focal position of the device. Therefore, only a small geometric portion of the laser beam, i.e. the edge beam, is used here for the focal position measurement.

The thermal lens is caused by a thermal gradient along the radial direction of the optical component. Due to the radial laser power distribution, the temperature and therefore the refractive index change is significantly stronger at the center of the optics than at the edges. If only a small portion of the laser beam is measured, information about the thermal lens is lost and the effect of the thermal lens on the focus position cannot be accurately ascertained. Spherical aberration is expected in the case of very pronounced thermal lenses. Thus, the edge beam and the beam near the axis do not meet at the same focal point due to the different temperatures at the edge and the center of the optical assembly. Furthermore, the power component of the edge beam is smaller than the power component of the beam near the axis. Therefore, if the focal position is obtained using only the information of the edge beam, only low measurement accuracy can be expected.

US 8,988,673B 2 describes an apparatus for characterizing a laser beam using a measurement of scattered light of the laser beam. The system uses rayleigh scattering from a laser beam extending through the surrounding ambient air, so that no special scattering cavity or liquid is required for the measurement. Using special eliminationAn algorithm or filter to distinguish scattered light from dust particles.

Disclosure of Invention

Starting from this, the object underlying the invention is to provide a method and a device for the exact detection of the focal position of a laser beam, in particular of a machining laser beam in real time during the machining of a laser material, which can be integrated into a laser machining head in a constructively compact manner, in order to thus be able to achieve a precise adjustment of the focal position during the machining process.

This object is achieved by a device according to claim 1 and a method according to claim 14. Advantageous embodiments of the invention are specified in the respective dependent claims.

According to the invention, a device for detecting the focal position of a laser beam, in particular of a machining laser beam in a laser machining head, comprises: an optical element arranged in the laser beam converging towards the focal point for coupling out at least one back reflection from the laser beam path; and a sensor assembly for detecting a beam characteristic of the laser beam along a propagation direction of the laser beam in the region of the focal point, the sensor assembly measuring reflections of the coupled-out of the laser beam at least two positions offset relative to one another along the propagation direction for determining a current focal point position. In order to determine the focal position of the working laser beam precisely in real time during the laser machining process, in a first step, the partial beams of the working laser beam are coupled out of the laser beam path, so that imaging errors and thermal effects on the coupled-out partial beams or back-reflection can be ignored. In a second step, the focal position of the partial beam and thus also of the working laser beam is determined by evaluating the beam characteristics measured along the beam propagation direction by means of a sensor or a detector, wherein the entire beam, i.e. the working laser beam over the entire cross section of the working laser beam, is used for determining the focal position.

In a preferred embodiment, the sensor arrangement has at least one spatially resolved detector, which is preferably arranged so as to be movable along the propagation direction of the back-reflected beam. In this way, back reflection and thus the machining laser beam represented by it can be measured at a plurality of positions, so that not only focus position control and correction can be performed in real time, but also beam diagnosis can be performed according to ISO 11146. This means that no additional laboratory measuring devices are required for the output control.

In an alternative embodiment of the invention, it is provided that the coupling-out of the laser beam path can be deflected by means of a deflection element onto a spatially resolved detector, which is arranged so as to be movable along the beam propagation direction of the coupling-out. This enables a shorter displacement path to be achieved with the same measuring range.

A further embodiment of the invention is characterized in that the spatially resolved detector is arranged at an angle to the back-projected beam propagation direction, wherein, in order to increase the possible measurement points along the beam propagation direction, the spatially resolved detector can advantageously be moved into a plurality of states at an angle to the back-projected beam propagation direction.

In a further embodiment of the invention, which makes it possible to evaluate the measurement data in a particularly simple manner, it is provided that the sensor arrangement has a non-spatially resolved sensor or detector, in particular a power detector, preferably a photodiode, whose position can be varied in the propagation direction of the back reflection 30 relative to said back reflection in order to measure the intensity of the back reflection in the vicinity of its beam axis at different positions.

In order to be able to mechanically and simply insert the device for detecting the focal position into the laser processing head, it is expedient to subdivide the coupled-out back radiation into a plurality of partial back radiation by means of the deflection unit, the optical paths of which from the last side of the focusing optics to the sensor or detector of the sensor arrangement differ from one another. The deflection element can be composed of one or more planar plates, so that, by means of a plurality of surfaces, a plurality of back reflections, each of which is associated with a position on the beam axis, can be simultaneously deflected onto the sensor or detector of the sensor arrangement.

In a suitable manner, the sensor or detector of the sensor arrangement is also a spatially resolved sensor here, which is a CCD, in particular a camera sensor or a line scan sensor (Zeilensensor), the orientation of which corresponds to the subdivided back-reflected beam propagation direction.

In a further embodiment of the invention, it is provided that the coupled-out back reflection is subdivided by at least one beam splitter into at least two partial back reflections and is diverted onto at least two sensors or detectors of the sensor arrangement.

Alternatively, it can also be provided that the sensor arrangement comprises a scattering medium arranged along the optical axis of the back-reflection, wherein the scattered light emitted by the back-reflection can be imaged onto the detector by means of the imaging optics for the purpose of observing the beam caustic.

The method according to the invention for detecting the focal position of a laser beam, in particular of a machining laser beam in a laser machining head, is characterized by the following steps: coupling out at least one back reflection from the laser beam path by means of an optical element arranged in the laser beam converging toward the focal point; detecting, by means of a sensor assembly, a beam characteristic of the laser beam along a propagation direction of the laser beam in a focal region; and measuring back reflection of the coupled-out of the laser beam at least two locations offset from each other along the propagation direction for determining the current focus position.

In this case, the intensity of the back reflection near its beam axis, its beam diameter or scattered light emitted by it is detected and measured as a beam characteristic of the laser beam for observing the beam caustic.

In order to detect or measure the diameter of the back-reflected beam at a plurality of positions offset from one another along the propagation direction of the back-reflected beam, it is provided in one embodiment of the invention that the spatially resolved detector is moved into a plurality of states inclined with respect to the propagation direction of the back-reflected beam.

In order to be able to detect and/or measure beam characteristics simultaneously at a plurality of positions along the beam propagation direction, it is provided in a purposeful manner that the coupled-out back reflection is subdivided by means of the deflection unit into a plurality of partial back reflections, the optical paths of which from the last face of the focusing optics to the sensor or detector of the sensor assembly differ from one another, so that each of the plurality of back reflections is associated with a different position on the beam axis.

Drawings

The invention is explained in detail below, for example, on the basis of the figures. In the drawings:

fig. 1 shows a simplified schematic illustration of a laser processing head with a device according to the invention for detecting a focal position of a processing laser beam in the laser processing head during processing of a laser material;

fig. 2 shows a simplified diagram of beam guidance optics of a laser processing head with a schematic illustration of a sensor assembly for focus position control or measurement;

FIG. 3 shows a schematic view of the beam directing optics according to FIG. 2 with a sensor assembly for focal position control according to a configuration of the present invention;

FIG. 4 shows the course of the laser beam caustic in the region of the laser focus;

fig. 5 to 7 each show a schematic illustration of a beam-guiding optics according to fig. 2 with a differently configured sensor arrangement for focal position control according to the invention;

fig. 8 shows a schematic illustration of the beam guidance optics according to fig. 2 with a sensor arrangement according to a further embodiment of the invention, the spatially resolved sensors of which are arranged at a defined angle α with respect to the beam propagation direction;

FIGS. 9a and 9b each show a schematic cross section of a laser beam caustic for illustrating the oblique arrangement of the spatially resolved sensor according to FIG. 8;

fig. 9c shows a schematic diagram of a sensor plane of the spatially resolved sensor according to fig. 8;

FIG. 10 shows a schematic cross-section similar to FIG. 9a of a laser beam caustic for illustrating measurement of the beam caustic at a defined tilt angle for detecting a plurality of beam diameters along a beam propagation direction; and

fig. 11 to 13 each show a schematic illustration of a beam guidance optics according to fig. 2 with a sensor arrangement for focal position control according to a further embodiment of the invention.

In the several figures of the drawing, elements corresponding to each other are provided with the same reference numerals.

Detailed Description

Fig. 1 schematically shows a laser processing head 10, by means of which a processing laser beam 12 is guided. The machining laser is supplied to the laser machining head 10, for example, via an optical fiber 14. The machining laser beam 12 emerging from the optical fiber 14 is collimated by the first optics 16 and focused by the focusing optics 18 to a laser focus 20 on a workpiece 22. Between the focusing optics 18 and the beam nozzle 24, there is usually arranged a protective glass 26, by means of which the focused machining laser beam 12 is focused onto the workpiece 22, which should protect the interior of the laser machining head 10 and in particular the focusing optics 18 from contamination, which may be caused, for example, by splashes or smoke.

The first optics 16 and the focusing optics 18 are shown as a single lens, but can also be a lens group in a known manner. The first optical element 16 may in particular be formed by a movable lens of a zoom system, which collimates the machining laser beam 12.

In order to couple one or more back-reflections 30 for focal position measurement or control out of the machining laser beam path, the cover glass 26 is tilted relative to the optical axis 28 of the beam-guiding optics such that the angle between the optical axis 28 and the refractive and reflective surfaces 32, 34 of the cover glass 26 differs from 90 °. As schematically shown in fig. 1, the back-reflection 30 is diverted onto the sensor assembly 36. As explained in greater detail below in accordance with various configurations of the present invention, the sensor assembly 36 may have spatially resolved sensors or non-spatially resolved sensors.

As is schematically shown in fig. 2, for beam measurement, at least one back reflection from an optical element of the beam guidance optics, for example a back reflection 30 from the last transparent optical surface, is coupled out of the working laser beam path before the laser machining process. For this purpose, the last cover glass 26 is arranged, for example, obliquely to the optical axis. However, further optical elements (not shown here) arranged in the path of the converging working laser beam can also be used for coupling out of the back reflection 30. The cover glass 26 with increased thickness is used in an advantageous manner in order to separate the two back-reflections 30 indicated in fig. 1 from both sides of the cover glass 26. The back reflection 30 of the coupling-out from the last transparent optical surface is preferably measured by means of a sensor assembly 36. Thus, beam measurements are made separately from the machining laser beam path.

In order to determine the position of the laser focal point 20 in real time, the beam behavior of the machining laser beam 12 is evaluated along the beam propagation direction by means of the sensor arrangement 36, wherein the back reflection 30 corresponds to the entire laser beam.

The first possibility is to find the beam caustic. This has the advantage that all possible changes of the machining laser beam caused by the thermal lens can be monitored. A second possibility is to determine the maximum laser intensity along the beam propagation direction. In this case, monitoring of other beam characteristics is dispensed with, but the focal position can still be detected in real time.

For setting the focal position and for correcting the focal position, at least one imaging optical element of the beam directing optics (i.e. in the example shown the first optics 16 and/or the focusing optics 18) is arranged movably in the direction of its optical axis 28, so that a suitable adjustment drive (not shown) can move said imaging optical element for focal position correction. For focus Position correction based on the detected focus Position movement, the output signal of the sensor assembly 36 is supplied to an evaluation circuit (not shown), which determines the current focus Position (Position) or Position (Lage) from the output signal of the sensor assembly 36 and outputs an adjustment signal for adjusting the drive, so that at least one optical element, for example the first optics 16, is moved accordingly.

The back reflection 30 coupled out of the machining laser beam 12 is diverted into a measuring region 38 of a sensor or detector 40 of the sensor arrangement 36, in which the laser power no longer has a measurable thermal influence. Here, a deflection mirror 42 can be provided, for example, as shown in fig. 2. In order to determine the focal point position in real time, a sensor or detector 40 measures a characteristic of the machining laser beam along a beam propagation direction 44 of the machining laser beam. In particular, beam characteristics are measured in at least two different planes A, B perpendicular to the beam propagation direction 44.

As shown in fig. 3, for example, the last optical element from the beam guidance optics, i.e. the two back reflections 30.1, 30.2 from the cover glass 26, is used before the laser process for measuring the focal point position, in order to measure the machining laser beam at a plurality of positions along the beam propagation direction 44 and to deflect it onto a spatially resolved sensor or detector 40 by means of a further transparent optical element (deflection element 60). Any sensor with which the diameter of the laser beam impinging on the sensor, i.e. the laser back-reflection, can be determined for beam measurement can be used as the spatially resolving sensor or detector 40. Expediently, however, a camera is used as the spatially resolved sensor or detector 40, the sensor surface of which is formed, for example, by a CCD sensor.

Plane-parallel plates may be provided as the deflecting elements 60. However, it is also possible to use wedge plates as deflection elements 60, cover glass 26 or as further deflection elements in order to separate the individual sub-back irradiation points or regions on the spatially resolved sensor 40, i.e. on its sensor surface, from one another. Furthermore, the rear surface of the deflection element 60 can also be mirrored in order to avoid a corresponding back-reflected light loss. In this case, it is also conceivable for the front surface of the deflection element 60 to be provided with a coating, so that the intensity of the two incident back reflections 30.1 and 30.2 is distributed uniformly over the respective sub-back reflections.

By means of the multiple back reflections produced in this way, the machining laser beam, in particular the beam diameter thereof, can thus be measured at a plurality of positions in the region of the focal point, since the optical path of the light from the last surface of the focusing optics 18 to the spatially resolved sensor surface of the sensor or detector 40 is different for each of the back reflections, i.e. is partially shorter or partially longer than the nominal focal length, which determines the focal point position.

As shown in FIG. 3, four back-rays formed by two back-rays 30 from the cover glass 26 by multiple reflections at the deflecting element 60 impinge at locations 1, k-2, k-1 and k. The beam diameters determined by the spatially resolved sensor 40 at these regions of its sensor surface are schematically illustrated in fig. 4. Thus, it is shown that the beam diameter in front of the focal spot 20 is detected at regions 1 and k-2, while the beam diameter at the site behind the focal spot 20 is detected at regions k-1 and k. By measuring a plurality of beam diameters in the region of the target focal point 20 along the beam propagation direction, the beam caustic 62 can be approximated in order to then determine the actual focal position of the machining laser beam 12 from this beam caustic 62.

As shown in fig. 5, the back-reflection 30 to be measured is subdivided into (at least) two beams with (at least one) beam splitter 46 and the (at least) two beams are steered onto (at least) two associated spatially resolved sensors or detectors 40.1 and 40.2 of the sensor assembly 36 for measuring beam characteristics at (at least) two locations along the beam propagation direction 44. The detectors 40.1 and 40.2 are positioned perpendicular to the beam propagation direction 44. The detectors 40.1 and 40.2 can measure (at least) two beam diameters along the beam propagation direction in order to determine the beam caustic and the focal position from the beam caustic for focal position correction.

As indicated in fig. 6 by the double arrow 48, the spatially resolving sensor or detector 40 is arranged perpendicular to the beam propagation direction 44 and can be moved along the beam propagation direction. Thus, the detector 40 may measure the beam diameter of the back-reflection 30 at a plurality of locations in the region of the focal spot 20' of the back-reflection 30 along the beam propagation direction 44. The focal point 20' of the back-reflection 30 corresponds to the focal point 20 of the machining laser beam 12. Thus, by measuring the back reflection 30 in the region of the focal point 20' of the back reflection, the beam defocusing area of the machining laser beam 12 can be detected and evaluated for determining and correcting the focal point position.

According to fig. 7, in a further embodiment of the invention, the spatially resolved sensor or detector 14 is not movable, but the deflecting mirror 42 is movable, as indicated by the double arrow 48'. In contrast to the configuration according to fig. 6, a larger detector area is required, but a smaller displacement path is produced for the deflection mirror 42, since a displacement of the deflection mirror 42 essentially results in a double relative displacement of the sensor or detector 14 along the back reflection 30 in the beam propagation direction 44. This results in a more compact design.

Fig. 8 shows a further embodiment of the invention, in which a spatially resolved sensor or detector 40 is arranged at a defined angle α with respect to the beam propagation direction.

Fig. 9a shows a section perpendicular to the sensor or camera plane 41 of the back reflection 30, which is shown as a beam caustic, which corresponds to the machining laser beam 12, while fig. 9b, together with a top view of the sensor or camera plane 41 of the tilted spatially resolved sensor or detector 40, shows a section of the beam caustic 62, which extends parallel to the longitudinal extent of the sensor or camera plane 41 in the propagation direction 44 of the machining laser beam 12. Fig. 9c shows an elliptical image of the measured beam on the sensor or camera plane 41.

To this end, taking into account the angle α between the spatially resolved sensor or detector 40 and the beam axis 12', the distance AB in the elliptical image of the measured beam and the distances OC and OD. along the major axis of the ellipse are evaluated when the line segment AB in the elliptical image of the measured beam directly corresponds to the beam diameter at the center O of the sensor or detector plane 41, from the line segments OC and OD, the beam diameter existing at a position offset axially along the beam axis relative to the center O can be calculated₁OD sin α, and the diameter d is calculated as d 2 r₁Wherein r is₁＝OD*cosα。

Another possibility is to twist or tilt the spatially resolved sensor or detector 40 by a defined angle α, respectively_jSpatially resolved sensor and angle α corresponding to distance OD or OC_jCorrelatively measuring line segments s_j1And s_j2. On the basis of this, the respective beam radius and thus the beam diameter are determined as a function of the z position. At least (2 × j +1) different planes of the beam caustic are thus obtained along the beam propagation direction at j different angles, in which planes the beam diameter d can be measured for approximating the beam caustic 62.

The arrangement of the sensor or detector plane 41 at three different angles is schematically shown in fig. 10. Thus, seven different positions z in the z-direction along the beam axis 12_j1、z_j2Giving 7 different beam diameters d. Diameter d_j1、d_j2And position z_j1、z_j2Can be calculated in the following way:

d_j1＝2*r_j1wherein r is_j1＝s_j1*cosα_j

z_j1＝s_j1*sinα_j。

As shown in fig. 11, a non-spatially resolved sensor or detector 40', in particular a power detector, for example a photodiode, is used, which is arranged movably in the propagation direction 44 of the back-reflection 30 in order to measure the intensity of the back-reflection 30 in the vicinity of its beam axis. The free opening of the sensor cannot be larger than the beam diameter d at the focal point 20'. With this arrangement, the intensity or power measured at the sensor reaches a maximum at the focal point 20'. By moving the sensor or detector 40' along the optical axis, the intensity or power distribution along the propagation direction 44 shown in the graph of fig. 11 can be measured, from which the focus position can then be found corresponding to the maximum of the distribution.

As shown in fig. 12, a line scan sensor 40 ″ is used as a sensor or detector for measuring the power in the back reflection 30, to which a plurality of back reflections 30.n emitted by the deflection element 64 are delivered. The deflection element 64 is composed of a plurality of stacked planar plates, for example, so that a plurality of back reflections 30.n, each of which can be associated with a position on the beam axis, can be provided simultaneously by means of a plurality of surfaces. The linear power distribution on the line scan sensor 40 ″ is in this case correlated with the power density distribution along the optical axis 28 (the maximum of which corresponds to the focal position) and can therefore be used to determine and correct the focal position.

Fig. 13 shows a further embodiment of the invention, in which the back reflection 30 is deflected through a scattering medium 50 arranged along its optical axis 28 ' in such a way that its focal point 20 ' lies in the region of the scattering medium 50 and the beam focal plane can be observed in the region of the focal point 20 ' for finding and correcting the focal point position. The beam caustic is observed here by means of imaging optics 52, which image the scattered light emitted by the backlight 30 onto a detector 54.

The detector 54 can be a spatially resolved sensor, for example a CCD, which captures a beam focal plane from which the focal position can be determined. However, it is also conceivable to determine the focal point position using a line scan sensor for measuring the scattered light power, which detects the profile of the scattered light intensity or power along the beam propagation direction. Then, the maximum value of the variation curve of the scattered light intensity or power represents the focal position.

The imaging optics 52 may be, for example, an elliptical cavity, a parabolic reflector, or the like.

A solid transparent material is advantageously used as scattering medium 50, which has scattering elements, for example small particles, uniformly distributed therein. Due to improvements in the production of particles in the submicron range, it is today possible to produce and use solid materials with very high transmission, which are capable of scattering light for illumination purposes very uniformly and efficiently. This has the advantage that the measurement artifacts caused by dust particles are not critical. An alternative to this configuration of the scattering medium is a movable element, such as a scattering wall along the optical axis or a rotating fan.