阅读说明：本技术 一种显微测量系统及显微测量方法 (Microscopic measurement system and microscopic measurement method ) 是由 李红兵 刘娜娜 李海宏 陈雪丹 于 2020-06-09 设计创作，主要内容包括：本发明实施例提供了一种显微测量系统及显微测量方法,该显微测量系统包括内部运动控制模块、显微成像模块和显示处理模块；内部运动控制模块用于控制待测工件运动,并向显示处理模块传输测工件的位置信息；显微成像模块包括至少两个显微成像单元和显微成像光源,存在两个显微成像单元用于对待测工件的不同表面进行显微成像；显微成像单元用于对待测工件进行显微成像,并将显微成像获得的图像信息传输至显示处理模块；显示处理模块用于根据位置信息和图像信息对待测工件进行显微测量。本发明实施例提供的显微测量系统,能够对待测工件进行多方向同时拍照测量,提高测量效率,同时还可以直接测量待测产品的厚度,丰富测量功能。(The embodiment of the invention provides a microscopic measurement system and a microscopic measurement method, wherein the microscopic measurement system comprises an internal motion control module, a microscopic imaging module and a display processing module; the internal motion control module is used for controlling the motion of the workpiece to be measured and transmitting the position information of the workpiece to be measured to the display processing module; the microscopic imaging module comprises at least two microscopic imaging units and a microscopic imaging light source, and the two microscopic imaging units are used for carrying out microscopic imaging on different surfaces of a workpiece to be detected; the microscopic imaging unit is used for carrying out microscopic imaging on the workpiece to be detected and transmitting image information obtained by the microscopic imaging to the display processing module; and the display processing module is used for carrying out microscopic measurement on the workpiece to be measured according to the position information and the image information. The microscopic measuring system provided by the embodiment of the invention can be used for simultaneously photographing and measuring the workpiece to be measured in multiple directions, so that the measuring efficiency is improved, the thickness of the product to be measured can be directly measured, and the measuring function is enriched.)

1. A microscopic measurement system is characterized by comprising an internal motion control module, a microscopic imaging module and a display processing module;

the internal motion control module is electrically connected with the display processing module and is used for receiving a first motion control instruction sent by the display processing module, controlling the movement of the workpiece to be detected according to the first motion control instruction and transmitting the position information of the workpiece to be detected to the display processing module;

the microscopic imaging module comprises at least two microscopic imaging units and a microscopic imaging light source, and the two microscopic imaging units are used for carrying out microscopic imaging on different surfaces of the workpiece to be detected; the microscopic imaging unit is connected with the display processing module and is used for carrying out microscopic imaging on the workpiece to be detected and transmitting image information obtained by the microscopic imaging to the display processing module;

and the display processing module is used for carrying out microscopic measurement on the workpiece to be measured according to the position information and the image information.

2. The microscopic measurement system of claim 1 wherein the microscopic imaging unit comprises a microscope and an imaging subunit disposed on the microscope eyepiece.

3. The microscopic measuring system according to claim 1, wherein the internal motion control module comprises an operation platform and a motion control unit, the operation platform is a bearing platform of the workpiece to be measured;

the motion control unit is respectively electrically connected with the display processing module and the operating platform and used for controlling the operating platform to move according to the first motion control instruction so as to drive the workpiece to be detected to move and transmit the position information of the workpiece to be detected to the display processing module.

4. The microscopic measurement system according to claim 1, wherein the display processing module comprises an upper computer; the upper computer is provided with a human-computer interaction display unit and a processing unit, and an image processing program is arranged in the processing unit;

and the upper computer is used for receiving the position information and the image information and carrying out microscopic measurement on the workpiece to be measured according to the position information and the image information.

5. The microscopic measurement system according to any one of claims 1 to 4, further comprising an external motion control module, said external motion control module being electrically connected to said internal motion control module;

the external motion control module is used for sending a second motion control instruction to the internal motion control module, and the internal motion control module is further used for controlling the workpiece to be detected to move according to the second motion control instruction.

6. The microscopic measurement system according to any one of claims 1 to 4, further comprising at least one set of input-output control modules, said input-output control modules comprising an input and at least two outputs, said at least two outputs comprising a first output and a second output;

the input end of the input/output control module is electrically connected with the display processing module, the first output end of the input/output module is electrically connected with the internal motion control module, and the second output end of the input/output module is electrically connected with the microscopic imaging module.

7. The microscopic measurement system according to any one of claims 1 to 4, further comprising a measurement switching module comprising at least one measurement switching button;

the measurement switching button is electrically connected with the display processing module and used for generating a measurement instruction and sending the measurement instruction to the display processing module;

the display processing module is used for receiving the measurement instruction and calling a preset measurement range sequence according to the measurement instruction to measure the image information.

8. A microscopic measuring method using the microscopic measuring system according to any one of claims 1 to 7, comprising:

sending a first motion control instruction to an internal motion control module, and receiving position information of the workpiece to be detected based on the first motion control instruction;

receiving image information sent by the microscopic imaging module;

and carrying out microscopic measurement on the workpiece to be measured according to the position information and the image information.

9. The microscopic measuring method according to claim 8, wherein the image information includes at least first image information and second image information;

the microscopic measurement of the workpiece to be measured according to the position information and the image information comprises the following steps:

determining fused image information of the workpiece to be detected according to the first image information, the second image information and the position information;

and carrying out microscopic measurement on the workpiece to be measured according to the fused image information.

10. The microscopic measuring method according to claim 8, wherein the microscopic imaging module comprises at least two microscopic imaging units and a microscopic imaging light source;

before receiving the image information sent by the microscopic imaging module, the method also comprises the following steps;

sending a light source control instruction to the microscopic imaging light source to control the microscopic imaging light source to be started;

and sending parameter information to the microscopic imaging unit, and configuring system parameters of the microscopic imaging unit.

Technical Field

The embodiment of the invention relates to the technical field of microscopic measurement, in particular to a microscopic measurement system and a microscopic measurement method.

Background

With the development of industrial technology, the microscopic measurement technology is increasingly applied to the field of industrial image detection due to the accurate measurement effect and the convenient measurement mode.

Disclosure of Invention

The embodiment of the invention provides a microscopic measuring system and a microscopic measuring method, and aims to simultaneously measure workpieces to be measured in multiple directions, improve the measuring efficiency and expand the function of microscopic measurement. The problem of when the work piece that awaits measuring of micro-measurement, multiaspect measurement efficiency is low is solved, still solved simultaneously that micro-measurement can not the direct measurement work piece thickness that awaits measuring the problem.

To achieve the object, in a first aspect, embodiments of the present invention provide a microscopic measurement system, which includes an internal motion control module, a microscopic imaging module, and a display processing module;

the internal motion control module is electrically connected with the display processing module and is used for receiving a first motion control instruction sent by the display processing module, controlling the movement of the workpiece to be detected according to the first motion control instruction and transmitting the position information of the workpiece to be detected to the display processing module;

the microscopic imaging module comprises at least two microscopic imaging units and a microscopic imaging light source, and the two microscopic imaging units are used for carrying out microscopic imaging on different surfaces of the workpiece to be detected; the microscopic imaging unit is connected with the display processing module and is used for carrying out microscopic imaging on the workpiece to be detected and transmitting image information obtained by the microscopic imaging to the display processing module;

and the display processing module is used for carrying out microscopic measurement on the workpiece to be measured according to the position information and the image information.

Optionally, the microscopic imaging unit comprises a microscope and an imaging subunit disposed on the microscope eyepiece.

Optionally, the internal motion control module includes an operation platform and a motion control unit, and the operation platform is a bearing platform of the workpiece to be measured;

the motion control unit is respectively electrically connected with the display processing module and the operating platform and used for controlling the operating platform to move according to the first motion control instruction so as to drive the workpiece to be detected to move and transmit the position information of the workpiece to be detected to the display processing module.

Optionally, the display processing module comprises an upper computer; the upper computer is provided with a human-computer interaction display unit and a processing unit, and an image processing program is arranged in the processing unit;

and the upper computer is used for receiving the position information and the image information and carrying out microscopic measurement on the workpiece to be measured according to the position information and the image information.

Optionally, the microscopic measurement system further comprises an external motion control module, the external motion control module being electrically connected to the internal motion control module;

the external motion control module is used for sending a second motion control instruction to the internal motion control module, and the internal motion control module is further used for controlling the workpiece to be detected to move according to the second motion control instruction.

Optionally, the microscopic measurement system further comprises at least one set of input/output control module, wherein the input/output control module comprises an input end and at least two output ends, and the at least two output ends comprise a first output end and a second output end;

the input end of the input/output control module is electrically connected with the display processing module, the first output end of the input/output module is electrically connected with the internal motion control module, and the second output end of the input/output module is electrically connected with the microscopic imaging module.

Optionally, the system further comprises a measurement switching module, wherein the measurement switching module comprises at least one measurement switching button;

the measurement switching button is electrically connected with the display processing module and used for generating a measurement instruction and sending the measurement instruction to the display processing module;

the display processing module is used for receiving the measurement instruction and calling a preset measurement range sequence according to the measurement instruction to measure the image information.

In a second aspect, an embodiment of the present invention further provides a microscopic measurement method, which is applied to the microscopic measurement system in the first aspect, and the microscopic measurement method includes:

sending a first motion control instruction to an internal motion control module, and receiving position information of the workpiece to be detected based on the first motion control instruction;

receiving image information sent by the microscopic imaging module;

and carrying out microscopic measurement on the workpiece to be measured according to the position information and the image information.

Optionally, the image information includes at least first image information and second image information;

the microscopic measurement of the workpiece to be measured according to the position information and the image information comprises the following steps:

determining fused image information of the workpiece to be detected according to the first image information, the second image information and the position information;

and carrying out microscopic measurement on the workpiece to be measured according to the fused image information.

Optionally, the microscopic imaging module comprises at least two microscopic imaging units and a microscopic imaging light source;

before receiving the image information sent by the microscopic imaging module, the method also comprises the following steps;

sending a light source control instruction to the microscopic imaging light source to control the microscopic imaging light source to be started;

and sending parameter information to the microscopic imaging unit, and configuring system parameters of the microscopic imaging unit.

According to the micro-measurement system and the micro-measurement method provided by the embodiment of the invention, the internal motion control module is used for controlling the motion of the workpiece to be measured, and the position information of the workpiece to be measured is transmitted to the display processing module, so that the micro-measurement is facilitated, and the control accuracy is improved. The micro imaging module comprises two micro imaging units, so that the workpiece to be detected can be detected from a plurality of angles in a plurality of directions, and the detection efficiency is improved. And, through setting up two micro-imaging units, can the direct measurement product that awaits measuring thickness, richened measurement function. Meanwhile, the image acquired by the microscopic imaging module is transmitted to the display processing module, so that a user can visually detect the parameters of the workpiece to be detected, and the workpiece to be detected is comprehensively detected.

Drawings

Fig. 1 is a schematic structural diagram of a microscopic measurement system according to an embodiment of the present invention.

Fig. 2 is a flow chart of a microscopic measurement method provided by an embodiment of the invention.

FIG. 3 is a flow chart of another microscopic measurement method provided by an embodiment of the present invention.

Fig. 4 is a flow chart of another microscopic measurement method provided by the embodiment of the invention.

Detailed Description

In order to make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the embodiments of the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings.

Fig. 1 is a schematic structural diagram of a microscopic measurement system according to an embodiment of the present invention, and as shown in fig. 1, the microscopic measurement system 10 includes an internal motion control module 1, a microscopic imaging module 2, and a display processing module 3;

the internal motion control module 1 is electrically connected with the display processing module 3 and is used for receiving a first motion control instruction sent by the display processing module 3, controlling the workpiece 6 to be detected to move according to the first motion control instruction and transmitting the position information of the workpiece 6 to be detected to the display processing module 3;

the microscopic imaging module 2 comprises at least two microscopic imaging units 21 and a microscopic imaging light source 22, wherein the two microscopic imaging units 21 are used for carrying out microscopic imaging on different surfaces of the workpiece 6 to be detected; the microscopic imaging unit 21 is connected with the display processing module 3 and is used for carrying out microscopic imaging on the workpiece 6 to be detected and transmitting image information obtained by the microscopic imaging to the display processing module 3;

the display processing module 3 is used for carrying out microscopic measurement on the workpiece 6 to be measured according to the position information and the image information.

Through setting up internal control module 1, can control the measuring position of the work piece 6 that awaits measuring, make things convenient for the operator to remove the work piece 6 that awaits measuring according to the demand, make the work piece 6 that awaits measuring be located in the measuring position of being convenient for, improve measuring maneuverability, and simultaneously, internal control module 1 still transmits the positional information of the work piece 6 that awaits measuring to display processing module 3, make things convenient for the operator to fix a position 6 concrete positions of the work piece that awaits measuring, when the operator needs to review, positional information can be transferred, through resetting the accurate position on the work piece 6 that awaits measuring of location of positional information, and the detection efficiency is.

Further, a plurality of detection planes of the workpiece 6 to be detected can be detected simultaneously by arranging the two micro-imaging units 21, so that the positions of the micro-imaging units 21 and the workpiece 6 to be detected are required to be adjusted manually when different detection surfaces of the workpiece 6 to be detected are detected, the detection flow is reduced, the detection efficiency is improved, the thickness of the workpiece 6 to be detected can be directly detected by the two micro-imaging units 21, the function of micro-detection is enriched, and the experience of an operator is improved. Meanwhile, the two microscopic imaging units 21 are used for detecting the workpiece to be detected, images of two detection surfaces of the workpiece to be detected 6 can be generated simultaneously, the detection surface of the workpiece to be detected 6 can be compared more visually, the images of the two detection surfaces can be fused, and the detection accuracy is improved. Illustratively, when two surfaces to be measured of the workpiece 6 to be measured require to be provided with components at opposite positions, the two surfaces to be measured of the workpiece 6 to be measured are simultaneously detected by the two microscopic imaging units 21 to generate a detection image, and an operator can detect whether the components arranged on the two surfaces to be measured are the same or not by visually comparing the two images, and can also fuse the two images, thereby judging whether the positions of the components arranged on the two surfaces to be measured are accurately arranged oppositely or not. The micro imaging unit 21 is used for transmitting the shot picture to the display processing module 3, the measurement picture is displayed through the display processing module 3, and the comparison and measurement are convenient for a user through a software program in the display processing module 3. Illustratively, the display processing module 3 is internally provided with image analysis processing software RHDMA, and after the display processing module 3 receives the detection picture, the analysis processing is performed through the image analysis processing software RHDMA, so that a user can directly view the length, the angle, the height, the shape and the like of the workpiece 6 to be detected in the detection picture through a measuring tool under the image analysis processing software RHDMA platform. The detection flow of an operator is reduced, the operation of the operator is facilitated, and the operation efficiency is improved.

Optionally, the microscopic imaging unit 21 includes a microscope (not shown in the figure) and an imaging sub-unit (not shown in the figure) disposed on an eyepiece of the microscope.

The imaging subunit includes the camera, is the microscope through setting up microscopic imaging unit 21, improves the fine and smooth degree that detects the work piece that awaits measuring, improves and detects the accuracy, sets up the camera on the microscope eyepiece simultaneously, saves installation space, reduces entire system's volume.

Optionally, the internal motion control module 1 includes an operation platform 11 and a motion control unit 12, where the operation platform 11 is a bearing platform for the workpiece 6 to be measured;

the motion control unit 12 is electrically connected to the display processing module 3 and the operation platform 11, and is configured to control the operation platform 11 to move according to the first motion control instruction, so as to drive the workpiece 6 to be measured to move, and transmit the position information of the workpiece 6 to be measured to the display processing module 3.

The operation platform is used for supporting the workpiece to be detected, and can be arranged to be of a transparent structure or a hollow structure in order to reduce the influence of the operation platform on the detection of the workpiece to be detected. The motion control unit 12 controls the operation platform to move according to the first motion control instruction, so that the workpiece to be tested is controlled to move, and an operator can conveniently adjust the test position of the workpiece to be tested. Illustratively, the display processing module 3 generates the first control instruction through the built-in image analysis processing software RHDMA, and the user can freely control the moving position of the operation platform only through the image analysis processing software RHDMA, so that the operation is simple and convenient, and no separate control equipment is required to be additionally arranged, thereby saving the cost.

Optionally, the display processing module 3 includes an upper computer; the upper computer is provided with a human-computer interaction display unit 31 and a processing unit 32, and an image processing program is arranged in the processing unit 32;

the upper computer is used for receiving the position information and the image information and carrying out microscopic measurement on the workpiece 6 to be measured according to the position information and the image information.

The processing unit 32 is a chip capable of analyzing and processing parameters, and for example, the processing unit 32 may be a Central Processing Unit (CPU), and the human-computer interaction unit 31 facilitates operation of an operator, saves operation time, and increases use experience of the operator. The upper computer receives the position information and the image information, and transmits the position information and the image information to the processing unit 32 for analysis and processing, so that the analysis and processing capacity is improved, the detection time is saved, and the detection efficiency is improved.

Optionally, the microscopic measurement system 10 further includes an external motion control module 4, the external motion control module 4 being electrically connected to the internal motion control module 1;

the external motion control module 4 is used for sending a second motion control instruction to the internal motion control module 1, and the internal motion control module 1 is further used for controlling the workpiece 6 to be detected to move according to the second motion control instruction.

Illustratively, the external motion control module 4 is an external console, and a second motion control instruction can be sent to the internal motion control module 1 through the external console, so as to control the motion of the workpiece 6 to be measured. By arranging the external motion control module 4, the method for controlling the motion of the workpiece 6 to be detected is enriched, different control modes are provided, when the image analysis processing software RHDMA is wrong and cannot be used, the motion of the workpiece 6 to be detected can be controlled through the external motion control module 4, and the controllability of the system is improved.

Optionally, the microscopic measuring system 10 further includes at least one set of input/output control module 5, where the input/output control module 5 includes an input end a and at least two output ends, and the at least two output ends include a first output end B and a second output end C;

an input end A of the input/output control module 5 is electrically connected with the display processing module 3, a first output end B of the input/output module 5 is electrically connected with the internal motion control module 1, and a second output end C of the input/output module 5 is electrically connected with the microscopic imaging module 2.

The input and output control module 5 is an input and output control interface, and by arranging the input and output control module 5, the connection among the processing module 3, the internal motion control module 1 and the microscopic imaging module 2 is conveniently indicated, so that the port number of the processing module 3, the internal motion control module 1 and the microscopic imaging module 2 is saved, meanwhile, a connecting line is conveniently planned, and the neatness of the measuring system is improved.

Optionally, the device further comprises a measurement switching module 7, wherein the measurement switching module 7 comprises at least one measurement switching button;

the measurement switching button is electrically connected with the display processing module 3 and used for generating a measurement instruction and sending the measurement instruction to the display processing module 3;

the display processing module 3 is used for receiving the measurement instruction and calling a preset measurement range sequence according to the measurement instruction to measure the image information.

Analysis processing program in the display processing module 3 can be switched through the measurement switching module 7, exemplarily, after an operator presses the measurement switching module 7, the measurement program in the display processing module 3 is switched to detect the total length of the workpiece 6 to be detected, after the display processing module 3 receives an image of the workpiece 6 to be detected, the total length of the workpiece to be detected is directly measured and is displayed in a picture, the operator can visually see the total length of the workpiece 6 to be detected, so that the measurement is not needed again, the detection steps are simplified, and the detection efficiency is improved.

Based on the same inventive concept, an embodiment of the present invention further provides a display measurement method, and fig. 2 is a flowchart of a microscopic measurement method provided in an embodiment of the present invention, and the microscopic measurement method is applied to any one of the above microscopic measurement systems, as shown in fig. 2, and the microscopic measurement method includes:

s101, sending a first motion control instruction to the internal motion control module, and receiving position information of the workpiece to be detected based on the first motion control instruction.

Through sending first motion control instruction to inside motion control module, utilize inside motion control module control workpiece to be measured to remove along with operation platform, conveniently the control to the workpiece to be measured, improve system maneuverability. The position information of the workpiece to be detected is received, the detection position of the workpiece to be detected is conveniently and accurately positioned, and the detection traceability is ensured.

And S102, receiving the image information sent by the microscopic imaging module.

And receiving the image information sent by the microscopic imaging module, and displaying the image information to an operator visually, so that the operator can compare, analyze and process the image information conveniently.

And S103, performing microscopic measurement on the workpiece to be measured according to the position information and the image information.

By utilizing the image analysis processing software RHDMA and according to the position information and the image information, the length, the width, the angle and other characteristics of the workpiece to be measured can be measured, the measurement process is simplified, and the detection efficiency is improved.

In summary, in the microscopic measurement method provided by the embodiment of the present invention, the motion control module can adjust the position of the workpiece to be measured according to the user's requirement based on the first motion control instruction, so as to improve the controllability of the workpiece to be measured, and at the same time, the movement of the workpiece to be measured is controlled in a software manner, so that an external control operation device does not need to be separately arranged, thereby reducing the cost and simplifying the measurement system. The workpiece to be detected is detected simultaneously through the two microscopic imaging units, and the detection image is transmitted to the display processing module, so that a user can quickly and visually observe the conditions of a plurality of surfaces of the workpiece to be detected, the plurality of surfaces are not required to be detected in sequence, the detection flow is reduced, the detection efficiency is improved, the picture information is processed through software, the measurement is simple and convenient, and a larger operation space is provided for the user. In addition, the thickness information of the workpiece to be detected can be simply and conveniently detected through the image information, and detection methods are enriched.

On the basis of the above embodiment, fig. 3 is another micro-measurement method provided by the embodiment of the present invention, and the micro-measurement method shown in fig. 3 is used to describe in detail how to perform micro-measurement on a workpiece to be measured according to position information and image information. Optionally, the image information comprises at least first image information and second image information; correspondingly, the microscopic measurement method provided by the embodiment of the invention comprises the following steps:

s201, sending a first motion control instruction to the internal motion control module, and receiving position information of the workpiece to be detected based on the first motion control instruction.

And S202, receiving the image information sent by the microscopic imaging module.

S203, determining fusion image information of the workpiece to be measured according to the first image information, the second image information and the position information.

And S204, performing microscopic measurement on the workpiece to be measured according to the fused image information.

The first image information is information of a first surface of a workpiece to be detected, the second image information is information of a second surface of the workpiece to be detected, the two surfaces of the workpiece to be detected are fused according to the first image information and the second image information, so that the difference between the two surfaces can be visually analyzed, illustratively, the workpiece to be detected requires that a component is arranged at the same position of the two surfaces, an operator can also fuse the first image information and the second image information to obtain the fused image information, whether the positions of the components arranged on the two surfaces of the workpiece to be detected coincide or not can be visually identified according to the fused image information, further, when the coincidence is not accurately confirmed by direct observation or the requirement on the coincidence degree of the components is high, an abscissa X1 and an ordinate Y1 of the position of the first surface of the workpiece to be detected, which need to be provided with the component, can be obtained according to the first image information, then according to second image information, the abscissa X2 and the ordinate Y2 of the position of the component required to be arranged on the second surface of the workpiece to be detected are obtained, and an operator can directly compare the difference value of the two groups of the abscissas and the ordinates to judge whether the components arranged on the two surfaces of the workpiece to be detected coincide or not, so that the detection difficulty is reduced, and the detection accuracy and efficiency are improved.

On the basis of the above embodiment, fig. 4 is a flowchart of another microscopic measurement method provided by an embodiment of the present invention, and on the basis of the above embodiment, the microscopic measurement method shown in fig. 4 adds an operation flow to the microscopic imaging module. Optionally, the microscopic imaging module comprises at least two microscopic imaging units and a microscopic imaging light source; correspondingly, the microscopic measurement method provided by the embodiment of the invention comprises the following steps:

s301, sending a first motion control instruction to the internal motion control module, and receiving position information of the workpiece to be detected based on the first motion control instruction.

And S302, sending a light source control instruction to the microscopic imaging light source to control the microscopic imaging light source to be started.

It can be understood that before the workpiece to be detected is detected, the microscopic imaging light source is firstly controlled to be started, and the brightness of microscopic imaging is increased by opening the microscopic imaging light source, so that the shooting definition of the workpiece to be detected is improved, and the detection accuracy is improved.

And S303, sending the parameter information to the microscopic imaging unit, and configuring the system parameters of the microscopic imaging unit.

The system parameters include: the focal length, the resolution ratio, the shutter and the exposure of the camera, the color of the display interface and the style of the display interface are adjusted, and the quality of the picture of the workpiece to be detected is improved by adjusting the parameters of the camera, so that the detection accuracy is improved, and the effectiveness of microscopic detection is enhanced.

And S304, receiving the image information sent by the microscopic imaging module.

And receiving the image information sent by the microscopic imaging module, and displaying the image information to an operator visually, so that the operator can compare, analyze and process the image information conveniently.

And S305, performing microscopic measurement on the workpiece to be measured according to the position information and the image information.

The internal motion control module sends a first operation control command to control the workpiece to be detected to move along with the operating platform, so that the controllability of the workpiece to be detected is improved, an operator can conveniently select the detection position of the workpiece to be detected, and the detection effect is improved. The opening of the microscopic imaging light source is controlled to provide illumination for microscopic imaging and enhance the definition of the microscopic imaging, and it can be understood that the brightness of the microscopic imaging light source can be controlled, and when the shot image is darker, the brightness of the microscopic imaging light source is enhanced to make the image clearer; when the shot image is too bright, the brightness of the microscopic imaging light source is weakened, so that the exposure degree of the camera is reduced, and the information of the workpiece to be measured is displayed more accurately and effectively. The obtained image information is convenient for operators to directly analyze and measure, and the real condition of the workpiece to be measured is visually provided for the operators; the measuring position of the workpiece to be measured can be accurately positioned by combining the position information and the image information, when the workpiece to be measured is unqualified, an operator can quickly and accurately position the unqualified position of the workpiece to be measured, statistics is convenient, and the detection efficiency is improved

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.