阅读说明：本技术 超级电容器的极板、超级电容器及其制作方法 (Plate of super capacitor, super capacitor and manufacturing method thereof ) 是由 苏逸 默罕默德·萨万 文燎勇 荣国光 傅杰 于 2021-03-22 设计创作，主要内容包括：本发明实施例提供了一种超级电容器极板、超级电容器及其制作方法,超级电容器极板的制作方法,包括：提供牺牲层,所述牺牲层内具有亚微米或微米级的孔隙；在所述牺牲层的其中一面上沉积金属,形成第一覆盖层；在所述第一覆盖层上施加PDMS溶液并烘干,形成第二覆盖层；其中,所述第一覆盖层和所述第二覆盖层未填充满所述孔隙；去除所述牺牲层；在所述第一覆盖层远离所述第二覆盖层的一面上沉积聚吡咯,形成第三覆盖层,且所述第一覆盖层作为沉积所述聚吡咯的基底。本发明实施例有利于同时提高超级电容器在透明、生物兼容性和柔性方面的性能。(The embodiment of the invention provides a super capacitor plate, a super capacitor and a manufacturing method thereof, wherein the manufacturing method of the super capacitor plate comprises the following steps: providing a sacrificial layer having submicron or micron scale pores therein; depositing metal on one side of the sacrificial layer to form a first covering layer; applying a PDMS solution on the first covering layer and drying to form a second covering layer; wherein the first and second capping layers do not fill the pores; removing the sacrificial layer; and depositing polypyrrole on one surface of the first covering layer, which is far away from the second covering layer, so as to form a third covering layer, wherein the first covering layer is used as a substrate for depositing the polypyrrole. The embodiment of the invention is beneficial to simultaneously improving the performances of the super capacitor in the aspects of transparency, biocompatibility and flexibility.)

1. A method for manufacturing a plate of a super capacitor is characterized by comprising the following steps:

providing a sacrificial layer having submicron or micron scale pores therein;

depositing metal on one side of the sacrificial layer to form a first covering layer;

applying a PDMS solution on the first covering layer and drying to form a second covering layer; wherein the first and second capping layers do not fill the pores;

removing the sacrificial layer;

and depositing polypyrrole on one surface of the first covering layer, which is far away from the second covering layer, so as to form a third covering layer, wherein the first covering layer is used as a substrate for depositing the polypyrrole.

2. The method for manufacturing the plate of the supercapacitor according to claim 1, wherein the step of depositing a metal on one surface of the sacrificial layer to form a first cover layer as a substrate for depositing polypyrrole comprises:

depositing a noble metal on one side of the sacrificial layer to form the first covering layer; alternatively, the first and second electrodes may be,

depositing nickel on one side of the sacrificial layer to form a fourth covering layer;

depositing the noble metal on the fourth covering layer to form a fifth covering layer; wherein the fourth cover layer and the fifth cover layer together constitute the first cover layer.

3. The method for manufacturing the plate of the supercapacitor according to claim 2, wherein the thickness of the fourth covering layer is not higher than 2nm, and the thickness of the fifth covering layer is 5-50 nm; the noble metal is gold, silver or platinum, and the method for depositing the metal is physical vapor deposition.

4. The method of claim 1, wherein the capping layer has a thickness of 1-200 nm.

5. The method for manufacturing the plate of the supercapacitor according to claim 1, wherein the sacrificial layer comprises a porous metal material layer or a porous alumina material layer, and the removing the sacrificial layer specifically comprises: and dissolving to remove the sacrificial layer.

6. A manufacturing method of a super capacitor is characterized by comprising the following steps:

the method of making the supercapacitor plate of any one of claims 1 to 5, making two supercapacitor plates;

adding electrolyte between the two super capacitor plates to form a super capacitor;

wherein the supercapacitor plate comprises a third capping layer, the third capping layer of the supercapacitor plate proximate to the electrolyte.

7. The method of claim 6, wherein the electrolyte is sodium alginate, sodium sulfate and calcium chloride.

8. A supercapacitor plate, characterized in that the supercapacitor plate is a plate with submicron or micron pores manufactured by the method for manufacturing the supercapacitor plate according to any one of claims 1 to 5.

9. An ultracapacitor comprising two ultracapacitor plates provided in claim 6 and an electrolyte positioned between the two ultracapacitor plates; wherein the supercapacitor plate comprises a third capping layer, the third capping layer of the supercapacitor plate proximate to the electrolyte.

10. The supercapacitor of claim 9, wherein the electrolytes are sodium alginate, sodium sulfate and calcium chloride.

Technical Field

The embodiment of the invention relates to the field of super capacitors, in particular to a plate of a super capacitor, the super capacitor and a manufacturing method of the super capacitor.

Background

The super capacitor is a novel energy storage device between a traditional capacitor and a rechargeable battery, and has the characteristics of quick charge and discharge of the capacitor and the energy storage characteristic of the battery. The current research on the super capacitor mainly considers two aspects of increasing the specific surface area and searching metal oxide with large power density, conductive polymer, carbon and isotope, etc. to improve the performance of the super capacitor. However, when the supercapacitor is applied to wearable devices and carrier devices, the supercapacitor also needs to meet the requirements of the wearable devices and the carrier devices for the critical performance of transparency, biocompatibility, flexibility and the like.

Therefore, how to simultaneously improve the performance of the supercapacitor in the aspects of transparency, biocompatibility and flexibility is a problem to be solved urgently at present.

Disclosure of Invention

The technical problem to be solved by the embodiment of the invention is to provide a method for manufacturing a super capacitor plate, which is beneficial to simultaneously improving the performances of the super capacitor in the aspects of transparency, biocompatibility and flexibility.

In order to solve the above problem, an embodiment of the present invention provides a method for manufacturing a plate of a super capacitor, including: providing a sacrificial layer having submicron or micron scale pores therein; depositing metal on one side of the sacrificial layer to form a first covering layer; applying a PDMS solution on the first covering layer and drying to form a second covering layer; wherein the first and second capping layers do not fill the pores; removing the sacrificial layer; and depositing polypyrrole on one surface of the first covering layer, which is far away from the second covering layer, so as to form a third covering layer, wherein the first covering layer is used as a substrate for depositing the polypyrrole.

In order to solve the above problem, an embodiment of the present invention further provides a method for manufacturing a super capacitor, including:

according to the manufacturing method of the super capacitor plate, two super capacitor plates are manufactured; adding electrolyte between the two super capacitor plates to form a super capacitor; wherein the supercapacitor plate comprises a third capping layer, the third capping layer of the supercapacitor plate proximate to the electrolyte.

In order to solve the above problems, an embodiment of the present invention further provides a super capacitor plate, where the super capacitor plate is a plate with submicron or micron pores manufactured according to the above manufacturing method of the super capacitor plate.

In order to solve the above problem, an embodiment of the present invention further provides a super capacitor, where the super capacitor includes two or more super capacitor plates and an electrolyte located between the two super capacitor plates; wherein the supercapacitor plate comprises a third capping layer, the third capping layer of the supercapacitor plate proximate to the electrolyte.

In addition, the depositing metal on one side of the sacrificial layer to form a first covering layer as a substrate for depositing polypyrrole specifically includes: depositing a noble metal on one side of the sacrificial layer to form the first covering layer; or depositing nickel on one surface of the sacrificial layer to form a fourth covering layer; depositing the noble metal on the fourth covering layer to form a fifth covering layer; wherein the fourth cover layer and the fifth cover layer together constitute the first cover layer.

In addition, the thickness of the fourth covering layer is not higher than 2nm, the thickness of the fifth covering layer is 5-50 nm, the noble metal is gold, silver or platinum, and the metal deposition method is a physical vapor deposition method.

In addition, the thickness of the third covering layer is 1-200 nm.

In addition, the sacrificial layer comprises a porous metal material layer or a porous alumina material layer, and the removing of the sacrificial layer specifically comprises: and dissolving and removing the sacrificial layer.

In addition, the electrolytes are sodium alginate, sodium sulfate and calcium chloride.

In the technical scheme, metal is firstly deposited on one surface of a sacrificial layer with submicron or micron pores to form a first covering layer, then PDMS solution is applied and dried to form a second covering layer, then the sacrificial layer is removed, and conductive polymer polypyrrole is deposited on one surface of the first covering layer, which is far away from the second covering layer, to form a third covering layer, at the moment, the first covering layer is used as a substrate for depositing the polypyrrole, which is conductive polymer, is favorable for depositing the polypyrrole, and in the formed three-layer electrode structure, the first covering layer is used as the substrate of a polar plate, the third covering layer is used as a conductive layer of the polar plate, the second covering layer is favorable for forming the third covering layer, the polypyrrole is light in color and has biocompatibility, PDMS is transparent, non-toxic and flexible, and the metal has ductility, so that the performances of the supercapacitor polar plate in the aspects of transparency, biocompatibility and flexibility can be simultaneously improved, and the performance of the super capacitor manufactured by using the super capacitor plate in the aspects of transparency, biocompatibility and flexibility is improved at the same time. In addition, the components of the electrolyte of the super capacitor are transparent and nontoxic, so that the performance of the super capacitor manufactured by using the electrolyte in the aspects of transparency and biocompatibility is improved.

In addition, the holes in the sacrificial layer are not filled, so that the prepared polar plate has holes, the energy density is increased, and the internal stress is improved; the polypyrrole has the advantages of good environmental stability, high conductivity, good oxidation-reduction property, strong commercial availability and simple synthesis process, and can improve the stability of the electrode material, reduce the manufacturing cost and improve the electrical property of the polar plate; the electrolyte is neutral, has small corrosivity compared with an acidic electrolyte, and is not easy to leak compared with an alkaline electrolyte.

Drawings

One or more embodiments are illustrated by corresponding figures in the drawings, which are not to scale unless specifically noted.

Fig. 1 to 5 are schematic cross-sectional structures corresponding to steps of a method for manufacturing a supercapacitor plate according to a first embodiment of the present invention;

fig. 6 to 8 are schematic cross-sectional structures corresponding to steps of a method for manufacturing a supercapacitor plate according to a second embodiment of the invention;

fig. 9 is a schematic cross-sectional structure diagram corresponding to a manufacturing method of a super capacitor according to a third embodiment of the invention;

fig. 10 is a graph showing the relationship between the wavelength and the light transmittance according to the method for manufacturing the super capacitor according to the third embodiment of the present invention;

11-12, 14-17 are images of respective performance test results corresponding to a supercapacitor provided in a fifth embodiment of the present invention;

fig. 13 is an impedance test model of a supercapacitor according to a fifth embodiment of the present invention.

Detailed Description

As can be seen from the background art, how to simultaneously improve the performance of the supercapacitor in terms of transparency, biocompatibility and flexibility in the prior art is a problem to be solved at present.

It can be analyzed that the research on the super capacitor mainly considers two aspects of increasing the specific surface area and searching the metal oxide with large power density so as to improve the performance of the super capacitor. However, when the supercapacitor is applied to wearable devices and carrier devices, the supercapacitor also needs to meet the requirements of the wearable devices and the carrier devices for the critical performance of transparency, biocompatibility, flexibility and the like.

In order to solve the above problems, embodiments of the present invention provide a method for manufacturing a super capacitor plate, wherein a metal is deposited on one surface of a sacrificial layer having submicron or micron pores to form a first capping layer, a PDMS solution is applied and dried to form a second capping layer, the sacrificial layer is removed, and a conductive polymer polypyrrole is deposited on one surface of the first capping layer away from the second capping layer to form a third capping layer, wherein the first capping layer is used as a substrate for depositing the polypyrrole to facilitate deposition of the conductive polymer, and in the formed three-layer electrode structure, the first capping layer is used as a substrate of the plate, the third capping layer is used as a conductive layer of the plate, the second capping layer is used to facilitate formation of the third capping layer, and the polypyrrole is light in color and has biocompatibility, and the PDMS is transparent, non-toxic, flexible, and malleable, therefore, the performance of the super capacitor plate in the aspects of transparency, biocompatibility and flexibility can be improved simultaneously, and the performance of the super capacitor manufactured by the super capacitor plate in the aspects of transparency, biocompatibility and flexibility is improved simultaneously.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.

Fig. 1 to fig. 5 are schematic cross-sectional structures corresponding to steps of a method for manufacturing a supercapacitor plate according to a first embodiment of the present invention.

Referring to fig. 1, a sacrificial layer 100 is provided, the sacrificial layer 100 having submicron or micron-scale pores 101 therein.

In the present embodiment, the sacrificial layer 100 is a layer of material having several submicron or micron-sized pores 101.

Further, the sacrificial layer 100 may be a porous metal material layer, and may also be a porous alumina material layer. In the case of a porous metal material layer, a material composed of a metal matrix and a plurality of pores may be prepared by a casting method, a deposition method, a chemical reaction method, and a sintering method. If the porous alumina material layer is prepared, the porous alumina material can be prepared by an anodic oxidation method. Because the porous metal material and the porous alumina material have a plurality of submicron or micron pores, the material does not need to be further processed to form the submicron or micron pores, the flow of obtaining the sacrificial layer is simplified, and the cost is saved. In addition, compared with other types of porous materials, such as porous silicon materials and the like, the sacrificial layer made of the porous metal material and the porous alumina material is easier to remove in the subsequent process, so that the practicability and the performability of the method are improved.

It should be noted that the pore size of the pores 101 is influenced by the preparation process of the material. Referring to fig. 2, a metal is deposited on one side of the sacrificial layer 100 to form a first capping layer 102.

In this embodiment, the process of depositing the metal includes a physical vapor deposition method, in which a metal material is vaporized by a physical method, such as evaporation, sputtering, etc., and a thin film, i.e., the first capping layer 102, is deposited on the surface of the sacrificial layer 100, and at this time, the first capping layer 102 is not filled in the pores 101.

Further, the first capping layer 102 may have a single-layer structure, and in this case, the metal deposited on one side of the sacrificial layer 100 is specifically a noble metal, such as gold, silver, platinum, etc., and the noble metal layer is formed as the first capping layer 102.

It should be noted that, in this embodiment, when the noble metal is deposited by using the physical vapor deposition method, one side of the sacrificial layer 100, including the outer surface and the inner surface (i.e., the pores 101), is deposited on the noble metal to obtain an initial first capping layer 102, and then the noble metal deposited on the inner surface is removed by etching to obtain a final first capping layer 102.

In other embodiments, the deposited noble metal in the pores 101 may be retained, and the first capping layer 102 may still not fill the pores 101.

Referring to fig. 3, a PDMS solution is applied on the first capping layer 102 and dried to form a second capping layer 103.

In this embodiment, the PDMS solution used may be specifically dow corning PDMS solution. The dow corning PDMS solution consists of two components: a liquid a as a prepolymer and a liquid B as a crosslinking agent. Prior to application of the PDMS solution, A, B liquid in dow corning PDMS was first mixed in a weight ratio of 10: 1, then applying the solution to the first cover layer 102, and finally drying the solution, e.g. at 100 c for 30min, to form a second cover layer 103 not filled with voids 101. The PDMS material has the characteristics of transparency, non-toxicity, flexibility and the like, and the second covering layer 103 prepared by the PDMS solution can be used as the substrate of the plate, so that the substrate of the plate has the performances of transparency, flexibility and biocompatibility.

After the PDMS solution is dried, the cured material of the PDMS solution possibly existing in the pores 101 of the sacrificial layer 101 needs to be removed. Of course, the cured material of the PDMS solution filled in the pores 101 may also be retained.

Referring to fig. 4, the sacrificial layer 100 is removed.

In this embodiment, if the sacrificial layer 100 is a porous metal material layer or a porous alumina material layer, the sacrificial layer 100 is removed by dissolving with an acidic solution such as hydrochloric acid, for example, after forming the second capping layer 103, the sacrificial layer 100, the first capping layer 102 and the second capping layer 103 are immersed in hydrochloric acid with a concentration of 5% in total, and the sacrificial layer 100 is dissolved by performing a table-shaking reaction for 24 hours. If the material is other material, such as porous silicon material, the sacrificial layer 100 is removed by a corresponding method.

It should be noted that, since the first cover layer 102 and the second cover layer 103 do not fill the pores 101, after the sacrificial layer 100 is removed, as shown in fig. 4, unfilled pores 104 exist in the first cover layer 102 and the second cover layer 105, and the pore diameters of the pores 104 and the pores 101 are substantially the same, and are both on the submicron scale or the micron scale. The holes 104 are formed in the prepared plate, so that a reaction surface which is larger than that of a plate electrode is provided for a super capacitor manufactured by using the plate, namely, the specific surface area is increased, ions in the electrolyte can migrate in the holes of the plate, namely, the holes in the plate provide more migration paths for the ions, the ion migration efficiency in the electrolyte is improved, the electrical performance of the super capacitor is improved, meanwhile, the holes in the plate reserve spaces for the contraction and expansion of the volume of the active substances in the charging and discharging processes, and short circuits caused by the deformation of the electrode, the falling of the active substances and the like are reduced. It is further noted that micro-scale voids 104 have better tensile properties than sub-micro-scale voids 104.

Referring to fig. 5, polypyrrole is deposited on the side of the first cover layer 102 remote from the second cover layer 103, forming a third cover layer 105.

In this embodiment, the polypyrrole deposition includes a chemical oxidation method and an electrochemical deposition method, and the thickness of the third capping layer is 1 to 200 nm. In addition, the electrochemical deposition method is an oxidation polymerization reaction of pyrrole monomers under the action of an electric field, and compared with the chemical oxidation method, the electrochemical deposition method can control the form of polypyrrole by controlling the polymerization conditions, and the obtained polypyrrole is stable in different solvents, so the electrochemical deposition method is superior to the chemical oxidation method. At this time, the first cover layer 102 serves as a substrate for depositing polypyrrole, and pyrrole monomers are oxidized by the action of the electric field and polymerized into polypyrrole on the surface of the first cover layer 102 to form a thin film, i.e., a third cover layer 105. Since the noble metal is chemically inert, the first cover layer 102 hardly undergoes chemical change when the pyrrole monomer is oxidized, so that the first cover layer 102 can provide a substrate for depositing polypyrrole and prevent the substrate from undergoing chemical change to affect the deposition of polypyrrole.

In addition, the third covering layer 105 formed by the conductive polymer polypyrrole is used as a conductive layer, and it should be noted that in the actual implementation process, the third covering layer 105 may also be formed by other conductive polymers, such as polythiophene, polyaniline, and the like. But compared with other conductive polymers, the polypyrrole is lighter in color, and meanwhile, the polypyrrole is non-toxic and good in mechanical ductility, namely, the conductive layer prepared from the polypyrrole has flexibility, biocompatibility and transparency, and the performance of the polar plate is improved. In addition, the polypyrrole has the advantages of good environmental stability, high conductivity, good redox property, strong commercial availability and simple synthesis process, and can improve the stability of the electrode material, reduce the manufacturing cost and improve the electrical property of the electrode plate.

A second embodiment of the present invention further provides a method for manufacturing a plate of a super capacitor, which is substantially the same as the previous embodiment, and mainly differs from the previous embodiment in that the number of layers of the first cover layer is different. The method for manufacturing a supercapacitor plate according to a second embodiment of the present invention will be described in detail below with reference to the accompanying drawings, and it should be noted that the same or corresponding parts as those in the foregoing embodiments may refer to the detailed description of the foregoing embodiments, and are not repeated herein.

Fig. 6 to 8 are schematic cross-sectional structures corresponding to steps of a method for manufacturing a supercapacitor plate according to a second embodiment of the present invention.

Referring to fig. 6, nickel is deposited on one side of the sacrificial layer 100 to form a fourth capping layer 106, and then a noble metal is deposited on the fourth capping layer 106 to form a fifth capping layer 107.

In the present embodiment, the fourth cover layer 106 and the fifth cover layer 107 together constitute the first cover layer 102. The thickness of the fourth covering layer is not higher than 2nm, the thickness of the fifth covering layer is 5-50 nm, and the fourth covering layer and the fifth covering layer are not filled in the holes 101 in the sacrificial layer 100.

Referring to fig. 7, a PDMS solution is applied on the first capping layer 102 and dried, forming a second capping layer 103.

In this embodiment, the second cap layer 103 is formed by applying a PDMS solution on the fifth cap layer 107 and then drying the PDMS solution. At this time, the fourth capping layer 106, the fifth capping layer 107, and the second capping layer 103 do not fill the pores 101 in the sacrificial layer 100.

Referring to fig. 8, polypyrrole is deposited on the side of the first cover layer 102 remote from the second cover layer 103, forming a third cover layer 105.

In this embodiment, after the sacrificial layer 100 is removed, the third capping layer 105 is actually formed on the fourth capping layer 106. The fourth capping layer 106 is formed of nickel, and since nickel provides more electrons to the electrolyte in the reaction environment through an electrochemical reaction, the collision probability of charged radicals formed by pyrrole monomers is increased, the polymerization rate of pyrrole monomers is increased, and the efficiency of depositing polypyrrole is improved.

It should be noted that although nickel can provide more electrons, nickel itself undergoes redox reaction, and therefore, the fourth capping layer 106 formed of nickel does not need to be as thick as 2nm or more, which can provide enough electrons and minimize the adverse effects of impurities and reduced deposition efficiency caused by chemical changes of nickel.

Fig. 9 is a schematic cross-sectional structure diagram corresponding to each step of a manufacturing method of a super capacitor according to a third embodiment of the present invention.

Referring to fig. 9, two supercapacitor plates 201 are fabricated.

In this embodiment, two supercapacitor plates 201 are manufactured according to the method for manufacturing the supercapacitor plates provided in the first and second embodiments. Each supercapacitor plate 201 comprises a first covering layer 102, a second covering layer 103, a third covering layer 105 and a plurality of holes 104, wherein the hole diameters of the holes 104 are approximately the same as the hole diameters of the holes 101 in the sacrificial layer 100 used for manufacturing the capacitor plate, and are submicron or micron.

An electrolyte 202 is added between the two supercapacitor plates to form a supercapacitor 203.

In this embodiment, the third cover layer 206 of the two supercapacitor plates 201 is proximate to the electrolyte 202. Further, the electrolyte 202 includes sodium alginate, sodium sulfate, and calcium chloride, and is a solid electrolyte formed by mixing 0.5 mol of sodium alginate, 1 mol of sodium sulfate, and 1 mol of calcium chloride. Because the sodium alginate, the sodium sulfate and the calcium chloride are all transparent and nontoxic, the biocompatibility and the transparency of the supercapacitor 203 can be improved by using the sodium alginate, the sodium sulfate and the calcium chloride to construct the supercapacitor 203. In addition, sodium alginate, sodium sulfate and calcium chloride are neutral, and the electrolyte formed by the sodium alginate, the sodium sulfate and the calcium chloride is also neutral, so that a neutral environment is provided for the supercapacitor 203, the electrolyte 202 is less corrosive compared with an acid electrolyte, and the electrolyte 202 is not easy to leak compared with an alkaline electrolyte.

Referring to fig. 10, the graph shows the variation relationship between the wavelength and the transparency of the light under a certain concentration condition of the electrolyte 202, the horizontal axis of the coordinate system represents the wavelength of the light, the vertical axis of the coordinate system represents the transmittance, the curve 1 represents the transmittance variation curve of the plate, and the curves 2, 3, 4 and 5 sequentially correspond to the transmittance variation curves of the super capacitor under the electrolyte concentration conditions of 2 mol, 0.5 mol, 1 mol and 0.1 mol. As can be seen from fig. 10, on one hand, the concentration of the electrolyte 202 has an influence on the transmittance, but the influence is not linearly changed, and the plate transmittances obtained by different concentrations of the electrolyte 202 in fig. 10 are all above 80%; on the other hand, when the concentration of the electrolyte 202 is constant, the wavelength of light does not greatly affect the light transmittance.

It should be further noted that, in order to reduce the influence of other substances in the supercapacitor 203, after the supercapacitor plate 201 is prepared, the supercapacitor plate 201 may be repeatedly rinsed with deionized water and dried with nitrogen.

In other embodiments, the electrolyte 202 may be composed of other components, such as polyethylene oxide-KOH-H2O or sulfonate salts, among others.

Correspondingly, the fourth embodiment of the invention also provides a super capacitor plate, and the super capacitor plate is manufactured by the manufacturing method of the super capacitor plate provided by the first embodiment or the second embodiment.

Referring to fig. 5, the supercapacitor plates include: the first cover layer 102, the second cover layer 103, the third cover layer 105 and a plurality of holes 104, wherein the holes 104 penetrate through the first cover layer 102, the second cover layer 103 and the third cover layer 105, and the hole 104 has a submicron or micron aperture size. The holes 104 are formed in the prepared pole plate, so that a reaction surface which is much larger than that of a flat plate electrode is provided for the super capacitor manufactured by the pole plate, namely, the specific surface area is increased, ions in the electrolyte can migrate in the holes of the pole plate, namely, more migration paths are provided for the ions by the holes in the pole plate, the ion migration efficiency in the electrolyte is improved, and further, the electrical performance of the super capacitor is improved. Correspondingly, the fifth embodiment of the invention also provides a super capacitor, and the plate of the super capacitor is manufactured by the manufacturing method of the super capacitor provided by the third embodiment.

Referring to fig. 9, a supercapacitor 203 comprises two supercapacitor plates 201 and an electrolyte 202, wherein the supercapacitor plates 201 comprise a first cover layer 102, a second cover layer 103, a third cover layer 105 and a plurality of holes 104, the holes 104, and the third cover layer 105 of the two supercapacitor plates 201 is proximate to the electrolyte 202.

Further, the constituents of the electrolyte 202 include sodium alginate, sodium sulfate, and calcium chloride.

It should be noted that, the performance test is performed on the super capacitor 203: referring to fig. 11, CV curves of the supercapacitor 203 under different voltage conditions are obtained by cyclic voltammetry, and curves 1, 2, 3, 4, 5 and 6 in fig. 11 sequentially represent CV curves of the supercapacitor 203 under conditions of 200mV, 100mV, 80mV, 50mV, 20mV and 10 mV. For a capacitor, the more similar the CV to the rectangle, the more ideal the capacitance performance, and as can be seen from fig. 11, the CV curve under each current condition is similar to the rectangle, i.e. the super capacitor 203 has better capacitance performance under different current conditions. Referring to fig. 12, a charge and discharge test is performed on the super capacitor 203 to obtain charge and discharge curves under different current conditions, curves 1, 2, 3, and 4 in fig. 12 sequentially represent the corresponding charge and discharge curves of the super capacitor 203 under the conditions of 5mA, 2mA, 1mA, and 0.8mA, and it can be seen from fig. 12 that the larger the current is, the faster the charge and discharge speed is, and the shorter the charge and discharge time is, that is, the super capacitor 203 has a better response speed. Impedance of the super capacitor 203 is tested according to the model shown in fig. 13, and an impedance spectrum shown in fig. 14 is obtained, wherein curves 1 and 2 in fig. 14 respectively represent a real curve and a fitted dotted line, and it can be known from fig. 14 that the super capacitor and the used sodium alginate electrolyte have excellent conductivity. Referring to fig. 15, the supercapacitor 203 is charged and discharged for a plurality of times to obtain a relationship between the charging and discharging times and the capacitance, the horizontal axis of the coordinate system represents the charging and discharging times, and the vertical axis represents a ratio of the current capacitance to the initial capacitance, as can be seen from fig. 15, after the charging and discharging for a plurality of times, the capacitance remains stable and changes little, that is, the supercapacitor 203 has better stability. Referring to fig. 16 and 17, which are comparative graphs of CV curves of the supercapacitor after stretching and bending, respectively, it can be seen from fig. 16 and 17 that the supercapacitor 203 has flexibility and the electrical properties thereof are hardly affected by the stretching or bending, regardless of whether the stretching or bending CV curves are substantially coincident.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.