阅读说明：本技术 用于固态蜡的贴片设备 (Patch device for solid wax ) 是由 胡小辉 于 2020-06-08 设计创作，主要内容包括：本发明公开了一种用于固态蜡的贴片设备,包括：滴蜡装置,用于向晶片的背面滴蜡；甩蜡装置,用于使晶片上的蜡融化并对晶片进行甩蜡；预贴片装置,用于将甩蜡后的晶片预定位于承载工件上；压附装置,用于对晶片和承载工件进行加压,从而使得晶片粘附在承载工件上,压附装置包括第三承载台和设置在第三承载台上方的压机模组,第三承载台用于承载预贴有晶片的承载工件,压机模组用于对承载工件上的晶片进行加压,第三承载台上设有第三加热机构和冷却机构,第三加热机构用于对承载工件和晶片之间的蜡进行加热,冷却机构用于对承载工件和晶片之间的蜡进行冷却。本方案具有节约固态蜡、省却吸蜡纸等耗材、提高生产效率、减少安装空间等优点。(The invention discloses a paster device for solid wax, which comprises: the wax dropping device is used for dropping wax to the back of the wafer; the wax throwing device is used for melting wax on the wafer and throwing the wax to the wafer; the pre-sticking device is used for presetting the wafer subjected to wax throwing on a bearing workpiece; the pressing and attaching device is used for pressing the wafer and the bearing workpiece, so that the wafer is adhered to the bearing workpiece, the pressing and attaching device comprises a third bearing table and a pressing machine module arranged above the third bearing table, the third bearing table is used for bearing the bearing workpiece with the wafer attached in advance, the pressing machine module is used for pressing the wafer on the bearing workpiece, a third heating mechanism and a cooling mechanism are arranged on the third bearing table, the third heating mechanism is used for heating wax between the bearing workpiece and the wafer, and the cooling mechanism is used for cooling the wax between the bearing workpiece and the wafer. This scheme has the solid-state wax of saving, saves consumptive materials such as wax paper, improves production efficiency, reduces advantages such as installation space.)

1. A die attachment apparatus for attaching a die to a work piece, comprising:

the wax dropping device is used for dropping wax to the back side of the wafer;

the wax throwing device is used for melting wax on the wafer and throwing the wax to the wafer;

the pre-pasting device is used for presetting the wafer subjected to wax throwing on the bearing workpiece;

the pressing and attaching device is used for pressing the wafer and the bearing workpiece so that the wafer is adhered to the bearing workpiece, and comprises a third bearing table and a pressing module arranged above the third bearing table, wherein the third bearing table is used for bearing the bearing workpiece to which the wafer is pre-attached, the pressing module is used for pressing the wafer on the bearing workpiece, a third heating mechanism and a cooling mechanism are arranged on the third bearing table, the third heating mechanism is used for heating wax between the bearing workpiece and the wafer, and the cooling mechanism is used for cooling the wax between the bearing workpiece and the wafer.

2. A patch device as claimed in claim 1, wherein the cooling mechanism comprises a plurality of water channels disposed within the third carrier and below the third heating mechanism, and pipes for inlet and/or outlet of water connected to the third carrier and communicating with the plurality of water channels.

3. A patch device as claimed in claim 2, wherein a plurality of said water reservoirs are interconnected.

4. A die set according to claim 1, wherein said press die set includes a plurality of press heads and a plurality of air cylinders in one-to-one correspondence with a plurality of said press heads, said plurality of press heads being in one-to-one correspondence with a plurality of said wafers on said carrier workpiece.

5. A chip device according to claim 4, wherein the indenter comprises a metal body and a silicon gel provided under the body for contacting the wafer.

6. A die bonding apparatus according to claim 1, wherein the press module presses the wafer for 5 to 6 minutes, the third heating mechanism is configured to heat the wax between the carrier workpiece and the wafer within the first 2 to 3 minutes of the press module pressing process, and the cooling mechanism is configured to cool the wax between the carrier workpiece and the wafer within the second 2 to 3 minutes of the press module pressing process.

7. The chip mounting device according to claim 1, wherein the pre-chip mounting device comprises a first chip taking mechanism, a second carrying table for carrying the carrying workpiece, a third driving mechanism and a fourth driving mechanism, the first chip taking mechanism is used for taking out the chips which are subjected to wax throwing from the wax throwing device and placing the chips on the carrying workpiece, the second carrying table comprises a movable module and a fixed module which are in clearance fit, a suction hole for sucking the carrying workpiece is formed in the movable module, the third driving mechanism is used for driving the movable module to ascend and descend, the fourth driving mechanism can drive the movable module to rotate after the movable module ascends so that the carrying workpiece can simultaneously carry a plurality of chips, and a second heating mechanism is arranged on the fixed module.

8. A chip device according to claim 7, wherein the first chip taking mechanism comprises a turning arm, a fifth driving mechanism for driving the turning arm to move between the wax throwing device and the second carrier, a sixth driving mechanism for driving the turning arm to turn, and a first picking unit arranged at a free end of the turning arm for picking up the chip.

9. A pick-and-place apparatus according to claim 8, further comprising a second pick-and-place mechanism for picking up the wafer after wax throwing from the wax throwing device and transferring the wafer to a position corresponding to the first pick-and-place unit.

10. The sheet sticking apparatus according to claim 9, wherein the sheet sticking apparatus includes two pre-sheet sticking devices and two pressing devices, the second sheet taking mechanism includes a guide rail and a second picking unit reciprocating along the guide rail, the two pre-sheet sticking devices are distributed on both sides of the guide rail along a long axis direction of the guide rail, and the two pressing devices and the two pre-sheet sticking devices are in one-to-one correspondence.

11. A patch device as claimed in claim 1, wherein the wafer is of sapphire, gallium arsenide or silicon carbide.

12. A patch device as claimed in claim 1, wherein the carrier workpiece is of ceramic material.

Technical Field

The invention relates to the technical field of photoelectron, in particular to a piece mounting device for solid wax.

Background

The manufacturing process of the LED chip needs to undergo a grinding and thinning process of the wafer, and the thinning process can facilitate subsequent chip cutting, packaging and die bonding and improve the heat dissipation performance of the chip in the using process. Before the thinning process, the wafer needs to be adhered to a specific workpiece surface for bearing, the side of the wafer which does not need to be ground is adhered to the bearing workpiece, the side of the wafer which needs to be ground and thinned (also called the back side of the wafer) is exposed, and in the LED chip process, the process of adhering the wafer is called a chip adhering process.

With the rapid development of the LED chip industry, automatic chip mounters have been vigorously developed to meet the increasing demand for productivity. Solid wax has been widely used in the chip mounting process of the wafer due to its good adhesion property.

The method adopted by the existing chip mounter for chip mounting is as follows: firstly, molten wax is dripped on a bearing workpiece, then the wafer is positioned on the bearing workpiece, and then the wafer and the bearing workpiece are pressurized and cooled to solidify the wax between the wafer and the bearing workpiece so as to fix the wafer on the bearing workpiece. However, when the conventional chip mounter mounts a chip on a wafer by using solid wax, the flowability of the solid wax is slightly poor, so that the wax content between the wafer and a bearing workpiece is not uniform, and the flatness of the adhered wafer is not good. In addition, in order to ensure that the contact surface between the wafer and the bearing workpiece has wax, usually, excessive wax is dropped on the bearing workpiece, and then the wafer and the bearing workpiece are pressed and attached, and meanwhile, the wax absorbing paper is adopted to absorb the excessive wax on the bearing workpiece, so that the use amount of solid wax and the use amount of consumables such as the wax absorbing paper are increased, and the control of the production cost is not facilitated.

Disclosure of Invention

To overcome the deficiencies in the prior art, embodiments of the present invention provide a patch device for solid wax that addresses at least one of the above-mentioned problems.

The embodiment of the application discloses: a die attachment apparatus for attaching a die to a work piece, comprising:

the wax dropping device is used for dropping wax to the back side of the wafer;

the wax throwing device is used for melting wax on the wafer and throwing the wax to the wafer;

the pre-pasting device is used for presetting the wafer subjected to wax throwing on the bearing workpiece;

the pressing and attaching device is used for pressing the wafer and the bearing workpiece so that the wafer is adhered to the bearing workpiece, and comprises a third bearing table and a pressing module arranged above the third bearing table, wherein the third bearing table is used for bearing the bearing workpiece to which the wafer is pre-attached, the pressing module is used for pressing the wafer on the bearing workpiece, a third heating mechanism and a cooling mechanism are arranged on the third bearing table, the third heating mechanism is used for heating wax between the bearing workpiece and the wafer, and the cooling mechanism is used for cooling the wax between the bearing workpiece and the wafer.

Specifically, the cooling mechanism comprises a plurality of water tanks arranged inside the third bearing table and positioned below the third heating mechanism, and pipelines connected to the third bearing table and communicated with the water tanks and used for water inlet and/or water outlet.

Specifically, the plurality of water tanks are communicated with each other.

Specifically, the press module comprises a plurality of press heads and a plurality of air cylinders which are in one-to-one correspondence with the plurality of press heads, and the plurality of press heads are in one-to-one correspondence with the plurality of wafers on the bearing workpiece.

Specifically, the indenter includes a metal body and a silicon gel provided below the body for contacting the wafer.

Specifically, the press module pressurizes the wafer for 5-6 minutes, the third heating mechanism is used for heating the wax between the bearing workpiece and the wafer within the first 2-3 minutes of the pressurizing process of the press module, and the cooling mechanism is used for cooling the wax between the bearing workpiece and the wafer within the last 2-3 minutes of the pressurizing process of the press module.

Specifically, the pre-pasting device comprises a first piece taking mechanism, a second bearing table, a third driving mechanism and a fourth driving mechanism, wherein the second bearing table, the third driving mechanism and the fourth driving mechanism are used for bearing a workpiece, the first piece taking mechanism is used for taking out the wafer after wax throwing from the wax throwing device and placing the wafer on the bearing workpiece, the second bearing table comprises a movable module and a fixed module which are in clearance fit, a suction hole used for sucking the bearing workpiece is formed in the movable module, the third driving mechanism is used for driving the movable module to lift, the fourth driving mechanism can drive the movable module to rotate after the movable module rises so that the bearing workpiece can bear a plurality of wafers simultaneously, and the fixed module is provided with a second heating mechanism.

Specifically, the first wafer taking mechanism comprises an overturning arm, a fifth driving mechanism for driving the overturning arm to move between the wax throwing device and the second bearing table, a sixth driving mechanism for driving the overturning arm to overturn, and a first picking unit arranged at the free end of the overturning arm to pick up the wafer.

Specifically, the chip mounting device further comprises a second chip taking mechanism, and the second chip taking mechanism is used for taking out the wafer subjected to wax throwing from the wax throwing device and conveying the wafer to a position corresponding to the first picking unit.

Specifically, the sheet sticking equipment comprises two pre-sheet sticking devices and two pressing and attaching devices, the second sheet taking mechanism comprises a guide rail and a second picking unit which reciprocates along the guide rail, the two pre-sheet sticking devices are distributed on two sides of the guide rail along the long axis direction of the guide rail, and the two pressing and attaching devices correspond to the two pre-sheet sticking devices one to one.

The invention has at least the following beneficial effects:

1. compared with the traditional chip mounting equipment for dropping wax on the bearing workpiece, the chip mounting equipment of the embodiment drops the melted solid wax on the back of the wafer and carries out wax throwing treatment on the wafer, so that the wax on the back of the wafer is uniformly distributed, the flatness of the attached wafer relative to the bearing workpiece is ensured to be good, and the grinding amount of each part of the back of the wafer can be uniform in the subsequent grinding process taking the surface of the bearing workpiece as a reference.

2. After the wax is thrown by the wax throwing device, the wax content on the back of the wafer is uniform and less, so that the phenomenon that redundant wax flows everywhere in the pressing and attaching step can be avoided, and consumables such as wax absorption paper and the like can be saved.

3. The paster equipment of this embodiment has the advantage that improves production efficiency, reduces installation space etc. and does benefit to reduction in production cost.

In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a patch device according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a schematic structural diagram of a wax dropping device according to an embodiment of the present invention;

FIG. 4 is a perspective view of the wax slinging device in an embodiment of the invention;

FIG. 5 is a top view of the wax slinging device in an embodiment of the invention;

FIG. 6 is a side view of a wax slinging device in an embodiment of the invention;

FIG. 7 is a schematic structural diagram of the first sheet taking mechanism in the embodiment of the present invention;

fig. 8 is a schematic structural diagram of the second carrier stage according to the embodiment of the present invention;

fig. 9 is a perspective view of the third carrier stage according to the embodiment of the present invention;

FIG. 10 is a front view of a third carrier table in accordance with an embodiment of the present invention;

FIG. 11 is a cross-sectional view taken at B-B of FIG. 10;

FIG. 12 is a cross-sectional view taken at C-C of FIG. 10;

fig. 13 is a schematic structural view of the press module according to the embodiment of the present invention.

Reference numerals of the above figures:

10. a wafer; 100. carrying a workpiece;

1. a wax dropping device; 11. a wax box; 12. a drip nozzle; 13. a first heating mechanism; 14. a support;

2. a wax throwing device; 21. a first carrier stage; 22. a first drive mechanism; 23. a second drive mechanism; 24. a protective cover; 25. a wax collecting box;

31. a first film taking mechanism; 311. a turning arm; 312. a fifth drive mechanism; 313. a sixth drive mechanism; 314. a first pickup unit;

32. a second carrier table; 321. a movable module; 322. fixing the module; 323. a second heating mechanism;

33. a third drive mechanism;

34. a fourth drive mechanism;

35. a seventh drive mechanism;

36. a top rod;

41. a third bearing table; 411. hanging the plate; 412. a bottom wall;

42. a press module; 421. a pressure head; 422. a cylinder;

43. a third heating mechanism;

441. a water tank; 442. a pipeline; 443. water inlet and outlet holes;

51. a guide rail; 52. a second pickup unit;

6. and a disk taking device.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1, the die attachment apparatus of the present embodiment is used to attach a wafer 10 to a workpiece 100, the wafer 10 may be made of sapphire, gallium arsenide, or silicon carbide, and the workpiece 100 may be a ceramic disk. Wherein, paster equipment includes:

the wax dropping device 1 is used for dropping wax to the back surface of the wafer 10, and the wax in this embodiment is solid wax.

And the wax throwing device 2 is used for melting the solid wax dropped on the wafer 10 and throwing the wax to the wafer 10 so that the melted wax can be uniformly coated on the back surface of the wafer 10.

The pre-pasting device is used for pre-positioning the wafer 10 after wax throwing on the bearing workpiece 100, and particularly, the pre-pasting device can enable the wafer 10 to be initially adhered on the bearing workpiece 100, and the adhering force between the wafer 10 and the bearing workpiece 100 is relatively small.

And a pressing device for pressing the wafer 10 and the supporting workpiece 100 so that the wafer 10 is adhered to the supporting workpiece 100, wherein the adhesion force between the wafer 10 pressed by the pressing device and the supporting workpiece 100 can ensure that the wafer 10 is not separated from the supporting workpiece 100 in the subsequent grinding process of the wafer 10.

By means of the structure, the chip mounting equipment in the embodiment has the following advantages:

1. compared with the conventional pasting device for dripping wax on the bearing workpiece 100, the pasting device of the embodiment drips the solid wax on the back of the wafer 10 and carries out wax throwing treatment on the wafer 10, so that the wax on the back of the wafer 10 is uniformly distributed, the flatness of the adhered wafer 10 relative to the bearing workpiece 100 is ensured to be good, and the grinding amount of all positions on the back of the wafer 10 can be uniform in the subsequent grinding process taking the surface of the bearing workpiece 100 as a reference.

2. After the wax is thrown by the wax throwing device 2, the wax content on the back of the wafer 10 is uniform and small, so that the phenomenon that redundant wax flows everywhere in the pressing and attaching step can be avoided, and consumables such as wax absorption paper and the like can be saved.

Specifically, as shown in fig. 3, the wax dropping device 1 may include a wax box 11, a dropping nozzle 12 communicating with the wax box 11, and a first heating mechanism 13 provided on the wax box 11 for heating the wax box 11. More specifically, the first heating mechanism 13 is mainly used to heat the wax box 11 near the nozzle 12, so that the solid wax stored in the wax box 11 can be melted into a liquid state and dropped onto the wafer 10.

Specifically, as shown in fig. 4 to 6, the wax throwing device 2 may include a first carrier 21 for carrying the wafer 10, a first driving mechanism 22 for driving the first carrier 21 to move up and down, a second driving mechanism 23 for driving the first carrier 21 to rotate, and a protective cover 24 covering the periphery of the first carrier 21. The first carrier 21 is provided with a suction hole (not shown) for sucking the wafer 10 to fix the wafer 10, and the first carrier 21 is correspondingly disposed below the nozzle 12 of the wax dropping device 1. The shield 24 may also be provided with a second heating mechanism 323 for maintaining the temperature of the wax on the wafer 10. The first driving mechanism 22 drives the first carrying table 21 to move up and down so as to take and place the wafer 10; the second driving mechanism 23 drives the first carrier table 21 to rotate so that the wax on the wafer 10 can be uniformly distributed on the back surface of the wafer 10 under the action of centrifugal force, specifically, the first carrier table 21 initially rotates at a speed of 100 rpm for 2-3 seconds so that the wax is uniformly distributed on the back surface of the wafer 10, and then the first carrier table 21 rotates at a speed of 3000 rpm for 4-5 seconds so as to finish the wax throwing action and avoid the use of consumables such as wax absorbing paper in the later processes; the protective cover 24 can avoid the wax from splashing around when the wax is thrown off, and preferably, a wax collecting box 25 for collecting the wax dropping from the inner wall of the protective cover 24 can be arranged below the protective cover 24. The wax dropping device 1 can also be provided with a bracket 14 for mounting the wax box 11, and the wax box 11 can also move along the bracket 14, so that the wax box 11 and the dropping nozzle 12 can be staggered with the wax throwing device 2, and the wax box 11, the dropping nozzle 12 and the wax throwing device 2 can be conveniently mounted, maintained and maintained.

Specifically, as shown in fig. 1 and 8, the pre-pasting device includes a first sheet taking mechanism 31, a second carrying table 32 for carrying and carrying the workpiece 100, a third driving mechanism 33, and a fourth driving mechanism 34. The first sheet taking mechanism 31 is used for taking the wafer 10 after wax throwing from the wax throwing device 2 and placing the wafer 10 on the bearing workpiece 100. The second supporting platform 32 includes a movable module 321 and a fixed module 322 in clearance fit, the movable module 321 is provided with a plurality of suction holes (not shown) for sucking the supporting workpiece 100 to fix the supporting workpiece, preferably, the movable module 321 may be circular, and the entire circumference of the movable module 321 is in clearance fit with the fixed module 322. The third driving mechanism 33 is used for driving the movable module 321 to move up and down, and the fourth driving mechanism 34 can drive the movable module 321 to rotate after the movable module 321 moves up, so that the workpiece 100 can simultaneously carry a plurality of wafers 10, thereby improving the working efficiency of the die-bonding apparatus. The fixing module 322 is provided with a second heating mechanism 323 for heating the workpiece 100 and the wafer 10 thereon.

With the above-mentioned scheme, the movable module 321 of the second carrier 32 in this embodiment can be lifted up and down along the vertical direction, when the workpiece 100 is to receive the current wafer 10, the movable module 321 can be lowered to make its end surface level with the end surface of the fixed module 322, when the workpiece 100 is to receive the next wafer 10, the movable module 321 can be lifted up and rotated to make the blank portion (the portion not attached with the wafer 10) on the workpiece 100 align with the first wafer taking mechanism 31, and then the movable module 321 is lowered to be level with the fixed module 322 to receive the wafer 10. Thus, the movable module 321 of the second carrier 32 only needs to rotate to drive the workpiece 100 thereon to rotate, the space required by the rotation of the movable module 321 is small, and the movable module 321 rotates after rising, so as to avoid interference with the fixed module 322. The second heating mechanism 323 can melt the wax on the back side of the wafer 10 at all times to improve the viscosity of the wafer 10 and the workpiece 100, and prevent the wafer 10 from warping and separating from the surface of the workpiece 100.

Further, referring to fig. 8, the pre-patch device may further include a seventh driving mechanism 35 and a plurality of lift pins 36, and the plurality of lift pins 36 may be uniformly distributed in the circumferential direction. When the movable module 321 of the second bearing table 32 is going to be lifted, the plurality of lift pins 36 can penetrate through the fixed module 322 of the second bearing table 32 under the driving of the seventh driving mechanism 35 to lift the bearing workpiece 100 upwards. Because the area of the workpiece 100 is usually large, the movable module 321 can stably drive the workpiece 100 to rise by using the ejector rod 36 to assist the ejection.

Specifically, as shown in fig. 7, the first pick-up mechanism 31 includes a flip arm 311, a fifth driving mechanism 312 for driving the flip arm 311 to move between the wax slinger 2 and the second carrier stage 32, a sixth driving mechanism 313 for driving the flip arm 311 to flip, and a first pick-up unit 314 disposed at a free end of the flip arm 311 to pick up the wafer 10. The first picking unit 314 may be provided with a suction hole (not shown) for sucking the wafer 10, when the flipping arm 311 moves to a position corresponding to the wax throwing device 2, one end of the first picking unit 314 away from the flipping arm 311 sucks the wafer 10 from the lower side of the wafer 10 (i.e. the side of the wafer 10 not coated with wax), and when the flipping arm 311 moves to a position corresponding to the second carrier table 32, the sixth driving mechanism 313 drives the flipping arm 311 to drive the first picking unit 314 to rotate above the carrier workpiece 100, at this time, the back side of the wafer 10 coated with wax on the first picking unit 314 faces the carrier workpiece 100, and the sixth driving mechanism 313 further drives the flipping arm 311 to attach the wafer 10 to the carrier workpiece 100.

Specifically, as shown in fig. 1 and 9, the press attachment device may include a third bearing table 41 and a press module 42 disposed above the third bearing table 41. The third carrier 41 is used for carrying the carrier 100 to which the wafer 10 is pre-attached, and the pressing module is used for pressing the wafer 10 on the carrier 100. The third stage 41 is provided with a third heating mechanism 43 and a cooling mechanism. In the conventional process, the wax heating and pressing process of the back surface of the wafer 10 are divided into two different processes, and the wafer 10 is easily warped during the process from the heating process to the pressing process, but by adopting the scheme in the embodiment, the heating and pressing cooling processes of the wafer 10 can be performed in the same device at the same station, so that the wafer 10 can be prevented from warping.

Further, as shown in fig. 9 to 12, the cooling mechanism includes a plurality of water tanks 441 disposed inside the third stage 41 and below the third heating mechanism 43, and a pipe 442 connected to the third stage 41 and communicating with the plurality of water tanks 441 for water inlet and/or outlet, and when wax on the back surface of the wafer 10 needs to be cooled, water may be introduced into the water tanks 441 through the pipe 442 connected to a water source for cooling, and when wax on the back surface of the wafer 10 needs to be heated, water in the water tanks 441 may be sucked through the pipe 442.

Further, as shown in fig. 9 to 12, the third stage 41 may include an upper plate 411 and a lower plate 412 which are vertically connected, a front surface of the upper plate 411 is used for supporting and supporting the workpiece 100, a rear surface of the upper plate 411 is abutted against a front surface of the lower plate 412, the pipeline 442 may be connected to the lower plate 412, and the lower plate 412 may be provided with a water inlet/outlet hole 443 for communicating the pipeline 442 with the water tank 441. A plurality of water tanks 441 and a third heating mechanism 43 may be provided on the upper tray 411, wherein the third heating mechanism 43 is provided on both side surfaces of the upper tray 411 and near the front surface of the upper tray 411, and a plurality of water tanks 441 are provided on the rear surface of the upper tray 411, the water tanks 441 can penetrate the rear surface of the upper tray 411 and be recessed toward the front surface of the upper tray 411, and the water tanks 441 do not penetrate both side surfaces and the front surface of the upper tray 411. To improve the efficiency of water inlet and outlet, the cooling mechanism may include two pipes 442, and thus, the lower plate 412 is also provided with two water inlet and outlet holes 443. Preferably, each water tank 441 may be circular, the circular water tanks 441 have different diameters but have their axes overlapped, and the water tanks 441 may be communicated with each other to improve water flow efficiency; two water inlet/outlet holes 443 may extend through a side surface of the lower plate 412 to extend toward the inside of the lower plate 412, wherein when one water inlet/outlet hole 443 extends to a position corresponding to the innermost water tank 441, the water inlet/outlet hole 443 is rotated to extend upward to extend through the front surface of the lower plate 412, and when the other water inlet/outlet hole 443 extends to a position corresponding to the outermost water tank 441, the water inlet/outlet hole 443 is rotated to extend upward to extend through the front surface of the lower plate 412, that is, one end of each of the two water inlet/outlet holes 443 extends through the side surface of the lower plate 412 to communicate with the pipe 442, and the other end extends through the front surface of the lower plate 412 to.

By adopting the above scheme, the water tanks 441 with the ring shapes in the embodiment are coaxially arranged on the back surface of the upper disc 411, and the water tanks 441 are communicated with each other, so that the area and the water flow speed of the water tanks 441 can be improved, the cooling speed can also be improved, and the opening direction of the water tanks 441 faces downwards, so that the water in the water tanks 441 can be quickly sucked away without influencing the heating of products, and the improvement of the production efficiency is facilitated.

Specifically, as shown in fig. 13, the press module 42 may include a plurality of pressing heads 421 and a plurality of air cylinders 422, and the plurality of air cylinders 422 and the plurality of pressing heads 421 are connected in a one-to-one correspondence. The number of the pressing heads 421 is the same as the number of the wafers 10 on the bearing workpiece 100, that is, each wafer 10 is pressed by one pressing head 421, so that the uniformity of the force applied to each wafer 10 can be improved, and the pressing effect can be improved. The indenter 421 may include a body and a silicon gel disposed under the body for the wafer 10 to contact, and the silicon gel may prevent the surface of the wafer 10 from being crushed or scratched. Preferably, the body is made of metal, for example aluminium. The press module 42 presses the wafer 10 for 5-6 minutes, the third heating mechanism 43 is used for heating the wax between the bearing workpiece 100 and the wafer 10 in the first 2-3 minutes of the pressing process of the press module 42, and the cooling mechanism is used for cooling the wax between the bearing workpiece 100 and the wafer 10 in the last 2-3 minutes of the pressing process of the press module 42. By adopting the scheme, the wax is heated in the pressurizing process, so that the fluidity of the wax can be improved, the wax on the back surface of the wafer 10 is ensured to be uniform, and the wafer 10 is pressurized in the cooling process, so that the wafer 10 can be prevented from warping.

Specifically, as shown in fig. 1 and 2, the die attachment apparatus in this embodiment may further include a second die taking mechanism, and the second die taking mechanism is configured to take the wafer 10 after wax throwing from the wax throwing device 2 and convey the wafer 10 to a position corresponding to the first picking unit 314 of the first die taking mechanism 31. Further, the second picking mechanism may include a guide rail 51 and a second picking unit 52 capable of moving along the guide rail 51, and after the second picking unit 52 removes the wafer 10 from the wax slinging device 2 and moves the wafer to a predetermined position, the first picking unit 314 sucks the wafer 10 from the second picking unit 52, so that the second picking unit 52 may include a U-shaped carrier, two sides of the U-shaped carrier are used for carrying the wafer 10, and the first picking unit 314 may penetrate upward from the middle of the U-shape to suck the wafer 10.

As shown in fig. 1, the sheet sticking apparatus in this embodiment may include two pre-sheet sticking devices and two pressing devices, the two pre-sheet sticking devices are distributed on two sides of the guide rail 51 along the long axis direction of the guide rail 51, and the two pressing devices and the two pre-sheet sticking devices correspond to each other one by one. Preferably, the two pre-sticking devices and the two pressing devices are arranged on the same side of the wax throwing device 2 along the feeding direction. The die bonding equipment can also comprise a disk taking device 6 for taking off the bonded wafer 10 and the bearing workpiece 100 from the two pressing devices, and the disk taking device 6 is arranged between the two pressing devices, so that the production efficiency can be improved, and the investment and the installation space of the equipment can be reduced.

Specifically, the first driving mechanism 22, the second driving mechanism 23, the third driving mechanism 33, the fourth driving mechanism 34, the fifth driving mechanism 312, the sixth driving mechanism 313 and the seventh driving mechanism 35 may each include a motor for providing a driving force to the driven object, and may further include a guide member cooperating with the motor for guiding the driven object, if necessary.

The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.