阅读说明：本技术 一种多超薄芯片封装设备 (Multi-ultrathin-chip packaging equipment ) 是由 窦晓梅 于 2020-06-24 设计创作，主要内容包括：本发明公开了一种多超薄芯片封装设备,包括芯片加工装置本体,所述芯片加工装置本体的顶部设置有壳体,所述壳体内腔的底部固定连接有电机一。本发明通过电机一驱动升降结构旋转,同时升降结构通过其内部电动升降杆的设置,起到了利用支杆带动旋转板和加工板升降的目的,在加工完成后,通过电机二带动加工板旋转,更是方便了使用者取用加工板顶部加工完成的芯片,方便了使用者进行二次加工,该多超薄芯片封装设备具备方便调节的优点,在实际使用过程中,结构简单合理,易于实现和维护,适合批量生产,提高了多超薄芯片封装设备的加工效率,方便了使用者使用,提高了多超薄芯片封装设备的实用性。(The invention discloses multi-ultrathin-chip packaging equipment which comprises a chip processing device body, wherein a shell is arranged at the top of the chip processing device body, and a first motor is fixedly connected to the bottom of an inner cavity of the shell. The lifting structure is driven to rotate by the first motor, meanwhile, the lifting structure achieves the purpose of utilizing the supporting rod to drive the rotating plate and the processing plate to lift through the arrangement of the electric lifting rod inside the lifting structure, after the processing is finished, the processing plate is driven to rotate by the second motor, a user can conveniently take a chip processed and finished at the top of the processing plate, secondary processing is facilitated for the user, the multi-ultrathin chip packaging equipment has the advantage of convenience in adjustment, and in the actual use process, the multi-ultrathin chip packaging equipment is simple and reasonable in structure, easy to realize and maintain, suitable for batch production, and capable of improving the processing efficiency of the multi-ultrathin chip packaging equipment, and convenient for the user to use, and the practicability of the multi-ultrathin chip packaging equipment is improved.)

1. The utility model provides a many ultra-thin chip package equipment, includes chip processingequipment body (1), its characterized in that: the top of chip processingequipment body (1) is provided with casing (2), the bottom fixedly connected with motor (3) of casing (2) inner chamber, the output shaft fixedly connected with elevation structure (4) of motor (3), the top of elevation structure (4) runs through to the inner chamber and the fixedly connected with rotor plate (5) of chip processingequipment body (1), the top swing joint of rotor plate (5) has processing board (6), the left side fixedly connected with motor case (7) of rotor plate (5) bottom, the bottom fixedly connected with motor two (8) of motor case (7) inner chamber, the output shaft of motor two (8) run through to the top of rotor plate (5) and with processing board (6) fixed connection.

2. The multi ultra-thin chip packaging apparatus of claim 1, wherein: lifting structure (4) include with motor (3) fixed connection's fixed pipe (41), the bottom fixedly connected with electric lift pole (42) of fixed pipe (41) inner chamber, the output end fixedly connected with fly leaf (43) of electric lift pole (42), the surface and the fixed pipe (41) swing joint of fly leaf (43), the top fixedly connected with branch (44) of fly leaf (43), the top of branch (44) run through to the top of chip processingequipment body (1) and with rotor plate (5) fixed connection.

3. The multi ultra-thin chip packaging apparatus of claim 2, wherein: the top of the fixed pipe (41) is provided with a through hole matched with the support rod (44), and the through hole is a circular hole with the diameter smaller than three centimeters.

4. The multi ultra-thin chip packaging apparatus of claim 1, wherein: and through holes matched with the second motor (8) are formed in the tops of the rotating plate (5) and the motor box (7), and the surfaces of the through holes are smooth.

5. The multi ultra-thin chip packaging apparatus of claim 2, wherein: spacing groove (45) have all been seted up to the both sides of fixed pipe (41) inner chamber, the inner chamber swing joint of spacing groove (45) has stopper (46), one side and fly leaf (43) fixed connection that spacing groove (45) were kept away from in stopper (46).

6. The multi ultra-thin chip packaging apparatus of claim 2, wherein: the chip processing device is characterized in that bases (9) are fixedly connected to four corners of the bottom of the chip processing device body (1), the bases (9) are circular, and anti-skid lines are arranged at the bottom of the bases (9).

7. The multi ultra-thin chip packaging apparatus of claim 2, wherein: the diameter of the shell (2) is not less than ten centimeters, and the depth of the shell (2) is not less than fifteen centimeters.

8. The multi ultra-thin chip packaging apparatus of claim 2, wherein: the central points of the first motor (3), the lifting structure (4), the rotating plate (5) and the processing plate (6) are all located on the same axis.

Technical Field

The invention relates to the technical field of chip packaging, in particular to multi-ultrathin chip packaging equipment.

Background

The package for mounting semiconductor integrated circuit chip is characterized by that it is a bridge for connecting chip internal world and external circuit, and the contacts on the chip are connected to pins of package shell by means of wires on the printed circuit board, so that the package can be used for connecting CPU and other LSI integrated circuits, and said package not only has the functions of mounting, fixing, sealing, protecting chip and raising heat-conducting property, but also is a bridge for connecting chip internal world and external circuit, and the contacts on the chip are connected to pins of package shell by means of wires, and these pins are connected with other devices by means of wires on the printed circuit board, and the chip-on-board technological process is firstly that the heat-conducting epoxy resin (generally using silver-particle-doped epoxy resin) is used on the surface of substrate Covering a silicon chip placing point, directly placing the silicon chip on the surface of a substrate, carrying out heat treatment until the silicon chip is firmly fixed on the substrate, and then directly establishing electrical connection between the silicon chip and the substrate by using a wire bonding method, wherein the bare chip technology mainly has two forms: one is COB technology, the other is flip-chip technology, chip-on-board packaging, semiconductor chips are cross-bonded on a printed wiring board, electrical connection of the chip and the substrate is achieved by a wire-stitch method, and is covered with resin to ensure reliability.

Many ultra-thin chip packaging equipment is one of the device commonly used in the chip packaging field, current many ultra-thin chip packaging equipment has the rotation angle of chip and the shortcoming of highly unable regulation when chip package adds man-hour in the use, the shortcoming of having caused many ultra-thin chip packaging equipment of current not convenient for processing and taking in the in-service use, be unfavorable for the user to use, the machining efficiency of many ultra-thin chip packaging equipment has been reduced, the lower shortcoming of many ultra-thin chip packaging equipment production efficiency has been caused, the practicality of many ultra-thin chip packaging equipment has been reduced.

Disclosure of Invention

The invention aims to provide multi-ultrathin chip packaging equipment which has the advantage of convenience in adjustment, and solves the problems that the rotation angle and the height of a chip cannot be adjusted when the chip is packaged and processed in the using process of the conventional multi-ultrathin chip packaging equipment, the conventional multi-ultrathin chip packaging equipment is inconvenient to process and take in the actual using process, the multi-ultrathin chip packaging equipment is not convenient for a user to use, the processing efficiency of the multi-ultrathin chip packaging equipment is reduced, the production efficiency of the multi-ultrathin chip packaging equipment is low, and the practicability of the multi-ultrathin chip packaging equipment is reduced.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a many ultra-thin chip encapsulation equipment, includes the chip processingequipment body, the top of chip processingequipment body is provided with the casing, the bottom fixedly connected with motor one of casing inner chamber, the output shaft fixedly connected with elevation structure of motor one, elevation structure's top is run through to the inner chamber and the fixedly connected with rotor plate of chip processingequipment body, the top swing joint of rotor plate has the processing board, the left side fixedly connected with motor case of rotor plate bottom, the bottom fixedly connected with motor two of motor case inner chamber, the output shaft of motor two run through to the top of rotor plate and with processing board fixed connection.

Preferably, the lifting structure includes a fixed pipe fixedly connected with a motor, an electric lifting rod is fixedly connected to the bottom of an inner cavity of the fixed pipe, a movable plate is fixedly connected to an output end of the electric lifting rod, the surface of the movable plate is movably connected with the fixed pipe, a supporting rod is fixedly connected to the top of the movable plate, and the top of the supporting rod penetrates through the top of the chip processing device body and is fixedly connected with the rotating plate.

Preferably, the top of the fixed pipe is provided with a through hole matched with the support rod, and the through hole is a circular hole with the diameter smaller than three centimeters.

Preferably, the top of the rotating plate and the top of the motor box are both provided with through holes matched with the motor, and the surfaces of the through holes are smooth.

Preferably, the limiting grooves are formed in two sides of the inner cavity of the fixed pipe, the inner cavity of each limiting groove is movably connected with a limiting block, and one side, far away from the limiting grooves, of each limiting block is fixedly connected with the movable plate.

Preferably, the four corners of the bottom of the chip processing device body are fixedly connected with bases, the bases are circular, and anti-skid lines are arranged at the bottoms of the bases.

Preferably, the diameter of the shell is not less than ten centimeters, and the depth of the shell is not less than fifteen centimeters.

Preferably, the central points of the first motor, the lifting structure, the rotating plate and the processing plate are all located on the same axis.

Compared with the prior art, the invention has the following beneficial effects:

1. the invention drives the lifting structure to rotate by the first motor, and simultaneously the lifting structure achieves the purpose of lifting the rotating plate and the processing plate by utilizing the support rod through the arrangement of the electric lifting rod inside the lifting structure, after the processing is finished, the processing plate is driven to rotate by the second motor, thereby being more convenient for a user to take a chip processed and finished at the top of the processing plate and being convenient for the user to carry out secondary processing. The defects that the existing multi-ultrathin chip packaging equipment is not convenient to process and take in the actual use process are caused, the use by a user is not facilitated, the processing efficiency of the multi-ultrathin chip packaging equipment is reduced, the defect that the production efficiency of the multi-ultrathin chip packaging equipment is lower is caused, and the problem of the practicability of the multi-ultrathin chip packaging equipment is reduced.

2. The invention has the advantages that the matching use of the fixed tube, the electric lifting rod, the movable plate and the support rod plays a role in driving the rotating plate and the processing plate to lift, on one hand, the matching effect on the processing structure of the multi-ultrathin chip packaging equipment is realized, on the other hand, the convenient taking effect is realized, the channel is provided for the up-and-down movement of the support rod through the arrangement of the through hole, the friction between the surface of the support rod and the fixed tube is avoided, the rotation resistance is reduced, the channel is provided for the output shaft of the motor II through the arrangement of the through hole, the friction between the surface of the output shaft of the motor II and the rotating plate and the motor box is avoided, the rotation resistance is reduced, the lifting of the movable plate is limited through the matching use of the limiting groove and the limiting block, the stability of the movable plate in the up-and-down movement is, through the setting of base, played the effect of increase chip processingequipment body and the effect of frictional force between the ground, improved the stability of chip processingequipment body.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a front sectional view of a part of the structure of the present invention.

In the figure: 1. a chip processing device body; 2. a housing; 3. a first motor; 4. a lifting structure; 41. a fixed tube; 42. an electric lifting rod; 43. a movable plate; 44. a strut; 45. a limiting groove; 46. a limiting block; 5. a rotating plate; 6. processing a plate; 7. a motor case; 8. a second motor; 9. a base.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 2, the present invention provides a technical solution: