阅读说明：本技术 一种pcb印制电路板加工用防偏移点胶装置 (Anti-deviation dispensing device for processing PCB (printed circuit board) ) 是由 龚剑波 于 2021-06-04 设计创作，主要内容包括：本发明公开了一种PCB印制电路板加工用防偏移点胶装置,包括机架、刮料组件、推料组件和抽气泵,所述机架的表面设置有输送带,且机架的顶部固定有安装架,所述安装块固定在收集盒的上方,且安装块的表面开设有限位槽,所述第二气缸固定在第二龙门架的两端,所述抽气泵固定在第二龙门架的顶部。该PCB印制电路板加工用防偏移点胶装置设置有第二气缸和弹簧,通过第二龙门架两端的第二气缸延伸可以带动横板以及活动板向输送带的内侧滑动,以便在输送过程中推动电路板的两侧,使电路板能够保持居中设置,从而避免在点胶过程中因电路板偏移而影响点胶质量,同时配合横板内部弹簧的弹力作用下可以避免因压力过大而损坏电路板,提高其实用性。(The invention discloses an anti-deviation dispensing device for processing a PCB (printed Circuit Board), which comprises a rack, a scraping component, a pushing component and an air pump, wherein a conveying belt is arranged on the surface of the rack, a mounting frame is fixed at the top of the rack, a mounting block is fixed above a collecting box, a limiting groove is formed in the surface of the mounting block, a second air cylinder is fixed at two ends of a second portal frame, and the air pump is fixed at the top of the second portal frame. This PCB printed circuit board processing is with preventing excursion dispensing device is provided with second cylinder and spring, the second cylinder through second portal frame both ends extends and to drive diaphragm and fly leaf and slide to the inboard of conveyer belt, so that promote the both sides of circuit board in transportation process, make the circuit board can keep setting placed in the middle, thereby avoid dispensing the in-process and influence the quality of gluing because of the circuit board skew, can avoid damaging the circuit board because of too big pressure under the spring action of cooperation diaphragm inside spring simultaneously, improve its practicality.)

1. The utility model provides a PCB printed circuit board processing is with preventing excursion dispensing device, includes frame (1), scrapes material subassembly (13), pushes away material subassembly (14) and aspiration pump (15), its characterized in that:

the surface of the rack (1) is provided with a conveying belt (2), the top of the rack (1) is fixed with a mounting rack (3), the left end and the right end of the rack (1) are respectively fixed with a first portal frame (4) and a second portal frame (5), the outer side of the mounting rack (3) is fixed with a first motor (6), the output end of the first motor (6) is connected with a first lead screw (7), the first lead screw (7) is rotatably connected above the inner side of the mounting rack (3), the surface of the first lead screw (7) is in threaded connection with a sliding block (8), the sliding block (8) is slidably connected at the top of the inner side of the mounting rack (3), a first air cylinder (9) is fixed below the sliding block (8), a glue dispensing device (10) is fixed at the bottom of the first air cylinder (9), a glue dispensing pipe (11) is arranged below the glue dispensing device (10), a collecting box (12) is fixed on the inner wall surface of the mounting rack (3);

the scraping assembly (13) used for cleaning the glue injection pipe (11) is arranged above the collecting box (12);

the pushing assemblies (14) for preventing the circuit board from deviating are arranged at two ends of the inner wall of the second portal frame (5);

the air suction pump (15) is fixed at the top of the second portal frame (5), the air suction pump (15) is respectively connected with the collection box (16) and the fixed plate (17) through the conveying pipe, the collection box (16) is fixed at the top of the second portal frame (5), the fixed plate (17) is fixed at the top of the inner side of the second portal frame (5), a dust suction nozzle (18) is arranged below the fixed plate (17), the outer side of the first portal frame (4) is fixed with the second motor (19), the output end of the second motor (19) is connected with the second lead screw (20), the second lead screw (20) is rotatably connected above the inner side of the first portal frame (4), two ends of the second lead screw (20) are in threaded connection with the movable blocks (21), the movable blocks (21) are in sliding connection with the top of the inner side of the first portal frame (4), the lower part of the movable blocks (21) is rotatably connected with the connecting rod (22), the bottom of the connecting rod (22) is connected with the movable plate (23), and the lower surface of the movable plate (23) is provided with a heating wire (24).

2. The offset-preventing dispensing device for processing the PCB as claimed in claim 1, wherein: the scraping assembly (13) comprises an installation block (1301), a limiting groove (1302), a scraping plate (1303) and a heater (1304), the installation block (1301) is fixed above the collection box (12), the limiting groove (1302) is formed in the surface of the installation block (1301), the scraping plate (1303) is fixed to two ends of the inner wall of the limiting groove (1302), and the heater (1304) is fixed to two ends of the outer side of the installation block (1301).

3. The offset-preventing dispensing device for processing the PCB as claimed in claim 1, wherein: the material pushing assembly (14), the second cylinder (1401), the transverse plate (1402), the spring (1403), the movable plate (1404) and the pulley (1405), the second cylinder (1401) is fixed at two ends of the second portal frame (5), the transverse plate (1402) is fixed on the inner side of the second portal frame (5) in a penetrating mode of the second cylinder (1401), the spring (1403) is fixed inside the transverse plate (1402), the spring (1403) is connected with the movable plate (1404), and the pulley (1405) is arranged on the outer side surface of the movable plate (1404) simultaneously.

4. The offset-preventing dispensing device for processing the PCB as claimed in claim 1, wherein: the first screw rod (7), the sliding block (8), the first air cylinder (9) and the glue dispensing device (10) jointly form a sliding mechanism.

5. The offset-preventing dispensing device for processing the PCB as claimed in claim 1, wherein: the dust suction nozzles (18) are arranged in a plurality of groups at equal intervals.

6. The offset-preventing dispensing device for processing the PCB as claimed in claim 1, wherein: the connecting rod (22) is rotatably connected with the movable block (21) and the movable plate (23).

7. The offset-preventing dispensing device for processing the PCB as claimed in claim 2, wherein: the inner diameter of the limiting groove (1302) is the same as the outer diameter of the glue injection pipe (11), and the highest height of the glue injection pipe (11) is located on the same horizontal line with the limiting groove (1302).

8. The offset-preventing dispensing device for processing the PCB as claimed in claim 2, wherein: the heaters (1304) are arranged in two groups and are symmetrically arranged.

9. The offset-preventing dispensing device for processing the PCB as claimed in claim 3, wherein: the second cylinder (1401) and the transverse plate (1402) are both provided with two groups, and the two groups are symmetrically arranged.

Technical Field

The invention relates to the technical field related to PCB (printed circuit board) processing, in particular to an anti-offset dispensing device for PCB processing.

Background

Printed circuit boards are one of the important components in the electronic industry, almost every kind of electronic equipment, small electronic watches, calculators, computers, communication electronic equipment, military weapon systems, as long as there are electronic components such as integrated circuits, etc., printed circuit boards are used for electrically interconnecting the components, and epoxy resin glue is injected to the surface of the printed circuit board to fix the electronic components during the processing of the printed circuit board.

The most of current dispensing device brings to carry the point to the circuit board through carrying and glues, and the staff makes the position of circuit board take place the skew when placing the circuit board easily, thereby influence the quality of gluing, and because the surface of circuit board adheres to the dust because of static easily, current dispensing device is not convenient for clear up the surface of circuit board before the point is glued, make the dust influence point effect of gluing easily, and current dispensing device can remain partial surplus glue in the bottom of injecting glue pipe after the point is glued, and the surplus glue solidifies the back then can cause certain influence to the play glue flow, can make the phenomenon of wire drawing appear in the glue solution at follow-up injecting glue in-process simultaneously, be not convenient for clear up surplus glue.

Disclosure of Invention

The invention aims to provide an anti-offset dispensing device for processing a PCB (printed circuit board), which solves the problems that the position of the circuit board is easy to offset by the existing dispensing device in the background art, so that the dispensing quality is influenced, the surface of the circuit board is inconvenient to clean before dispensing, and the residual glue is inconvenient to clean.

In order to achieve the purpose, the invention provides the following technical scheme: an anti-offset dispensing device for processing a PCB (printed Circuit Board) comprises a frame, a scraping component, a pushing component and an air pump,

the automatic glue dispensing device comprises a rack, a conveying belt, a mounting frame, a first lead screw, a second lead screw, a slider, a first air cylinder, a glue dispensing device, a glue injection pipe and a collecting box, wherein the conveying belt is arranged on the surface of the rack, the mounting frame is fixed to the top of the rack, the first portal frame and the second portal frame are respectively fixed to the left end and the right end of the rack, the first motor is fixed to the outer side of the mounting frame, the output end of the first motor is connected with the first lead screw, the first lead screw is rotatably connected to the upper portion of the inner side of the mounting frame, the slider is connected to the top of the inner side of the mounting frame in a sliding mode, the first air cylinder is fixed to the lower portion of the slider, the glue dispensing device is fixed to the bottom of the first air cylinder, the glue injection pipe is arranged below the glue dispensing device, and the collecting box is fixed to the surface of the inner wall of the mounting frame;

the scraping assembly for cleaning the glue injection pipe is arranged above the collecting box;

the pushing assemblies for preventing the circuit board from deviating are arranged at two ends of the inner wall of the second portal frame;

the utility model discloses a portable air suction device, including first portal frame, aspiration pump, collecting box, fixed plate, dust absorption mouth, movable block, connecting rod, movable block, air suction pump, collecting box, fixed plate, dust absorption mouth, movable block, air suction pump, collecting box and fixed plate, the top at the second portal frame is fixed to the air suction pump, and the air suction pump is connected with collecting box and fixed plate respectively through the conveyer pipe, and the collecting box is fixed at the top of second portal frame simultaneously, the outside of first portal frame is fixed with the second motor, and the output of second motor is connected with the second lead screw, the second lead screw rotates the inboard top of connecting at first portal frame, and the both ends threaded connection of second lead screw has the movable block, and movable block sliding connection is at the inboard top of first portal frame simultaneously, the below of movable block rotates and is connected with the connecting rod, and the bottom of connecting rod is connected with the fly leaf, and the lower surface of fly leaf is provided with the heater strip simultaneously.

Preferably, the scraping component comprises an installation block, a limiting groove, a scraping plate and a heater, the installation block is fixed above the collection box, the limiting groove is formed in the surface of the installation block, the scraping plate is fixed at two ends of the inner wall of the limiting groove, and the heater is fixed at two ends of the outer side of the installation block.

Preferably, the pushing assembly, the second cylinder, the transverse plate, the spring, the movable plate and the pulley are arranged, the second cylinder is fixed at two ends of the second portal frame, the transverse plate is fixed on the inner side of the second portal frame through which the second cylinder penetrates, the spring is fixed inside the transverse plate and connected with the movable plate, and the pulley is arranged on the outer side surface of the movable plate.

Preferably, the first screw rod, the slide block, the first air cylinder and the glue dispensing device together form a sliding mechanism.

Preferably, the dust suction nozzles are provided with a plurality of groups which are arranged at equal intervals.

Preferably, the connecting rod is rotatably connected with the movable block and the movable plate.

Preferably, the inner diameter of the limiting groove is the same as the outer diameter of the glue injection pipe, and the highest height of the glue injection pipe and the limiting groove are located on the same horizontal line.

Preferably, the heaters are arranged in two groups and are symmetrically arranged.

Preferably, the second cylinder and the transverse plate are both provided with two groups, and the two groups are symmetrically arranged.

Compared with the prior art, the invention has the beneficial effects that: the anti-offset dispensing device for processing the PCB,

(1) the second cylinders at the two ends of the second portal frame extend to drive the transverse plate and the movable plate to slide towards the inner side of the conveying belt, so that the two sides of the circuit board are pushed in the conveying process, the circuit board can be kept in a centered arrangement, the influence on the dispensing quality caused by the deviation of the circuit board in the dispensing process is avoided, meanwhile, the circuit board can be prevented from being damaged due to overlarge pressure under the action of the elasticity of the springs in the transverse plate, and the practicability of the circuit board is improved;

(2) the suction pump at the top of the second gantry can enable a plurality of groups of dust suction nozzles on the surface of the fixed plate at the top of the inner side of the second gantry to generate suction so as to adsorb and clean dust attached to the surface of the circuit board in the conveying process of the circuit board, and thus the subsequent dispensing quality of the circuit board is improved;

(3) the glue spreading device is provided with a scraping plate and a heater, after glue spreading, the sliding block can be rotated by the first lead screw to move, so that the sliding block drives the glue spreading device and the glue injection pipe to move into the limiting groove on the inner side of the mounting frame, residual glue on the surface of the glue injection pipe is cleaned by the scraping plates at two ends of the inner wall of the limiting groove, the subsequent glue spreading effect is prevented from being influenced by the residual glue, meanwhile, the glue injection pipe can be heated after the glue spreading by the heaters at two ends of the mounting frame, the glue injection pipe is kept in a constant temperature state, the blocking caused by the solidification of the glue solution inside is avoided, and the functionality of the glue injection pipe is improved;

(4) be provided with movable block and connecting rod, can heat the glue solution on circuit board surface after the point is glued through the heater strip on the inboard movable plate surface of first portal frame and dry to improve the efficiency that the glue solution solidifies, still can rotate through the second lead screw simultaneously and drive two sets of movable blocks and move the slip in opposite directions or dorsad, make and to drive the fly leaf and heater strip through the connecting rod on two sets of movable block surfaces and rise or descend height-adjusting position, so that adjust the temperature when drying.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a side view of the mounting bracket of the present invention;

FIG. 3 is a schematic top view of the mounting block of the present invention;

FIG. 4 is a schematic side view of a second portal frame according to the present invention;

FIG. 5 is a schematic top view of a cross-sectional structure of the present invention;

fig. 6 is a schematic side view of a first portal frame according to the present invention.

In the figure: 1. the automatic glue injection machine comprises a rack, 2, a conveying belt, 3, a mounting frame, 4, a first portal frame, 5, a second portal frame, 6, a first motor, 7, a first screw rod, 8, a sliding block, 9, a first air cylinder, 10, a glue dispensing device, 11, a glue injection pipe, 12, a collection box, 13, a scraping component, 1301, a mounting block, 1302, a limiting groove, 1303, a scraping plate, 1304, a heater, 14, a material pushing component, 1401, a second air cylinder, 1402, a transverse plate, 1403, a spring, 1404, a movable plate, 1405, a pulley, 15, an air suction pump, 16, a collection box, 17, a fixed plate, 18, a dust suction nozzle, 19, a second motor, 20, a second screw rod, 21, a movable block, 22, a connecting rod, 23, a movable plate, 24 and a heating wire.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution: an anti-offset dispensing device for processing a PCB (printed Circuit Board), as shown in figures 1, 2 and 3, a conveyor belt 2 is arranged on the surface of a frame 1, a mounting frame 3 is fixed on the top of the frame 1, a first portal frame 4 and a second portal frame 5 are respectively fixed at the left end and the right end of the frame 1, a first motor 6 is fixed on the outer side of the mounting frame 3, the output end of the first motor 6 is connected with a first lead screw 7, the first lead screw 7 is rotatably connected above the inner side of the mounting frame 3, a slider 8 is in threaded connection with the surface of the first lead screw 7, the slider 8 is in sliding connection with the top of the inner side of the mounting frame 3, a first air cylinder 9 is fixed below the slider 8, a dispensing device 10 is fixed at the bottom of the first air cylinder 9, a glue injection pipe 11 is arranged below the dispensing device 10, the first lead screw 7, the slider 8, the first air cylinder 9 and the dispensing device 10 jointly form a sliding mechanism, the first motor 6 outside the mounting rack 3 drives the first screw rod 7 to rotate, so that the first screw rod 7 drives the sliding block 8 on the surface of the first screw rod to slide left and right on the inner side of the mounting rack 3, so that the sliding block 8 drives the glue dispensing device 10 and the glue injection pipe 11 to move and adjust the position, so as to perform the glue dispensing operation, the collecting box 12 is fixed on the inner wall surface of the mounting rack 3, the scraping component 13 for cleaning the glue injection pipe 11 is arranged above the collecting box 12, the scraping component 13 comprises a mounting block 1301, a limiting groove 1302, a scraping plate 1303 and a heater 1304, the mounting block 1301 is fixed above the collecting box 12, the limiting groove 1302 is arranged on the surface of the mounting block 1301, the scraping plates 1303 are fixed at two ends of the inner wall of the limiting groove 1302, the inner diameter of the limiting groove 1302 is the same as the outer diameter of the glue injection pipe 11, the highest height of the glue injection pipe 11 is on the same horizontal line with the limiting groove, after the glue dispensing is finished, the pressure of the first air cylinder 9 can be released, so that the first air cylinder can drive the glue dispensing device 10 and the glue injection pipe 11 to ascend, the cooperation first lead screw 7 rotates and drives slider 8 and injecting glue pipe 11 and slides in to the spacing groove 1302 on installation piece 1301 surface, so that scrape flitch 1303 through spacing groove 1302 inner wall both ends and clear up the remaining glue on injecting glue pipe 11 surface, thereby avoid causing the influence to the injecting glue effect after the remaining glue solidifies, the surplus glue of scraping then can fall into and collect in the collection box 12 of installation piece 1301 below, heater 1304 is fixed at the outside both ends of installation piece 1301, heater 1304 is provided with two sets ofly, and its symmetry sets up, can heat it when injecting glue pipe 11 is cleared up after the injecting glue finishes through heater 1304 at installation piece 1301 both ends, make injecting glue pipe 11 keep the constant temperature state, thereby avoid injecting glue pipe 11 inside glue solution to solidify and cause the jam, improve its functionality.

As shown in fig. 1, 4 and 5, the pushing assemblies 14 for preventing the circuit board from deviating are disposed at two ends of an inner wall of the second portal frame 5, the pushing assemblies 14, the second cylinders 1401, the horizontal plate 1402, the springs 1403, the movable plate 1404 and the pulleys 1405 are disposed, the second cylinders 1401 are fixed at two ends of the second portal frame 5, the horizontal plate 1402 is fixed on the second cylinders 1401 penetrating through the inner side of the second portal frame 5, the springs 1403 are fixed inside the horizontal plate 1402, the springs 1403 are connected to the movable plate 1404, the pulleys 1405 are disposed on the outer surface of the movable plate 1404, the two sets of the second cylinders 1401 and the horizontal plate 1402 are symmetrically disposed, the two sets of the horizontal plates 1402 and the movable plate 1404 are driven by the second cylinders 1401 disposed at two sides of the second portal frame 5 to slide toward one end of the central axis of the conveyor belt 3, so that two sides of the circuit board can be pushed during the process of conveying the circuit board, and the circuit board can be conveniently centered on the conveyor belt 3, thereby avoid appearing the skew because of the circuit board and influencing the injecting glue quality, improve its practicality, can avoid damaging because of the too big both sides that lead to the circuit board of pressure appear under the elastic force effect of the inside spring 1403 of cooperation diaphragm 1402, improve its functionality.

As shown in fig. 1 and 6, an air pump 15 is fixed on the top of the second portal frame 5, the air pump 15 is respectively connected with a collection box 16 and a fixing plate 17 through a conveying pipe, the collection box 16 is fixed on the top of the second portal frame 5, the fixing plate 17 is fixed on the top of the inner side of the second portal frame 5, a dust suction nozzle 18 is arranged below the fixing plate 17, the dust suction nozzles 18 are arranged in multiple groups and are arranged at equal intervals, the air pump 15 can enable the dust suction nozzle 18 on the surface of the fixing plate 17 on the top of the inner side of the second portal frame 5 to generate suction force so as to adsorb and clean dust on the surface of a circuit board in the conveying process of the circuit board, thereby improving the subsequent glue injection quality, a second motor 19 is fixed on the outer side of the first portal frame 4, the output end of the second motor 19 is connected with a second lead screw 20, the second lead screw 20 is rotatably connected above the inner side of the first portal frame 4, the two ends of the second screw rod 20 are connected with movable blocks 21 through threads, the movable blocks 21 are connected to the top of the inner side of the first portal frame 4 in a sliding manner, a connecting rod 22 is rotatably connected below the movable blocks 21, the bottom of the connecting rod 22 is connected with a movable plate 23, a heating wire 24 is arranged on the lower surface of the movable plate 23, the connecting rod 22 is rotatably connected with the movable blocks 21 and the movable plate 23, the glue solution can be dried after the glue is dispensed on the circuit board through the heating wire 24 on the surface of the movable plate 23, so that the solidification speed of the glue solution is increased, meanwhile, the second screw rod 20 can be driven to rotate by a second motor 19 on the outer side of the first portal frame 4, so that the second screw rod 20 drives the two groups of movable blocks 21 to move oppositely or reversely, so that the movable blocks 21 drive the top of the connecting rod 22 to rotate, and the movable plate 23 and the heating wire 24 are driven by the connecting rod 22 to adjust the height position upwards or downwards, so as to adjust the drying temperature.

The working principle is as follows: when the anti-deviation dispensing device for processing the PCB is used, firstly, a circuit board to be dispensed is arranged on the right side of the conveying belt 2, when the circuit board is conveyed to the lower part of a second portal frame 5 on the right side of the frame 1, two groups of transverse plates 1402 and movable plates 1404 can be driven by second air cylinders 1401 on two sides of the second portal frame 5 to push two sides of the circuit board, so that the circuit board can be arranged on the conveying belt 3 in the middle, the damage to the circuit board due to overlarge pressure can be avoided under the action of the elastic force of springs 1403 in the transverse plates 1402, then, a suction pump 15 on the top of the second portal frame 5 can be used for enabling a fixed plate 17 surface dust suction nozzle 18 on the top of the inner side of the second portal frame 5 to generate suction force so as to suck dust attached to the surface of the circuit board into a collecting box 16, then the conveying belt 3 can drive the circuit board to be conveyed to the lower part of the mounting frame 3, a first motor 6 on the outer side of the mounting frame 3 is opened to drive a first screw rod 7 to rotate, the first screw 7 drives the slide block 8 and the first air cylinder 9 to slide, so as to adjust the positions of the glue dispensing device 10 and the glue injection pipe 11 at the bottom of the first air cylinder 9 to perform glue dispensing operation on the circuit board, after the glue dispensing operation is completed, the first air cylinder 9 can be decompressed to drive the glue dispensing device 10 and the glue injection pipe 11 to ascend, meanwhile, the first motor 6 drives the first screw 7 to rotate, so that the first screw 7 drives the slide block 8 and the glue injection pipe 11 to slide into the limiting groove 1302 on the surface of the mounting block 1301, residual glue on the surface of the glue injection pipe 11 can be cleaned through the scraping plates 1303 at the two ends of the inner wall of the limiting groove 1302, the scraped residual glue can fall into the collecting box 12 below the mounting block 1301 to be collected, meanwhile, the heaters 1304 at the two ends of the mounting block 1301 can heat the glue injection pipe 11 after the glue injection is finished, and blockage caused by glue solidification inside the glue injection pipe 11 is avoided, then the conveyer belt 3 will drive the circuit board to move to the left of the frame 1 below the first portal frame 4, the heating wire 24 on the surface of the movable plate 23 can heat and dry the glue solution on the surface of the circuit board, so as to improve the efficiency of glue solution solidification, when the height position of the heating wire 24 needs to be adjusted, at first, the second motor 19 on the outer side of the first portal frame 4 is opened to drive the second screw rod 20 to rotate, the second screw rod 20 drives the two sets of movable blocks 21 to slide in opposite directions or in a back-to-back direction, so as to drive the movable plate 23 and the heating wire 24 to adjust the height position upwards or downwards by matching with the connecting rod 22 indicated by the movable blocks 21, after drying, the worker can take out the circuit board from the left of the frame 1, and the whole operation is completed, and the content not described in detail in the present specification belongs to the prior art known by the professional skilled in the art.

The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for simplicity of description only and are not intended to indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operative in a particular orientation, and are not to be considered limiting of the claimed invention.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.