阅读说明：本技术 一种光模块 (Optical module ) 是由 张加傲 王欣南 于 2020-04-22 设计创作，主要内容包括：本申请公开了一种光模块,包括电路板；光发射组件,与电路板电连接,用于发射光信号；光接收组件,用于接收来自光模块外部的光信号；柔性板,用于连接光接收组件与电路板；其中,光接收组件包括：壳体；光接收器件,设置在壳体内,用于接收外部光纤的光信号；跨阻放大器,设置在插入壳体的柔性板表面上,与光接收器件连接,并通过柔性板与电路板电连接,用于将放大后的电信号传送至电路板。本申请提供的光模块将光接收组件集成在柔性板上,再通过柔性板将光接收组件连接至电路板上,避免了发射端与接收端的芯片均集成在电路板上,通过外接柔性板从空间上分离了收发芯片的距离,运用空间隔离、位置隔离等手段,在根本上解决了电路串扰的问题。(The application discloses an optical module, which comprises a circuit board; the light emitting component is electrically connected with the circuit board and used for emitting light signals; the optical receiving assembly is used for receiving an optical signal from the outside of the optical module; a flexible board for connecting the light receiving assembly and the circuit board; wherein, the light receiving component includes: a housing; the optical receiving device is arranged in the shell and used for receiving an optical signal of the external optical fiber; and the transimpedance amplifier is arranged on the surface of the flexible board inserted into the shell, is connected with the light receiving device, is electrically connected with the circuit board through the flexible board and is used for transmitting the amplified electric signal to the circuit board. The optical module that this application provided is integrated on the flexible board with the light receiving component, and the rethread flexible board is connected to the light receiving component on the circuit board, has avoided the chip of transmitting terminal and receiving terminal all to integrate on the circuit board, has separated the distance of receiving and dispatching chip from the space through external flexible board, and means such as application space isolation, position isolation have solved the problem that the circuit is crosstalked fundamentally.)

1. A light module, comprising:

a circuit board;

the light emitting component is electrically connected with the circuit board and is used for emitting a light signal;

the optical receiving assembly is used for receiving an optical signal from the outside of the optical module;

a flexible board for connecting the light receiving assembly and the circuit board;

wherein the light receiving assembly includes:

a housing;

the light receiving device is arranged in the shell and used for receiving the light signal of the external optical fiber;

the transimpedance amplifier is arranged on the surface of the flexible board inserted into the shell, is electrically connected with the light receiving device, is electrically connected with the circuit board through the flexible board and is used for transmitting the amplified electric signal to the circuit board.

2. The optical module of claim 1, wherein a substrate is provided in the housing for supporting a flexible board inserted into the housing.

3. The optical module of claim 2, wherein the housing comprises a package and a cover plate that is pressed over the package,

a first slot is formed in one side plate of the packaging shell adjacent to the cover plate, and the flexible plate is inserted into the shell through the first slot; and a second slot is arranged on the side plate opposite to the side plate where the first slot is positioned, and the light receiving device is inserted into the shell through the second slot.

4. The optical module according to claim 3, wherein a mounting groove is formed on a bottom plate of the package housing, the mounting groove corresponds to the first slot, and the substrate is embedded in the mounting groove.

5. The optical module according to claim 3, wherein when a plurality of transimpedance amplifiers are provided on a surface of the flexible board inserted into the housing, a plurality of second slots are provided side by side on a side board opposite to a side board where the first slot is located, and a plurality of light receiving devices are inserted into the housing through the plurality of second slots.

6. The optical module according to claim 5, wherein when a plurality of light receiving devices are provided in the housing, the optical module is provided with a plurality of light emitting modules, and the plurality of light emitting modules are electrically connected to the circuit board, respectively.

7. The optical module according to claim 4, wherein an observation hole is provided on a side plate of the housing connecting the side plate of the first slot and the side plate of the second slot, and the position of the observation hole corresponds to the inner wall of the mounting groove.

8. The optical module according to claim 1, wherein a side of the flexible board facing the circuit board is provided with a wiring layer through which the plurality of transimpedance amplifiers are connected to the circuit board;

and a power supply wiring layer is arranged below the wiring layer and is arranged on one side of the transimpedance amplifier.

9. A light module, comprising:

a circuit board;

the light emitting component is electrically connected with the circuit board and is used for emitting a light signal;

the optical receiving assembly is used for receiving an optical signal from the outside of the optical module;

a flexible board for connecting the light receiving assembly and the circuit board;

wherein the light receiving assembly includes:

a housing;

the light receiving device is arranged in the shell and used for receiving the light signal of the external optical fiber;

a base plate disposed within the housing for supporting a flexible board inserted into the housing;

the transimpedance amplifier is arranged on the surface of the substrate through a mounting hole arranged on the flexible board, is electrically connected with the light receiving device, is electrically connected with the circuit board through the flexible board and is used for transmitting the amplified electric signal to the circuit board.

10. The optical module according to claim 9, wherein when a plurality of light receiving devices are provided in the housing, a plurality of mounting holes are provided in parallel on the flexible board inserted into the housing, and a plurality of the transimpedance amplifiers are mounted on a surface of the substrate through the plurality of mounting holes.

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

The optical module is mainly used for photoelectric and electro-optical conversion, an electric signal is converted into an optical signal by a transmitting end of the optical module and is transmitted out through an optical fiber, and a received optical signal is converted into an electric signal by a receiving end of the optical module. The current packaging form of the optical module mainly includes a TO (Transistor-out) package and a COB (Chip on Board) package.

In the high-speed optical modules adopted in the existing data center, a micro-optical COB packaging scheme is mostly adopted, the chips of a transmitting end and a receiving end are integrated on a PCB (printed circuit board) under the common condition of the optical modules adopting the COB scheme, most of receiving and transmitting chips are integrated on one surface of the PCB, particularly, the receiving and transmitting of the high-speed 200G optical modules have 8 channels, and the transmitting channels and the receiving channels on the PCB are very close to each other. In this case, since the power of the transmitting end is much larger than that of the receiving end and the circuit wirings are adjacent to each other, a case of circuit crosstalk is very easily generated. When solving the problem of circuit crosstalk, the industry generally adopts a mode of using a ground wire as an interval for shielding, namely, the ground wire is used for separating a transmitting chip and a receiving chip on a PCB (printed circuit board) so as to shield the circuit crosstalk between a transmitting end and a receiving end.

However, when the above method is adopted, the space layout is compact, even if the receiving and transmitting chips on the PCB are separated by the ground wire, the channel wiring distance between the transmitting chip and the receiving chip is still short, and the circuit crosstalk between the receiving and transmitting terminals cannot be completely solved.

Disclosure of Invention

The application provides an optical module to solve the problem that circuit crosstalk is caused due to the fact that the channel wiring distance is short between receiving and transmitting chips on a PCB of the existing optical module.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

in a first aspect, an embodiment of the present application discloses an optical module, including:

a circuit board;

the light emitting component is electrically connected with the circuit board and is used for emitting a light signal;

the optical receiving assembly is used for receiving an optical signal from the outside of the optical module;

a flexible board for connecting the light receiving assembly and the circuit board;

wherein the light receiving assembly includes:

a housing;

the light receiving device is arranged in the shell and used for receiving the light signal of the external optical fiber;

the transimpedance amplifier is arranged on the surface of the flexible board inserted into the shell, is electrically connected with the light receiving device, is electrically connected with the circuit board through the flexible board and is used for transmitting the amplified electric signal to the circuit board.

In a second aspect, an embodiment of the present application further discloses an optical module, including:

a circuit board;

the light emitting component is electrically connected with the circuit board and is used for emitting a light signal;

the optical receiving assembly is used for receiving an optical signal from the outside of the optical module;

a flexible board for connecting the light receiving assembly and the circuit board;

wherein the light receiving assembly includes:

a housing;

the light receiving device is arranged in the shell and used for receiving the light signal of the external optical fiber;

a base plate disposed within the housing for supporting a flexible board inserted into the housing;

the transimpedance amplifier is arranged on the surface of the substrate through a mounting hole arranged on the flexible board, is electrically connected with the light receiving device, is electrically connected with the circuit board through the flexible board and is used for transmitting the amplified electric signal to the circuit board.

In the optical module provided by the application, the light emitting assembly is electrically connected with the circuit board, the light receiving assembly is integrated on the flexible board, and the light receiving assembly is connected to the circuit board through the flexible board, so that the light emitting assembly and the light receiving assembly are prevented from being integrated on the PCB, a large amount of space is saved for the PCB, the distance of the transceiving chip is separated from the space through the external flexible board under the condition that the space requirement of the PCB is not increased, and the problem of circuit crosstalk is fundamentally solved by means of space isolation, position isolation and the like; in addition, the transimpedance amplifier is arranged on the surface of the flexible board inserted into the shell, is connected with the light receiving device arranged in the shell and is electrically connected with the circuit board through the flexible board, so that the receiving channel and the transmitting channel on the circuit board are separated, the shell can play a role in isolating the electric signal of the transimpedance amplifier, the electric signal of the light emitting assembly is prevented from influencing the electric signal of the transimpedance amplifier, and the problem of circuit crosstalk of the receiving channel and the transmitting channel can be fundamentally solved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 5 is a diagram illustrating a structure of a circuit board according to an embodiment of the present invention;

FIG. 6 is an exploded view of the circuit board according to the embodiment of the present disclosure;

FIG. 7 is a block diagram of a receiving component in an embodiment of the present application;

FIG. 8 is an exploded view of a receiver assembly according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a partial structure of a receiving assembly according to an embodiment of the present application;

FIG. 10 is an enlarged view of a portion of FIG. 9 at A;

FIG. 11 is a partial cross-sectional view of a receiver assembly in an embodiment of the present application;

fig. 12 is a partially enlarged view of a portion B in fig. 11.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver module 400.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver module 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module 400 are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

The optical transceiver module comprises an optical transmitting module and an optical receiving module which are respectively used for transmitting optical signals and receiving the optical signals. Fig. 5 is a schematic structural diagram of a circuit board 300 according to an embodiment of the present disclosure, and fig. 6 is an exploded structural diagram of the circuit board 300 according to the embodiment of the present disclosure. As shown in fig. 5 and 6, a light emitting assembly 401 and a flexible board 500 are disposed on the circuit board 300, the light emitting assembly 401 includes a light emitter and a laser driving chip, which are electrically connected to the circuit board 300 and are used for emitting light signals; one end of the flexible board 500 is fixed to the circuit board 300, and the other end extends into the light receiving module 402, that is, the light receiving module 402 and the circuit board 300 are connected through the flexible board 500, so that the light receiving module 402 does not need to be integrated on the circuit board 300, and the light emitting module 401 and the light receiving module 402 are prevented from being integrated on the circuit board, and the synchronous wiring distance between the two is short. That is, the flexible board 500 is a carrier for mounting components such as the light receiving module 402, and is generally made of a flexible material.

The light emitting assembly 401 generally includes a housing, a light emitter fixed inside the housing for emitting a light beam, and a lens assembly; the lens component is positioned on a light emitting path of the light emitter, is fixed inside the shell and is used for changing the transmission direction of the light beam so that the laser light beam enters the external optical fiber. That is, light emitted by the light emitter is reflected by the lens assembly and enters the optical fiber.

Fig. 7 is a schematic structural diagram of a light receiving module 402 according to an embodiment of the present disclosure, and fig. 8 is an exploded structural diagram of the light receiving module 402 according to an embodiment of the present disclosure. As shown in fig. 7 and 8, the light receiving module 402 includes a housing 4021, a lens assembly (not shown), a light receiving device 4022 and a transimpedance amplifier 501, wherein the light receiving device 4022 is fixed inside the housing 4021 and is configured to receive an optical signal of an external optical fiber; the lens assembly is arranged between the light receiving device 4022 and the external optical fiber 101 and is used for reflecting light from the external optical fiber 101 through the lens assembly and then entering the light receiving device 4022; one end of the flexible board 500 is inserted into the housing 4021, and the transimpedance amplifier 501 is disposed on the surface of the flexible board 500 inserted into the housing 4021, and is connected to the light receiving device 4022, for amplifying an electrical signal output by the light receiving device 4022, that is, a weak signal current output by the light receiving device 4022 is converted into a signal voltage having a sufficient amplitude by the transimpedance amplifier 501, and output, so that the amplitude of the voltage signal output from the transimpedance amplifier 501 meets the requirement of a subsequent system board on the signal amplitude. The transimpedance amplifier 501 is electrically connected to the circuit board 300 through the flexible board 500 to transmit the amplified electrical signal to the circuit board 300, and the circuit board 300 performs subsequent processing on the electrical signal.

Since the flexible board 500 is made of a flexible material and has high flexibility, in order to insert the flexible board 500 into the housing 4021, the substrate 600 is disposed in the housing 4021, and the substrate 600 is located between the flexible board 500 inserted into the housing 4021 and the bottom plate of the housing 4021 and is used for supporting the flexible board 500.

In this example, the light receiving device 4022 is often a PIN photodiode and an avalanche photodiode APD, which convert an optical signal in the external optical fiber 101 into an electrical signal using the photoelectric effect.

The flexible board 500 integrated with the transimpedance amplifier 501 is inserted into the housing 4021 and connected to the light receiving device 4022 in the housing 4021, and then the flexible board 500 is fixedly mounted on the circuit board 300, so that the light emitting module 401 and the light receiving module 402 are spatially separated by the external flexible board, and the light emitting channel and the light receiving channel are prevented from being closer in wiring distance.

When the flexible board 500 is fixedly mounted on the circuit board 300, the flexible board 500 and the light emitting module 401 can be respectively mounted on different sides of the circuit board 300, so that the receiving channel and the emitting channel on the circuit board 300 are not on the same surface, thereby avoiding the crosstalk problem between the light receiving channel and the light emitting channel. The flexible board 500 and the light emitting module 401 may also be mounted on the same side of the circuit board 300, that is, the receiving channel and the transmitting channel are on the same surface on the circuit board 300, and the transimpedance amplifier 501 and the light receiving device 4022 are placed inside the housing 4021, so that the crosstalk problem between the light receiving channel and the light emitting channel can be reduced due to the isolation function of the housing 4021.

The housing 4021 includes a package housing 4024 and a cover plate 4023 pressing the package housing 4024, the package housing 4024 and the cover plate 4023 form a receiving cavity, the light receiving module 402 is placed in the receiving cavity, and the flexible board 500 integrated with the transimpedance amplifier 501 is inserted into the receiving cavity, thereby implementing micro-optical COB packaging of the light receiving module 402.

Fig. 9 is a partial structural schematic diagram of a light receiving module 402 according to an embodiment of the present disclosure. As shown in fig. 8 and fig. 9, the package housing 4024 comprises a bottom plate and four side plates adjacent to the bottom plate, wherein one of the side plates is provided with a first slot 4028, and the first slot 4028 corresponds to the flexible plate 500, i.e., the flexible plate 500 is inserted into the package housing 4024 through the first slot 4028.

In order to limit the insertion of the flexible board 500 into the package housing 4024, a bottom plate of the package housing 4024 is provided with a mounting groove 4025, the mounting groove 4025 corresponds to the first notch 4028, that is, the bottom surface of the mounting groove 4025 is parallel to the bottom surface of the first notch 4028, and when the end surface of the flexible board 500 is inserted into the first notch 4028, the flexible board 500 is aligned with the first notch 4028, so that the bottom surface of the flexible board 500 is in contact with the bottom surface of the first notch 4028; then, the flexible board 500 is pushed so that the bottom surface of the flexible board 500 moves on the bottom surface of the mounting groove 4025 until the end surface of the flexible board 500 abuts against the side wall of the mounting groove 4025.

In this example, the width dimension of the first slot 4028 may be equal to the width dimension of the flexible plate 500, such that the flexible plate 500 is just inserted into the first slot 4028; the width of the first slot 4028 may be slightly larger than the width of the flexible board 500, leaving a gap to facilitate the insertion of the flexible board 500 into the first slot 4028. Similarly, the thickness dimension of the first notch 4028 may be equal to the sum of the thickness dimension of the flexible board 500 and the thickness dimension of the transimpedance amplifier 501, such that the flexible board 500 is just inserted into the first notch 4028; the thickness of the first slot 4028 may be greater than the thickness of the flexible board 500, leaving a gap to facilitate the insertion of the flexible board 500 into the first slot 4028.

The size of the mounting groove 4025 on the bottom plate of the package housing 4024 in the mounting direction of the flexible board 500 can be determined according to the position of the light receiving device 4022 in the package housing 4024 and the size of the package housing 4024, so that after the flexible board 500 is inserted into the package housing 4024 through the first slot 4028 and fixed to the mounting groove 4025, the connection between the light receiving device 4022 and the transimpedance amplifier 501 on the flexible board 500 is facilitated.

Fig. 10 is a partially enlarged schematic view of a light receiving module 402 according to an embodiment of the present disclosure. As shown in fig. 10, an observation hole 4029 is formed in the other side plate of the package housing 4024, the side plate where the observation hole 4029 is located is adjacent to the side plate where the first notch 4028 is located, and the observation hole 4029 corresponds to the side wall of the mounting groove 4025 in the bottom plate of the package housing 4024. The light receiving device 4022 includes a detector and an AWG (Arrayed Waveguide Grating), a photosurface of the detector faces an output Waveguide end of the AWG, a distance between the photosurface of the detector tube and the output Waveguide end of the AWG enables the photosurface and the output Waveguide end of the AWG to be directly coupled, the coupling between the AWG and the detector can be observed through the observation hole 4029, and the front and back positions of the AWG can be conveniently adjusted.

When the flexible board 500 is inserted into the package housing 4024 through the first slot 4028, the substrate 600 may be attached to the bottom surface of the mounting slot of the package housing 4024, and then the flexible board 500 may be attached to the substrate 600 to fix the flexible board 500 in the package housing 4024.

A second notch 4026 is provided on the other side plate of the package housing 4024 opposite to the side plate where the first notch 4028 is located, and the second notch 4026 corresponds to the light receiving device 4022, that is, the light receiving device 4022 is inserted into the package housing 4024 through the second notch 4026.

After the light receiving device 4022 is inserted into the package housing 4024 through the second slot 4026, the light receiving device 4022 is pushed until the end surface of the light receiving device 4022 is close to the side wall of the mounting groove 4025, and then the light receiving device 4022 may be attached to the bottom plate of the package housing 4024 to fix the light receiving device 4022 in the package housing 4024.

The installation process of the light receiving module 402 is as follows: first, the light receiving device 4022 is inserted into the package housing 4024 through the second slot 4026 until the end surface of the light receiving device 4022 is close to the side wall of the mounting slot 4025, and then the light receiving device 4022 is fixed on the bottom plate of the package housing 4024; then the transimpedance amplifier 501 is fixed on the surface of the flexible board 500; then, the flexible board 500 integrated with the transimpedance amplifier 501 is inserted into the packaging shell 4024 through the first notch 4028 until the end face of the flexible board 500 abuts against the side wall of the mounting groove 4025; after the flexible board 500 and the light receiving device 4022 are fixed, the cover board 4023 is pressed on the opening of the package case 4024, and the transimpedance amplifier 501 and the light receiving device 4022 are packaged in the case 4021.

A transimpedance amplifier 501 may be disposed on the surface of the flexible board 500 inserted into the housing 4021, that is, the optical module has a set of light receiving elements 402 and a set of light emitting elements 401, so that a second slot 4026 is disposed on the side board opposite to the side board where the first slot 4028 is located, and the light receiving elements are electrically connected to the circuit board 300 through the external flexible board. The surface of the flexible board 500 inserted into the housing 4021 may further be provided with a plurality of transimpedance amplifiers 501, that is, the optical module has a plurality of sets of light receiving elements 402 and a plurality of sets of light emitting elements 401, the plurality of sets of light receiving elements 402 are packaged in the same receiving cavity, the plurality of sets of light emitting elements 401 are packaged respectively, and the plurality of packaged sets of light emitting elements 401 are electrically connected to the circuit board 300 respectively.

When a plurality of transimpedance amplifiers 501 are provided on the surface of the flexible board 500 inserted into the housing 4021, a plurality of second slots (4026, 4027) are provided in parallel on the side board opposite to the side board on which the first slot 4028 is located, and a plurality of light receiving devices 4022 are inserted into the housing 4021 through the plurality of second slots (4026, 4027) so as to be adapted to a high-speed optical module.

After the transimpedance amplifier 501 is integrated on the flexible board 500, a wiring layer (not shown) is provided on the side of the flexible board 500 facing the circuit board 300, and the transimpedance amplifier 501 is connected to the circuit board 300 through the wiring layer. The routing layer has 8 differential vias, and the 8 differential vias are connected to the circuit board 300 to implement subsequent processing of the electrical signals.

A power supply wiring layer (not shown in the figure) is arranged below the wiring layer, and the power supply wiring layer is arranged on one side of the transimpedance amplifier 501 and used for supplying power to the transimpedance amplifier 501. This application is to the problem that signal wiring and power line electric crosstalk on the flexplate 500, at the in-process of walking the line design, signal wiring and power line cross distribution, and the flexplate upper strata sets up the signal and walks the line promptly, and signal wiring below sets up the power and walks the line, has realized that the signal is walked the position of line and power line and has kept apart, has reduced the influence that circuit crosstalk as far as possible.

When the transimpedance amplifier 501 is placed on the flexible board 500, the transimpedance amplifier 501 may be directly attached to the surface of the flexible board 500 inserted into the housing 4021, or a hole may be bored in the flexible board 500, and the transimpedance amplifier 501 may be embedded in the hole and mounted on the surface of the substrate 600 through the hole.

Fig. 11 is a schematic cross-sectional view of a light receiving module 402 according to an embodiment of the present disclosure; fig. 12 is an enlarged schematic view of fig. 11 at B. As shown in fig. 11 and 12, since the flexible board 500 is made of a soft material, the flexible board 500 is easily deformed, and therefore, the substrate 600 is provided between the flexible board 500 and the mounting groove 4025 on the bottom plate of the package case 4024, and the substrate 600 can prevent the flexible board 500 from being deformed and support the flexible board 500.

In this example, the substrate 600 is located below the flexible board 500, and can be inserted into the mounting groove 4025 through the first slot 4028 to hold one end of the flexible board 500 integrated with the transimpedance amplifier 501, and the end surface of the substrate 600 abuts against the side wall of the mounting groove 4025. Specifically, the substrate 600 may be attached to the bottom surface of the flexible board 500 opposite to the transimpedance amplifier 501, and then the flexible board 500 together with the substrate 600 is inserted into the mounting groove 4025 through the first notch 4028 until the end surface of the flexible board 500 and the end surface of the substrate 600 abut against the side wall of the mounting groove 4025.

In this example, a mounting hole (not shown in the figure) may be provided on the flexible board 500 inserted into the housing 4021, the transimpedance amplifier 501 is mounted on the surface of the substrate 600 through the mounting hole, and the transimpedance amplifier 501 mounted on the substrate 600 is electrically connected to the light receiving device 4022 and the circuit board 300 through the flexible board 500 for transmitting the amplified electrical signal to the circuit board 300.

For a high-speed 200G optical module, there are multiple sets of optical receiving components and optical emitting components, that is, multiple transimpedance amplifiers 501 are integrated on the flexible board 500, so that multiple mounting holes (not shown in the figure) can be provided on the flexible board 500 inserted into the housing 4021, and the multiple transimpedance amplifiers 501 are mounted on the surface of the substrate 600 through the multiple mounting holes.

In this example, the optical module has two sets of optical receiving assemblies 402, so that the second slot 4026 and the fourth slot 4027 are disposed on the other side plate of the package housing 4024 opposite to the side plate where the first slot 4028 is located, the second slot 4026 and the fourth slot 4027 are disposed in parallel, and the second slot 4026 and the fourth slot 4027 correspond to the two optical receiving devices 4022, respectively, that is, one optical receiving device 4022 is inserted into the package housing 4024 through the second slot 4026, and the other optical receiving device 4022 is inserted into the package housing 4024 through the fourth slot 4027.

After the two light receiving devices 4022 are inserted into the package housing 4024 through the second slot 4026 and the fourth slot 4027, the two light receiving devices 4022 are pushed until the end surfaces of the two light receiving devices 4022 are close to the side walls of the mounting slots 4025, and then the two light receiving devices 4022 are attached to the bottom plate of the package housing 4024, respectively, so as to fix the two light receiving devices 4022 in the package housing 4024.

The installation process of the two light receiving modules 402 is as follows: firstly, two light receiving devices 4022 are respectively inserted into the packaging shell 4024 through the second slot 4026 and the fourth slot 4027 until the end faces of the two light receiving devices 4022 are close to the side walls of the mounting slots 4025, and then the two light receiving devices 4022 are fixed on the bottom plate of the packaging shell 4024; then, two transimpedance amplifiers 501 are mounted on the substrate 600 in parallel through mounting holes on the flexible board 500; then, the flexible board 500 integrated with the two transimpedance amplifiers 501 and the substrate 600 are inserted into the package housing 4024 through the first notch 4028 until the end surfaces of the flexible board 500 and the substrate 600 are abutted to the side wall of the mounting groove 4025; after the flexible board 500 and the light receiving device 4022 are fixed, the cover board 4023 is pressed on the opening of the housing 4024, and the two transimpedance amplifiers 501 and the two light receiving devices 4022 are housed in the housing 4021.

After the two transimpedance amplifiers 501 are integrated on the flexible board 500, a wiring layer (not shown) is disposed on a side of the flexible board 500 facing the circuit board 300, and the two transimpedance amplifiers 501 are connected to the circuit board 300 through the wiring layer. The routing layer has 8 pairs of differential channels, and the 8 pairs of differential channels are connected with the circuit board 300 to realize the subsequent processing of the electric signals.

The wiring layer is disposed on the flexible board 500, so that the light receiving module 402 is integrated on the flexible board 500, and the independent flexible board 500 is integrated with the transimpedance amplifier 501, so that the light receiving channel is spatially separated from the light emitting channel.

A power supply wiring layer (not shown in the figure) is arranged below the wiring layer, and the power supply wiring layer is arranged on one side of the transimpedance amplifier 501 and used for supplying power to the transimpedance amplifier 501. This application is to the problem that signal wiring and power line electric crosstalk are gone up to flexbile plate 500, and at the in-process of walking the line design, signal wiring and power line cross distribution, the flexbile plate upper strata sets up the signal and walks the line promptly, and signal wiring below sets up the power and walks the line, has realized that the signal is walked the position of line and power line and has kept apart, has reduced the influence that circuit crosstalk as far as possible.

The number of the transimpedance amplifiers 501 integrated on the flexible board 500 is not limited to one or two as described in the above embodiments, and a plurality of transimpedance amplifiers may be integrated according to actual requirements, so that the optical module has a plurality of receiving channels, which all belong to the protection scope of the embodiments of the present application.

When the flexible board 500 is welded to the bottom surface of the circuit board 300, and the electrical chip of the light emitting assembly 401 is integrated on the top surface of the circuit board 300, that is, the flexible board 500 and the light emitting assembly 401 are respectively located on different sides of the circuit board 300, thereby realizing the spatial separation of the transmitting and receiving links, avoiding the closer channel wiring distance between the transmitting electrical chip and the receiving electrical chip, and fundamentally solving the problem of circuit crosstalk by means of spatial isolation, position isolation and the like.

When the flexible board 500 is welded to the top surface of the circuit board 300, the electrical chip of the optical transmitter 401 is also integrated on the top surface of the circuit board 300, that is, the flexible board 500 and the optical transmitter 401 are located on the same side of the circuit board 300, because the optical receiver 4022 and the transimpedance amplifier 501 are packaged in the housing 4021, on the premise that the space requirement of the circuit board is not increased, the distance of the transceiver chip is separated from the space through the external flexible board, through the isolation effect of the housing 4021, the measures such as space isolation and position isolation are applied again, and the problem of circuit crosstalk between the transmitter chip and the receiver chip is avoided.

Adopt the wiring structure that flexography and receiving chip transimpedance amplifier are integrated together, although the integrated electric core piece can be adopted on the flexography on coaxial packaging form, its purpose only is the passive selection under the not enough condition of wiring space, and only can integrate 1 receiving chip on the flexography, and this application adopts external flexography voluntarily based on the COB scheme, with receiving electric chip integration on the flexography, avoid integrating receiving electric chip on the circuit board, and this application can be integrated two transimpedance amplifiers on the flexography, solve the problem that receiving chip is integrated on the circuit board, thereby save a large amount of spaces for the circuit board, make receiving channel and transmission channel distance increase on the circuit board, solve the problem of circuit crosstalk between receiving channel and the transmission channel fundamentally.

The optical module that this application embodiment provided, especially all there are 8 passageways to high-speed 200G optical module receiving and dispatching, adopt the scheme of the integrated transimpedance amplifier of external flexible board, avoid the integrated receiving electric chip on the circuit board, under the condition that does not increase the circuit board space demand, the overall arrangement compactness of transmitting chip and receiving chip has been avoided, through the distance of external flexible board from the space separation receiving channel with the transmitting channel, and the casing of encapsulation light receiving component plays the isolation effect to the signal of telecommunication of its inside transimpedance amplifier, the signal of telecommunication of having avoided light emitting component influences the signal of telecommunication of transimpedance amplifier, utilize means such as space isolation, position isolation, lamination configuration optimization, optical module circuit crosstalk's problem has been solved fundamentally.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.