阅读说明：本技术 一种集成电路制造用电镀硅片的清洗干燥设备 (Cleaning and drying equipment for electroplated silicon wafer for manufacturing integrated circuit ) 是由 陈博文 于 2020-05-20 设计创作，主要内容包括：本发明公开了一种集成电路制造用电镀硅片的清洗干燥设备,其结构包括主体和漏板,通过设置了调节机构在主体内右端,可通过电机间接带动转动盘转动,转动盘带动出料管内部中的硅片,通过吸水板上端吸收水分后,硅片间歇传输至输送带上,避免硅片在清洗完成后,大量堆积在一起,造成对硅片的压损；通过设置了传动机构在主体内右端,可通过电机间带动滚轴转动,滚轴带动输送带转动,输送带可接收吸水盘上传输下来的硅片,且鼓风机上端进风管可提高输送带表面的空气流动性,便于对硅片的干燥和提高硅片在输送带上输送时的稳定性,便于对清洗过后的硅片收集。(The invention discloses a cleaning and drying device for an electroplated silicon wafer for manufacturing an integrated circuit, which structurally comprises a main body and a leakage plate, wherein an adjusting mechanism is arranged at the right end in the main body, a rotating disc can be indirectly driven to rotate through a motor, the rotating disc drives the silicon wafer in the inner part of a discharge pipe, and after water is absorbed by the upper end of a water absorbing plate, the silicon wafer is intermittently transmitted to a conveying belt, so that the silicon wafer is prevented from being accumulated together in a large amount after being cleaned, and the pressure loss to the silicon wafer is avoided; through having set up drive mechanism right-hand member in the main part, accessible motor drive roller bearing rotation between, the roller bearing drives the conveyer belt and rotates, and the silicon chip that the conveyer belt can receive and absorb and transmit on the dish, and the air-supply line of air-blower upper end can improve the air flow nature on conveyer belt surface, is convenient for to the drying of silicon chip and the stability of improvement silicon chip when carrying on the conveyer belt, is convenient for collect the silicon chip after wasing.)

1. A cleaning and drying device for an electroplated silicon wafer for manufacturing an integrated circuit comprises a main body (1) and a bushing plate (10), wherein a placing opening (2) is formed in the left end of the top of the main body (1), a water inlet pipe (3) is fixedly connected to the left side of the main body (1), a controller (4) is fixedly connected to the right side of the main body (1), a power line (5) is fixedly connected to the upper end of the right side of the main body (1), the upper end of the inner top of the main body (1) is connected with a water pump (7) through a bolt, a water outlet pipe at the right end of the water pump (7) is fixedly connected with a spray pipe (8), a drainage channel (9) is formed in the middle end of the main body (1), the top of the drainage channel (9) is fixedly connected with the bushing plate (10), and the power line (;

the method is characterized in that: also comprises an adjusting mechanism (6), the adjusting mechanism (6) is arranged at the right end in the main body (1), the adjusting mechanism (6) consists of a discharge pipe (61), a water absorption plate (62), a rotating disc (63), a stress disc (64), a force application plate (65), a blower (66) and a transmission mechanism (67), the discharge pipe (61) is arranged at the inner right end of the main body (1), the left end of the water absorption plate (62) is fixedly connected with the inner middle end of the main body (1), the rotating disc (63) is rotationally connected with the top of the water suction plate (62), the lower end of the rotating disc (63) and the stress disc (64) form a whole, the lower end of the force application plate (65) is rotationally connected with the bottom in the main body (1), the force application plate (65) is rotatably connected with the right end of the force application disc (64), the air blower (66) is fixedly connected with the inner bottom of the main body (1), and the transmission mechanism (67) is rotatably connected with the front end face of the main body (1).

2. The apparatus for cleaning and drying a plated silicon wafer for manufacturing an integrated circuit according to claim 1, wherein: the transmission mechanism (67) consists of a rolling shaft (671), a conveying belt (672), a motor (673), a first bevel gear set (674), a second bevel gear set (675), a bearing column (676) and a third bevel gear set (677), the rolling shaft (671) is rotationally connected with the inner side surface of the main body (1), the conveying belt (672) is in transmission connection with the side surface of the rolling shaft (671), the motor (673) is in bolt connection with the inner right side surface of the main body (1), an output shaft of the motor (673) coaxially rotates with the rolling shaft (671), the middle end of the output shaft of the motor (673) is fixedly connected with the first bevel gear set (674), the first bevel gear set (674) is in transmission connection with the left end of the second bevel gear set (675), the left end of the second bevel gear set (675) is fixedly connected with the bearing column (676), and the lower end of the bearing column (676) is fixedly connected with the inner bottom of the, the left end of the third bevel gear set (677) is fixedly connected with the bearing column (676), the right end of the third bevel gear set (677) is fixedly connected with the force application plate (65), and the motor (673) is electrically connected with the controller (4).

3. The apparatus for cleaning and drying a plated silicon wafer for manufacturing an integrated circuit according to claim 1, wherein: four placing grooves are formed in the periphery of the rotating disc (63), an air inlet pipe at the upper end of the air blower (66) extends to the middle end in the conveying belt (672), and a plurality of air inlets are formed in the surface of the air inlet pipe.

4. The apparatus for cleaning and drying a plated silicon wafer for manufacturing an integrated circuit according to claim 1, wherein: the height ratio of the water suction plate (62) to the rotary disc (63) is 4: 1.

5. The apparatus for cleaning and drying a plated silicon wafer for manufacturing an integrated circuit according to claim 2, wherein: the distance between the top end surface of the conveying belt (672) and the bottom of the water suction plate (62) is 0.1CM, and the thickness of the conveying belt (672) is 1 CM.

6. The apparatus for cleaning and drying a plated silicon wafer for manufacturing an integrated circuit according to claim 1, wherein: the stress disc (64) and the stress plate (65) are located at the same height, and four transmission grooves are formed in the periphery of the stress disc (64).

7. The apparatus for cleaning and drying a plated silicon wafer for manufacturing an integrated circuit according to claim 1, wherein: the terminal surface is equipped with an opening before main part (1), and opening length is greater than conveyer belt (672) length 2 CM.

8. The apparatus for cleaning and drying a plated silicon wafer for manufacturing an integrated circuit according to claim 2, wherein: conveyer belt (672) surface is equipped with a plurality of through-holes, and conveyer belt (672) front end flushes mutually with main part (1) preceding terminal surface.

Technical Field

The invention relates to the technical field of cleaning and drying equipment, in particular to cleaning and drying equipment for an electroplated silicon wafer for manufacturing an integrated circuit.

Background

The integrated circuit is a miniature electronic device or component, and is made up by adopting a certain technological process, and the elements of transistor, resistor, capacitor and inductor, etc. required in a circuit and wiring are interconnected together, and made into a small semiconductor wafer or medium substrate, then packaged in a tube shell so as to obtain the miniature structure with the required circuit function.

When the cleaning and drying equipment is used for cleaning and drying the silicon wafer, the cleaned silicon wafer is always accumulated in one of the areas in the cleaning and drying equipment, so that the silicon wafer is easily damaged by pressure and is troublesome to collect.

Disclosure of Invention

Technical problem to be solved

In order to overcome the defects of the prior art, the cleaning and drying equipment for the electroplated silicon wafer for manufacturing the integrated circuit is provided, and the problems are solved.

(II) technical scheme

The invention is realized by the following technical scheme: the invention provides a cleaning and drying device of an electroplated silicon wafer for manufacturing an integrated circuit, which comprises a main body, an adjusting mechanism and a bushing plate, wherein the left end of the top of the main body is provided with a placing opening, the left side surface of the main body is fixedly connected with a water inlet pipe, the right side surface of the main body is fixedly connected with a controller, the upper end of the right side surface of the main body is fixedly connected with a power wire, the upper end of the top part in the main body is connected with a water pump bolt, a water outlet pipe at the right end of the water pump is fixedly connected with a spray pipe, the middle end of the main body is provided with a water drainage channel, the top of the water drainage channel is fixedly connected with the bushing plate, the power wire and the water pump are both electrically connected with the controller, the adjusting mechanism is arranged at the right end in the main body and consists of a discharge pipe, a water suction plate, a rotating disc, the rotary disc is rotatably connected with the top of the water absorption plate, the lower end of the rotary disc and the stress disc form a whole, the lower end of the force application plate is rotatably connected with the bottom in the main body, the force application plate is rotatably connected with the right end of the stress disc, the air blower is fixedly connected with the bottom in the main body, and the transmission mechanism is rotatably connected with the front end face of the main body.

Further, the transmission mechanism comprises a roller, a conveyer belt, a motor, a first bevel gear set, a second bevel gear set, a bearing column and a third bevel gear set, the roller is rotatably connected with the inner side face of the main body, the conveyer belt is in transmission connection with the side face of the roller, the motor is in bolted connection with the inner right side face of the main body, an output shaft of the motor coaxially rotates with the roller, the middle end of the output shaft of the motor is fixedly connected with the first bevel gear set, the first bevel gear set is in transmission connection with the left end of the second bevel gear set, the left end of the second bevel gear set is fixedly connected with the bearing column, the lower end of the bearing column is fixedly connected with the inner bottom of the main body, the left end of the third bevel gear set is fixedly connected with the bearing column, the right end of the third bevel gear set is fixedly.

Furthermore, four placing grooves are formed in the periphery of the rotating disc, an air inlet pipe at the upper end of the air blower extends to the middle end in the conveying belt, and a plurality of air inlets are formed in the surface of the air inlet pipe.

Furthermore, the height ratio of the water suction plate to the rotating disc is 4: 1.

Furthermore, the distance between the top end face of the conveying belt and the bottom of the water absorption plate is 0.1CM, and the thickness of the conveying belt is 1 CM.

Furthermore, the stress disc and the stress plate are positioned at the same height, and four transmission grooves are formed in the periphery of the stress disc.

Furthermore, the front end face of the main body is provided with an opening, and the length of the opening is greater than the length of the conveying belt by 2 CM.

Furthermore, the surface of the conveying belt is provided with a plurality of through holes, and the front end of the conveying belt is flush with the front end face of the main body.

Furthermore, the rotating disc is made of plastic.

Furthermore, the first bevel gear set is made of 38 CrMoAl.

(III) advantageous effects

Compared with the prior art, the invention has the following beneficial effects:

1) according to the cleaning and drying equipment for the electroplated silicon wafer for manufacturing the integrated circuit, the adjusting mechanism is arranged at the right end in the main body, the rotating disc can be indirectly driven to rotate through the motor, the rotating disc drives the silicon wafer in the inner part of the discharge pipe, and after water is absorbed by the upper end of the water absorption plate, the silicon wafer is intermittently transmitted to the conveying belt, so that the silicon wafer is prevented from being accumulated together in a large amount after being cleaned, and the pressure loss to the silicon wafer is avoided.

2) According to the cleaning and drying equipment for the electroplated silicon wafer for manufacturing the integrated circuit, the transmission mechanism is arranged at the right end in the main body, the rolling shaft can be driven to rotate by the motor, the rolling shaft drives the conveying belt to rotate, the conveying belt can receive the silicon wafer transmitted from the water absorption disc, the air inlet pipe at the upper end of the air blower can improve the air fluidity on the surface of the conveying belt, the silicon wafer can be dried conveniently, the stability of the silicon wafer during conveying on the conveying belt is improved, and the cleaned silicon wafer can be collected conveniently.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the main body of the present invention;

FIG. 3 is a schematic view of an adjustment mechanism according to the present invention;

FIG. 4 is a schematic view of the transmission mechanism of the present invention;

fig. 5 is an enlarged schematic view of the structure at a in fig. 2 according to the present invention.

In the figure: the device comprises a main body-1, a placing opening-2, a water inlet pipe-3, a controller-4, a power line-5, an adjusting mechanism-6, a water pump-7, a spraying pipe-8, a water drainage channel-9, a leakage plate-10, a discharge pipe-61, a water suction plate-62, a rotating disc-63, a stress disc-64, a force application plate-65, a blower-66, a transmission mechanism-67, a rolling shaft-671, a conveying belt-672, a motor-673, a first bevel gear set-674, a second bevel gear set-675, a receiving column-676 and a third bevel gear set-677.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, the present invention provides a cleaning and drying apparatus for a plated silicon wafer for integrated circuit manufacturing, comprising: the silicon wafer cleaning device comprises a main body 1, an adjusting mechanism 6 and a leakage plate 10, wherein a placing opening 2 is arranged at the left end of the top of the main body 1, a water inlet pipe 3 is fixedly connected to the left side of the main body 1, a controller 4 is fixedly connected to the right side of the main body 1, a power cord 5 is fixedly connected to the upper end of the right side of the main body 1, the upper end of the inner top of the main body 1 is in bolt connection with a water pump 7, a water outlet pipe at the right end of the water pump 7 is fixedly connected with a spray pipe 8, a drainage channel 9 is arranged at the middle end of the main body 1, the top of the drainage channel 9 is fixedly connected with the leakage plate 10, the power cord 5 and the water pump 7 are both electrically connected with the controller 4, the adjusting mechanism 6 is arranged at the inner right end of the main body 1, the adjusting mechanism 6 comprises a discharge pipe 61, a water suction plate 62, a rotating disc 63, the rotating disc 63 is rotatably connected with the top of the water suction plate 62 and can receive silicon wafers conveyed by the discharge pipe 61, the lower end of the rotating disc 63 and the stress disc 64 form a whole, the lower end of the force application plate 65 is rotatably connected with the bottom in the main body 1, the force application plate 65 is rotatably connected with the right end of the stress disc 64, the air blower 66 is fixedly connected with the bottom in the main body 1, and the transmission mechanism 67 is rotatably connected with the front end face of the main body 1.

The transmission mechanism 67 is composed of a roller 671, a conveyor belt 672, a motor 673, a first bevel gear set 674, a second bevel gear set 675, a bearing column 676 and a third bevel gear set 677, the roller 671 is rotatably connected with the inner side surface of the main body 1, the conveyor belt 672 is in transmission connection with the side surface of the roller 671, the motor 673 is in bolt connection with the inner right side surface of the main body 1, an output shaft of the motor 673 coaxially rotates with the roller 671, the middle end of the output shaft of the motor 673 is fixedly connected with the first bevel gear set 674, the first bevel gear set 674 is in transmission connection with the left end of the second bevel gear set 675, the left end of the second bevel gear set 675 is fixedly connected with the bearing column 676, the lower end of the bearing column 676 is fixedly connected with the inner bottom of the main body 1, the left end of the third bevel gear set 677 is fixedly connected with the bearing column 676, the right end of the third.

Four placing grooves are formed in the periphery of the rotating disc 63, an air inlet pipe at the upper end of the air blower 66 extends to the inner middle end of the conveying belt 672, a plurality of air inlets are formed in the surface of the air inlet pipe, the air flowability at the upper end of the conveying belt 672 is effectively improved, and the drying effect on the silicon wafers is improved.

Wherein, the height ratio of the water suction plate 62 to the rotary disc 63 is 4:1, which is convenient for conveying silicon wafers.

The distance between the top end surface of the conveying belt 672 and the bottom of the water suction plate 62 is 0.1CM, the thickness of the conveying belt 672 is 1CM, and the silicon wafer receiving effect is improved.

The force bearing disc 64 and the force bearing plate 65 are located at the same height, and four transmission grooves are formed in the periphery of the force bearing disc 64, so that transmission of the rotating disc 63 at the upper end is facilitated.

Wherein, the terminal surface is equipped with an opening before the main part 1, and opening length is greater than conveyer belt 672 length 2CM, is convenient for receive the silicon chip of conveyer belt 672 surface transmission.

Wherein, the conveyer belt 672 surface is equipped with a plurality of through-holes, and the conveyer belt 672 front end flushes mutually with main part 1 front end face, improves the drying effect of air-blower 66 to the silicon chip.

Wherein, the rotating disc 63 is made of plastic, and has the advantages of durability, water resistance and light weight.

The first bevel gear set 674 is made of 38CrMoAl and has high wear resistance and high fatigue strength.

The first bevel gear set 674 material be 38CrMoAl, 38CrMoal is high-grade nitrided steel, has high wear resistance, high fatigue strength and high strength characteristics, the accurate nitrogenize part of size after mainly used heat treatment, or various receive impact load not big and nitrogenize parts that the wearability is high.

The invention provides a cleaning and drying device for an electroplated silicon wafer for manufacturing an integrated circuit through improvement, which has the following working principle;

firstly, when the equipment is used, the equipment is firstly placed in a working area, and then the equipment is connected with an external power supply, so that the required electric energy can be provided for the work of the equipment;

secondly, the silicon wafers are placed into a bushing 10 in the main body 1 through the placing opening 2 one by one, the silicon wafers slide towards the lower end, the water pump 7 drives the water in the water inlet pipe 3 to be sprayed through the spraying pipe 8, the spraying pipe 8 sprays the silicon wafers on the bushing 10, and the cleaning liquid can be discharged towards the outer end through the water discharging channel 9;

thirdly, the silicon wafer enters the discharge pipe 61, the motor 673 drives the first bevel gear set 674 to rotate, the first bevel gear set 674 drives the second bevel gear set 675 to rotate, the second bevel gear set 675 drives the force application plate 65 to rotate through the third bevel gear set 677, the force application plate 65 drives the force application plate 64 to rotate, and the force application plate 64 can drive the rotating disc 63 at the upper end to rotate while rotating;

fourthly, the rotating disc 63 drives the silicon wafer in the discharging pipe 61 to be transmitted to the end of the conveying belt 672 through the water absorption plate 62, the conveying belt 672 drives the roller 671 to rotate through the motor 673, and the roller 671 drives the conveying belt 672 to move;

fifthly, the silicon wafer on the upper end of the conveying belt 672 drives the air on the conveying belt 672 into the air blower 66 through the air inlet pipe on the upper end of the air blower 66, so that the air fluidity on the surface of the conveying belt 672 is improved, and the drying effect on the silicon wafer and the stability of the silicon wafer during conveying on the surface of the conveying belt 672 are improved;

sixth, the silicon wafer is intermittently transported out by the transport belt 672 through the front end surface of the main body 1.

The basic principles and main features of the present invention and the advantages of the present invention have been shown and described, and the standard parts used in the present invention are all available on the market, the special-shaped parts can be customized according to the description and the accompanying drawings, the specific connection mode of each part adopts the conventional means of bolt and rivet, welding and the like mature in the prior art, the machinery, parts and equipment adopt the conventional type in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, and the details are not described herein.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.