阅读说明：本技术 受损太阳能电池芯片回收方法及装置 (Damaged solar cell chip recovery method and device ) 是由 陈宗洋 黄亮 李刚 祁俊路 吴根辉 于 2018-12-27 设计创作，主要内容包括：本发明是关于受损太阳能电池芯片回收方法及装置。该方法包括：将受损太阳能电池芯片划分为预设大小的多个太阳能电池芯片块；对多个太阳能电池芯片块进行筛选,以在多个太阳能电池芯片块中确定未包括损伤部位的多个目标太阳能电池芯片块；使用汇流条对多个目标太阳能电池芯片块进行焊接,使焊接后的多个目标太阳能电池芯片块的太阳能芯片电连接；对焊接后的多个目标太阳能电池芯片块进行封装,以获取封装目标太阳能电池组件。该技术方案能够将受损太阳能电池芯片处理为正常进行太阳能转换且不包括任何破损部位的目标太阳能电池组件,避免了太阳能电池芯片出现破损后必须报废的状况,减少了对环境的污染,降低了太阳能电池芯片的生产成本。(The invention relates to a damaged solar cell chip recovery method and a damaged solar cell chip recovery device. The method comprises the following steps: dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes; screening the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks which do not include damaged parts in the plurality of solar cell chip blocks; welding the target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected; and packaging the welded target solar cell chip blocks to obtain a packaged target solar cell module. According to the technical scheme, the damaged solar cell chip can be processed into the target solar cell module which can normally perform solar energy conversion and does not comprise any damaged part, the condition that the solar cell chip must be scrapped after being damaged is avoided, the pollution to the environment is reduced, and the production cost of the solar cell chip is reduced.)

1. A damaged solar cell chip recycling method is characterized by comprising the following steps:

dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

screening the plurality of solar cell chip blocks, and determining a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks;

welding the target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected;

and packaging the plurality of welded target solar cell chip blocks to obtain a packaged target solar cell module.

2. The damaged solar cell chip recycling method according to claim 1, wherein the dividing the damaged solar cell chip into a plurality of solar cell chip blocks with a preset size comprises:

physically scribing the damaged solar cell chip according to a preset scribing pattern, and breaking a semiconductor layer of the damaged solar cell chip in the scribing pattern;

laser scribing is carried out on the damaged solar cell chip subjected to physical scribing according to the preset scribing pattern, so that the electrode layer of the damaged solar cell chip subjected to physical scribing, which is located in the scribing pattern, is disconnected;

and cutting the damaged solar cell chip subjected to laser scribing into a plurality of target solar cell chip blocks with the preset size along the preset scribing pattern.

3. The damaged solar cell chip recycling method of claim 1, further comprising:

pre-treating the target solar cell chip blocks, wherein the pre-treating comprises edge finishing and cleaning;

the soldering of the plurality of target solar cell chip blocks using the bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding the pretreated target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected.

4. The damaged solar cell chip recycling method of claim 1, further comprising:

performing power detection on the target solar cell chip blocks, and determining a plurality of target solar cell chip blocks meeting preset power requirements in the target solar cell chip blocks according to power detection results;

the soldering of the plurality of target solar cell chip blocks using the bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding the target solar cell chip blocks meeting the preset power requirement by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected.

5. The damaged solar cell chip recycling method of claim 1, further comprising:

and carrying out power detection on the packaging target solar cell module, and identifying the power of the packaging target solar cell module according to a power detection result.

6. The damaged solar cell chip recycling method of claim 1, further comprising:

and connecting the packaging target solar cell module with a junction box to obtain a complete solar cell module.

7. A damaged solar cell chip recycling apparatus, comprising:

the dividing module is used for dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

the screening module is used for screening the plurality of solar cell chip blocks so as to determine a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks;

the welding module is used for welding the target solar cell chip blocks by using the bus bars so as to electrically connect the solar cells of the welded target solar cell chip blocks;

and the packaging module is used for packaging the welded target solar cell chip blocks so as to obtain a packaged target solar cell module.

8. The damaged solar cell chip recycling device of claim 7, wherein the dividing module comprises:

the physical scribing submodule is used for physically scribing the damaged solar cell chip according to a preset scribing pattern so as to break the semiconductor layer of the damaged solar cell chip in the scribing pattern;

the laser scribing submodule is used for carrying out laser scribing on the damaged solar cell chip subjected to physical scribing according to the preset scribing pattern, so that the electrode layer of the damaged solar cell chip subjected to physical scribing, which is positioned in the scribing pattern, is disconnected;

and the cutting submodule is used for cutting the damaged solar cell chips subjected to laser scribing into a plurality of target solar cell chip blocks with preset sizes along the preset scribing pattern.

9. The damaged solar cell chip recycling device of claim 7, further comprising:

the pretreatment module is used for pretreating the target solar cell chip blocks, and the pretreatment comprises edge finishing and cleaning;

the welding module includes:

and the first welding submodule is used for welding the preprocessed multiple target solar cell chip blocks by using the bus bar so as to electrically connect the solar cells of the multiple target solar cell chip blocks after welding.

10. The damaged solar cell chip recycling device of claim 7, further comprising:

the first power detection module is used for carrying out power detection on the target solar cell chip blocks and determining a plurality of target solar cell chip blocks meeting preset power requirements in the target solar cell chip blocks according to power detection results;

the welding module includes:

and the second welding submodule is used for welding the target solar cell chip blocks meeting the preset power requirement by using the bus bars so as to electrically connect the solar cells of the welded target solar cell chip blocks.

11. The damaged solar cell chip recycling device of claim 7, further comprising:

and the second power detection module is used for carrying out power detection on the packaging target solar cell module and identifying the power of the packaging target solar cell module according to a power detection result.

12. The damaged solar cell chip recycling device of claim 7, further comprising:

and the connecting module is used for connecting the packaging target solar cell module with the junction box so as to obtain a complete solar cell module.

13. A damaged solar cell chip recycling apparatus, comprising:

a processor;

a memory for storing processor-executable instructions;

wherein the processor is configured to:

dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

screening the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks;

welding the target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected;

and packaging the plurality of welded target solar cell chip blocks to obtain a packaged target solar cell module.

14. A computer-readable storage medium having stored thereon computer instructions, which when executed by a processor, perform the steps of the method of any one of claims 1 to 6.

Technical Field

The invention relates to the technical field of solar cells, in particular to a damaged solar cell chip recovery method and device.

Background

Solar technology is a technology that converts light energy into electrical energy. The solar cell using the solar technology is safe and clean, and can be directly arranged at a place needing power for power generation, and the characteristics enable the solar technology to occupy an important strategic position in the technical field of new energy. With the development of solar cell chips towards high efficiency and low cost, the manufacturing process of the solar cell chips is improved day by day, the solar cell chips become thinner and brittle, and in the production and transportation process of the solar cell chips, the solar cell chips are easy to damage, and a large number of solar cell chips are scrapped, so that the production cost of the solar cell chips is increased, and the pollution to the environment is increased.

Disclosure of Invention

To overcome the problems in the related art, embodiments of the present invention provide a damaged solar cell chip recycling method and apparatus. The technical scheme is as follows:

according to a first aspect of embodiments of the present invention, there is provided a damaged solar cell chip recycling method, including:

dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

screening the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks which do not include damaged parts in the plurality of solar cell chip blocks;

welding the target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected;

and packaging the welded target solar cell chip blocks to obtain a packaged target solar cell module.

In the technical scheme provided by the embodiment of the invention, the damaged solar cell chips are divided into a plurality of solar cell chip blocks with preset sizes, the plurality of solar cell chip blocks are screened so as to determine a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks, the plurality of target solar cell chip blocks are welded by using the bus bars, the solar cells of the plurality of welded target solar cell chip blocks are electrically connected, and the plurality of welded target solar cell chip blocks are packaged so as to obtain the packaged target solar cell module. The solar cell chip blocks including the damaged parts are excluded from the target solar cell chip blocks through screening, so that the target solar cell module obtained by welding and packaging the target solar cell chip blocks does not include any damaged parts and can normally perform solar energy conversion.

In one embodiment, dividing the damaged solar cell chip into a plurality of solar cell chip pieces of a predetermined size includes:

physically scribing the damaged solar cell chip according to a preset scribing pattern, so that the semiconductor layer of the damaged solar cell chip in the scribing pattern is disconnected;

laser scribing is carried out on the damaged solar cell chip subjected to physical scribing according to a preset scribing pattern, so that an electrode layer of the damaged solar cell chip subjected to physical scribing, which is located in the scribing pattern, is disconnected;

and cutting the damaged solar cell chip subjected to laser scribing into a plurality of target solar cell chip blocks with preset sizes along a preset scribing pattern.

In one embodiment, the method further comprises:

preprocessing a plurality of target solar cell chip blocks, wherein the preprocessing comprises edge finishing and cleaning;

the method for soldering a plurality of target solar cell chip blocks by using a bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding the pretreated target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected.

In one embodiment, the method further comprises:

performing power detection on the plurality of target solar cell chip blocks, and determining a plurality of target solar cell chip blocks meeting preset power requirements in the plurality of target solar cell chip blocks according to power detection results;

the method for soldering a plurality of target solar cell chip blocks by using a bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding a plurality of target solar cell chip blocks meeting the preset power requirement by using the bus bar, so that the solar cells of the plurality of welded target solar cell chip blocks are electrically connected.

In one embodiment, the method further comprises:

and carrying out power detection on the packaged target solar cell module, and identifying the power of the packaged target solar cell module according to the power detection result.

In one embodiment, the method further comprises:

and connecting the packaging target solar cell module with the junction box to obtain a complete solar cell module.

According to a second aspect of embodiments of the present invention, there is provided a damaged solar cell chip recycling apparatus, comprising:

the dividing module is used for dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

the screening module is used for screening the plurality of solar cell chip blocks so as to determine a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks;

the welding module is used for welding the target solar cell chip blocks by using the bus bars so as to electrically connect the solar cells of the welded target solar cell chip blocks;

and the packaging module is used for packaging the welded target solar cell chip blocks so as to obtain a packaged target solar cell module.

In one embodiment, the partitioning module includes:

the physical scribing submodule is used for physically scribing the damaged solar cell chip according to a preset scribing pattern so as to disconnect the semiconductor layer of the damaged solar cell chip in the scribing pattern;

the laser scribing submodule is used for carrying out laser scribing on the damaged solar cell chip subjected to physical scribing according to a preset scribing pattern, so that the electrode layer of the damaged solar cell chip subjected to physical scribing, which is positioned in the scribing pattern, is disconnected;

and the cutting submodule is used for cutting the damaged solar cell chip subjected to laser scribing into a plurality of target solar cell chip blocks with preset sizes along the preset scribing pattern.

In one embodiment, the apparatus further comprises:

the pretreatment module is used for pretreating a plurality of target solar cell chip blocks, and the pretreatment comprises edge finishing and cleaning;

a welding module comprising:

and the first welding submodule is used for welding the preprocessed multiple target solar cell chip blocks by using the bus bar so as to electrically connect the solar cells of the multiple target solar cell chip blocks after welding.

In one embodiment, the apparatus further comprises:

the first power detection module is used for carrying out power detection on the target solar cell chip blocks and determining a plurality of target solar cell chip blocks meeting the preset power requirement in the target solar cell chip blocks according to the power detection result;

a welding module comprising:

and the second welding submodule is used for welding a plurality of target solar cell chip blocks meeting the preset power requirement by using the bus bar so as to electrically connect the solar cells of the plurality of target solar cell chip blocks after welding.

In one embodiment, the apparatus further comprises:

and the second power detection module is used for carrying out power detection on the packaged target solar cell module and identifying the power of the packaged target solar cell module according to the power detection result.

In one embodiment, the apparatus further comprises:

and the connecting module is used for connecting the packaging target solar cell module with the junction box so as to obtain a complete solar cell module.

According to a third aspect of embodiments of the present invention, there is provided a damaged solar cell chip recycling apparatus, comprising:

a processor;

a memory for storing processor-executable instructions;

wherein the processor is configured to:

dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

screening the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks which do not include damaged parts in the plurality of solar cell chip blocks;

welding the target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected;

and packaging the welded target solar cell chip blocks to obtain a packaged target solar cell module.

According to a fourth aspect of embodiments of the present invention there is provided a computer readable storage medium having stored thereon computer instructions which, when executed by a processor, carry out the steps of the method of any one of the first aspect of embodiments of the present invention.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

FIG. 1a is a schematic flow diagram illustrating a damaged solar cell chip reclamation method according to an exemplary embodiment;

FIG. 1b is a schematic flow diagram illustrating a damaged solar cell chip reclamation method according to an exemplary embodiment;

FIG. 1c is a schematic flow diagram illustrating a damaged solar cell chip reclamation method according to an exemplary embodiment;

FIG. 1d is a schematic flow diagram illustrating a damaged solar cell chip reclamation method according to an exemplary embodiment;

FIG. 1e is a schematic flow diagram illustrating a damaged solar cell chip reclamation method according to an exemplary embodiment;

FIG. 2a is a schematic top view of a damaged solar cell chip according to an exemplary embodiment;

FIG. 2b is a schematic top view of a damaged solar cell chip according to an exemplary embodiment;

fig. 2c is a schematic top view of a series-parallel target solar cell die block shown in accordance with an exemplary embodiment;

FIG. 3a is a schematic diagram illustrating a damaged solar cell chip reclamation apparatus according to an exemplary embodiment;

FIG. 3b is a schematic diagram illustrating the construction of a damaged solar cell chip reclamation apparatus according to an exemplary embodiment;

FIG. 3c is a schematic diagram illustrating the construction of a damaged solar cell chip reclamation apparatus according to an exemplary embodiment;

FIG. 3d is a schematic diagram illustrating the construction of a damaged solar cell chip reclamation apparatus according to an exemplary embodiment;

FIG. 3e is a schematic diagram illustrating a damaged solar cell chip reclamation apparatus according to an exemplary embodiment;

FIG. 3f is a schematic diagram illustrating a damaged solar cell chip reclamation apparatus according to an exemplary embodiment;

FIG. 4 is a block diagram illustrating an apparatus in accordance with an exemplary embodiment;

FIG. 5 is a block diagram illustrating an apparatus in accordance with an example embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.

With the rapid development of scientific technology and the continuous improvement of living standard of people, people have more and more attention to renewable energy technology, namely new energy technology in recent years. Solar technology is a technology that converts light energy into electrical energy. The solar cell using the solar technology is safe and clean, and can be directly arranged at a place needing power for power generation, and the characteristics enable the solar technology to occupy an important strategic position in the technical field of new energy.

With the development of solar cell chips towards high efficiency and low cost, the manufacturing process of the solar cell chips is improved day by day, the solar cell chips become thinner and brittle, and the solar cell chips are easily damaged in the production and transportation processes of the solar cell chips. In the related art, when a portion of a solar cell chip is damaged, the entire solar cell chip needs to be scrapped. Thereby increasing the production cost of the solar cell chip and increasing the pollution to the environment.

In order to solve the above problem, in the technical solution provided in the embodiment of the present invention, a damaged solar cell chip is divided into a plurality of solar cell chip blocks with a preset size, the plurality of solar cell chip blocks are screened to determine a plurality of target solar cell chip blocks without damage parts among the plurality of solar cell chip blocks, the plurality of target solar cell chip blocks are soldered by using a bus bar, so that solar cells of the soldered plurality of target solar cell chip blocks are electrically connected, and the soldered plurality of target solar cell chip blocks are packaged to obtain a packaged target solar cell module. The solar cell chip blocks including the damaged parts are excluded from the target solar cell chip blocks through screening, so that the target solar cell module obtained by welding and packaging the target solar cell chip blocks does not include any damaged parts and can normally perform solar energy conversion.

An embodiment of the present invention provides a damaged solar cell chip recycling method, as shown in fig. 1a, including the following steps 101 to 104:

in step 101, the damaged solar cell chip is divided into a plurality of solar cell chip blocks with a preset size.

For example, the damaged solar cell chip may be a glass-based solar cell chip, which may include a crystalline silicon solar cell chip, a microcrystalline silicon solar cell chip, a nanocrystalline silicon solar cell chip, a copper indium selenium solar cell chip, a copper indium gallium selenium sulfur solar cell chip, a copper zinc tin sulfur solar cell chip, and a cadmium telluride solar cell chip.

The damaged solar cell chip is divided into a plurality of solar cell chip blocks with preset sizes, and the damaged solar cell chip can be cut by using a cutting machine according to a preset cutting pattern so as to be divided into a plurality of solar cell chip blocks with preset sizes.

Dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes, or physically scribing the damaged solar cell chip according to a preset scribing pattern to disconnect a semiconductor layer of the damaged solar cell chip in the scribing pattern, and performing laser scribing on the damaged solar cell chip after the physical scribing according to the preset scribing pattern to disconnect an electrode layer of the damaged solar cell chip after the physical scribing in the scribing pattern; and cutting the damaged solar cell chip subjected to laser scribing into a plurality of target solar cell chip blocks with preset sizes along a preset scribing pattern. Wherein, when cutting off, the glass cutting and severing integrated machine can be used for cutting off.

By sequentially carrying out physical scribing, laser scribing and cutting on the damaged solar cell chip, the additional damage to the solar cell chip blocks when the damaged solar cell chip is divided into a plurality of solar cell chip blocks with preset sizes can be avoided.

In step 102, the plurality of solar cell chip pieces are screened to determine a plurality of target solar cell chip pieces without damage parts among the plurality of solar cell chip pieces.

For example, the screening of the plurality of solar cell chip blocks may be performed according to an image recognition result of each solar cell chip block, in order to acquire an image of each solar cell chip block and perform image recognition on the image of each solar cell chip block, where the image recognition result is used to indicate whether a target solar cell chip block includes a damaged portion.

In step 103, the plurality of target solar cell chip blocks are bonded using the bus bars, and the solar cells of the plurality of target solar cell chip blocks after bonding are electrically connected.

In step 104, the welded target solar cell chip blocks are packaged to obtain a packaged target solar cell module.

For example, the plurality of target solar cell chip blocks are bonded using bus bars, and the plurality of target solar cell chip blocks may be roll-bonded using the bus bars.

And packaging the welded target solar cell chip blocks, namely adhering a surface glass layer to the upper surface of the solar cell chip layer and adhering a back glass layer to the lower surface of the solar cell chip layer as the solar cell chip layer, and then laminating to discharge gas between the surface glass layer and the back glass layer and the solar cell chip layer and seal edges. The lamination can be performed by using an autoclave, and the autoclave can evenly distribute pressure on the surface of the whole piece of glass so as to cleanly remove gas between the surface glass layer and the back glass layer and the solar cell chip layer.

In the technical scheme provided by the embodiment of the invention, the damaged solar cell chips are divided into a plurality of solar cell chip blocks with preset sizes, the plurality of solar cell chip blocks are screened so as to determine a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks, the plurality of target solar cell chip blocks are welded by using the bus bars, the solar cells of the plurality of welded target solar cell chip blocks are electrically connected, and the plurality of welded target solar cell chip blocks are packaged so as to obtain the packaged target solar cell module. The solar cell chip blocks including the damaged parts are excluded from the target solar cell chip blocks through screening, so that the target solar cell module obtained by welding and packaging the target solar cell chip blocks does not include any damaged parts and can normally perform solar energy conversion.

In one embodiment, as shown in fig. 1b, the damaged solar cell chip recycling method provided by the embodiment of the present invention further includes the following steps 105:

in step 105, a plurality of target solar cell dice are pre-processed, including edge trimming and cleaning.

In step 103, the plurality of target solar cell dice are soldered using the bus bars, and the solar cells of the plurality of target solar cell dice after soldering are electrically connected, which may be implemented by step 1031:

in step 1031, the preprocessed target solar cell chip pieces are soldered using bus bars, and the solar cells of the soldered target solar cell chip pieces are electrically connected.

The pretreatment including edge trimming and cleaning is carried out on the target solar cell chip blocks, burrs at the edges of the target solar cell chip blocks can be removed through the edge trimming, and dust and oil stains on the surfaces of the target solar cell chip blocks can be removed through cleaning, so that the probability of edge damage or safety accidents in the rear-end process and the using process is reduced, and the recovery success rate of damaged solar cell chips is improved.

In one embodiment, as shown in fig. 1c, the damaged solar cell chip recycling method provided by the embodiment of the present invention further includes the following steps 106:

in step 106, power detection is performed on the target solar cell chip blocks, and a plurality of target solar cell chip blocks meeting preset power requirements are determined among the target solar cell chip blocks according to the power detection result.

In step 103, the plurality of target solar cell dice are bonded by using the bus bars, and the solar cells of the plurality of target solar cell dice after bonding are electrically connected, which may be implemented by step 1032:

in step 1032, the target solar cell dice that satisfy the preset power requirement are soldered using the bus bars, and the solar cells of the soldered target solar cell dice are electrically connected.

For example, the power detection may be performed on a plurality of target solar cell dice, and the IV test may be performed on the plurality of target solar cell dice to detect the power of each of the plurality of target solar cell dice.

The target solar cell chip that meets the preset power requirement may be a target solar cell chip whose power is within a preset power interval, where the preset power interval may include multiple power intervals, and the multiple power intervals may be 1W, 2W, or 5W in one gear.

Furthermore, an Electroluminescence (E L) test may be performed on the target solar cell dice to determine a target solar cell dice including internal defects in the target solar cell dice, and the target solar cell dice including internal defects may be removed from the target solar cell dice satisfying the preset power requirement before step 1032.

The power of each target solar cell chip in the plurality of welded target solar cell chip blocks can meet the requirement, and the recovery success rate of the damaged solar cell chips is improved.

In one embodiment, as shown in fig. 1d, the damaged solar cell chip recycling method provided by the embodiment of the present invention further includes the following steps 107:

in step 107, power detection is performed on the packaging target solar cell module, and the power of the packaging target solar cell module is identified according to the power detection result.

For example, the power detection of the solar cell module to be packaged may be an IV detection of the solar cell module to be packaged.

By carrying out power detection on the packaged target solar cell module and identifying the power of the packaged target solar cell module according to the power detection result, a user can conveniently know the power of the packaged target solar cell module so as to further use the packaged target solar cell module, and thus, the user experience is improved.

In one embodiment, as shown in fig. 1e, the damaged solar cell chip recycling method provided by the embodiment of the present invention further includes the following steps 108:

in step 108, the packaging target solar cell module is connected with the junction box to obtain a complete solar cell module.

The packaging target solar cell module is connected with the junction box to obtain the complete solar cell module, so that the complete solar cell module can be conveniently used by a user, and the user experience is improved.

The method for recycling damaged solar cell chips according to the embodiments of the present invention is described in detail below by using specific embodiments, fig. 2a is a top view of a damaged solar cell chip 200, as shown in fig. 2a, the damaged solar cell chip 200 has a size of 1200mm by 800mm, the damaged solar cell chip 200 includes a glass substrate 201, and a solar thin film solar CIGS solar layer 202 disposed on the glass substrate 201, and a scratch damage 203 is present on the surface of the CIGS solar layer 202, as shown in fig. 2b, the damaged solar cell chip 200 having the scratch damage 203 is subdivided into 9 solar cell chips by physical scribing and laser scribing, and is cut into 9 small solar cell chips by using a glass cutting and severing machine, which are 211 to 219, 9 solar cell chips are screened by using a solar cell chip slicing machine, wherein 211, 214,217 are solar cell chips including damaged portions, 212, 213,215,216, 219 are solar cell junction boxes, 218,219 are solar cell modules including undamaged portions, a solar cell module is subjected to a power bonding process, a power test is performed by using a roll, a solar cell bonding process, a solar cell module is characterized by a solar cell module bonding process, a solar cell module is performed by using a solar cell module bonding process, a solar cell module bonding process is performed by using a solar cell module bonding process, a solar module bonding process is performed by using a solar module bonding process, a solar module bonding process is completed solar module bonding process, a solar module bonding process is performed by using a solar module bonding process, a solar module bonding process is completed solar module bonding process, a solar module bonding process is performed by using a solar module bonding process, a solar module bonding process is completed solar module bonding process, a solar.

The following are embodiments of the apparatus of the present invention that may be used to perform embodiments of the method of the present invention.

Fig. 3a is a block diagram illustrating a damaged solar cell chip recycling apparatus 30 according to an exemplary embodiment, the damaged solar cell chip recycling apparatus 30 may be an electronic device or a part of the electronic device, and the damaged solar cell chip recycling apparatus 30 may be implemented as a part or all of the electronic device through software, hardware or a combination of both. As shown in fig. 3a, the damaged solar cell chip recycling apparatus 30 includes:

the dividing module 301 is configured to divide the damaged solar cell chip into a plurality of solar cell chip blocks of a preset size.

The screening module 302 is configured to screen the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks without including damaged portions among the plurality of solar cell chip blocks.

And a soldering module 303 for soldering the plurality of target solar cell chip blocks by using the bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering.

And the packaging module 304 is configured to package the plurality of target solar cell chip blocks after being welded, so as to obtain a packaged target solar cell module.

In one embodiment, as shown in fig. 3b, the partitioning module 301 comprises:

and the physical scribing submodule 3011 is configured to perform physical scribing on the damaged solar cell chip according to a preset scribing pattern, so that the semiconductor layer of the damaged solar cell chip in the scribing pattern is disconnected.

And the laser scribing submodule 3012 is configured to perform laser scribing on the physically scribed damaged solar cell chip according to a preset scribing pattern, so that the electrode layer of the physically scribed damaged solar cell chip in the scribing pattern is disconnected.

And a cutting submodule 3013 for cutting the damaged solar cell chip scribed by the laser into a plurality of target solar cell chip blocks with preset sizes along a preset scribing pattern.

In one embodiment, as shown in fig. 3c, the damaged solar cell chip recycling device 30 further includes:

the pre-processing module 305 is used for pre-processing a plurality of target solar cell chip blocks, and the pre-processing comprises edge trimming and cleaning.

A welding module 303, comprising:

the first soldering submodule 3031 is configured to solder the plurality of pretreated target solar cell chip blocks using the bus bar, and electrically connect the solar cells of the plurality of soldered target solar cell chip blocks.

In one embodiment, as shown in fig. 3d, the damaged solar cell chip recycling device 30 further includes:

the first power detection module 306 is configured to perform power detection on the plurality of target solar cell chip blocks, and determine a plurality of target solar cell chip blocks meeting a preset power requirement from among the plurality of target solar cell chip blocks according to a power detection result.

A welding module 303, comprising:

and a second soldering submodule 3032, configured to solder, by using a bus bar, a plurality of target solar cell chip blocks that meet a preset power requirement, so as to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering.

In one embodiment, as shown in fig. 3e, the damaged solar cell chip recycling device 30 further includes:

and a second power detection module 307, configured to perform power detection on the packaged target solar cell module, and identify the power of the packaged target solar cell module according to a power detection result.

In one embodiment, as shown in fig. 3f, the damaged solar cell chip recycling device 30 further comprises:

and the connecting module 308 is used for connecting the packaging target solar cell module with the junction box to obtain a complete solar cell module.

The damaged solar cell chip recovery device can divide a damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes, screen the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks, weld the plurality of target solar cell chip blocks by using a bus bar, electrically connect solar cells of the plurality of welded target solar cell chip blocks, and package the plurality of welded target solar cell chip blocks to obtain a packaged target solar cell module. The solar cell chip blocks including the damaged parts are excluded from the target solar cell chip blocks through screening, so that the target solar cell module obtained by welding and packaging the target solar cell chip blocks does not include any damaged parts and can normally perform solar energy conversion.

Fig. 4 is a block diagram illustrating a damaged solar cell chip recycling apparatus 40 according to an exemplary embodiment, where the damaged solar cell chip recycling apparatus 40 may be an electronic device or a part of an electronic device, and the damaged solar cell chip recycling apparatus 40 includes:

a processor 401;

a memory 402 for storing instructions executable by the processor 401;

wherein the processor 401 is configured to:

dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

screening the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks which do not include damaged parts in the plurality of solar cell chip blocks;

welding the target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected;

and packaging the welded target solar cell chip blocks to obtain a packaged target solar cell module.

In one embodiment, the processor 401 may be further configured to:

divide damaged solar cell chip into a plurality of solar cell chip pieces of predetermineeing the size, include:

physically scribing the damaged solar cell chip according to a preset scribing pattern, so that the semiconductor layer of the damaged solar cell chip in the scribing pattern is disconnected;

laser scribing is carried out on the damaged solar cell chip subjected to physical scribing according to a preset scribing pattern, so that an electrode layer of the damaged solar cell chip subjected to physical scribing, which is located in the scribing pattern, is disconnected;

and cutting the damaged solar cell chip subjected to laser scribing into a plurality of target solar cell chip blocks with preset sizes along a preset scribing pattern.

In one embodiment, the processor 401 may be further configured to:

preprocessing a plurality of target solar cell chip blocks, wherein the preprocessing comprises edge finishing and cleaning;

the method for soldering a plurality of target solar cell chip blocks by using a bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding the pretreated target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected.

In one embodiment, the processor 401 may be further configured to:

performing power detection on the plurality of target solar cell chip blocks, and determining a plurality of target solar cell chip blocks meeting preset power requirements in the plurality of target solar cell chip blocks according to power detection results;

the method for soldering a plurality of target solar cell chip blocks by using a bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding a plurality of target solar cell chip blocks meeting the preset power requirement by using the bus bar, so that the solar cells of the plurality of welded target solar cell chip blocks are electrically connected.

In one embodiment, the processor 401 may be further configured to:

and carrying out power detection on the packaged target solar cell module, and identifying the power of the packaged target solar cell module according to the power detection result.

In one embodiment, the processor 401 may be further configured to:

and connecting the packaging target solar cell module with the junction box to obtain a complete solar cell module.

The damaged solar cell chip recovery device can divide a damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes, screen the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks without damage parts in the plurality of solar cell chip blocks, weld the plurality of target solar cell chip blocks by using a bus bar, electrically connect solar cells of the plurality of welded target solar cell chip blocks, and package the plurality of welded target solar cell chip blocks to obtain a packaged target solar cell module. The solar cell chip blocks including the damaged parts are excluded from the target solar cell chip blocks through screening, so that the target solar cell module obtained by welding and packaging the target solar cell chip blocks does not include any damaged parts and can normally perform solar energy conversion.

Fig. 5 is a block diagram illustrating an apparatus 500 for recovering damaged solar cell chips, according to an exemplary embodiment. For example, the apparatus 500 may be provided as a server. The apparatus 500 includes a processing component 522 that further includes one or more processors, and memory resources, represented by memory 532, for storing instructions, such as application programs, that are executable by the processing component 522. The application programs stored in memory 532 may include one or more modules that each correspond to a set of instructions. Further, the processing component 522 is configured to execute instructions to perform the above-described methods.

The apparatus 500 may further include a power supply component 526 configured to perform power management of the apparatus 500, a wired or wireless network interface 550 configured to connect the apparatus 500 to a network, and an input/output (I/O) interface 558 the apparatus 500 may be operable based on an operating system stored in the memory 532, such as Windows server, Mac OS XTM, UnixTM, &ltttttranslation = L "&gtt translation &/t &gttinx, FreeBSDTM, or the like.

A non-transitory computer readable storage medium having instructions therein which, when executed by a processor of a device 500, enable the device 500 to perform a method of broken solar cell chip reclamation, the method comprising:

dividing the damaged solar cell chip into a plurality of solar cell chip blocks with preset sizes;

screening the plurality of solar cell chip blocks to determine a plurality of target solar cell chip blocks which do not include damaged parts in the plurality of solar cell chip blocks;

welding the target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected;

and packaging the welded target solar cell chip blocks to obtain a packaged target solar cell module.

In one embodiment, dividing the damaged solar cell chip into a plurality of solar cell chip pieces of a predetermined size includes:

physically scribing the damaged solar cell chip according to a preset scribing pattern, so that the semiconductor layer of the damaged solar cell chip in the scribing pattern is disconnected;

laser scribing is carried out on the damaged solar cell chip subjected to physical scribing according to a preset scribing pattern, so that an electrode layer of the damaged solar cell chip subjected to physical scribing, which is located in the scribing pattern, is disconnected;

and cutting the damaged solar cell chip subjected to laser scribing into a plurality of target solar cell chip blocks with preset sizes along a preset scribing pattern.

In one embodiment, the method further comprises:

preprocessing a plurality of target solar cell chip blocks, wherein the preprocessing comprises edge finishing and cleaning;

the method for soldering a plurality of target solar cell chip blocks by using a bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding the pretreated target solar cell chip blocks by using the bus bars, so that the solar cells of the welded target solar cell chip blocks are electrically connected.

In one embodiment, the method further comprises:

performing power detection on the plurality of target solar cell chip blocks, and determining a plurality of target solar cell chip blocks meeting preset power requirements in the plurality of target solar cell chip blocks according to power detection results;

the method for soldering a plurality of target solar cell chip blocks by using a bus bar to electrically connect the solar cells of the plurality of target solar cell chip blocks after soldering includes:

and welding a plurality of target solar cell chip blocks meeting the preset power requirement by using the bus bar, so that the solar cells of the plurality of welded target solar cell chip blocks are electrically connected.

In one embodiment, the method further comprises:

and carrying out power detection on the packaged target solar cell module, and identifying the power of the packaged target solar cell module according to the power detection result.

In one embodiment, the method further comprises:

and connecting the packaging target solar cell module with the junction box to obtain a complete solar cell module.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.