阅读说明：本技术 一种低温固化酚醛树脂及其制备方法 (Low-temperature cured phenolic resin and preparation method thereof ) 是由 王钧 晏应秋 杨小利 陈晞 于 2020-05-11 设计创作，主要内容包括：本发明提供一种低温固化酚醛树脂及其制备方法,该低温固化酚醛树脂,按重量份计,由以下组分组成：一阶酚醛树脂：100份,三苯基膦：0.1-2份,2-甲基咪唑：0.1-2份,碘：0.1-0.8份。本发明通过在一阶酚醛树脂中添加三苯基膦,2-甲基咪唑和碘三种复合而成的催化剂,可以有效降低酚醛树脂的固化温度,其中,相对于现有的酚醛树脂,本发明的低温固化酚醛树脂的固化温度可降低约40℃。(The invention provides a low-temperature cured phenolic resin and a preparation method thereof, wherein the low-temperature cured phenolic resin comprises the following components in parts by weight: first-order phenolic resin: 100 parts, triphenylphosphine: 0.1-2 parts, 2-methylimidazole: 0.1-2 parts, iodine: 0.1 to 0.8 portion. According to the invention, the catalyst compounded by triphenylphosphine, 2-methylimidazole and iodine is added into the first-order phenolic resin, so that the curing temperature of the phenolic resin can be effectively reduced, wherein compared with the existing phenolic resin, the curing temperature of the low-temperature curing phenolic resin can be reduced by about 40 ℃.)

1. The low-temperature cured phenolic resin is characterized by comprising the following components in parts by weight: first-order phenolic resin: 100 parts, triphenylphosphine: 0.1-2 parts, 2-methylimidazole: 0.1-2 parts, iodine: 0.1 to 0.8 portion.

2. The low temperature cured phenolic resin of claim 1, wherein the first order phenolic resin comprises one of an ammonia phenolic resin, a barium phenolic resin, and a boron phenolic resin.

3. A process for preparing a low temperature cured phenolic resin according to claim 1 or 2, comprising the steps of:

and dissolving the triphenylphosphine, the 2-methylimidazole and the iodine in a dichloromethane solution, and adding the dichloromethane solution into the first-order phenolic resin to obtain the low-temperature cured phenolic resin.

Technical Field

The invention relates to the technical field of phenolic resin, in particular to low-temperature cured phenolic resin and a preparation method thereof.

Background

As for the three thermosetting resins, the phenolic resin has the characteristics of low price, heat resistance, flame resistance, low smoke, low toxicity and the like, and has wide application range and long development history. However, the phenolic resin has the disadvantages of long curing time and high curing temperature, and can be cured at a temperature of more than 170 ℃ generally, so that the application of the phenolic resin is limited to a certain extent. Therefore, if the curing conditions of the phenolic resin can be reduced, namely the curing temperature of the phenolic resin is reduced, the product profit can be increased, the application field of the phenolic resin is expanded, and more products are produced.

Disclosure of Invention

In view of the above, the present invention is directed to provide a low temperature cured phenolic resin, so as to solve the problem of high curing temperature of the existing phenolic resin.

In order to achieve the purpose, the technical scheme of the invention is realized as follows:

the low-temperature cured phenolic resin comprises the following components in parts by weight: first-order phenolic resin: 100 parts, triphenylphosphine: 0.1-2 parts, 2-methylimidazole: 0.1-2 parts, iodine: 0.1 to 0.8 portion.

Optionally, the first order phenolic resin comprises one of ammonia phenolic resin, barium phenolic resin and boron phenolic resin.

The second purpose of the invention is to provide a method for preparing the low-temperature curing phenolic resin, which comprises the following steps:

and dissolving the triphenylphosphine, the 2-methylimidazole and the iodine in a dichloromethane solution, and adding the dichloromethane solution into the first-order phenolic resin to obtain the low-temperature cured phenolic resin.

Compared with the prior art, the low-temperature cured phenolic resin has the following advantages:

according to the invention, the catalyst compounded by triphenylphosphine, 2-methylimidazole and iodine is added into the first-order phenolic resin, so that the curing temperature of the phenolic resin can be effectively reduced, wherein compared with the existing phenolic resin, the curing temperature of the low-temperature curing phenolic resin can be reduced by about 40 ℃.

Detailed Description

It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.

The present invention will be described in detail with reference to examples.