阅读说明：本技术 热电堆红外探测器及其热导通结构 (Thermopile infrared detector and heat conduction structure thereof ) 是由 毛海央 张琛琛 戴鑫 于 2020-04-15 设计创作，主要内容包括：本发明提供了一种热电堆红外探测器及其热导通结构,安装于基底上,其包括设于基底上的热电堆,热电堆具有探测冷端和探测热端,热电堆的探测冷端与基底贴合,热电堆的探测热端开设有导热槽,导热槽内填充有红外吸收材料。本发明提供的热电堆红外探测器及其热导通结构,通过在探测热端的热电堆上开通导热槽,并在导热槽内填充红外吸收材料,可以将位于热电堆红外探测器的中心的吸收区的绝大部分热量传送至热电堆的探测热端,探测冷端直接连接基底,使得探测热端和探测冷端能够具有较大的温差,从而实现该红外堆红外探测器对环境温度的精准测量,并且热导通结构简单,施工工艺简单,且能够达到较好的热导通效果。(The invention provides a thermopile infrared detector and a heat conduction structure thereof, which are arranged on a substrate and comprise a thermopile arranged on the substrate, wherein the thermopile is provided with a detection cold end and a detection hot end, the detection cold end of the thermopile is attached to the substrate, the detection hot end of the thermopile is provided with a heat conduction groove, and an infrared absorption material is filled in the heat conduction groove. According to the thermopile infrared detector and the heat conduction structure thereof, the thermopile at the detection hot end is provided with the heat conduction groove, and the heat conduction groove is filled with the infrared absorption material, so that most of heat of the absorption area at the center of the thermopile infrared detector can be transmitted to the detection hot end of the thermopile, and the detection cold end is directly connected with the substrate, so that the detection hot end and the detection cold end can have a larger temperature difference, and the infrared detector of the thermopile can accurately measure the ambient temperature.)

1. The heat leads to the structure, installs on basement (1), its characterized in that: the method comprises the following steps:

locate thermopile (2) on base (1), thermopile (2) have detection cold junction (22) and detection hot junction (21), the detection cold junction (22) of thermopile (2) with base (1) laminating, heat-conducting groove (25) have been seted up in detection hot junction (21) of thermopile (2), heat-conducting groove (25) intussuseption is filled with infrared absorbing material (4).

2. The heat conduction structure of claim 1, wherein: the thermopile (2) comprises a first thermocouple strip (23) and a second thermocouple strip (24), wherein the first thermocouple strip (23) and the second thermocouple strip (24) are sequentially stacked on the substrate (1), the second thermocouple strip (24) is arranged on the first thermocouple strip (23), and the heat conducting groove (25) is formed in the second thermocouple strip (24).

3. The heat conduction structure of claim 2, wherein: the heat conducting groove (25) penetrates through the second thermocouple strip (24) and extends into the first thermocouple strip (23).

4. The heat conduction structure of claim 2, wherein: extension parts (241) are convexly arranged at two ends of the second thermocouple strip (24) towards one side of the first thermocouple strip (23), the heat conduction groove (25) is arranged on the extension parts (241), and a heat insulation layer (26) is filled between the middle part of the second thermocouple strip (24) and the first thermocouple strip (23).

5. The heat conductive structure of any one of claims 1 to 4, wherein: the infrared absorption material (4) is made of silicon nitride.

6. The heat conductive structure of any one of claims 1 to 4, wherein: and a supporting membrane assembly (3) is also arranged between the substrate (1) and the thermopile (2).

7. The heat conduction structure of claim 6, wherein: the supporting membrane assembly (3) comprises a first silicon oxide layer (31), a silicon nitride layer (32) and a second silicon oxide layer (33) which are sequentially stacked.

8. Thermopile infrared detector, its characterized in that: the thermal conduction structure comprises a substrate (1) and the thermal conduction structure as claimed in any one of claims 1 to 7, wherein a plurality of thermopiles (2) are arranged on the substrate (1) at intervals.

9. The thermopile infrared detector of claim 8, wherein: the substrate (1) is formed with an absorbing region (5) in the middle, and the infrared absorbing material (4) is attachable to the absorbing region (5).

10. The thermopile infrared detector of claim 9, wherein: the substrate (1) is divided into four areas through a cross-shaped partition channel, a plurality of thermopiles (2) which are parallel to each other are transversely or vertically distributed in each area, and the central area of the cross-shaped partition channel is the absorption area (5).

Technical Field

The invention relates to the technical field of infrared detectors, in particular to a thermopile infrared detector and a heat conduction structure thereof.

Background

The infrared detector belongs to non-contact temperature measurement, and is used for detecting infrared radiation of a heat source and converting the infrared radiation into an electric signal to be output. Due to the non-contact property of the infrared detector, the infrared detector does not need to contact with the measured object when measuring the surface temperature of the object, so that the change of the temperature field around the object is avoided, and the influence of the change of the air or the ambient temperature before measurement is small.

The MEMS thermopile infrared detector is researched and developed by combining the mature MEMS technology at present. The MEMS thermopile infrared detector is a micro-integrated device based on the Seebeck effect. According to the Seebeck effect, when one ends of two materials with different Seebeck coefficients are connected to form a thermocouple, if the temperature difference occurs between the connected end and the non-connected end, a potential difference can be generated between the cold end and the hot end. The MEMS thermopile infrared detector has the advantages of small volume, light weight, low power consumption, high reliability, excellent performance, multifunctional integration, batch production and the like, and is widely applied to the fields of military affairs, medical treatment, industry, aerospace and the like.

Because silicon has the advantage of good thermal conductivity, the thermopile is directly integrated on the substrate in the traditional integrated infrared sensor chip, and absorbed infrared radiation energy can dissipate a large amount of heat through the silicon substrate, so that the thermal short circuit of the thermopile is caused, and the deviation of the measurement result is large. Meanwhile, the consistency and uniformity of the release process of each device are ensured to be difficult, so that the cold end and the hot end of the prepared device have no obvious temperature difference, and the performance of the whole device is reduced or even the whole device cannot be used.

Disclosure of Invention

The invention aims to provide a thermopile infrared detector and a heat conduction structure thereof, and aims to solve the technical problems that the performance of the whole device is reduced and even the whole device cannot be used because the cold end and the hot end have no obvious temperature difference in the prior art.

In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a heat leads to structure installs in the basement, and it is including locating thermopile on the basement, the thermopile has detection cold junction and detection hot junction, the detection cold junction of thermopile with the basement laminating, the heat-conducting groove has been seted up to the detection hot junction of thermopile, the heat-conducting groove intussuseption is filled with infrared absorption material.

Furthermore, the thermopile comprises a first thermocouple strip and a second thermocouple strip, wherein the first thermocouple strip and the second thermocouple strip are sequentially stacked on the substrate, and the heat conducting groove is formed in the second thermocouple strip.

Further, the heat conduction groove penetrates through the second thermocouple strip and extends into the first thermocouple strip.

Furthermore, the two ends of the second thermocouple strip are convexly provided with extending parts towards one side of the first thermocouple strip, the heat conducting groove is arranged on the extending parts, and a heat insulating layer is filled between the middle part of the second thermocouple strip and the first thermocouple strip.

Further, the infrared absorption material adopts silicon nitride.

Further, a supporting membrane assembly is arranged between the substrate and the thermopile.

Furthermore, the support film assembly comprises a first silicon oxide layer, a silicon nitride layer and a second silicon oxide layer which are sequentially stacked.

The invention also discloses a thermopile infrared detector in other embodiments, which comprises a substrate and the heat conduction structure, wherein a plurality of thermopiles are arranged on the substrate at intervals.

Further, the substrate is formed with an absorption region in the central portion thereof, and the infrared absorbing material may be attached to the absorption region.

Furthermore, the substrate is divided into four areas by a cross-shaped dividing channel, a plurality of thermopiles which are parallel to each other are transversely or vertically distributed in each area, and the central area of the cross-shaped dividing channel is the absorption area.

The thermopile infrared detector and the heat conduction structure thereof provided by the invention have the beneficial effects that: compared with the prior art, the thermal conduction structure has the advantages that the thermal conduction groove is formed in the thermopile at the detection hot end, the infrared absorption material is filled in the thermal conduction groove, most of heat of the absorption area in the center of the thermopile infrared detector can be transmitted to the detection hot end of the thermopile, the detection cold end is directly connected with the substrate, the detection hot end and the detection cold end can have larger temperature difference, the infrared detector of the thermopile can accurately measure the ambient temperature, the thermal conduction structure is simple, the construction process is simple, and the better thermal conduction effect can be achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a first structural schematic view of a longitudinal section of a thermal conduction structure according to an embodiment of the present invention;

fig. 2 is a second structural schematic diagram of a longitudinal section of a thermal conduction structure according to an embodiment of the present invention;

fig. 3 is a first structural diagram illustrating a cross-section of a hot end of a thermal via structure according to an embodiment of the present invention;

fig. 4 is a structural diagram illustrating a cross-section of a hot end of a thermal conduction structure according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a thermopile infrared detector according to an embodiment of the present invention.

Description of reference numerals:

1. a substrate; 2. a thermopile; 3. supporting the membrane module; 4. an infrared filling material; 5. an absorption zone; 6. an electrode; 21. detecting a hot end; 22. detecting a cold end; 23. a first thermocouple strip; 24. a second thermocouple strip; 25. a heat conducting groove; 26. a heat insulating layer; 241. an extension portion; 31. a first silicon oxide layer; 32. a silicon nitride layer; 33. and a second silicon dioxide layer.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.