阅读说明：本技术 车辆led大灯结构 (vehicle L ED headlight structure ) 是由 陈东桥 于 2020-04-03 设计创作，主要内容包括：一种车辆LED大灯结构,属于车辆构件技术领域。包括一散热座、一导热体、一散热风扇、灯碗和LED芯片,散热座朝向下的一侧构成有一散热腔并且在散热座的四周间隔开设有自散热座的上部贯通至散热腔的散热座散热孔,在散热座的侧部开设有一与散热腔相通的车载电源引接线孔,散热风扇设在散热腔内,LED芯片设在导热体上的上部,特点：在所述散热座朝向上的一侧表面的中部区域还构成有一导热体插固机构,所述导热体的下部与导热体插固机构插固,灯碗与导热体插固机构固定并且对导热体的上部蔽护,该导热体为横截面形状呈矩形的扁平状铜板。热散效果得好,延长LED芯片的使用寿命；改善光源在灯碗中的反射效率,增进聚集效果；节约成本。(an L-shaped light-Emitting Diode (ED) headlight structure for vehicles is composed of a heat radiating seat with a heat radiating cavity, heat radiating holes around said heat radiating seat, a heat radiating fan with a power supply lead hole, a bowl and an L-shaped chip, a heat conducting body with a rectangular cross-section and a heat radiating ring, a heat radiating bowl, a heat conducting body with a heat radiating hole, and a heat conducting body fixing mechanism.)

1. the utility model provides a vehicle L ED headlight structure, includes a radiating seat (1), a heat conductor (2), a radiator fan (3), lamp bowl (4) and L ED chip (5), radiating seat (1) one side down constitutes has a radiating chamber (11) and has offered around radiating seat (1) interval from the upper portion of radiating seat (1) to link up to radiating chamber (11) radiating seat louvre (12), the lateral part of radiating seat (1) is offered one with the communicating on-vehicle power supply lead wire hole (13) of radiating chamber (11), radiator fan (3) set up in radiating chamber (11), L ED chip (5) set up the upper portion on heat conductor (2), its characterized in that the middle part region of the side surface that radiating seat (1) is upwards still constitutes a heat conductor solid mechanism of inserting (14), the lower part of heat conductor (2) is inserted solid with heat conductor solid mechanism of inserting (14), lamp bowl (4) are fixed and are the upper portion to heat conductor (2) of heat conductor solid mechanism of inserting, and should be the flat copper shape of protecting for the heat conductor cross section (2).

2. the vehicle L ED headlamp structure according to claim 1, wherein the heat conductor insertion mechanism (14) includes an additional heat dissipating stud (141), a heat conductor left restriction seat (142), and a heat conductor right restriction seat (143), the additional heat dissipating stud (141) is formed in a central region of an upward facing side surface of the heat dissipating stud (1), additional heat dissipating stud heat dissipating holes (1411) are formed in the additional heat dissipating stud (141) at intervals around the additional heat dissipating stud (141), the additional heat dissipating stud heat dissipating holes (1411) pass through from an upper portion to a lower portion of the additional heat dissipating stud (141) and communicate with the heat dissipating cavity (11), a heat conductor lower support restriction cavity (1412) is formed at a central position of the additional heat dissipating stud (141), the heat conductor left restriction seat (142) and the heat conductor right restriction seat (143) extend upward in left-right correspondence to each other to form an upper surface of the additional heat dissipating stud (141), the heat conductor left restriction seat (142) and the heat conductor right restriction seat (143) are formed to extend upward in left-right correspondence with each other to form an upper surface of the additional heat dissipating stud heat dissipating cavity (141), the heat dissipating stud heat dissipating hole (1412) is inserted into the upper portion (144), and the heat dissipating stud inserted into the heat dissipating cavity (1412), the heat conducting body left restriction seat (144), and the heat conducting stud inserted into the heat dissipating stud inserted space (1412), and the heat conducting stud inserted into the heat dissipating.

3. the vehicle L ED headlamp structure as claimed in claim 2, wherein a heat conductor left defining seat wire hole (1421) is formed in the heat conductor left defining seat (142), a heat conductor right defining seat wire hole (1431) is formed in the heat conductor right defining seat (143), the heat conductor left defining seat wire hole (1421) extends downward from an upper portion of the heat conductor left defining seat (142) and communicates with the heat dissipating chamber (11) after passing through the additional heat dissipating pillar (141) and the heat dissipating seat (1) in this order, and the heat conductor right defining seat wire hole (1431) extends downward from an upper portion of the heat conductor right defining seat (143) and communicates with the heat dissipating chamber (11) after passing through the additional heat dissipating pillar (141) and the heat dissipating seat (1) in this order.

4. vehicle L ED headlight structure according to claim 2, characterized in that the width of the heat conductor lower insert cavity (144) and the heat conductor lower support limiting cavity (1412) is adapted to the thickness of the heat conductor (2).

5. the vehicle L ED headlight structure according to claim 2 or 3, characterized in that the cross-sectional shape of the heat conductor left delimiting seat (142) and the heat conductor right delimiting seat (143) is semicircular.

6. the vehicle led headlight structure according to claim 2, wherein a heat conductor fixing screw hole (1413) is formed in a side portion of said additional heat dissipating pillar (141), said heat conductor fixing screw hole (1413) communicates with said heat conductor lower support limit chamber (1412), and a heat conductor fixing screw (14131) for fixing a lower portion of said heat conductor (2) is provided in said heat conductor fixing screw hole (1413).

7. the vehicle led headlight structure according to claim 2, wherein a lamp bowl fixing sleeve (1414) is fixedly sleeved on an outer wall of the additional heat dissipating post (141), and a lower portion of the lamp bowl (4) is fixed to the lamp bowl fixing sleeve (1414).

8. the vehicle L ED headlamp structure as claimed in claim 7, wherein a mounting collar flange (14141) is formed on an upper portion of the lamp bowl mounting collar (1414), a lamp bowl fixing flange ring (41) is formed on a lower portion of the lamp bowl (4), the lamp bowl fixing flange ring (41) is fixed to the mounting collar flange (14141) by a flange ring screw (411), and a lamp bowl panel (42) is provided on an upper portion of the lamp bowl (4), the lamp bowl panel (42) being transparent.

9. the vehicle L ED headlamp structure according to claim 1, wherein the L ED chips (5) are paired and are respectively disposed on the upper left and right sides of the heat conductor (2) through a chip substrate (51), and the chip substrates (51) are fixed to the heat conductor (2) by chip substrate fixing screws (511).

10. the vehicle L ED headlamp structure according to claim 6, characterized in that a heat conductor fixing screw penetrating hole (21) is formed in a lower portion of the heat conductor (2) at a position corresponding to the heat conductor fixing screw hole (1413), the heat conductor fixing screw (14131) penetrates into the heat conductor fixing screw penetrating hole (21), and the heat conductor fixing screw penetrating hole (21) is a blind hole.

Technical Field

the invention belongs to the technical field of vehicle components, and particularly relates to an L ED headlamp structure of a vehicle.

Background

as is known in the art, since the led is a semiconductor electric element, if the temperature is high and the forced physical cooling is not achieved effectively, the lighting effect is significantly reduced, so that the search for effective technical measures for cooling the L ED headlamp of the vehicle is of positive significance.

the typical examples of the former are "a car headlight heat dissipation device based on micro-pump cycle" recommended by CN109780505A and "a chimney led car headlight" provided by CN108916809A, the latter is CN202938202U (a spiral heat dissipating L0 ED car headlight), CN207471434U (an H-type intelligent L ED car headlight lighting system), CN207407269U (an H1-type intelligent L ED car headlight lighting system), CN207438466U (a new car headlight), CN207438464U (a closed heat dissipating car headlight), CN207438477U (a surrounding heat dissipating structure car headlight) and CN207935972U (a car headlight assembly and its L headlight bulb) because the latter is simpler than the former and does not need to leak a cooling medium, the application range of the latter is far greater than that of the former, namely the latter is more likely than that of the former because the latter is more likely to be influenced by the heat dissipation efficiency of the heat dissipation of the heat sink due to the fact that the heat sink is generally designed as a heat sink, the heat sink is more likely to be used than the former, and the heat sink is more likely to be used as a heat sink.

Disclosure of Invention

the invention aims to provide a vehicle L ED headlight structure which is beneficial to obviously improving the heat conduction efficiency of a heat conductor and the reflectivity of an L ED chip in a reflector.

the invention aims to solve the problem that the L ED headlamp structure of the vehicle comprises a heat radiating seat, a heat conductor, a heat radiating fan, a lamp bowl and an L ED chip, wherein a heat radiating cavity is formed on one downward side of the heat radiating seat, heat radiating seat heat radiating holes penetrating from the upper part of the heat radiating seat to the heat radiating cavity are formed at intervals on the periphery of the heat radiating seat, a vehicle-mounted power supply lead wire hole communicated with the heat radiating cavity is formed in the side part of the heat radiating seat, the heat radiating fan is arranged in the heat radiating cavity, the L ED chip is arranged on the upper part of the heat conductor, the L ED headlamp structure is characterized in that a heat conductor inserting and fixing mechanism is further formed in the middle area of the surface of one upward side of the heat radiating seat, the lower part of the heat conductor is inserted and fixed with the heat conductor inserting and fixing mechanism, the lamp bowl is fixed with the heat conductor inserting and fixing mechanism and shields the upper part of the heat conductor.

in a specific embodiment of the present invention, the heat conductor insertion mechanism includes an additional heat-dissipating stud, a heat conductor left limiting seat and a heat conductor right limiting seat, the additional heat-dissipating stud is formed in a middle region of an upward facing side surface of the heat-dissipating seat, additional heat-dissipating stud heat-dissipating holes are formed in the additional heat-dissipating stud at intervals around the additional heat-dissipating stud, the additional heat-dissipating stud heat-dissipating holes penetrate from an upper portion to a lower portion of the additional heat-dissipating stud and communicate with the heat-dissipating cavity, a heat conductor lower supporting limiting cavity is formed in a central position of the additional heat-dissipating stud, the heat conductor left limiting seat and the heat conductor right limiting seat extend upward and form an upper surface of the additional heat-dissipating stud in a left-right corresponding state, a space between the heat conductor left limiting seat and the heat conductor right limiting seat is formed as a heat conductor lower insertion cavity, the heat conductor lower insertion cavity corresponds to and communicates with the heat conductor lower supporting limiting cavity, the lower portion of the heat conductor is sequentially inserted into the heat conductor lower insertion cavity and the heat conductor lower insertion cavity, the additional heat-dissipating stud extends out of the fixing bowl.

In another specific embodiment of the present invention, a conductor hole of the left conductor defining seat is formed on the left conductor defining seat, and a conductor hole of the right conductor defining seat is formed on the right conductor defining seat, the conductor hole of the left conductor defining seat extends downward from the upper portion of the left conductor defining seat and communicates with the heat dissipation chamber after sequentially passing through the additional heat dissipation pillar and the heat dissipation seat, and the conductor hole of the right conductor defining seat extends downward from the upper portion of the right conductor defining seat and communicates with the heat dissipation chamber after sequentially passing through the additional heat dissipation pillar and the heat dissipation seat.

In yet another specific embodiment of the present invention, the widths of the heat conductor lower insert cavity and the heat conductor lower support limit cavity are adapted to the thickness of the heat conductor.

In a further particular embodiment of the invention, the cross-sectional shape of the left and right seats of the heat conductor is semicircular.

In still another embodiment of the present invention, a heat conductor fixing screw hole is formed at a side portion of the additional heat dissipating stud, the heat conductor fixing screw hole communicates with the heat conductor lower support limit chamber, and a heat conductor fixing screw for fixing a lower portion of the heat conductor is provided at the heat conductor fixing screw hole.

In a more specific embodiment of the present invention, a lamp bowl fixing sleeve is fixedly sleeved on the outer wall of the additional heat dissipation column, and the lower part of the lamp bowl is fixed with the lamp bowl fixing sleeve.

In a further embodiment of the invention, a mounting sleeve flange is formed on the upper part of the lamp bowl mounting sleeve, a lamp bowl fixing flange ring is formed on the lower part of the lamp bowl, the lamp bowl fixing flange ring is fixed with the mounting sleeve flange through flange ring screws, and a lamp bowl panel is arranged on the upper part of the lamp bowl and is transparent.

in yet another specific embodiment of the present invention, the number of the led chips is one pair and each of the led chips is disposed on the upper left and right sides of the heat conductor by a chip substrate, and the chip substrate is fixed to the heat conductor by a chip substrate fixing screw.

In yet another specific embodiment of the present invention, a heat conductor fixing screw penetrating hole is formed in a lower portion of the heat conductor at a position corresponding to the heat conductor fixing screw hole, the heat conductor fixing screw penetrating hole into which the heat conductor fixing screw penetrates, and the heat conductor fixing screw penetrating hole is a blind hole.

the technical scheme provided by the invention has the advantages that firstly, the heat conductor and the heat radiating seat form a split structure creatively, so that the heat conductor can adopt a copper plate with higher heat conduction efficiency, the heat radiating effect can be exerted extremely and the service life of the LED chip can be prolonged remarkably, secondly, the heat conductor is formed into a flat structure with a rectangular cross section, so that the reflecting efficiency of a light source in a lamp bowl is improved and the gathering effect is improved compared with a cylinder in the prior art, and thirdly, the heat conductor adopts copper with higher price, and the heat radiating seat still adopts traditional cheap materials, so that a reasonable balance point is found between resource saving and product cost.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present invention.

Fig. 2 is a detailed structure diagram of the heat sink, the heat conductor and the heat dissipation fan shown in fig. 1.

Fig. 3 is a schematic diagram of another embodiment of the present invention.

Fig. 4 is a detailed structure diagram of the heat sink, the heat conductor and the heat dissipation fan shown in fig. 3.

Fig. 5 is a schematic view of the heat sink shown in fig. 3.

Detailed Description

In order to clearly understand the technical spirit and the advantages of the present invention, the applicant below describes in detail by way of example, but the description of the example is not intended to limit the technical scope of the present invention, and any equivalent changes made according to the present inventive concept, which are merely in form and not in material, should be considered as the technical scope of the present invention.

In the following description, all the concepts related to the directions or orientations of up, down, left, right, front and rear are in the position state shown in fig. 1, and thus, it should not be understood as a particular limitation to the technical solution provided by the present invention.