阅读说明：本技术 一种同时切割不同SiC厚度的多线切割机槽轮 (Multi-wire saw grooved wheel capable of cutting SiC with different thicknesses simultaneously ) 是由 陈秀芳 谢雪健 徐现刚 杨祥龙 胡小波 王瑞琪 于 2018-08-23 设计创作，主要内容包括：本发明涉及一种同时切割不同SiC厚度的多线切割机槽轮,属于半导体单晶材料加工领域,该槽轮设置有两种或两种以上槽区间,每个槽区间设置有等间距的槽,不同槽区间内的槽间距不同。本发明通过将槽轮设计为不同的槽间距,可以同时切割出不同厚度的切割片,减少了安装、拆卸槽轮的次数,减少了操作工序,提高了工作效率,实现了节省能源、材料的目的。(The invention relates to a sheave of a multi-wire cutting machine for simultaneously cutting SiC with different thicknesses, which belongs to the field of processing of semiconductor single crystal materials. According to the invention, the grooved wheels are designed to have different groove intervals, so that cutting pieces with different thicknesses can be cut simultaneously, the times of mounting and dismounting the grooved wheels are reduced, the operation procedures are reduced, the working efficiency is improved, and the purposes of saving energy and materials are achieved.)

1. The sheave of the multi-wire cutting machine for simultaneously cutting SiC with different thicknesses is characterized in that the sheave is provided with two or more than two groove sections, grooves with equal intervals are arranged between every two groove sections, the groove intervals in the different groove sections are different, and transition grooves are arranged between the groove sections.

2. The multi-wire saw sheave for simultaneously cutting SiC thicknesses of claim 1, wherein the number of groove segments is 2-5.

3. The multi-wire saw sheave for simultaneously cutting SiC of different thicknesses as claimed in claim 1, wherein the groove pitch in the groove sections is 0.6-1 mm, and the groove pitch in different groove sections is different.

4. The multi-wire saw sheave for simultaneously cutting SiC thicknesses of claim 1, wherein the number of grooves in each groove segment is 30-120.

5. The multi-wire saw sheave for simultaneously cutting different SiC thicknesses as in claim 1, wherein the sheave is made of a polyethylene material or a polyurethane material.

6. The multi-wire saw sheave for simultaneously cutting SiC of different thicknesses as claimed in claim 5, wherein the groove is a V-shaped groove; further preferably, when the material of the sheave is a polyethylene material, the grooving angle is 50 °, and when the material of the sheave is a polyurethane material, the grooving angle is 70 °.

Technical Field

The invention relates to a sheave of a multi-wire cutting machine for simultaneously cutting SiC with different thicknesses, belonging to the field of processing of semiconductor single crystal materials.

Background

The SiC single crystal is a typical representative of wide bandgap semiconductor materials, is a key material for preparing high-temperature, high-frequency and high-power electronic devices, and is an ideal substrate material for preparing green, blue and ultraviolet LEDs. The mohs hardness of SiC is 9.2, second only to diamond, resulting in considerable difficulty in cutting SiC crystals, very slow cutting rates, and the cutting time required increases rapidly with increasing diameter. Generally, the larger the crystal diameter, the greater the internal stress of the crystal, the slower the stage moving speed when cutting the crystal, and the longer the cutting time. The optimized cutting process shows that the cutting time of the 2-inch SiC monocrystal is 10-20 h, the cutting time of the 3-inch SiC monocrystal is 20-30 h, the cutting time of the 4-inch SiC monocrystal is 80-100 h, and the cutting time of the 6-inch SiC monocrystal is 150-200 h, so that the cost is increased rapidly due to the long cutting time. When the SiC single crystal is cut, slices with different single crystal diameters have different thickness requirements, the thickness of the 2inch to 4inch SiC substrate is 350 to 450 mu m, and the thickness of the 6inch SiC substrate is 500 to 800 mu m. When the multi-wire cutting machine is used for cutting materials, the grooving distance of the grooved wheels determines the thickness of the cut materials. The design of the sheave determines the thickness of the final sheet of cut material. Typically, the thickness of the sheet of cutting material is approximately equal to the sheave groove spacing minus the diameter of the metal cutting wire and the size of the abrasive particles in the cutting fluid. The grooved pulley design scheme of a single grooved pulley groove cannot simultaneously cut SiC single crystals with different diameters and different sheet thickness requirements. Therefore, grooved wheels with different specifications need to be frequently disassembled and assembled, and the workload is greatly increased; meanwhile, because crystals with the same diameter and the same thickness requirement are cut once, the time utilization rate is low, and the cutting efficiency is seriously reduced.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a design method of a sheave of a multi-wire cutting machine for simultaneously obtaining SiC cutting pieces with different thicknesses. The grooved pulley can reduce the installation and disassembly times of the grooved pulley in the multi-wire cutting process of different thicknesses of the crystal, further reduce the accidental sand feeding probability of the bearing in the bearing base disassembly process, save labor, and prolong the use times of the grooved pulley and the service life of the guide pulley in the bearing base. Due to the fact that the distances between the grooved pulley grooves are different, combined crystals with different diameters can be cut simultaneously, and therefore the effects of saving time, energy and materials are achieved.

The technical scheme of the invention is as follows:

a sheave of a multi-wire cutting machine capable of simultaneously cutting SiC with different thicknesses is provided with two or more than two groove sections, grooves with equal intervals are arranged between every two groove sections, and the groove intervals in different groove sections are different.

According to the invention, preferably, the number of the groove sections is 2-5; further preferably, the number of the groove sections is determined by the number of different diameters in the combined crystal to be cut.

According to the invention, preferably, the groove spacing in the groove sections is 0.6-1 mm, and the groove spacing in different groove sections is different; further preferably, the size of the groove pitch is determined by the thickness of SiC wafers of different diameters.

According to the invention, the number of the inner grooves in each groove zone is preferably 30-120; further preferably, the number of inner grooves in each groove region is determined by the thickness of the SiC crystal cut by the groove.

According to the present invention, preferably, the material of the sheave is a polyethylene material or a polyurethane material.

According to the present invention, preferably, the groove is a V-shaped groove; further preferably, when the material of the sheave is a polyethylene material, the grooving angle is 50 °, and when the material of the sheave is a polyurethane material, the grooving angle is 70 °.

According to the invention, the grooved pulley capable of simultaneously realizing SiC cutting sheets with different thicknesses can be installed in the existing multi-wire cutting machine for use, and the cutting wire used in cutting is a steel wire or a diamond wire. The invention is suitable for all types of multi-wire cutting machines.

Compared with the prior art, the invention has the following advantages:

1. the grooved wheels are designed to have different groove intervals, so that wafers with different thicknesses can be cut simultaneously, the cutting efficiency is improved, and the purposes of saving energy, materials and time are achieved.

2. According to the invention, the grooved wheels are designed to have different groove intervals, so that the times of mounting and dismounting the grooved wheels are reduced, the operation procedures are reduced, and the working efficiency is improved.

3. The grooved wheel is easy to realize, and convenient to popularize and use.

Drawings

Fig. 1 is a structural view of a sheave in embodiment 1 of the present invention.

Fig. 2 is a partially enlarged view of a sheave in embodiment 1 of the present invention.

Wherein: 2-1 represents a first slot interval; 2-2 denotes a second slot interval.

Detailed Description

The present invention will be further described with reference to the following examples and accompanying drawings, but is not limited thereto.