阅读说明：本技术 晶圆涂覆清洗装置 (Wafer coating and cleaning device ) 是由 赵裕兴 韩秋杰 于 2021-07-28 设计创作，主要内容包括：本发明涉及晶圆涂覆清洗装置,包括水槽组件、旋转轴组件、涂覆摆臂组件、清洗摆臂组件和吸附载台,旋转轴组件、涂覆摆臂组件和清洗摆臂组件均安装在水槽组件上,旋转轴组件位于水槽组件的中间位置,涂覆摆臂组件和清洗摆臂组件位于旋转轴组件的两侧位置,旋转轴组件的顶部安装有吸附载台。本发明通过水槽组件、旋转轴组件、涂覆摆臂组件、清洗摆臂组件和吸附载台的结构设置,综合对晶圆进行涂覆处理和清洗处理,处理效果较好,处理效率较高。(The invention relates to a wafer coating and cleaning device which comprises a water tank assembly, a rotating shaft assembly, a coating swing arm assembly, a cleaning swing arm assembly and an adsorption carrying platform, wherein the rotating shaft assembly, the coating swing arm assembly and the cleaning swing arm assembly are all arranged on the water tank assembly, the rotating shaft assembly is positioned in the middle of the water tank assembly, the coating swing arm assembly and the cleaning swing arm assembly are positioned on two sides of the rotating shaft assembly, and the adsorption carrying platform is arranged at the top of the rotating shaft assembly. According to the invention, through the structural arrangement of the water tank assembly, the rotating shaft assembly, the coating swing arm assembly, the cleaning swing arm assembly and the adsorption carrying platform, the coating treatment and the cleaning treatment are comprehensively carried out on the wafer, the treatment effect is better, and the treatment efficiency is higher.)

1. The wafer coating and cleaning device is characterized by comprising a water tank assembly (1), a rotating shaft assembly (2), a coating swing arm assembly (3), a cleaning swing arm assembly (4) and an adsorption carrying platform (5), wherein the rotating shaft assembly (2), the coating swing arm assembly (3) and the cleaning swing arm assembly (4) are all arranged on the water tank assembly (1), the rotating shaft assembly (2) is located in the middle of the water tank assembly (1), the coating swing arm assembly (3) and the cleaning swing arm assembly (4) are located on two sides of the rotating shaft assembly (2), and the adsorption carrying platform (5) is arranged at the top of the rotating shaft assembly (2);

the water tank assembly (1) comprises a fixed base, a water tank (8) and a lifting cylinder (13), the water tank (8) is installed on the fixed base through a plurality of upright posts (7), the lifting cylinder (13) is installed on one side of the fixed base along the vertical direction, and a driving end of the top of the lifting cylinder (13) is in driving connection with the rotating shaft assembly (2) in the vertical direction;

the rotary shaft assembly (2) comprises a servo motor (14), a rotary fixed disc (17) and a rotary connecting plate (19), the servo motor (14) is connected with the water tank (8) sequentially through a motor base and the rotary fixed disc (17) above, a rotary shaft housing (18) is arranged on the inner side of the rotary fixed disc (17), a driving shaft at the top of the servo motor (14) is connected with the rotary connecting plate (19) on the inner side of the rotary shaft housing (18) above and is driven sequentially through a first coupler (15) and a sealing rotary shaft (16), and an adsorption carrying platform (5) is arranged on the rotary connecting plate (19);

the bottom of the coating swing arm assembly (3) and the bottom of the cleaning swing arm assembly (4) are both installed on the fixed base, and the top of the coating swing arm assembly (3) and the top of the cleaning swing arm assembly (4) both penetrate through the water tank (8) and are located on two side positions of the adsorption carrying platform (5).

2. The wafer coating cleaning device according to claim 1, further comprising a housing assembly (6), wherein the housing assembly (6) is installed on the water tank (8), the housing assembly (6) comprises a sealed housing (41), an opening is formed in the top of the sealed housing (41), a sealed roller shutter (44) is movably arranged in the opening, a roller shutter cylinder (45) is further arranged in the sealed housing (41), the driving end of the roller shutter cylinder (45) is in driving connection with the sealed roller shutter (44), and a first manifold (42) and a second manifold (43) are further arranged on the outer side of the sealed housing (41).

3. The wafer coating and cleaning device as claimed in claim 1, wherein the adsorption stage (5) comprises an adsorption disc (21) and a steel ring (24), the adsorption disc (21) is mounted on the rotary connecting plate (19), the steel ring (24) is arranged on the outer side of the adsorption disc (21), and the adsorption disc (21) is connected with the steel ring (24) through a steel ring clamping support (22) and a clamping (23).

4. The wafer coating cleaning device according to claim 1, wherein the water tank assembly (1) further comprises a guide limiting assembly, the guide limiting assembly comprises a lifting limiting block (10), a linear bearing seat (12) and a guide shaft (20), the lifting limiting block (10) is mounted on a fixed base, the guide shaft (20) is mounted on a rotary fixed disk (17) through the linear bearing seat (12), and the lifting limiting block (10) is arranged at the bottom of the guide shaft (20).

5. The wafer coating cleaning device as claimed in claim 1, wherein a damper (9) is provided between the water tank (8) and the column (7), and a drain flange opening (11) is further provided at the bottom of the water tank (8).

6. The wafer coating cleaning device according to claim 1, characterized in that the coating swing arm assembly (3) comprises a stepping motor (25), a hollow shaft (30), an L-shaped joint (33) and a coating fixing plate (35) from bottom to top in sequence, the stepping motor (25) is connected with a motor fixing plate (32) above, the driving end at the top of the stepping motor (25) is connected with a coating fixing plate (35) in a driving way through a second coupler (26), a connecting shaft (27), a three-way joint (29), a hollow shaft (30) and an L-shaped joint (33), a coating nozzle (34) is arranged on the coating fixing plate (35), a first supporting seat (28) connected with the motor fixing plate (32) is arranged between the second coupler (26) and the connecting shaft (27), the hollow shaft (30) is arranged on a motor fixing plate (32) through a second supporting seat (31).

7. The wafer coating cleaning device according to claim 1, wherein the cleaning swing arm assembly (4) comprises a stepping motor (25), a solid shaft (36), an L-shaped joint (33) and a cleaning fixing plate (38) in sequence from bottom to top, the stepping motor (25) is connected with a motor fixing plate (32) above, the driving end at the top of the stepping motor (25) is connected with a cleaning fixing plate (38) above through a second coupling (26), a solid shaft (36) and an L-shaped joint (33) in a driving way, a cleaning nozzle (37) is arranged on the cleaning fixing plate (38), a first supporting seat (28) connected with the motor fixing plate (32) is arranged between the second coupler (26) and the solid shaft (36), the solid shaft (36) is arranged on the motor fixing plate (32) through the second supporting seat (31).

8. The wafer coating cleaning device as claimed in claim 7, wherein a blowing nozzle (39) and a check valve (40) connected with the cleaning nozzle (37) are further installed on the cleaning fixing plate (38).

Technical Field

The invention relates to the technical field related to wafer processing, in particular to a wafer coating and cleaning device.

Background

When a compound semiconductor such as GaAs (gallium arsenide) used for a high-frequency electronic component is cut with a diamond-impregnated wheel blade (hereinafter, wheel-blade cutting), the feed rate is slow, and it is difficult to improve the production efficiency. In addition, a sheet manufacturing technique with high flexural strength is also becoming more important in the context of high integration such as sip (system in package). However, for grinding wheel blade cutting, the thinner the wafer thickness, the more difficult the cutting. The wafer needs to be pre-processed before being cut and post-processed after being cut, but the pre-processing and post-processing of the wafer in the prior art are generally processed manually or by separate equipment, so that the pre-processing and post-processing have poor processing effect and low processing efficiency.

In view of the above-mentioned drawbacks, the present inventors have made active research and innovation to create a wafer coating and cleaning apparatus, which has industrial application value.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a wafer coating and cleaning apparatus.

In order to achieve the purpose, the invention adopts the following technical scheme:

the wafer coating and cleaning device comprises a water tank assembly, a rotating shaft assembly, a coating swing arm assembly, a cleaning swing arm assembly and an adsorption platform deck, wherein the rotating shaft assembly, the coating swing arm assembly and the cleaning swing arm assembly are all arranged on the water tank assembly;

the water tank assembly comprises a fixed base, a water tank and a lifting cylinder, the water tank is installed on the fixed base through a plurality of stand columns, the lifting cylinder is installed on one side of the fixed base in the vertical direction, and a driving end of the top of the lifting cylinder is in driving connection with the rotating shaft assembly in the vertical direction;

the rotary shaft assembly comprises a servo motor, a rotary fixing disc and a rotary connecting plate, the servo motor is connected with the water tank sequentially through the motor base and the rotary fixing disc above, a rotary shaft housing is arranged on the inner side of the rotary fixing disc, a driving shaft at the top of the servo motor is connected with the rotary connecting plate on the inner side of the rotary shaft housing sequentially through a first coupler and a sealing rotary shaft in a driving mode, and an adsorption loading platform is arranged on the rotary connecting plate;

the bottom of coating swing arm subassembly and washing swing arm subassembly all installs on unable adjustment base, and the top of coating swing arm subassembly and washing swing arm subassembly all passes the basin and is located the both sides position on the absorption microscope carrier.

As a further improvement of the invention, the water tank further comprises a housing component, the housing component is installed on the water tank and comprises a sealing housing, the top of the sealing housing is provided with an opening, a sealing roller shutter is movably arranged in the opening, a roller shutter cylinder is further arranged in the sealing housing, the driving end of the roller shutter cylinder is in driving connection with the sealing roller shutter, and the outer side of the sealing housing is further provided with a first manifold and a second manifold.

As a further improvement of the invention, the adsorption carrying platform comprises an adsorption disc and a steel ring, the adsorption disc is arranged on the rotary connecting plate, the steel ring is arranged on the outer side of the adsorption disc, and the adsorption disc is connected with the steel ring through a steel ring clamping support and a steel ring clamping.

As a further improvement of the invention, the water tank assembly also comprises a guide limiting assembly, the guide limiting assembly comprises a lifting limiting block, a linear bearing seat and a guide shaft, the lifting limiting block is arranged on the fixed base, the guide shaft is arranged on the rotary fixed disk through the linear bearing seat, and the bottom of the guide shaft is provided with the lifting limiting block.

As a further improvement of the invention, a shock absorber is arranged between the water tank and the upright post, and the bottom of the water tank is also provided with a drainage flange opening.

As a further improvement of the invention, the coating swing arm assembly sequentially comprises a stepping motor, a hollow shaft, an L-shaped joint and a coating fixing plate from bottom to top, the stepping motor is connected with the motor fixing plate above, a driving end at the top of the stepping motor is in driving connection with the coating fixing plate through a second coupling, a connecting shaft, a three-way joint, the hollow shaft and the L-shaped joint in sequence, a coating nozzle is installed on the coating fixing plate, a first supporting seat connected with the motor fixing plate is arranged between the second coupling and the connecting shaft, and the hollow shaft is installed on the motor fixing plate through a second supporting seat.

As a further improvement of the invention, the cleaning swing arm assembly sequentially comprises a stepping motor, a solid shaft, an L-shaped joint and a cleaning fixing plate from bottom to top, the stepping motor is connected with the motor fixing plate above, a driving end at the top of the stepping motor is connected with the cleaning fixing plate above through a second coupling, the solid shaft and the L-shaped joint in a driving mode, a cleaning nozzle is installed on the cleaning fixing plate, a first supporting seat connected with the motor fixing plate is arranged between the second coupling and the solid shaft, and the solid shaft is installed on the motor fixing plate through a second supporting seat.

As a further improvement of the invention, the cleaning fixing plate is also provided with an air blowing nozzle and a check valve connected with the cleaning nozzle.

By the scheme, the invention at least has the following advantages:

1. by the structural arrangement of the water tank assembly, the rotating shaft assembly, the coating swing arm assembly, the cleaning swing arm assembly and the adsorption carrying platform, coating treatment and cleaning treatment are comprehensively carried out on the wafer, the treatment effect is good, and the treatment efficiency is high;

2. the wafer is coated and cleaned through the coating swing arm assembly and the cleaning swing arm assembly, so that the cutting effect and yield of wafer processing can be improved;

3. through the structural arrangement of the housing assembly, a certain sealing protection effect can be achieved.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic structural view of a wafer coating and cleaning apparatus according to the present invention;

FIG. 2 is a schematic view of the housing assembly of FIG. 1 with the housing assembly removed;

FIG. 3 is a schematic view of the other side of FIG. 2;

FIG. 4 is a schematic structural view of the spindle assembly of FIG. 1;

FIG. 5 is a schematic diagram of the construction of the coating swing arm assembly of FIG. 1;

FIG. 6 is a schematic diagram of the construction of the wash swing arm assembly of FIG. 1;

FIG. 7 is a schematic structural diagram of a wafer coating and cleaning apparatus according to the present invention.

In the drawings, the meanings of the reference numerals are as follows.

1 sink assembly 2 rotation axis assembly

3 coating swing arm Assembly 4 cleaning swing arm Assembly

5 adsorption carrier 6 cover assembly

7 upright post 8 water tank

9 bumper shock absorber 10 lift stopper

11 straight line bearing seat of drainage flange mouth 12

13 lifting cylinder 14 servo motor

15 first coupling 16 sealed rotating shaft

17 rotating fixed disc 18 rotating shaft cover

19 rotating connecting plate 20 guide shaft

21 adsorption disc 22 steel ring clamping support

23-clamp 24 steel ring

25 step motor 26 second coupling

27 connecting shaft 28 first support seat

29 hollow shaft of three-way joint 30

31 second support base 32 motor fixing plate

33L-shaped joint 34 coating nozzle

35 coating fixed plate 36 solid shaft

37 cleaning nozzle 38 cleaning fixing plate

39 blowing nozzle 40 check valve

41 sealed enclosure 42 first manifold

43 second manifold 44 sealed roller shade

45 rolling curtain cylinder

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

Examples

As shown in figures 1 to 7 of the drawings,

a wafer coating and cleaning device comprises a water tank assembly 1, a rotating shaft assembly 2, a coating swing arm assembly 3, a cleaning swing arm assembly 4 and an adsorption carrying platform 5, wherein the rotating shaft assembly 2, the coating swing arm assembly 3 and the cleaning swing arm assembly 4 are all arranged on the water tank assembly 1, the rotating shaft assembly 2 is located in the middle of the water tank assembly 1, the coating swing arm assembly 3 and the cleaning swing arm assembly 4 are located on two sides of the rotating shaft assembly 2, and the adsorption carrying platform 5 is arranged at the top of the rotating shaft assembly 2;

the water tank assembly 1 comprises a fixed base, a water tank 8 and a lifting cylinder 13, wherein the water tank 8 is installed on the fixed base through a plurality of stand columns 7, the lifting cylinder 13 is installed on one side of the fixed base along the vertical direction, and a driving end at the top of the lifting cylinder 13 is in driving connection with the rotating shaft assembly 2 in the vertical direction;

the rotating shaft assembly 2 comprises a servo motor 14, a rotating fixed disc 17 and a rotating connecting plate 19, the servo motor 14 is connected with the water tank 8 sequentially through an upper motor base and the rotating fixed disc 17, a rotating shaft housing 18 is arranged on the inner side of the rotating fixed disc 17, a driving shaft on the top of the servo motor 14 is connected with the rotating connecting plate 19 on the inner side of the upper rotating shaft housing 18 in a driving mode sequentially through a first coupler 15 and a sealing rotating shaft 16, and an adsorption carrying platform 5 is arranged on the rotating connecting plate 19;

the bottom of the coating swing arm assembly 3 and the bottom of the cleaning swing arm assembly 4 are both installed on the fixed base, and the top of the coating swing arm assembly 3 and the top of the cleaning swing arm assembly 4 both penetrate through the water tank 8 and are located at two side positions on the adsorption carrying platform 5.

Preferably, the water tank water.

Preferably, the adsorption stage 5 comprises an adsorption disc 21 and a steel ring 24, the adsorption disc 21 is mounted on the rotary connecting plate 19, the steel ring 24 is arranged on the outer side of the adsorption disc 21, and the adsorption disc 21 is connected with the steel ring 24 through a steel ring clamping support 22 and a clamping 23.

Preferably, the sink assembly 1 further comprises a guide limiting assembly, the guide limiting assembly comprises a lifting limiting block 10, a linear bearing seat 12 and a guide shaft 20, the lifting limiting block 10 is mounted on the fixed base, the guide shaft 20 is mounted on the rotary fixed disk 17 through the linear bearing seat 12, and the lifting limiting block 10 is arranged at the bottom of the guide shaft 20.

Preferably, a damper 9 is arranged between the water tank 8 and the upright post 7, and a drain flange opening 11 is further arranged at the bottom of the water tank 8.

Preferably, the coating swing arm assembly 3 sequentially comprises a stepping motor 25, a hollow shaft 30, an L-shaped joint 33 and a coating fixing plate 35 from bottom to top, the stepping motor 25 is connected with the motor fixing plate 32 above, a driving end at the top of the stepping motor 25 sequentially passes through a second coupler 26, a connecting shaft 27, a three-way joint 29, the hollow shaft 30 and the L-shaped joint 33 are in driving connection with the coating fixing plate 35, a coating nozzle 34 is installed on the coating fixing plate 35, a first supporting seat 28 connected with the motor fixing plate 32 is arranged between the second coupler 26 and the connecting shaft 27, and the hollow shaft 30 is installed on the motor fixing plate 32 through a second supporting seat 31.

Preferably, the cleaning swing arm assembly 4 sequentially comprises a stepping motor 25, a solid shaft 36, an L-shaped joint 33 and a cleaning fixing plate 38 from bottom to top, the stepping motor 25 is connected with the motor fixing plate 32 above, a driving end at the top of the stepping motor 25 is connected with the cleaning fixing plate 38 above sequentially through a second coupler 26, the solid shaft 36 and the L-shaped joint 33 in a driving manner, a cleaning nozzle 37 is installed on the cleaning fixing plate 38, a first supporting seat 28 connected with the motor fixing plate 32 is arranged between the second coupler 26 and the solid shaft 36, and the solid shaft 36 is installed on the motor fixing plate 32 through a second supporting seat 31.

Preferably, the cleaning fixing plate 38 is further provided with an air blowing nozzle 39 and a check valve 40 connected to the cleaning nozzle 37.

The invention provides a wafer coating and cleaning device, which mainly comprises: comprises a water tank component 1, a rotating shaft component 2, a coating swing arm component 3, a cleaning swing arm component 4, an adsorption carrying platform 5 and a cover component 6. The rotating shaft assembly 2, the coating swing arm assembly 3, the cleaning swing arm assembly 4 and the housing assembly 6 are all installed on the water tank assembly 1, the rotating shaft assembly 2 can ascend and descend vertically, the coating swing arm assembly 3 and the cleaning swing arm assembly 4 can swing within the range of 0-120 degrees on the opposite side of the rotating shaft assembly 2 respectively, and the adsorption carrying platform 5 is installed on the rotating shaft assembly 2 and rotates along with the rotating shaft assembly 2.

The water tank assembly 1 comprises three upright posts 7 arranged on a fixed base, a water tank 8, a shock absorber 9 arranged between the water tank 8 and the upright posts 7, a lifting limiting block 10, a water outlet flange 11, a linear bearing seat 12 playing a guiding role in the lifting process of the rotating shaft assembly 2 and a lifting cylinder 13 used for pushing the rotating shaft assembly 2 to lift.

The rotating shaft assembly 2 comprises a servo motor 14, a first coupling 15, a sealing rotating shaft 16, a rotating fixed disk 17, a rotating shaft housing 18, a rotating connecting plate 19 between the rotating fixed disk 17 and the servo motor 14, a sealing ring between the sealing rotating shaft 16 and the rotating fixed disk 17 and a guide shaft 20 arranged on a linear bearing in the water tank assembly 1.

The adsorption carrying platform 5 comprises an adsorption disc 21 with a grooved surface, four steel ring clamping supports 22 uniformly installed and clamping clamps 23 connected with the clamping supports, and in the rotating process, the clamping clamps can hook the steel ring 24 to prevent the steel ring 24 from falling off.

The coating swing arm assembly 3 includes a stepping motor 25, a second coupling 26, a connecting shaft 27, a first support seat 28, a three-way joint 29, a hollow shaft 30, a second support seat 31, a motor fixing plate 32 connected to the first support seat 28, an L-shaped joint 33 connected to the hollow shaft 30, a coating nozzle 34, and a coating fixing plate 35 connecting the coating nozzle 34 to the L-shaped joint 33.

The cleaning swing arm assembly 4 comprises a stepping motor 25, a second coupling 26, a solid shaft 36, a first supporting seat 28, a second supporting seat 31, a motor fixing plate 32 connected with the first supporting seat 28, an L-shaped joint 33 connected with the solid shaft 36, a cleaning nozzle 37 and a cleaning fixing plate 38 connecting the cleaning nozzle 37 with the L-shaped joint 33, wherein an air blowing nozzle 39 and a check valve 40 are arranged on the cleaning fixing plate 38.

The housing assembly 6 comprises a sealed housing 41, a first manifold 42, a second manifold 43, a sealed roller shutter 44 and two roller shutter cylinders 45 connected to the sealed roller shutter, the sealed roller shutter 44 being opened and closed by the roller shutter cylinders 45.

The invention is realized by the following technical scheme:

the first step is as follows: before cutting, the wafer is firstly placed on an adsorption carrying platform 5 of a coating and cleaning device;

the second step is that: the adsorption carrying platform 5 descends to a working position, the sealing roller shutter 44 is closed, the sealing rotating shaft 16 drives the adsorption disc 21 and the steel ring 24 on the adsorption disc 21 to rotate, the coating swing arm assembly 3 coats coating liquid on the surface of the wafer in the process, and then the coating liquid is uniformly coated on the surface of the wafer through the rotation of the rotating shaft assembly 2 and the action of centrifugal force, so that the coating effect is achieved.

The third step: after the coating process is stopped, the sealing roller shutter 44 is opened, the adsorption carrying platform 5 is lifted to a material taking position, the wafer is taken out to be subjected to laser cutting, and the wafer is put into the coating and cleaning device again after the cutting is finished.

The fourth step: the adsorption carrier 5 descends to a working position from a material taking position, the sealing roller shutter 44 is closed, the sealing rotating shaft 16 drives the adsorption disc 21 and the steel ring 24 above the adsorption disc 21 to rotate, the swing arm assembly 4 is cleaned on the surface of the wafer in the process, water mist is formed inside the cleaning nozzle 37 under the action of the water-gas two-fluid nozzle, the coating liquid on the wafer and the residual slag after laser cutting are cleaned, after the cleaning is finished, the air blowing nozzle 39 beside the cleaning nozzle 37 can blow the surface of the wafer, then, the sealing roller shutter 44 is opened, and the adsorption carrier 5 ascends to the material taking position.

The coating and cleaning mechanism is an automatic mechanical device which is specially used for controlling fluid and coating the fluid on the surface of a product.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly referring to the number of technical features being grined. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection: either mechanically or electrically: the terms may be directly connected or indirectly connected through an intermediate member, or may be a communication between two elements.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, it should be noted that, for those skilled in the art, many modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.