阅读说明：本技术 基片处理装置和基片处理方法 (Substrate processing apparatus and substrate processing method ) 是由 森拓也 于 2021-04-13 设计创作，主要内容包括：本发明提供一种基片处理装置和基片处理方法。本发明的一方面的基片处理装置包括：对基片实施规定的处理的处理单元；输送单元,其具有保持基片的保持部,通过使保持着基片的保持部位移来对处理单元进行基片的送入送出；和基片检查单元,其在处理单元的外部,获取表示保持部所保持的基片的表面状态的信息。根据本发明,能够兼顾处理结果的可靠性提高和生产率。(The invention provides a substrate processing apparatus and a substrate processing method. A substrate processing apparatus of an aspect of the present invention includes: a processing unit for performing a predetermined process on the substrate; a transport unit having a holding section for holding the substrate, the transport unit being configured to transport the substrate to and from the processing unit by moving the holding section holding the substrate; and a substrate inspection unit that acquires, outside the processing unit, information indicating a surface state of the substrate held by the holding portion. According to the present invention, both improvement in reliability of processing results and productivity can be achieved.)

1. A substrate processing apparatus, comprising:

a processing unit for performing a predetermined process on the substrate;

a transport unit having a holding section for holding the substrate, the transport unit being configured to transport the substrate to and from the processing unit by moving the holding section holding the substrate; and

and a substrate inspection unit that acquires, outside the processing unit, information indicating a surface state of the substrate held by the holding portion.

2. The substrate processing apparatus according to claim 1, wherein:

the substrate inspection unit is provided to the conveyance unit.

3. The substrate processing apparatus according to claim 2, wherein:

the conveying unit further has a1 st driving unit that moves the holding portion in a1 st direction and a 2 nd driving unit that moves the 1 st driving unit in a 2 nd direction,

the substrate inspection unit is provided to the 1 st driving unit.

4. The substrate processing apparatus according to any one of claims 1 to 3, further comprising:

a displacement control section that displaces the holding section with the conveying unit so that the surface of the substrate passes through an acquisition region where the information is acquired by the substrate inspection unit; and

and a substrate inspection control unit that causes the substrate inspection unit to acquire the information indicating the surface state of the substrate when the substrate is carried into and when the substrate is carried out from the processing unit.

5. The substrate processing apparatus according to any one of claims 1 to 3, further comprising:

a displacement control section that displaces the holding section with the conveying unit so that the surface of the substrate passes through an acquisition region where the information is acquired by the substrate inspection unit; and

and a substrate inspection control unit that causes the substrate inspection unit to acquire a plurality of pieces of information indicating surface states of a plurality of regions on the surface of the substrate, respectively, while the surface of the substrate passes through the acquisition region.

6. The substrate processing apparatus according to claim 4, wherein:

the substrate inspection unit has a line sensor that acquires the information from a line-shaped area,

the displacement control unit displaces the holding unit in a direction intersecting an acquisition region in which the information is acquired by the line sensor.

7. The substrate processing apparatus according to any one of claims 1 to 3, wherein:

the substrate inspection unit has an area sensor for acquiring the information from a planar region.

8. The substrate processing apparatus according to any one of claims 1 to 3, wherein:

further comprising an environment checking unit provided in the holding portion and acquiring environment information in the processing unit.

9. The substrate processing apparatus according to claim 8, wherein:

further comprising a 2 nd processing unit for performing a predetermined process on the substrate and an environmental inspection control unit for causing the environmental inspection unit to acquire the environmental information,

the conveying unit also carries out the feeding and the discharging of the substrate to and from the 2 nd processing unit,

the environment inspection control unit causes the environment inspection unit to acquire the environment information in the processing unit in a state where the holding unit is located in the processing unit, and causes the environment inspection unit to acquire the environment information in the 2 nd processing unit in a state where the holding unit is located in the 2 nd processing unit.

10. A method of processing a substrate, comprising:

a step of carrying in and out the substrate to and from a processing unit capable of performing a predetermined process on the substrate by displacing a holding portion holding the substrate in a state where the holding portion holds the substrate;

a step of acquiring, outside the processing unit, information indicating a surface state of the substrate held by the holding portion.

Technical Field

The present invention relates to a substrate processing apparatus and a substrate processing method.

Background

Patent document 1 discloses a film thickness measuring apparatus for measuring the film thickness of a film formed on a substrate. The film thickness measuring apparatus includes: a photographing device for photographing the surface of the substrate; and a film thickness calculating section for calculating a film thickness of a film formed on the substrate based on pixel values of the captured image of the substrate as a film thickness measurement target. In a substrate processing system (substrate processing apparatus) having the film thickness measuring apparatus, inspection of a substrate is performed by film thickness measurement based on a captured image.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication (Kokai) No. 2015-215193

Disclosure of Invention

Problems to be solved by the invention

The invention provides a substrate processing apparatus and a substrate processing method which can improve reliability of processing results and improve productivity.

Means for solving the problems

A substrate processing apparatus of an aspect of the present invention includes: a processing unit for performing a predetermined process on the substrate; a transport unit having a holding section for holding the substrate, the transport unit being configured to transport the substrate to and from the processing unit by moving the holding section holding the substrate; and a substrate inspection unit that acquires, outside the processing unit, information indicating a surface state of the substrate held by the holding portion.

Effects of the invention

According to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method which contribute to both improvement in reliability of processing results and productivity.

Drawings

Fig. 1 is a schematic perspective view showing an example of a substrate processing system.

Fig. 2 is a schematic diagram showing an example of the coating and developing apparatus.

Fig. 3 is a plan view schematically showing an example of the processing module.

Fig. 4 is a side view schematically showing an example of the conveyance unit.

Fig. 5 is a block diagram showing an example of a functional configuration of the control device.

Fig. 6 is a block diagram showing an example of the hardware configuration of the control device.

Fig. 7 is a flowchart showing an example of the coating and developing process.

Fig. 8 is a flowchart showing an example of the inspection process when the inspection program is sent to the processing unit.

Fig. 9 is a flowchart showing an example of the inspection process when the inspection is sent from the processing unit.

Fig. 10 is a side view schematically showing an example of the conveyance unit.

Fig. 11 is a flowchart showing an example of the inspection process when the inspection process is carried into the processing unit.

Fig. 12 (a) is a plan view schematically showing an example of the conveyance unit. Fig. 12 (b) is a side view schematically showing an example of the conveyance unit.

Description of the reference numerals

2 … … coating and developing device, U1 … … liquid processing unit, A3 … … conveying device, 20 … … holding arm, 30 … … 1 st driving unit, 50 … … nd 2 driving unit, 70A … … substrate checking unit, 72A … … sensor, 80 … … environment checking unit, 90 … … multi-joint arm, 100 … … control device, 102 … … displacement control part, 106, 108 … … checking control part.

Detailed Description

An embodiment will be described below with reference to the drawings. In the description, the same elements or elements having the same function are denoted by the same reference numerals, and redundant description thereof is omitted.

[ substrate processing System ]

The substrate processing system 1 shown in fig. 1 is a system for forming a photosensitive coating film on a workpiece W, exposing the photosensitive coating film, and developing the photosensitive coating film. The workpiece W to be processed is, for example, a substrate or a substrate in a state where a film, a circuit, or the like is formed by performing a predetermined process. The substrate included in the workpiece W is, for example, a silicon-containing wafer. The workpiece W (substrate) may be formed in a circular shape. The workpiece W to be processed may be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or the like, or may be an intermediate obtained by subjecting such a substrate or the like to a predetermined process. The photosensitive film is, for example, a resist film.

The substrate processing system 1 includes a coating and developing apparatus 2 and an exposure apparatus 3. The exposure device 3 is a device for exposing a resist film (photosensitive coating film) formed on a workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates the portion of the resist film to be exposed with energy rays by a method such as immersion exposure. The coating and developing apparatus 2 performs a process of coating a resist (chemical solution) on the surface of the workpiece W to form a resist film before the exposure process by the exposure apparatus 3, and performs a developing process of the resist film after the exposure process.

(substrate processing apparatus)

Next, the configuration of the coating and developing apparatus 2 will be described as an example of the substrate processing apparatus. As shown in fig. 1 and 2, the coating and developing apparatus 2 includes a carrier block 4, a process block 5, an interface block 6, and a control apparatus 100.

The carrier block 4 performs introduction of the work W into the coating and developing apparatus 2 and discharge of the work W from the coating and developing apparatus 2. For example, the carrier block 4 has a plurality of carriers C capable of supporting the workpiece W, and a transport device a1 including a transfer arm is incorporated therein. The carrier C receives a plurality of circular workpieces W, for example. The transfer device a1 takes out the workpiece W from the carrier C and delivers it to the processing block 5, receives the workpiece W from the processing block 5 and returns it into the carrier C. The processing block 5 has processing modules 11, 12, 13, 14.

The processing module 11 incorporates a liquid processing unit U1, a heat processing unit U2, and a transfer device A3 that transfers the workpiece W to these units. The process module 11 forms an underlayer film on the surface of the workpiece W by the liquid processing unit U1 and the heat treatment unit U2. The liquid processing unit U1 applies a processing liquid for forming a lower layer film to the workpiece W. The heat treatment unit U2 performs various heat treatments accompanied by formation of an underlayer film. The processing module 11 may also have a checking unit U3 (processing unit). The inspection unit U3 acquires the state of the workpiece W to inspect the inspection of the workpiece W. The inspection unit U3 photographs, for example, the front, back, or peripheral edge of the workpiece W before the formation of the lower layer film with a camera, and outputs a photographed image photographed by the camera to the control device 100.

The processing module 12 incorporates a liquid processing unit U1, a heat processing unit U2, and a transfer device A3 that transfers the workpiece W to these units. The processing module 12 forms a resist film on the lower layer film by the liquid processing unit U1 and the heat treatment unit U2. The liquid processing unit U1 applies a processing liquid (resist) for resist film formation onto the underlayer film. The heat treatment unit U2 performs various heat treatments accompanied by the formation of the resist film.

The processing module 13 incorporates a liquid processing unit U1, a heat processing unit U2, and a transfer device A3 that transfers the workpiece W to these units. The processing module 13 forms an upper layer film on the resist film by the liquid processing unit U1 and the heat treatment unit U2. The liquid treatment unit U1 applies a treatment liquid for forming an upper layer film on the resist film. The heat treatment unit U2 performs various heat treatments accompanied by formation of an upper layer film.

The processing module 14 incorporates a liquid processing unit U1, a heat processing unit U2, and a transfer device A3 that transfers the workpiece W to these units. The processing module 14 performs the developing process of the resist film subjected to the exposure process and the heat treatment associated with the developing process by the liquid processing unit U1 and the heat treatment unit U2. The liquid processing unit U1 applies a developing solution to the surface of the exposed workpiece W, and then washes the surface with a rinse solution to perform a resist developing process. The heat treatment unit U2 performs various heat treatments along with the development treatment. Specific examples of the heat treatment include a heat treatment before development treatment (PEB: Post Exposure Bake), a heat treatment after development treatment (PB: Post Bake), and the like. The processing module 14 may also have a check unit U3. The inspection unit U3 photographs the front, back, or peripheral edge of the workpiece W after the development processing (after PB), for example, with a camera, and outputs the photographed image of the camera to the control device 100.

A shelf unit U10 is provided on the carrier block 4 side in the processing block 5. The shelf unit U10 is divided into a plurality of cells arranged in the up-down direction. A conveyor a7 including a lift arm is provided in the vicinity of the rack unit U10. The transfer device a7 raises and lowers the workpieces W between the cells of the rack unit U10.

A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is divided into a plurality of cells arranged in the up-down direction. Since the rack units U10 and U11 stand by the workpiece W to perform the next process on the workpiece W (function as buffers), these rack units U10 and U11 also correspond to processing units that perform processes on the workpiece W.

The interface block 6 transfers the workpiece W to and from the exposure apparatus 3. For example, the interface block 6 is provided with a transport device A8 including a transfer arm therein, and is connected to the exposure apparatus 3. The transport device A8 delivers the workpiece W placed on the rack unit U11 to the exposure apparatus 3. The conveying device A8 receives the workpiece W from the exposure device 3 and returns it to the rack unit U11.

(conveying device)

Next, an example of the transport device a3 in the process module 12 will be described in detail with reference to fig. 3 and 4. The conveying device a3 (conveying unit) conveys the workpiece W in the processing module 12 while holding the workpiece W. The conveying device a3 conveys the workpiece W outside the plurality of processing units, thereby conveying the workpiece W between the plurality of processing units included in the processing module 12. The outside of the processing unit is a region other than the internal space of the plurality of processing units in the processing module 12 (for example, a space surrounded by the casing of the processing unit). In the process module 12 illustrated in fig. 3, the plurality of liquid treatment units U1 are arranged in parallel in a horizontal direction. Hereinafter, a direction in which the plurality of liquid processing units U1 are arranged side by side is referred to as "direction D1", and a direction perpendicular to the direction D1 is referred to as "direction D2". The transport device a3 is configured to be able to move the workpiece W at least in the directions D1 and D2.

The transport device a3 has a holding arm 20 (holding portion). The holding arm 20 is configured to be able to hold the workpiece W. The holding arm 20 holds the workpiece W such that one main surface Wa of the workpiece W faces upward. The main surface Wa is a surface on which a coating film of a resist is formed in the liquid processing unit U1. The holding arm 20 may be formed so as to surround the periphery of the workpiece W and support the periphery of the main surface Wb (rear surface) on the opposite side of the main surface Wa of the workpiece W. The transport device a3 transports the workpiece W to and from the liquid processing unit U1 by moving the holding arm 20 holding the workpiece W. That is, the transport apparatus a3 feeds the workpiece W into the liquid processing unit U1 by displacing the holding arm 20, and feeds the workpiece W out of the liquid processing unit U1 by displacing the holding arm 20. The transport device a3 may transport the plurality of workpieces W to and from the plurality of liquid processing units U1, respectively.

The conveying device a3 further includes, for example, a1 st drive unit 30 (1 st drive unit) and a 2 nd drive unit 50 (2 nd drive unit). The 1 st driving unit 30 is configured to be able to move the holding arm 20 at least in the direction D2 (the 1 st direction). The 1 st drive unit 30 includes, for example, as shown in fig. 4, a drive section 32, a rotary drive section 46, and a base 48.

The driving unit 32 is an actuator configured to be able to reciprocate the holding arm 20 in a horizontal direction by a power source such as an electric motor. The drive section 32 moves (reciprocates) the holding arm 20 at least in the direction D2. The holding arm 20 is displaced in the direction D2 by the drive unit 32, and the workpiece W held by the holding arm 20 is moved in the direction D2.

As shown in fig. 4, for example, the driving unit 32 includes a housing 34, a slide member 36, pulleys 38a and 38b, a belt 42, and a motor 44. The housing 34 houses the elements included in the driving unit 32. An opening 34a is provided in the upper wall of the housing 34. The slide member 36 is provided movably with respect to the housing 34. The slide member 36 is formed to extend in the vertical direction, for example. The lower end of the slide member 36 is connected to the conveyor belt 42 inside the housing 34. The upper end of the slide member 36 protrudes out of the housing 34 through the opening 34a, and the base end of the holding arm 20 is connected to the upper end of the slide member 36. The pulleys 38a, 38b are disposed at respective end portions in the housing 34 in the direction D2. The pulleys 38a and 38b are provided in the housing 34 so as to be rotatable about a rotation shaft extending in the direction D1.

The belt 42 is mounted on the pulleys 38a, 38 b. The conveyor belt 42 is, for example, a timing conveyor belt. The motor 44 is a power source that generates torque. The motor 44 is, for example, a servo motor. When the torque (driving force) generated by the motor 44 is transmitted to the pulley 38a, the belt 42 bridged to the pulleys 38a, 38b moves in the direction D2. Thereby, the slide member 36 also moves in the direction D2 (the holder arm 20 is displaced in the direction D2).

The rotation driving unit 46 is, for example, a rotary actuator configured to be able to rotate the driving unit 32 around a vertical rotation axis by a power source such as a motor. The rotary drive unit 46 supports the drive unit 32. By rotating the driving unit 32 by the rotation driving unit 46, the moving direction (angle with respect to the direction D2) of the holding arm 20 driven by the driving unit 32 changes. The base 48 supports the rotary drive unit 46 and the drive unit 32. The rotary drive unit 46 is provided on the base 48, and the base 48 is formed to extend in the direction D2, for example. One end of the base 48 in the direction D2 is connected to the 2 nd driving unit 50.

The 1 st driving unit 30 (driving unit 32) described above moves the holding arm 20 so that the relative position of the holding arm 20 with respect to the housing 34 changes. The driving unit 32 moves the holding arm 20 in the direction D2, for example, between a position where the tip of the holding arm 20 overlaps the base 48 and a position where the tip of the holding arm 20 does not overlap the base 48 on the outer side of the base 48.

Returning to fig. 3, the 2 nd driving unit 50 includes an actuator configured to be able to reciprocate the 1 st driving unit 30 in a horizontal direction by a power source such as an electric motor. The 2 nd drive unit 50 moves the 1 st drive unit 30 in the direction D1 (2 nd direction), as shown in fig. 3, for example. Thereby, the holding arm 20 provided in the 1 st drive unit 30 is displaced in the direction D1, and the workpiece W held by the holding arm 20 is moved in the direction D1.

The 2 nd drive unit 50 includes, for example, a housing 52, a slide member 54, a guide rail 56, pulleys 58a, 58b, a belt 62, and a motor 64. The housing 52 accommodates the elements included in the 2 nd drive unit 50. An opening 52a is provided in a wall of the casing 52 opposite to the plurality of liquid processing units U1.

The slide member 54 is a member that is provided movably with respect to the housing 52 and supports the 1 st drive unit 30 (base 48). The slide member 54 is formed, for example, so as to extend in the direction D2. The base end of the slide member 54 is connected to the guide rail 56 and the conveyor belt 62 inside the housing 52. The front end of the slide member 54 protrudes out of the housing 52 through the opening 52 a. One end of the base 48 of the 1 st drive unit 30 is connected to the front end of the slide member 54. The guide rail 56 is provided in the housing 52 so as to linearly extend in the direction D1 (the width direction of the housing 52).

The pulleys 58a, 58b are disposed at respective end portions of the case 52 in the direction D1. The pulleys 58a, 58b are provided in the housing 52 so as to be rotatable about a rotation shaft along the direction D2. The conveyor belt 62 is mounted on the pulleys 58a, 58 b. The conveyor 62 is, for example, a timing conveyor. The motor 64 is a power source that generates torque. The motor 64 is, for example, a servo motor. The motor 64 is connected to the pulley 58 a. When the torque (driving force) generated by the motor 64 is transmitted to the pulley 58a, the belt 62 bridged to the pulleys 58a, 58b moves in the direction D1. Thereby, the slide member 54 (the 1 st drive unit 30) also reciprocates in the direction D1. By the sliding member 54 (the 1 st drive unit 30) moving in the direction D1, the 1 st drive unit 30 also moves in the direction D1.

Here, the transport operation of the transport apparatus A3 performed in association with the carrying in and out of the workpiece W to and from one liquid processing unit U1 among the plurality of liquid processing units U1 will be described. When receiving the workpiece W of the processing object in the liquid processing unit U1 from the rack unit U10, the transporter A3 rotates the driving section 32 with the rotary driving section 46 in such a manner that the direction in which the housing 34 (the conveyor belt 42) of the driving section 32 extends is along the direction D2. Next, the transfer device a3 moves the holding arm 20 to a position where the holding arm 20 (workpiece W) and the liquid processing unit U1 face each other in the direction D2 (a position where the holding arm 20 and the liquid processing unit U1 are aligned in the direction D2) by the 2 nd drive unit 50. Hereinafter, the position of the holding arm 20 (workpiece W) at which the holding arm 20 with the distal end portion positioned at the position overlapping the base 48 faces the liquid treatment unit U1 as the conveyance target in the direction D2 is referred to as a "relative position".

Then, the transport device a3 moves the holding arm 20 in the direction D2 with the drive section 32 of the 1 st drive unit 30 to transport the workpiece W from the relative position into the liquid processing unit U1. For example, the drive unit 32 moves the holding arm 20 in the direction D2 from a position where the tip end of the holding arm 20 overlaps the base 48 to a position where the tip end does not overlap the base 48. After the transfer device a3 has transferred the workpiece W to the liquid processing unit U1, the drive unit 32 moves the holding arm 20 that is not holding the workpiece W to the opposite position in the direction D2.

The transport apparatus a3 moves the holding arm 20, which is not holding the workpiece W, from the relative position into the liquid processing unit U1 by the drive section 32 to receive the processed workpiece W in the liquid processing unit U1. After receiving the workpiece W from the liquid processing unit U1, the transport device a3 moves the holding arm 20 from the liquid processing unit U1 to the opposite position by the drive unit 32. For example, the drive unit 32 moves the holding arm 20 in the direction D2 from a position where the tip end of the holding arm 20 does not overlap the base 48 to a position where the tip end overlaps the base 48. Then, the transport apparatus a3 transports the workpiece W from the relative position to the next process (e.g., heat treatment in the heat treatment unit U2) by rotating the drive section 32 with the rotation drive section 46 or moving the 1 st drive unit 30 in the direction D2 with the 2 nd drive unit 50.

(substrate inspecting unit)

The processing module 12 also includes a substrate inspection unit 70 as shown in fig. 3. The substrate inspection unit 70 is used for inspection of the workpiece W at the halfway stage of the coating and developing process between the inspection by the inspection unit U3 of the process module 11 and the inspection by the inspection unit U3 of the process module 14. The substrate inspection unit 70 acquires information indicating a surface state of the workpiece W held by the holding arm 20 (hereinafter referred to as "surface information") outside the processing unit such as the liquid processing unit U1. The substrate inspection unit 70 may also acquire image information obtained by imaging the workpiece W as surface information of the workpiece W.

The above surface state as the inspection object of the substrate inspection unit 70 may be a state of an arbitrary region on the outer surface of the workpiece W. For example, the surface state may be a state of at least a part of the main surface Wa of the workpiece W, a state of at least a part of the main surface Wb of the workpiece W on the opposite side to the main surface Wa, or a state of connecting at least a part of the side surfaces Wc of the main surfaces Wa, Wb of the workpiece W. The surface state may be a state including at least a part of a region of 2 or more of the main surfaces Wa, Wb and the side surfaces Wc of the workpiece W. As an example, the substrate inspection unit 70 acquires surface information indicating the state of the entire region of the main surface Wa.

The substrate inspection unit 70 may also be provided to the transport device a 3. The substrate inspection unit 70 is provided to, for example, the 1 st drive unit 30 of the transport device a 3. The substrate inspection unit 70 may also have a sensor 72 (camera) capable of photographing the surface of the workpiece W. The sensor 72 may also be provided to the transport device a 3. For example, the sensor 72 is fixed (connected) to the housing 34 of the driving unit 32 via a fixing member 74. By fixing the sensor 72 to the housing 34, the sensor 72 also moves in the direction D1 in accordance with the movement of the holding arm 20 by the 2 nd drive unit 50 of the transport device a 3. On the other hand, even if the holding arm 20 is moved by the 1 st drive unit 30 (drive portion 32) of the transport device a3, the sensor 72 does not move. That is, the relative position of the holding arm 20 (the workpiece W held by the holding arm 20) with respect to the sensor 72 changes with the movement of the holding arm 20 by the driving unit 32.

The sensor 72 is provided so as to be positioned between the workpiece W (holding arm 20) and the liquid processing unit U1 in a state where the tip end portion of the holding arm 20 is disposed at a position overlapping the base 48. The sensor 72 may be disposed above the workpiece W held by the holding arm 20. The sensor 72 has a field of view capable of capturing an area located below the sensor, for example. Hereinafter, the region that can be imaged by the sensor 72 is referred to as an "acquisition region AR". That is, the acquisition area AR is an area where surface information can be acquired by the substrate inspection unit 70.

The sensor 72 may be an image pickup device in which pixels are arranged one-dimensionally, and a line sensor (line sensor type camera) that acquires information (image information) from the linear acquisition region AR. The acquisition area AR of the sensor 72 may extend in the direction D1 (the photographing elements may be arranged side by side in the direction D1). The size of the acquisition area AR in the direction D1 is, for example, the same as the size of the workpiece W, but may be larger than the workpiece W. In this case, when the holding arm 20 is moved in the direction D2 by the 1 st drive unit 30 (drive unit 32) of the transport device a3, the sensor 72 is disposed so that the entire area of the main surface Wa of the workpiece W passes through the acquisition area AR. The substrate inspection unit 70 may further have a light source (a plurality of light sources arranged in a line) capable of irradiating light to the acquisition area AR.

(Environment inspection Unit)

The processing module 12 may further include an environment check unit 80 that acquires information indicating a state within a processing unit such as the liquid processing unit U1 (hereinafter, referred to as "environment information"). The environment inspection unit 80 has, for example, a sensor 82 that acquires the above-described environment information. The environmental information acquired by the sensor 82 includes information that affects the processing result of the workpiece W in the processing unit. For example, the environmental information detected by the sensor 82 includes infrared rays (radiation energy of infrared rays), temperature, humidity, air pressure in the processing unit, an angle (posture) of a component in the unit, vibration, a temperature of a hot plate in the unit, and the like. The sensor 82 may be a Micro Electro Mechanical System (MEMS) sensor in which Mechanical components, sensor elements, electronic circuits, and the like are integrated. The sensor 82 is provided in the holding arm 20 so that the sensor 82 is also located in the processing unit in a state where the holding arm 20 is disposed in the processing unit. As an example, as shown in fig. 3, the sensor 82 is provided near the tip of the holding arm 20.

(control device)

Next, an example of the control device 100 will be described in detail with reference to fig. 5 and 6. The control device 100 controls the coating and developing device 2. The control device 100 is configured to be capable of executing at least: controlling the transport device a3 so that the holding arm 20 is displaced while the holding arm 20 is holding the workpiece W, and performing a process of feeding and discharging the workpiece W to and from the liquid processing unit U1; and a process of controlling the substrate inspection unit 70 so that the surface information of the workpiece W held by the holding arm 20 is acquired outside the liquid processing unit U1. The control device 100 includes, as a functional configuration (hereinafter, referred to as a "functional block"), for example, a displacement control unit 102, inspection control units 106 and 108, and a processing control unit 112.

The displacement control unit 102 displaces the holding arm 20 by the transport device a 3. For example, the displacement control unit 102 displaces the holding arm 20 by the transport device a3 so that the acquisition area AR of the surface information of the substrate inspection unit 70 passes through the main surface Wa of the workpiece W. Specifically, the displacement controller 102 controls the 2 nd drive unit 50 so that the holding arm 20 moves to a relative position where the liquid processing unit U1 and the holding arm 20 are opposed in the direction D2.

The displacement control section 102 controls the 1 st drive unit 30 (drive section 32) to move the holding arm 20 from the relative position to the liquid processing unit U1. Thus, after the workpiece W passes through the acquisition area AR, the workpiece W held by the holding arm 20 is sent to the liquid processing unit U1. The displacement control section 102 controls the 1 st drive unit 30 (drive section 32) so that the holding arm 20 moves from the liquid processing unit U1 to the relative position. Thus, after the workpiece W passes through the acquisition area AR, the workpiece W held by the holding arm 20 is sent out from the liquid processing unit U1.

In the processing module 12 illustrated in fig. 3 and 4, when the workpiece W passes through the acquisition area AR, the holding arm 20 is displaced in a direction intersecting the acquisition area AR in both cases of feeding the workpiece W into and feeding the workpiece W out of the liquid processing unit U1. After the end of the feeding of the workpiece W into the liquid processing unit U1, the displacement control unit 102 may displace the holding arm 20 to feed another workpiece W into another liquid processing unit U1 from before the start of the feeding of the workpiece W into the liquid processing unit U1.

The inspection control section 106 (substrate inspection control section) causes the substrate inspection unit 70 to acquire the surface information of the workpiece W passing through the acquisition area AR. For example, when the workpiece W is fed into the liquid processing unit U1, the inspection control unit 106 causes the sensor 72 to acquire the surface information of the main surface Wa of the workpiece W passing through the acquisition region AR. When the workpiece W is sent out from the liquid processing unit U1, the inspection control unit 106 causes the sensor 72 to acquire the surface information of the main surface Wa of the workpiece W passing through the acquisition region AR. Thus, the inspection controller 106 acquires the surface information of the workpiece W before processing in the liquid processing unit U1 and the surface information of the workpiece W after processing in the liquid processing unit U1 from the sensor 72.

For example, the inspection control unit 106 acquires the surface information of the main surface Wa of the workpiece W such that the main surface Wa of the workpiece W passing through the acquisition area AR is scanned by the sensor 72. Specifically, the inspection control unit 106 causes the sensor 72 to acquire a plurality of pieces of surface information each indicating the surface state of a plurality of regions on the main surface Wa while the main surface Wa of the workpiece W passes through the acquisition region AR (without stopping the workpiece W). By integrating these plural pieces of surface information, the surface information of the main surface Wa can be obtained.

The inspection control unit 108 (environmental inspection control unit) causes the environmental inspection unit 80 to acquire environmental information in the processing unit such as the liquid processing unit U1. The inspection controller 108 causes the sensor 82 to acquire environmental information in one of the liquid processing units U1 (1 st processing unit) among the plurality of liquid processing units U1, for example, in a state where the holding arm 20 is positioned in the one liquid processing unit U1. The inspection controller 108 causes the sensor 82 to acquire environmental information in another liquid processing unit U1 (processing unit No. 2) among the liquid processing units U1 in a state where the holding arm 20 is positioned in the other liquid processing unit U1. When the workpiece W is fed into any one of the liquid processing units U1 and at least one of the liquid processing units U1 is fed out, the inspection controller 108 causes the sensor 82 to acquire environmental information in the liquid processing unit U1.

The process control unit 112 controls a processing unit such as the liquid processing unit U1 to perform a predetermined process on the workpiece W. For example, the process control unit 112 controls the liquid processing unit U1 so that a resist coating film is formed on the main surface Wa of the workpiece W after the workpiece W is fed. The processing controller 112 controls the liquid processing unit U1 based on at least one of the surface information of the workpiece W before processing acquired by the inspection controller 106 and the environmental information in the liquid processing unit U1 acquired by the inspection controller 108. For example, the process control unit 112 may set the process conditions (for example, the rotation speed of the workpiece W during resist coating) in the liquid processing unit U1 based on the environmental information acquired by the inspection control unit 108.

The control device 100 is constituted by one or more control computers. For example, the control device 100 has a circuit 120 shown in fig. 6. The circuit 120 has one or more processors 122, memory 124, storage 126, input-output ports 128, and timers 132. The memory 126 includes a storage medium readable by a computer, such as a hard disk. The storage medium stores a program for causing the control device 100 to execute a substrate processing method described later. The storage medium may be a removable medium such as a nonvolatile semiconductor memory, a magnetic disk, and an optical disk. The memory 124 temporarily stores the program loaded from the storage medium of the memory 126 and the operation result of the processor 122.

The processor 122 and the memory 124 cooperate to execute the above-described programs. The input/output port 128 inputs/outputs electrical signals to/from the 1 st drive unit 30, the 2 nd drive unit 50, the substrate inspection unit 70, the environment inspection unit 80, the liquid processing unit U1, and the like, in accordance with instructions from the processor 122. The timer 132 measures the elapsed time by, for example, counting a certain period of standard pulses. The hardware configuration of the control device 100 may be constituted by a dedicated logic Circuit or an ASIC (Application Specific Integrated Circuit) into which the logic Circuit is Integrated.

[ method of treating substrate ]

Next, a coating and developing process performed by the coating and developing apparatus 2 will be described as an example of a substrate processing method with reference to fig. 7. Fig. 7 is a flowchart showing an example of the coating and developing process, and shows a flow of the coating and developing process for 1 workpiece W. First, the controller 100 controls the transfer device a1 to transfer the workpiece W in the carrier C to the rack unit U10, and controls the transfer device a7 to arrange the workpiece W in the cell for the process module 11.

Next, the control device 100 controls the transfer device a3 to transfer the workpiece W of the rack unit U10 to the inspection unit U3 in the process module 11. The control device 100 controls the inspection unit U3 to inspect the workpiece W before the coating and developing process in the coating and developing device 2 (step S01).

Next, the control device 100 controls the processing module 11 to form an underlayer film on the main surface Wa of the workpiece W (step S02). In step S02, for example, the control device 100 controls the conveying device A3 to convey the workpiece W from the rack unit U10 to the liquid processing unit U1. Then, the control device 100 controls the liquid treatment unit U1 to form a coating film of the treatment liquid for forming the lower layer film on the main surface Wa of the workpiece W. The control device 100 controls the conveying device a3 to convey the workpiece W formed with the coating film to the heat treatment unit U2. Then, the control device 100 controls the heat treatment unit U2 to form an underlayer film on the main surface Wa of the workpiece W. Thereafter, the controller 100 controls the transfer device A3 to return the work W on which the lower layer film is formed to the shelf unit U10, and controls the transfer device a7 to place the work W in the chamber for the process module 12.

Next, the control device 100 controls the processing module 12 to form a resist film on the main surface Wa of the workpiece W on which the lower layer film is formed (step S03). In step S03, the control device 100 controls the transfer device A3 to transfer the workpieces W of the rack unit U10 to any one of the liquid processing units U1 in the process module 12, for example. Then, the control device 100 (process control unit 112) controls the liquid processing unit U1 to form a coating film of resist on the main surface Wa of the workpiece W. The control device 100 controls the conveying device a3 to convey the workpiece W on which the coating film of the resist is formed to the heat treatment unit U2. Then, the control device 100 controls the heat treatment unit U2 to form a resist film on the main surface Wa of the workpiece W. Thereafter, the controller 100 controls the transfer device A3 to return the resist-film-formed workpiece W to the rack unit U10, and controls the transfer device a7 to arrange the workpiece W in a chamber for the processing module 13.

Next, the control device 100 controls the processing module 13 to form an upper layer film on the main surface Wa of the workpiece W on which the resist film is formed (step S04). In step S04, the control device 100 controls the transport device A3 to transport the workpiece W to the liquid processing unit U1, for example. Then, the control device 100 controls the liquid processing unit U1 to form a coating film of the processing liquid for forming the upper layer film on the main surface Wa of the work W. The control device 100 controls the conveying device a3 to convey the workpiece W formed with the coating film to the heat treatment unit U2. Then, the control device 100 controls the heat treatment unit U2 to form an upper layer film on the main surface Wa of the workpiece W. Thereafter, the controller 100 controls the transfer device a3 to transfer the work W on which the upper film is formed to the rack unit U11.

Next, the control device 100 controls the transport device A8 to send out the workpiece W of the rack unit U11 to the exposure device 3. Thereafter, the controller 100 controls the transfer device A8 to receive the workpiece W subjected to the exposure processing from the exposure device 3, and arranges the workpiece W in the cell for the processing module 14 in the shelf unit U11.

Next, the control device 100 controls the processing module 14 to perform the development processing on the workpiece W subjected to the exposure processing (step S05). In step S05, for example, after the control device 100 controls the conveyance device A3 to convey the workpiece W to the heat treatment unit U2, the heat treatment unit U2 is controlled to perform the heat treatment before development on the resist film of the workpiece W. Then, the controller 100 controls the transport device a3 to transport the workpiece W subjected to the heat treatment before development to the liquid processing unit U1, and then controls the liquid processing unit U1 to perform the development treatment on the resist film of the workpiece W.

After that, the controller 100 controls the transport device a3 to transport the workpiece W subjected to the development process to the heat treatment unit U2, and then controls the heat treatment unit U2 to perform the post-development heat treatment on the resist film of the workpiece W. The controller 100 controls the conveyor a3 to convey the developed heat-treated workpiece W to the inspection unit U3.

Next, the control device 100 controls the inspection unit U3 to inspect the workpiece W after the development process including the heat treatment accompanying the development is performed (step S06). Then, the control device 100 controls the conveying device A3 to return the workpiece W to the rack unit U10, and controls the conveying device a7 and the conveying device a1 to return the workpiece W to the carrier C. In the above manner, the coating and developing process for 1 workpiece W is completed.

In the above-described exemplary coating and developing process, the control device 100 performs the inspection of the workpiece W by the inspection unit U3 before the process by the coating and developing apparatus 2 is started and after all the processes by the coating and developing apparatus 2. The control device 100 may execute the inspection of the workpiece W by the substrate inspection unit 70 in the middle of the processing of each of the steps S02 to S05, in addition to the inspection of the workpiece W by the inspection unit U3. Fig. 8 is a flowchart showing an example of the inspection process performed when the workpiece W before being processed in the liquid processing unit U1 is fed into the liquid processing unit U1 in step S03. Hereinafter, an example will be given in which the sensor 72 is a line sensor and acquires surface information indicating the state of the entire main surface Wa of the workpiece W.

In the inspection process at the time of feeding to the liquid processing unit U1, the control device 100 first executes step S21 in a state where the workpiece W is held by the holding arm 20 disposed at the position where the tip end portion overlaps the base 48 in the direction D2. In step S21, for example, the displacement controller 102 controls the 2 nd driving unit 50 to move the holding arm 20 to a position relative to the liquid treatment unit U1 that is the feeding target.

Next, control device 100 executes step S22. In step S22, for example, the displacement controller 102 causes the driver 32 to start moving the holding arm 20 in the direction D2. Thereby, the workpiece W held by the holding arm 20 starts to move from the relative position to the liquid processing unit U1.

Next, control device 100 executes step S23. In step S23, for example, the inspection control unit 106 waits until the workpiece W held by the holding arm 20 reaches the acquisition area AR of the surface information of the substrate inspection unit 70. For example, the inspection control unit 106 may determine whether or not at least a part of the workpiece W has reached the acquisition area AR based on the rotation amount of the motor 44 of the driving unit 32 or the elapsed time from the start of movement of the holding arm 20 by the driving unit 32. In step S23, if it is determined that the workpiece W has reached the acquisition area AR, the control device 100 executes step S24. In step S24, for example, the inspection control section 106 causes the substrate inspection unit 70 to acquire surface information. For example, the inspection control unit 106 causes the sensor 72 to capture an image of a region overlapping the acquisition region AR on the main surface Wa of the workpiece W.

Next, control device 100 executes step S25. In step S25, for example, the inspection control unit 106 waits until the workpiece W held by the holding arm 20 passes through the acquisition area AR of the surface information. For example, the inspection control unit 106 may determine whether or not the entire region of the workpiece W (the main surface Wa) passes through the acquisition region AR (whether or not the workpiece W has moved to a position not overlapping the acquisition region AR) based on the rotation amount of the motor 44 of the drive unit 32 or the elapsed time from the start of movement of the holding arm 20 by the drive unit 32.

In step S25, if it is determined that the workpiece W does not pass through the acquisition area AR (at least a part of the main surface Wa overlaps the acquisition area AR), the inspection control unit 106 executes step S24 again. By repeating the above steps S24 and S25, the substrate inspection unit 70 continues to acquire the surface information of the workpiece W while the workpiece W passes through the acquisition area AR. Specifically, while the entire area of the main surface Wa of the workpiece W passes through the acquisition area AR, the inspection control unit 106 sequentially images a plurality of areas in the main surface Wa of the workpiece W with the sensor 72 to acquire surface information (image information) of the entire area of the main surface Wa.

In step S25, if it is determined that the workpiece W passes through the acquisition area AR, the control device 100 executes step S26. In step S26, for example, the displacement controller 102 waits until the holding arm 20 reaches the inside of the liquid treatment unit U1. For example, the displacement control unit 102 may determine whether or not the holding arm 20 (workpiece W) has reached the liquid processing unit U1 based on the rotation amount of the motor 44 of the driving unit 32 or the elapsed time from the start of movement of the holding arm 20 by the driving unit 32. In step S26, if it is determined that the holding arm 20 has reached the inside of the liquid processing unit U1, the control device 100 executes step S27. In step S27, for example, the displacement controller 102 stops the drive unit 32 from moving the holding arm 20 in the direction D2. Thereby, the movement of the workpiece W from the relative position to the liquid processing unit U1 is ended.

Next, the control device 100 executes steps S28, S29, and S30. In step S28, for example, the control device 100 controls the transport device A3 and the liquid processing unit U1 to transfer the workpiece W from the holding arm 20 to the liquid processing unit U1. In step S29, for example, in a state where the holding arm 20 is disposed in the liquid processing unit U1, the inspection controller 106 causes the environmental inspection unit 80 (sensor 82) to acquire environmental information in the liquid processing unit U1. In step S30, the displacement controller 102 controls the drive unit 32 so that the holding arm 20, which is not holding the workpiece W, moves from the liquid processing unit U1 to the opposite position. In this way, the inspection process when the workpiece W is fed to the one liquid processing unit U1 is ended.

Fig. 9 is a flowchart showing an example of the inspection process performed when the processed workpiece W in the liquid processing unit U1 is sent out from the liquid processing unit U1 in step S03 in which the resist film forming process is performed. In the inspection process when the workpiece W is sent out from the liquid processing unit U1, the control device 100 first executes steps S41, S42, and S43 in a state where the holding arm 20 disposed at the position where the tip portion overlaps the base 48 in the direction D2 does not hold the workpiece W. In step S41, for example, the displacement control section 102 controls the 2 nd drive unit 50 so that the holding arm 20 moves to the relative position. In step S42, for example, the displacement controller 102 controls the driver 32 to move the holding arm 20 from the relative position to the liquid processing unit U1. In step S43, for example, the control device 100 controls the transport device A3 and the liquid processing unit U1 so that the holding arm 20 takes up the processed workpiece W from the liquid processing unit U1.

Next, control device 100 executes step S44. In step S44, for example, the displacement controller 102 causes the driver 32 to start the movement of the holding arm 20 in the direction D2 after the workpiece W is picked up. Thereby, the workpiece W held by the holding arm 20 starts to move from the liquid processing unit U1 to the opposite position.

Next, control device 100 executes step S45. In step S45, for example, the inspection controller 106 waits until the workpiece W held by the holding arm 20 reaches the acquisition area AR of the surface information of the substrate inspection unit 70, as in step S23. In step S45, if it is determined that the workpiece W has reached the acquisition area AR, the control device 100 executes step S46. In step S46, the inspection controller 106 causes the substrate inspection unit 70 to acquire surface information of an area of the main surface Wa of the workpiece W that overlaps the acquisition area AR, as in step S24 described above.

Next, control device 100 executes step S47. In step S47, for example, the inspection controller 106 waits until the workpiece W held by the holding arm 20 passes through the acquisition area AR, as in step S25. In step S47, if it is determined that the workpiece W does not pass through the acquisition area AR, the control device 100 executes step S46 again. By repeating the above steps S46 and S47, the substrate inspection unit 70 continues to acquire the surface information of the workpiece W while the workpiece W passes through the acquisition region AR, and as a result, the inspection controller 106 acquires the surface information of the entire main surface Wa, in the same manner as the steps S24 and S25.

In step S47, if it is determined that the workpiece W passes through the acquisition area AR, the control device 100 executes step S48. In step S48, for example, the displacement control unit 102 waits until the holding arm 20 reaches the relative position. For example, the displacement control unit 102 may determine whether or not the holding arm 20 (workpiece W) has reached the relative position based on the rotation amount of the motor 44 of the driving unit 32 or the elapsed time from the start of movement of the holding arm 20 by the driving unit 32. In step S48, if it is determined that the holding arm 20 has reached the relative position, the control device 100 executes step S49. In step S49, for example, the displacement controller 102 stops the drive unit 32 from moving the holding arm 20 in the direction D2. Thereby, the movement of the workpiece W to the opposite position from the liquid processing unit U1 is ended. In this manner, the inspection process when the workpiece W is sent out from the one-liquid processing unit U1 is ended.

The process controller 112 of the control apparatus 100 controls the liquid processing unit U1 to form a coating film of resist on the main surface Wa of the workpiece W from the time when the workpiece W is fed into the liquid processing unit U1 to the time when the workpiece W is fed out from the liquid processing unit U1. During the liquid processing in the liquid processing unit U1, the control device 100 may also control the transport device A3 to feed another workpiece W into another liquid processing unit U1. At this time, the control device 100 may execute the same process as the inspection process flow illustrated in fig. 8. In the same process as in step S29, the inspection controller 108 may cause the environmental inspection unit 80 (sensor 82) to acquire environmental information of the other liquid processing unit U1 with the holding arm 20 disposed in the other liquid processing unit U1.

The flow of the coating and developing process and the inspection process described above is an example, and can be changed as appropriate. For example, a part of the above-described steps (processing) may be omitted, and the steps may be executed in another flow. In addition, any 2 or more steps among the above-described steps may be combined, or a part of the steps may be corrected or deleted. Alternatively, other steps may be performed in addition to the above-described steps. For example, in the above example, the imaging state of the sensor 72 is switched after the arrival at the acquisition area AR and the passage through the acquisition area AR are determined, but the inspection control unit 106 may switch the imaging state of the sensor 72 in accordance with the start and end of the movement in the direction D2 (for example, in accordance with the execution of steps S22 and S27). For example, after step S22 is executed, the inspection controller 106 may continue the imaging of the workpiece W by the sensor 72 until step S27 is completed.

[ modification 1]

Although the embodiments of the present invention have been described in detail, various modifications may be made to the above embodiments within the scope of the present invention. The processing module 12 may include a substrate inspection unit having an area sensor in addition to the substrate inspection unit 70 having a line sensor. For example, as shown in fig. 10, the processing module 12 may include a substrate inspection unit 70A instead of the substrate inspection unit 70. The substrate inspection unit 70A has a sensor 72A instead of the sensor 72.

The sensor 72A is an area sensor (area sensor type camera) capable of imaging a two-dimensional area by using an imaging element in which pixels are two-dimensionally arranged. The acquisition area AR (field of view) of the surface information of the sensor 72A may be approximately the same as the entire area of the main surface Wa of the workpiece W, or may be larger than the entire area of the main surface Wa. In this case, the sensor 72A can acquire surface information (image information) of the entire main surface Wa in a state where the main surface Wa of the workpiece W is located in the acquisition area AR. The acquisition area AR (field of view) of the sensor 72A may also be a two-dimensional area extending along the direction D1.

The substrate inspection unit 70A may be provided in the transport device a3 in the same manner as the substrate inspection unit 70. For example, a substrate inspection unit 70A (sensor 72A) is provided to the 1 st drive unit 30. For example, the sensor 72A may be fixed to the housing 34 of the driving unit 32 via a fixing member (not shown). In this case, the position of the sensor 72A (the position of the acquisition area AR of the sensor 72A) changes with the movement of the holding arm 20 by the 2 nd driving unit 50, and the relative position of the holding arm 20 (the workpiece W) with respect to the sensor 72A changes with the movement of the holding arm 20 by the driving unit 32. In a state where the distal end portion of the holding arm 20 is disposed at a position overlapping the base 48, the sensor 72A may be disposed such that the acquisition area AR of the sensor 72A (the imaging range of the sensor 72A) includes the entire area of the main surface Wa.

Fig. 11 is a flowchart showing another example of the inspection process executed when the workpiece W before the process in the liquid processing unit U1 is loaded into the liquid processing unit U1. Here, the sensor 72A is exemplified to have a field of view capable of imaging the entire region of the main surface Wa of the workpiece W. In this inspection process, for example, the control device 100 executes step S61 in the same manner as step S21 in a state where the workpiece W is held by the holding arm 20 whose tip portion is arranged at a position overlapping the base 48.

Next, the control device 100 executes steps S62 and S63. In step S62, for example, the inspection control section 106 causes the substrate inspection unit 70A to acquire surface information of the workpiece W. For example, the inspection control unit 106 causes the sensor 72A to acquire surface information (image information) of the entire region of the main surface Wa of the workpiece W. In step S63, for example, the inspection control section 106 controls the drive section 32 to move the holding arm 20 from the relative position into the liquid processing unit U1 in the direction D2.

Subsequently, the control device 100 executes steps S64 to S66 in the same manner as steps S28 to S30. The inspection process when the workpiece W is fed into the liquid processing unit U1 in the above manner is completed. In the inspection process described above, since the acquisition region AR (field of view) of the sensor 72A includes the entire main surface Wa in a state where the distal end portion of the holding arm 20 is disposed at a position overlapping the base 48, unlike the inspection process illustrated in fig. 8, the sensor-based imaging is not performed during the movement in the direction D2. In the inspection process illustrated in fig. 11, the acquisition of the surface information of the main surface Wa is performed at the timing of switching between the movement of the holding arm 20 in the direction D1 and the movement in the direction D2 (the timing between step S61 and step S63).

In addition, the acquisition area AR of the sensor 72A may be located between the relative position and the liquid processing unit U1. In this case, the control device 100 may temporarily stop the holding arm 20 in the middle of the movement in the direction D2 by the driving unit 32, and then cause the sensor 72A to acquire the surface information of the main surface Wa. The control device 100 may execute the inspection process when the workpiece W is sent out from the liquid processing unit U1 in the same manner as when the workpiece W is sent in. In the inspection process at the time of feeding, the control device 100 may move the holding arm 20 from the liquid treatment unit U1 to the relative position by the drive unit 32, and may acquire the surface information of the entire main surface Wa by the sensor 72A in a state where the workpiece W is stopped at the relative position. The inspection controller 106 may cause the sensor 72A to acquire the surface information of the workpiece W while the holding arm 20 is moved in the direction D1 by the 2 nd driving unit 50, or during or before the movement in the direction D2 by the 2 nd driving unit 50.

[ modification 2]

The coating and developing apparatus 2 may be configured to carry the workpiece W in and out of the process units such as the liquid process unit U1 by using a multi-joint arm, instead of the transport apparatus A3 that moves the workpiece W in the directions D1 and D2. The multi-joint arm 90 (conveying unit) shown in fig. 12 (a) and 12 (b) includes a base 92, a rotating portion 94, a1 st arm 96, a 2 nd arm 97, and a holder 98 (holding portion).

The base portion 92 is provided on the bottom surface or the like in the coating and developing device 2. The rotating portion 94 is provided on the base portion 92 and is rotatable about a vertical axis Ax 1. One end portion of the 1 st arm 96 is connected to the base portion 92 via the rotating portion 94. The 1 st arm 96 rotates about the axis Ax1 by the rotation of the rotating portion 94 about the axis Ax 1. A rotation driving unit 96a is provided at the other end of the 1 st arm 96, and one end of the 2 nd arm 97 is connected to the rotation driving unit 96 a. The rotation driving portion 96a rotates the 2 nd arm 97 about the vertical axis Ax 2.

A rotation driving portion 97a is provided at the other end of the 2 nd arm 97, and the lower surface of the holder 98 is connected to the rotation driving portion 97 a. The rotation driving portion 97a rotates the holder 98 about the vertical axis Ax 3. The holder 98 places the workpiece W on its upper surface, and holds the workpiece W by, for example, suction. The articulated arm 90 may have 1 or more other arms, and any of the arms may be provided so as to be rotatable about an axis line intersecting the vertical direction.

When the workpiece W is transferred to and from the processing unit by the articulated arm 90, the substrate inspection unit 70 (sensor 72) may be fixed at a predetermined position without being provided on the articulated arm 90. In this case, even if the holder 98 (workpiece W) is arbitrarily moved by the multi-joint arm 90, the position of the substrate inspection unit 70 does not change. The control device 100 may control the multi-joint arm 90 (the turning unit 94 and the rotation driving units 96a and 97a) so that the workpiece W held by the holder 98 passes through the acquisition region AR of the sensor 72 fixed at a predetermined position. For example, the movement of the articulated arm 90 may be predetermined so that the workpiece W (the region of the workpiece W to which the surface information is to be acquired) passes through the acquisition region AR. When the sensor 72 is a line sensor, the control device 100 (displacement control unit 102) may control the articulated arm 90 so that the holder 98 is displaced in a direction intersecting the acquisition area AR of the line sensor when the workpiece W passes through the acquisition area AR. When the workpiece W is loaded and unloaded by the articulated arm 90, a substrate inspection unit 70A (sensor 72A) fixed at a predetermined position may be used instead of the substrate inspection unit 70 (sensor 72).

[ other modifications ]

The above illustrated transport apparatus A3 has 1 holding arm 20, but the transport apparatus A3 may also have other holding arms 20 and other 1 st drive units 30 that move the other holding arms 20 in the direction D2. The 1 st drive unit 30 and the other 1 st drive unit 30 may be arranged side by side in the vertical direction. In this case, the substrate inspection units 70, 70A may also have other sensors 72, 72A that acquire surface information of the workpieces W held by other holding arms 20. The other sensors 72 and 72A may be provided in the other 1 st driving unit 30. Alternatively, the surface information of the workpiece W held by the holding arm 20 and the surface information of the workpieces W held by the other holding arms 20 may be acquired for 1 sensor 72, 72A included in the substrate inspection unit 70. The control device 100 may control the 1 st drive unit 30 to feed the workpiece W held by the holding arm 20 into the liquid processing unit U1, or may control the other 1 st drive unit 30 to feed the workpiece W from the liquid processing unit U1 by using the other holding arm 20.

The substrate inspection units 70 and 70A illustrated above have 1 sensor 72 and 72A for 1 holding arm 20, but the substrate inspection units 70 and 70A may have another sensor 72 and 72A capable of acquiring surface information of the main surface Wb on the opposite side of the main surface Wa. Other sensors 72, 72A may also be provided at the 1 st drive unit 30.

In the coating and developing apparatus 2 illustrated above, the inspection process is performed by the substrate inspection unit 70 when the workpiece W is sent to and from the liquid processing unit U1, but the inspection process may be performed by the substrate inspection unit 70 when the workpiece W is sent to and from the heat processing unit U2, the shelf units U10, U11, or another processing unit for the inspection controller 106. Any of the process modules 11, 13, 14 may also include a substrate inspection unit 70 and an environmental inspection unit 80, as with the process module 12.

The inspection control unit 106 may cause the substrate inspection unit 70 to perform the inspection process on the workpiece W after the processing, without causing the substrate inspection unit 70 to perform the inspection process on the workpiece W before the processing when the workpiece W is transferred into the processing unit. The inspection control unit 106 may cause the substrate inspection unit 70 to perform the inspection process on the workpiece W before the processing, without causing the substrate inspection unit 70 to perform the inspection process on the workpiece W after the processing when the workpiece W is sent out from the processing unit.

The substrate processing system 1 is not limited to the above example, and may be configured arbitrarily as long as it includes a processing unit that performs a predetermined process on a substrate, a conveying unit that carries in and out a workpiece W to and from the processing unit, and a substrate inspection unit that acquires information indicating a surface state of the workpiece W held by a holding portion of the conveying unit.

[ Effect of the embodiment ]

As described above, the coating and developing apparatus 2 according to one aspect of the present invention includes: a liquid processing unit U1 for performing a predetermined process on the workpiece W; a transport device a3 having a holding arm 20 for holding the workpiece W, and configured to transport the workpiece W to and from the liquid processing unit U1 by moving the holding arm 20 holding the workpiece W; and a substrate inspection unit 70 that acquires, outside the liquid processing unit U1, information indicating the surface state of the workpiece W held by the holding arm 20.

A substrate processing method of an aspect of the present invention includes: a step of feeding and discharging the workpiece W to and from a liquid processing unit U1 that performs a predetermined process on the workpiece W by displacing a holding arm 20 that holds the workpiece W while holding the workpiece W by the holding arm 20; and a step of acquiring, outside the liquid processing unit U1, information indicating the surface state of the workpiece W held by the holding arm 20.

When the inspection of the work W is performed for each process performed in the coating and developing device 2, the reliability of the process result in the coating and developing device 2 is improved. However, in order to perform the inspection per process, the work W is conveyed to the inspection unit before and after each process, and when the inspection of the work W is performed in the inspection unit, productivity in the coating and developing apparatus 2 is lowered. In contrast, in the coating and developing apparatus 2 and the substrate processing method according to the present invention, since the surface information of the workpiece W held by the holding arm 20 is acquired, the inspection process of the workpiece W can be performed by using the opportunity of the transportation of the workpiece W outside the processing unit. That is, in order to perform the processing in the liquid processing unit U1, the work W outside the liquid processing unit U1 needs to be transported, and the coating and developing apparatus 2 and the above substrate processing method effectively utilize the opportunity of the transportation. Therefore, the coating and developing apparatus 2 and the above substrate processing method contribute to both reliability improvement of the processing result and productivity.

The substrate inspection unit 70 may also be provided at the transport device a 3. In this case, the acquisition area AR of the surface information of the workpiece W of the substrate inspection unit 70 moves in accordance with the movement of the conveying device a 3. Therefore, the inspection of the workpiece W can be performed at a position close to the liquid processing unit U1.

The transporter a3 may also include a1 st drive unit 30 that moves the holding arm 20 in the direction D1 and a 2 nd drive unit 50 that moves the 1 st drive unit 30 in the direction D2. The substrate inspection unit 70 may also be provided at the 1 st driving unit 30. In this case, since the acquisition area AR is also moved in accordance with the movement of the 2 nd drive unit 50, the inspection of the workpiece W can be performed at a position closer to the liquid treatment unit U1 more reliably.

The coating and developing apparatus 2 may further include: a displacement control unit 102 that displaces the holding arm 20 by the conveying device a3 so that the main surface Wa of the workpiece W passes through the acquisition area AR where the surface information is acquired by the substrate inspection unit 70; and an inspection control unit 106 that causes the substrate inspection unit 70 to acquire surface information indicating the surface state of the workpiece W when the workpiece W is carried into and out of the liquid processing unit U1. In this case, the surface state can be checked before and after the treatment in the liquid treatment unit U1, and therefore the reliability is further improved. In order to perform the treatment in the liquid treatment unit U1, a transport for feeding into the liquid treatment unit U1 and a transport for feeding out from the liquid treatment unit U1 are required. According to this configuration, since the inspection process is performed by the 2-time conveyance operation, both the improvement of reliability of the process result and the productivity can be more favorably achieved.

The coating and developing apparatus 2 may further include: a displacement control unit 102 that displaces the holding arm 20 by the conveying device a3 so that the main surface Wa of the workpiece W passes through the acquisition area AR where the surface information is acquired by the substrate inspection unit 70; and an inspection control unit 106 that causes the substrate inspection unit 70 to acquire a plurality of pieces of information indicating the surface states of a plurality of regions of the main surface Wa of the workpiece W, respectively, while the main surface Wa of the workpiece W passes through the acquisition region AR. In this case, the surface information of the area larger than the acquisition area AR of the substrate inspection unit 70 can be acquired, and the substrate inspection unit 70 can be simplified. Further, since the workpiece W moves relative to the substrate inspection unit 70 in association with the feeding and discharging of the liquid processing unit U1, it is not necessary to move the workpiece W only for acquiring the surface information of a plurality of areas by the substrate inspection unit 70. That is, the substrate inspection unit 70 can be simplified without complicating other devices of the substrate inspection unit 70.

The substrate inspection unit 70 may also have a line sensor that acquires surface information from the linear acquisition area AR. The displacement control unit 102 may displace the holding arm 20 in a direction intersecting the acquisition area AR in which the surface information is acquired by the line sensor. The line sensor has one-dimensionally arranged imaging elements, and therefore the substrate inspection unit 70 can be simplified as compared with an area sensor having two-dimensionally arranged imaging elements. Or, since the image quality can be improved as compared with the area sensor, surface information having more detailed information can be acquired.

The substrate inspection unit 70 may also have an area sensor that acquires surface information from the acquisition area AR that extends in a planar manner. In this case, the time for acquiring the surface information can be shortened as compared with the line sensor.

The coating and developing apparatus 2 may further include an environmental check unit 80 provided in the holding arm 20 to acquire environmental information in the liquid processing unit U1. In this case, a sensor for acquiring environmental information can be reduced in the liquid processing unit U1, and the liquid processing unit U1 can be simplified.

The coating and developing apparatus 2 may further include: another liquid processing unit U1 for performing a predetermined process on the workpiece W; and an inspection control unit 108 for causing the environment inspection unit 80 to acquire the environment information. The transport device a3 can also carry in and out another workpiece W to and from another liquid processing unit U1. The inspection controller 108 may cause the environmental inspection unit 80 to acquire environmental information in the liquid processing unit U1 in a state where the holding arm 20 is positioned in the liquid processing unit U1, and cause the environmental inspection unit 80 to acquire environmental information in the other liquid processing unit U1 in a state where the holding arm 20 is positioned in the other liquid processing unit U1. In this case, the environmental information of the liquid process unit U1 and the other liquid process units U1 can be acquired by the same sensor 82. Therefore, as compared with the case where measurement is performed by the sensors separately provided in the liquid processing unit U1 and the other liquid processing unit U1, the inter-device error of the measurement values of the sensors can be reduced.