阅读说明：本技术 用于电路装置的公差补偿元件 (Tolerance compensation element for a circuit arrangement ) 是由 R.克诺夫 B.米勒 J.斯特罗吉斯 K.威尔克 R.布兰克 M.弗兰克 P.弗鲁豪夫 于 2018-06-07 设计创作，主要内容包括：本发明涉及一种用于电路装置的公差补偿元件,所述电路装置具有DCB(Direct Copper Bonded)衬底(1)和PCB(Printed Circuit Board)印刷电路板(2),并且本发明还涉及一种具有所述公差补偿元件的电路装置。本发明的特征在于,公差补偿元件在DCB衬底(1)与PCB印刷电路板(2)之间、在用于使DCB衬底(1)上的构件(5)触点接通的间隙A(3)中借助增材制造法目标性地调节并且以封闭间隙的方式构造。(The invention relates to a tolerance-compensating element for a Circuit arrangement having a DCB (direct Copper bonded) substrate (1) and a PCB (printed Circuit Board) printed Circuit board (2), and to a Circuit arrangement having the tolerance-compensating element. The invention is characterized in that the tolerance compensation element is adjusted in a targeted manner by means of an additive manufacturing method and is designed to close the gap in a gap A (3) for contacting a component (5) on the DCB substrate (1) between the DCB substrate (1) and the PCB (2).)

1. Tolerance compensation element for a Circuit arrangement having a DCB (direct copperbonded) substrate (1) and a PCB (printed Circuit board) printed Circuit board (2), characterized in that the tolerance compensation element is adjusted in a targeted manner by means of additive manufacturing methods and is constructed in such a way that it closes a gap between the DCB substrate (1) and the PCB printed Circuit board (2) in the gap a (3) for contacting a component (5) on the DCB substrate (1).

2. Tolerance compensation element according to claim 1, characterized in that the DCB substrate (1) has a copper-aluminum-copper arrangement (dielectric).

3. Tolerance compensation element according to claim 1, characterized in that the DCB substrate (1) has a copper-ceramic-copper arrangement.

4. Tolerance compensation element according to one of claims 1 to 3, characterized in that it is applied in the gap A (3) either on the PCB printed circuit board (2) or on the DCB substrate (1) and is melted point by point.

5. Tolerance compensation element according to claim 4, characterized in that the tolerance compensation element can be melted in the gap A (3) by means of a laser beam.

6. Tolerance compensation element according to one of claims 3 to 5, characterized in that the component (5) to be electrically contacted is a semiconductor component (6).

7. Tolerance compensation element according to claim 6, characterized in that the gap A (3) between the PCB printed circuit board (2) and the DCB substrate (1) is manufactured undersized during the manufacturing process of the PCB printed circuit board (2) such that a target distance is constructed between the DCB substrate (1) and the PCB printed circuit board (2).

8. Tolerance compensation element according to claim 6 or 7, characterized in that the gap dimensions for the electrical contacting of the semiconductor element (6) are configured within narrow tolerances not only for the gap B (8) on the upper side (7) of the semiconductor component (6) but also in the gap C (10) on the lower side (9).

9. Tolerance compensation element according to one of claims 6 to 8, characterized in that the tolerance compensation element is constructed from a material which is wettable for solder or from an alloy.

10. Tolerance compensation element according to one of claims 1 to 9, characterized in that the distance in the gap a can be determined directly during the manufacturing process and is adjusted to the workpiece by means of a closed adjustment loop for the respective pairing consisting of the DCB substrate (1) and the PCB (2).

11. A circuit arrangement having a tolerance compensation element according to any one of claims 1 to 10.