阅读说明：本技术 一种功率半导体器件安装结构及模块化制作方法 (Power semiconductor device mounting structure and modular manufacturing method ) 是由 赫金涛 于 2021-09-07 设计创作，主要内容包括：本发明涉及一种功率半导体器件安装结构及模块化制作方法,功率半导体器件安装结构包括功率半导体器件、散热金属体、导热粘接绝缘膜和PCB板；功率半导体器件的本体通过导热粘接绝缘膜粘接固定在散热金属体上；PCB板与散热金属体垂直设置,其中,PCB板与散热金属体之间设有绝缘条,散热金属体同时与绝缘条和PCB固定,且功率半导体器件的引脚穿过PCB板并固定。本发明的导热粘接绝缘膜同时起到绝缘、固定和导热的作用。且功率半导体器件、散热金属体和导热粘接绝缘膜均为扁平结构,节约了空间；散热金属体、功率半导体器件和PCB板形成功率半导体模块形成功率半导体模块,使产品模块化,便于产品的组装、存储和管理。(The invention relates to a power semiconductor device mounting structure and a modularized manufacturing method, wherein the power semiconductor device mounting structure comprises a power semiconductor device, a heat dissipation metal body, a heat conduction bonding insulating film and a PCB (printed Circuit Board); the body of the power semiconductor device is fixedly bonded on the heat dissipation metal body through the heat conduction bonding insulating film; the PCB is perpendicular to the heat dissipation metal body, wherein an insulating strip is arranged between the PCB and the heat dissipation metal body, the heat dissipation metal body is fixed with the insulating strip and the PCB, and the pins of the power semiconductor device penetrate through the PCB and are fixed. The heat-conducting adhesive insulating film provided by the invention has the functions of insulation, fixation and heat conduction. The power semiconductor device, the heat dissipation metal body and the heat conduction bonding insulating film are all in flat structures, so that space is saved; the heat dissipation metal body, the power semiconductor device and the PCB are shaped to form the power semiconductor module, so that the product is modularized, and the assembly, storage and management of the product are facilitated.)