阅读说明：本技术 新型低成本光伏金刚线切割专用垫板及其制备方法 (Novel low-cost special backing plate for photovoltaic diamond wire cutting and preparation method thereof ) 是由 潘永强 梁羽 苏光临 陈韬 于 2019-11-04 设计创作，主要内容包括：本发明公开了一种新型低成本光伏金刚线切割专用垫板,以通用级聚苯乙烯和抗冲击性聚苯乙烯为原料,并添加了相容增韧剂苯乙烯-丁二烯共聚物K胶或苯乙烯-丁二烯-苯乙烯嵌段共聚物,和附着力促进剂热塑性聚氨酯弹性体。本发明加入苯乙烯-丁二烯共聚物K胶或苯乙烯-丁二烯-苯乙烯嵌段共聚物SBS塑料及聚氨酯弹性体TPU,使GPPS和HIPS能良好相容,有效改善了GPPS/HIPS塑料板材质脆易裂,抗拉和冲击强度低等问题,且明显提高光伏金刚线切割专用板材表面极性,从而提高新型低成本光伏金刚线切割专用垫板表面附着力,使新型低成本光伏金刚线切割专用垫板与金刚线粘板胶和粘棒胶的粘接强度明显提高且稳定。(The invention discloses a novel low-cost special backing plate for photovoltaic diamond wire cutting, which takes general-purpose polystyrene and impact-resistant polystyrene as raw materials, and is added with compatible toughening agent styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer and adhesion promoter thermoplastic polyurethane elastomer. According to the invention, the styrene-butadiene copolymer K glue or the styrene-butadiene-styrene block copolymer SBS plastic and the polyurethane elastomer TPU are added, so that the GPPS and the HIPS can be well compatible, the problems of brittleness, easy cracking, low tensile strength and impact strength and the like of the GPPS/HIPS plastic plate material are effectively solved, and the surface polarity of the special photovoltaic diamond wire cutting plate is obviously improved, so that the surface adhesive force of the novel low-cost special photovoltaic diamond wire cutting backing plate is improved, and the adhesive strength of the novel low-cost special photovoltaic diamond wire cutting backing plate, the diamond wire adhesive plate glue and the adhesive bar glue is obviously improved and stabilized.)

1. A novel low-cost special backing plate for photovoltaic diamond wire cutting is prepared from general-purpose polystyrene and impact-resistant polystyrene as raw materials, as well as styrene-butadiene copolymer (K) adhesive or styrene-butadiene-styrene block copolymer as compatible toughening agent and thermoplastic polyurethane elastomer as adhesion promoter.

2. The novel special pad for low-cost photovoltaic diamond wire cutting as claimed in claim 1, wherein the special pad specifically comprises the following raw materials:

60-80 parts of general-purpose polystyrene, 20-40 parts of impact-resistant polystyrene, 5-15 parts of styrene-butadiene copolymer K glue or 3-5 parts of styrene-butadiene-styrene block copolymer, and 1-5 parts of thermoplastic polyurethane elastomer.

3. The novel special backing plate for low-cost photovoltaic diamond wire cutting as claimed in claim 2, further comprising 0.5-2 parts of stabilizer and 0.5-2 parts of lubricant.

4. The preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting as claimed in any one of claims 1 to 3, wherein the method comprises the following steps:

uniformly mixing general-grade polystyrene, impact-resistant polystyrene, styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer, a thermoplastic polyurethane elastomer, a stabilizer and a lubricant, granulating, drying, extruding for molding, and finally calendering, cooling and shaping to obtain the novel low-cost special backing plate for the photovoltaic diamond wire cutting.

5. The preparation method of the novel special pad plate for the low-cost photovoltaic diamond wire cutting as claimed in claim 4, wherein the extrusion temperature during the granulation is 180-200 ℃.

6. The preparation method of the novel low-cost special backing plate for the wire-electrode cutting of photovoltaic diamond as claimed in claim 4, wherein the drying is carried out for 10-20 minutes at 60-80 ℃.

7. The preparation method of the novel low-cost special backing plate for the wire-electrode cutting of photovoltaic diamond as claimed in claim 4, wherein the extrusion molding is carried out at the temperature of 180-200 ℃.

Technical Field

The invention relates to the technical field of silicon wafer cutting in the photovoltaic industry, in particular to a novel low-cost special backing plate for photovoltaic diamond wire cutting and a preparation method thereof.

Background

In the solar silicon wafer cutting process, the backing plate serves as an indispensable cutting auxiliary material and plays an important role in cutting the silicon wafer by the diamond wire, and meanwhile, the problem of high cost of the backing plate also becomes an important factor for rapid development of the photovoltaic industry.

Most of padding plates used for cutting traditional diamond wire silicon wafers are epoxy, phenolic aldehyde, polyester and various thermoplastic resins, and the padding plates have high specific gravity of 1.1-2.0 g/cm in the using process³(ii) a The steel wire is easy to break, break and adhere during cutting; the backing plate has high cost; the thermosetting backing plate is inconvenient for recovering silicon materials and the backing plate, and the like, and the problems are more and more difficult to meet the development trend of reducing the cost and improving the production efficiency of the photovoltaic industry.

Therefore, it is necessary to develop a novel low-cost pad dedicated for photovoltaic diamond wire cutting, which can solve the above problems.

Disclosure of Invention

It is an object of the present invention to address at least the above-mentioned deficiencies and to provide at least the advantages which will be described hereinafter.

The invention also aims to provide a novel low-cost special backing plate for the photovoltaic diamond wire cutting, which has the advantages of light specific gravity, high hardness, low electrical conductivity, high tensile strength and high shear strength.

The invention also aims to provide a novel low-cost special backing plate for photovoltaic diamond wire cutting, which can solve the problems that general-purpose polystyrene (GPPS) plastics are brittle and easy to crack, low in tensile strength and impact strength and easy to break in the processes of processing, carrying and using.

The invention also aims to provide a novel low-cost photovoltaic diamond wire cutting special backing plate which can solve the problems that the surface adhesion of a plate is low due to the weak polarity of general-purpose polystyrene (GPPS), and the bonding strength is unstable after the photovoltaic diamond wire cutting special backing plate is combined with diamond wire bonding plate glue and stick glue for use.

The invention also aims to provide a preparation method of the novel low-cost special backing plate for the linear cutting of the photovoltaic diamond, which has simple steps.

To achieve these objects and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, there is provided a novel low-cost photovoltaic diamond wire cutting special purpose pad, wherein general purpose polystyrene and impact resistant polystyrene are used as raw materials, and a compatible toughening agent styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer (hereinafter abbreviated as SBS plastic or SBS resin), and an adhesion promoter thermoplastic polyurethane elastomer (TPU) are added.

The method has the advantages that general-purpose polystyrene GPPS and impact-resistant polystyrene (HIPS) are used as raw materials, a compatible toughening agent of styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer SBS plastic and a strong-polarity material thermoplastic polyurethane elastomer TPU are added, so that the GPPS and the HIPS can be well compatible, the problems of brittleness, easy cracking, low tensile strength and impact strength and the like of the GPPS/HIPS plastic plate material are effectively solved, the surface polarity of the special plate for photovoltaic diamond wire cutting is obviously improved, the surface adhesive force of the novel low-cost special backing plate for photovoltaic diamond wire cutting is improved, and the adhesive strength of the novel low-cost special backing plate for photovoltaic diamond wire cutting and diamond wire adhesive plate glue and stick glue is obviously improved and stable.

Preferably, the novel low-cost photovoltaic diamond wire cutting special backing plate specifically comprises the following component raw materials:

60-80 parts of general-purpose polystyrene, 20-40 parts of impact-resistant polystyrene, 5-15 parts of styrene-butadiene copolymer K glue or 3-5 parts of styrene-butadiene-styrene block copolymer, and 1-5 parts of thermoplastic polyurethane elastomer.

Preferably, the novel low-cost special backing plate for photovoltaic diamond wire cutting further comprises 0.5-2 parts of stabilizer and 0.5-2 parts of lubricant.

A preparation method of a novel low-cost special backing plate for photovoltaic diamond wire cutting comprises the following steps:

uniformly mixing general-grade polystyrene, impact-resistant polystyrene, styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer, a thermoplastic polyurethane elastomer, a stabilizer and a lubricant, granulating, drying, extruding for molding, and finally calendering, cooling and shaping to obtain the novel low-cost special backing plate for the photovoltaic diamond wire cutting.

Preferably, in the preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting, the extrusion temperature during granulation is 180-200 ℃.

Preferably, in the preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting, the drying is carried out for 10-20 minutes at the temperature of 60-80 ℃.

Preferably, in the preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting, the backing plate is extruded and molded at the temperature of 180-200 ℃.

The invention at least comprises the following beneficial effects:

according to the novel low-cost special backing plate for photovoltaic diamond wire cutting, the general-purpose polystyrene GPPS and the impact-resistant polystyrene HIPS are used as raw materials, the compatible toughening agent styrene-butadiene copolymer K glue or styrene-butadiene-styrene block copolymer SBS plastic and the strong-polarity material thermoplastic polyurethane elastomer TPU are added, so that the GPPS and the HIPS can be well compatible, the problems that the GPPS/HIPS plastic plate is brittle and easy to crack, low in tensile strength and impact strength and the like are effectively solved, the surface polarity of the special plate for photovoltaic diamond wire cutting is obviously improved, the surface adhesive force of the novel low-cost special backing plate for photovoltaic diamond wire cutting is improved, and the adhesive strength of the novel low-cost special backing plate for photovoltaic diamond wire cutting and the adhesive strength of the diamond wire adhesive is obviously improved and stable.

The specific gravity of the novel low-cost special backing plate for photovoltaic diamond wire cutting is 1-1.1 g/cm³Shore hardness of 83-85 HD, conductivity<20 mu s/cm, tensile strength of 20-25 Mpa, and shear strength of 4-5 Mpa when the aluminum sheet is bonded.

Compared with various resin plates in the prior art, the novel low-cost special backing plate for photovoltaic diamond wire cutting has the advantages of light specific gravity and low production cost, does not adhere to diamond wires when used for cutting silicon wafers, reduces the adhesion of impurities to the diamond wires, reduces the abrasion probability of the diamond wires, reduces the consumption of the diamond wires, saves the cost, improves the quality rate of the silicon wafers, has the characteristic of facilitating the recovery of silicon materials and GPPS/HIPS plastic plates, and can bring obvious benefits of saving energy consumption, reducing the cost, improving the production efficiency and the like.

The preparation method of the novel low-cost special backing plate for the photovoltaic diamond wire cutting is simple in steps and beneficial to large-scale industrial production.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.

Detailed Description

The present invention is further described in detail below with reference to examples so that those skilled in the art can practice the invention with reference to the description.