Gold-copper alloy wire and preparation method thereof

文档序号:1444468 发布日期:2020-02-18 浏览:20次 中文

阅读说明:本技术 一种金铜合金线材及其制备方法 (Gold-copper alloy wire and preparation method thereof ) 是由 张远望 于 2019-11-29 设计创作,主要内容包括:本发明公开了一种金铜合金线材及其制备方法,该金铜合金线材含有40%~50%的铜、50%~60%的金、1%~5%的银;上述金铜合金线材的制备方法,包括以下步骤:第一步,按照需求进行成分配比,将原料熔化静置后采用引杆方法制备金铜合金杆材;第二步,对引铸后的合金杆材进行固溶时效热处理;第三步,将热处理后的铜杆依次通过大拉、中拉和小拉制备得到所需尺寸的线材:通过添加银元素,改善合金组织结构,提高合金材料的导电率及抗拉强度;采用的水平连铸可起到均匀化成分、增大合金铸杆的晶粒尺寸,提升材料的导电率;由于金属银的添加,可使材料表面形成氧化膜,这对材料表面抗氧化性能有很大的提高。(The invention discloses a gold-copper alloy wire and a preparation method thereof, wherein the gold-copper alloy wire contains 40-50% of copper, 50-60% of gold and 1-5% of silver; the preparation method of the gold-copper alloy wire rod comprises the following steps: firstly, mixing the components according to requirements, melting and standing the raw materials, and preparing a gold-copper alloy rod material by adopting a rod guiding method; secondly, carrying out solution aging heat treatment on the alloy rod after the casting; thirdly, sequentially carrying out large drawing, medium drawing and small drawing on the copper rod after heat treatment to obtain a wire rod with a required size: by adding silver element, the alloy structure is improved, and the conductivity and tensile strength of the alloy material are improved; the adopted horizontal continuous casting can homogenize the components, increase the grain size of the alloy cast rod and improve the conductivity of the material; due to the addition of the metallic silver, an oxide film can be formed on the surface of the material, which greatly improves the oxidation resistance of the surface of the material.)

1. A gold-copper alloy wire rod is characterized in that: the gold-copper alloy wire contains 40-50% of copper, 50-60% of gold and 1-5% of silver.

2. A preparation method of a gold-copper alloy wire is characterized by comprising the following steps: the method comprises the following steps:

firstly, carrying out component proportioning according to requirements, melting and standing the raw materials, and preparing a gold-copper alloy rod material by adopting a rod guiding method: the raw materials comprise 40-50% of copper, 50-60% of gold and 1-5% of silver, and the standing time is not less than 20 min;

secondly, carrying out solution aging heat treatment on the alloy rod after the casting: carrying out solution aging heat treatment on the alloy rod material after the leading casting in an inert atmosphere, heating the alloy casting rod to a single-phase region through the solution treatment, preserving the heat, and then rapidly cooling, wherein after the alloy is subjected to the solution treatment through the aging treatment, a small amount of additive element silver is dissolved in a gold-copper matrix in a solid solution manner, and through the aging treatment, the silver element is mainly dissolved in the gold and precipitated from the copper phase, and forms a dispersed alloy phase in the copper matrix, and the alloy phase is cooled along with a furnace;

thirdly, sequentially carrying out large drawing, medium drawing and small drawing on the copper rod subjected to heat treatment to obtain a wire rod with a required size;

and fourthly, annealing the final wire rod in an inert atmosphere to obtain a finished product of the gold-copper alloy wire rod.

3. The gold-copper alloy wire rod and the preparation method thereof according to claim 2, wherein: in the first step, the gold is added in the form of particles having a particle size range of not more than 10 mm.

4. The gold-copper alloy wire rod and the preparation method thereof according to claim 2, wherein: in the first step, the added copper is 4N oxygen-free copper, and the purity of gold, copper and silver is not lower than 99.99%.

5. The gold-copper alloy wire rod and the preparation method thereof according to claim 2, wherein: the rod guiding method in the first step adopts horizontal guiding casting, the rod guiding speed is 100-150 mm/min, and the rod guiding temperature is 1155-.

6. The gold-copper alloy wire rod and the preparation method thereof according to claim 2, wherein: in the second step, the inert gas is argon.

7. The gold-copper alloy wire rod and the preparation method thereof according to claim 2, wherein: in the solid solution treatment of the second step, the solid solution temperature is 600-760 ℃, and the heat preservation time is 4 hours.

8. The gold-copper alloy wire rod and the method for producing the same according to claim 1 or 7, wherein: the cooling mode of the aging treatment is natural cooling.

9. The gold-copper alloy wire rod and the preparation method thereof according to claim 2, wherein: in the aging treatment of the second step, the aging temperature is 350-420 ℃, and the heat preservation time is 2 h.

Technical Field

The invention relates to the technical field of precious metal alloy smelting processing, in particular to a gold-copper alloy wire and a preparation method thereof.

Background

The gold-copper alloy has excellent signal transmission performance and good mechanical properties, and can be widely applied to high-end fever audio lines, aerospace, radars and other precise electronic components. However, the resistivity of the gold-copper alloy is greatly increased after alloying, and the use of the gold-copper alloy wire with large length not only causes the voltage drop of a signal end, but also causes great waste to energy transmission. Gold and copper are continuous solid solution alloys, so the hardness and strength properties of the resulting gold-copper alloy are not ideal, and moreover, the surface of copper is easily oxidized to form loose copper oxide due to long-term exposure to air, which is extremely disadvantageous for signal transmission of the gold-copper alloy.

The technical effect of the patent content shows that the copper-gold alloy has good conductivity, and because the addition of alloy elements destroys the lattice structure of the original metal and increases the structure interface resistance, the resistance of the alloyed conductor is certainly increased, so that the conductivity, tensile strength and oxidation resistance of the alloyed conductor need to be improved by changing the gold-copper alloy and the preparation method thereof.

Disclosure of Invention

The invention aims to provide a gold-copper alloy wire and a preparation method thereof aiming at the defects of the prior art.

The technical scheme for solving the problems comprises the following steps: a gold-copper alloy wire comprises 40-50% of copper, 50-60% of gold and 1-5% of silver.

A preparation method of a gold-copper alloy wire rod comprises the following steps:

firstly, carrying out component proportioning according to requirements, melting and standing the raw materials, and preparing a gold-copper alloy rod material by adopting a rod guiding method: the raw materials comprise 40-50% of copper, 50-60% of gold and 1-5% of silver, and the standing time is not less than 20 min;

secondly, carrying out solution aging heat treatment on the alloy rod after the casting: carrying out solution aging heat treatment on the alloy rod material after the leading casting in an inert atmosphere, heating the alloy casting rod to a single-phase region through the solution treatment, preserving the heat, and then rapidly cooling, wherein after the alloy is subjected to the solution treatment through the aging treatment, a small amount of additive element silver is dissolved in a gold-copper matrix in a solid solution manner, and through the aging treatment, the silver element is mainly dissolved in the gold and precipitated from the copper phase, and forms a dispersed alloy phase in the copper matrix, and the alloy phase is cooled along with a furnace;

thirdly, sequentially carrying out large drawing, medium drawing and small drawing on the copper rod subjected to heat treatment to obtain a wire rod with a required size;

and fourthly, annealing the final wire rod in an inert atmosphere to obtain a finished product of the gold-copper alloy wire rod.

Preferably, in the first step, the gold is added in the form of particles having a particle size in the range of not more than 10 mm.

Preferably, in the first step, the added copper is 4N oxygen-free copper, and the purity of gold, copper and silver is not lower than 99.99%.

Preferably, the rod guiding method in the first step adopts horizontal guiding casting, the rod guiding speed is 100-150 mm/min, and the rod guiding temperature is 1155-1165 ℃.

Preferably, in the second step, the inert gas is argon.

Preferably, in the solid solution treatment of the second step, the solid solution temperature is 600-760 ℃, and the heat preservation time is 4 hours.

Preferably, the cooling method of the aging treatment is natural cooling.

Preferably, in the aging treatment of the second step, the aging temperature is 350-420 ℃, and the heat preservation time is 2 hours.

The invention has the following beneficial effects:

the invention provides a gold-copper alloy wire and a preparation method thereof, wherein an alloy tissue structure is improved by adding silver element, a heat treatment process is matched to realize that the original continuous solid-dissolved gold-copper tissue shows precipitated phases, and the conductivity and tensile strength of the alloy material can be improved to a certain extent by uniform precipitation distribution of the precipitated phases and severe plastic deformation in the subsequent wire drawing process. The horizontal continuous casting adopted by the invention can homogenize the components and increase the grain size of the alloy cast rod, which properly improves the conductivity of the material. In addition, due to the addition of the metallic silver, an oxide film can be formed on the surface of the material, so that the oxidation resistance of the surface of the material is greatly improved.

Drawings

FIG. 1 shows the metallographic structure of the gold-copper alloy wire prepared according to the present invention.

Detailed Description

The present invention will be further described with reference to the following embodiments.

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