阅读说明：本技术 硅片清洗设备 (Silicon wafer cleaning equipment ) 是由 左国军 成旭 李雄朋 任金枝 于 2019-11-20 设计创作，主要内容包括：本发明提供了一种硅片清洗设备,包括：框架组件；工艺机构,设于框架组件中,数量为至少两个,适于对硅片进行工艺处理；传输组件,与框架组件连接,并适于沿框架组件移动并传输硅片,以使得硅片由任一工艺机构移动至任另一工艺机构；隔离组件,设于框架组件中,通过在开启状态和关闭状态之间切换,以使得任一工艺机构的内部空间与外部空间相互连通或相互分隔；其中,工艺机构包括至少一个的清洗组件和至少一个的烘干组件,清洗组件适于对硅片进行清洗,烘干组件适于对硅片进行烘干,清洗组件中设有鼓泡装置。本发明能够提高硅片的清洗效率和清洗质量。(The invention provides a silicon wafer cleaning device, which comprises: a frame assembly; the process mechanisms are arranged in the frame assembly, the number of the process mechanisms is at least two, and the process mechanisms are suitable for carrying out process treatment on the silicon wafers; the transmission assembly is connected with the frame assembly and is suitable for moving along the frame assembly and transmitting the silicon wafer so that the silicon wafer is moved from any process mechanism to any other process mechanism; the isolation assembly is arranged in the frame assembly and is switched between an opening state and a closing state, so that the internal space and the external space of any process mechanism are mutually communicated or mutually separated; the process mechanism comprises at least one cleaning assembly and at least one drying assembly, the cleaning assembly is suitable for cleaning the silicon wafer, the drying assembly is suitable for drying the silicon wafer, and a bubbling device is arranged in the cleaning assembly. The invention can improve the cleaning efficiency and the cleaning quality of the silicon wafer.)

1. A silicon wafer cleaning apparatus, comprising:

a frame assembly;

the process mechanisms are arranged in the frame assembly, the number of the process mechanisms is at least two, and the process mechanisms are suitable for carrying out process treatment on the silicon wafers;

the transmission assembly is connected with the frame assembly and is suitable for moving along the frame assembly and transmitting the silicon wafer so that the silicon wafer is moved from any one process mechanism to any other process mechanism;

the isolation assembly is arranged in the frame assembly and is switched between an opening state and a closing state, so that the internal space and the external space of any process mechanism are mutually communicated or mutually separated;

the process mechanism comprises at least one cleaning assembly and at least one drying assembly, the cleaning assembly is suitable for cleaning the silicon wafer, the drying assembly is suitable for drying the silicon wafer, and a bubbling device is arranged in the cleaning assembly.

2. The silicon wafer cleaning apparatus as claimed in claim 1, wherein the bubbling device comprises:

one or more bubbling tubes arranged in the cleaning assembly and provided with air inlets and bubbling through holes, wherein the bubbling through holes penetrate through the tube walls of the bubbling tubes;

and the bubbling gas source is communicated with the gas inlet, drives gas to enter the bubbling tube from the gas inlet and discharges the gas out of the bubbling tube from the bubbling through hole.

3. The silicon wafer cleaning apparatus as set forth in claim 2, comprising:

the bubbling pipe is provided with a reciprocating bent closed loop structure, and the air inlet is arranged at any position of the closed loop structure; or

The bubbling pipe is provided with an open passage structure which is bent in a reciprocating manner, and the two air inlets are respectively arranged at two ends of the open passage structure.

4. The silicon wafer cleaning apparatus as set forth in claim 2, comprising:

at least two bubbling pipes are arranged in parallel front and back along the horizontal direction; or

At least two bubbling pipes are arranged in parallel along the horizontal direction.

5. The silicon wafer cleaning apparatus as set forth in claim 2, comprising:

the bubbling through hole is arranged in the left side pipe wall of the bubbling pipe; and/or

The bubbling through hole is arranged in the pipe wall of the right side part of the bubbling pipe.

6. The silicon wafer cleaning apparatus as set forth in claim 2, comprising:

the bubbling air source with one quantity is respectively communicated with the air inlets with two or more quantities.

7. The silicon wafer cleaning apparatus as set forth in claim 2, comprising:

the plurality of bubbling through holes are distributed at intervals along the bubbling pipe.

8. The silicon wafer cleaning apparatus according to any one of claims 2 to 7, wherein the cleaning assembly comprises:

a main cleaning tank provided with a communicating part;

the auxiliary cleaning tank is arranged around the main cleaning tank and communicated with the main cleaning tank through the communicating part;

wherein, the bubbling pipe is arranged in the main cleaning tank.

9. The silicon wafer cleaning apparatus as claimed in claim 8, wherein the cleaning assembly further comprises:

a circulation pipe partially or entirely provided in the main cleaning tank and respectively communicated with the main cleaning tank and the sub cleaning tank;

a circulation pump disposed in the circulation pipe, driving liquid to circulate between the main cleaning tank and the sub cleaning tank through the circulation pipe;

wherein, the bubbling pipe is arranged above the circulating pipe.

10. The silicon wafer cleaning apparatus as set forth in claim 8, comprising:

the upper end of the main cleaning tank is provided with a plurality of overflow parts, and liquid in the main cleaning tank overflows from the overflow parts and enters the auxiliary cleaning tank.

Technical Field

The invention relates to the technical field of solar cell manufacturing, in particular to silicon wafer cleaning equipment.

Background

In recent years, solar energy has been widely used as a clean and environmentally friendly energy source in many fields. The silicon wafer is the most common element in the solar photovoltaic industry, and a plurality of processes are required to be carried out in the production flow, so that the photoelectric conversion effect of the silicon wafer is ensured. Among the processing procedures, the texturing and cleaning procedure of the surface of the silicon wafer is a process of immersing the silicon wafer into an acid liquid pool or an alkali liquid pool to generate a series of chemical reactions. In general, the alkali treatment is performed on the silicon wafer to obtain a pyramid-shaped texture surface, and the acid treatment is performed on the silicon wafer to obtain a wormhole-shaped texture surface. The high-quality texture surface treatment can improve the light trapping effect of the silicon wafer, so that incident light is reflected and refracted on the surface of the silicon wafer for multiple times, the light absorption is increased, the reflectivity is reduced, and the performance of the cell is improved. Therefore, the silicon wafer cleaning equipment adopted in the texturing cleaning process has a crucial influence on the production and manufacture of the silicon wafer.

Disclosure of Invention

The present invention is directed to solving at least one of the above problems.

Therefore, the invention aims to provide silicon wafer cleaning equipment.

To achieve the object of the present invention, an embodiment of the present invention provides a silicon wafer cleaning apparatus, including: a frame assembly; the process mechanisms are arranged in the frame assembly, the number of the process mechanisms is at least two, and the process mechanisms are suitable for carrying out process treatment on the silicon wafers; the transmission assembly is connected with the frame assembly and is suitable for moving along the frame assembly and transmitting the silicon wafer so that the silicon wafer is moved from any process mechanism to any other process mechanism; the isolation assembly is arranged in the frame assembly and is switched between an opening state and a closing state, so that the internal space and the external space of any process mechanism are mutually communicated or mutually separated; the process mechanism comprises at least one cleaning assembly and at least one drying assembly, the cleaning assembly is suitable for cleaning the silicon wafer, the drying assembly is suitable for drying the silicon wafer, and a bubbling device is arranged in the cleaning assembly.

Among the above-mentioned technical scheme, bubbling device's setting can be solved because of the poor, the poor problem of temperature uniformity of the interior liquid homogeneity of cell that the cell body grow of main washing tank arouses, and then, can effectively avoid the unstable drawback of silicon chip matte technology, improves the quality and the productivity of silicon chip. In addition, the frame assembly is arranged to facilitate installation and fixation of the process mechanism and the transmission assembly. So as to enable the transport assembly to reciprocate in sequence along the various process mechanisms. The isolation assembly can improve the acid-base gas isolation effect inside each process mechanism, and reduce the mutual interference of acid-base gas between adjacent process mechanisms or the influence on silicon wafers. The silicon wafer cleaning equipment is characterized in that the frame assembly, the process mechanisms and the transmission assembly are jointly constructed to form an automatic production line, and the transmission assembly is adopted to transmit the silicon wafers, so that the silicon wafers can flexibly and continuously move among the process mechanisms, and the automation degree and the production efficiency of the cleaning process are improved.

In addition, the technical solution provided by the above embodiment of the present invention may further have the following additional technical features:

in the above technical solution, the bubbling device includes: one or more bubbling tubes arranged in the cleaning assembly and provided with air inlets and bubbling through holes, wherein the bubbling through holes penetrate through the tube walls of the bubbling tubes; and the bubbling gas source is communicated with the gas inlet, drives gas to enter the bubbling tube from the gas inlet and discharges the gas out of the bubbling tube from the bubbling through hole.

In the technical scheme, the bubbling gas source drives gas to enter the bubbling tube from the gas inlet, so that the bubbling tube can realize the bubbling effect. The technical scheme formed by the bubbling pipe, the air inlet and the bubbling through hole is simple in structure and stable in performance, and can be used for uniformly bubbling in the cleaning assembly.

In any of the above technical solutions, the bubble tube has a reciprocating bending closed loop structure, and the air inlet is arranged at any position of the closed loop structure; or the bubbling pipe is provided with an open passage structure which is bent in a reciprocating way, and two air inlets are respectively arranged at two ends of the open passage structure.

The design of the reciprocating bending structure is convenient for enabling one bubbling pipe to be uniformly arranged in the inner cavity of the main cleaning tank through bending circulation so as to realize uniform bubbling of liquid at each position. The closed loop structure enables gas to fully flow in the bubbling pipe until the gas is discharged through the bubbling through hole, so that the aim of energy-saving and efficient bubbling is fulfilled. When the bubbling pipe is designed to be an open passage structure, gas can be simultaneously conveyed into the bubbling pipe through the two gas inlets so as to improve the gas pressure in the bubbling pipe, improve the bubbling rate, better increase the liquid circulation and promote the uniform flow of liquid.

In any of the above technical solutions, at least two of the bubbling tubes are arranged in parallel in the front-back direction along the horizontal direction; or at least two bubble tubes are arranged in parallel along the horizontal direction.

At least two bubbling pipes are arranged in parallel in the horizontal direction in a front-back or left-right mode, so that the bubbling pipes can be uniformly arranged in the inner wall of the main cleaning tank, and uniform bubbling of liquid at each position is realized.

In any of the above technical solutions, the bubbling through hole is disposed in the left side tube wall of the bubbling tube; and/or the bubbling through hole is arranged in the tube wall of the right side part of the bubbling tube.

The bubbling through holes in the tube walls of the upper top part or the lower bottom part of the bubbling tube can enable bubbles to penetrate through the bubbling tube, so that the bubbling effect is achieved.

In any of the above technical solutions, one bubbling gas source is respectively communicated with two or more gas inlets.

When the number of the bubbling pipes is set to be a plurality, and the two bubbling pipes pump gas in through the same bubbling gas source, the volume of the equipment can be reduced, and the cost is saved.

In any of the above technical solutions, the plurality of bubbling through holes are distributed along the bubbling tube at intervals.

The bubbling through holes are arranged at intervals, so that the bubbling through holes can be uniformly bubbled at all positions in the cleaning device.

In any of the above technical solutions, the cleaning assembly includes: a main cleaning tank provided with a communicating part; the auxiliary cleaning tank is arranged around the main cleaning tank and is communicated with the main cleaning tank through a communicating part; wherein, the bubbling pipe is arranged in the main cleaning tank.

According to the technical scheme, liquid is driven to enter the circulating pipe from the auxiliary cleaning tank through the circulating pump, and is discharged into the main cleaning tank through the circulating pipe. The liquid which continuously flows and circulates in the main cleaning tank and the bubble tube are matched, so that the silicon wafer can be uniformly and thoroughly cleaned.

In any of the above technical solutions, the cleaning assembly further includes: a circulation pipe partially or completely disposed in the main cleaning tank and respectively communicated with the main cleaning tank and the auxiliary cleaning tank; the circulating pump is arranged in the circulating pipe and drives the liquid to circulate between the main cleaning tank and the auxiliary cleaning tank through the circulating pipe; wherein, the bubbling pipe is arranged above the circulating pipe.

The bubble pipe is arranged on the circulating pipe, so that the liquid output from the circulating pipe is fully disturbed by bubbles, and the uniformity of the liquid in the main cleaning tank is improved.

In any of the above technical solutions, the upper end of the main cleaning tank is provided with a plurality of overflow parts, and the liquid in the main cleaning tank overflows from the overflow parts and enters the auxiliary cleaning tank.

The overflow part is favorable for destroying the surface tension of liquid molecules, accelerating the flow of surface liquid and promoting the stable circulation of the liquid.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic perspective view of a cleaning apparatus according to some embodiments of the present invention;

FIG. 2 is a schematic side cross-sectional view of a cleaning apparatus according to some embodiments of the invention;

FIG. 3 is a schematic top view of a cleaning assembly according to some embodiments of the invention;

FIG. 4 is a schematic cross-sectional view B-B of a cleaning assembly according to some embodiments of the invention;

FIG. 5 is a schematic cross-sectional view taken along line A-A of a cleaning assembly in accordance with a portion of the present invention;

FIG. 6 is a schematic view of the liquid circulation principle of a cleaning assembly according to some embodiments of the present invention;

FIG. 7 is a schematic cross-sectional view of a bubbler tube according to some embodiments of the present invention;

FIG. 8 is a first structural schematic of a bubbler tube according to some embodiments of the present invention;

FIG. 9 is a second structural schematic of a bubbler tube according to some embodiments of the present invention;

FIG. 10 is a schematic view of a third configuration of a bubbler tube according to some embodiments of the present invention;

FIG. 11 is a fourth schematic view of a bubbler tube according to some embodiments of the present invention;

FIG. 12 is a schematic diagram of an overflow arrangement according to some embodiments of the invention;

FIG. 13 is a schematic view of the fluid flow direction of a cleaning assembly in accordance with some embodiments of the present invention during dispensing;

FIG. 14 is a schematic side view of a main wash tank according to some embodiments of the invention;

FIG. 15 is a schematic diagram of the operation of a drying assembly according to some embodiments of the present invention;

FIG. 16 is a schematic side sectional view of a drying assembly in accordance with a portion of the exemplary embodiment of the present invention;

fig. 17 is a schematic cross-sectional view illustrating a drying assembly according to a part of the embodiment of the present invention;

FIG. 18 is a schematic side view of a drying assembly in accordance with a portion of the exemplary embodiment of the present invention;

FIG. 19 is a schematic diagram of the operation of a transfer assembly in accordance with some embodiments of the invention;

FIG. 20 is a schematic view of a portion of an embodiment of the isolation assembly in a closed position;

FIG. 21 is a schematic view of a portion of an embodiment of an isolation assembly in an open position;

FIG. 22 is a first schematic diagram of the isolation assembly of some embodiments of the present invention;

FIG. 23 is a schematic view of the installation location of the spacer assembly of some embodiments of the present invention;

FIG. 24 is a schematic structural view of an isolation assembly in accordance with some embodiments of the present invention;

FIG. 25 is a second operational schematic of an isolation assembly in accordance with some embodiments of the invention;

fig. 26 is a third schematic diagram of an isolation assembly according to some embodiments of the invention.

Wherein, the corresponding relation between the reference signs and the component names is as follows:

10: technological mechanism, 12: cleaning assembly, 121: main cleaning tank, 122: auxiliary cleaning tank, 123: communication portion, 124: circulation pipe, 125: circulation pump, 126: overflow, 127: overflow baffle, 128: overflow filtering device, 129: via structure, 14: drying assembly, 141: drying tank, 142: drying duct, 143: air supply device, 1431: air supply line, 1432: gas drive device, 1433: filtration device, 1434: control valve, 144: drying cover plate, 145: stoving groove link plate, 146: drying chute support plate, 147: adjusting screw, 16: bubbling device, 161: bubbling tube, 162: air inlet, 163: bubbling through hole, 164: bubbling gas source, 20: transmission assembly, 22: moving component, 221: hanging basket, 222: longitudinal support arm, 223: lateral suspension arm, 224: blowing protection device, 225: pressure sensor, 24: elevation drive device, 26: translation drive device, 30: frame assembly, 301: outer closure plate, 302: middle vertical plate, 303: lower base plate, 304: upper ceiling, 305: electrical mounting box, 306: pipe fixing plate, 307: liquid receiving plate, 308: liquid accumulation box, 309: drain valve, 310: moving component moving passage, 32: feeding table, 34: blanking table, 40: isolation assembly, 41: backing plate, 42: door body, 43: cylinder slide rail, 44: cylinder, 45: in-position sensing device, 46: door body guide groove, 47: motor, 48: rotating shaft, 49: rolling screen, 410: guide shaft, 411: high-pressure air curtain machine, 412: suction box, 413: updraft ventilator, 50: electrical component, 60: a ventilation assembly, 601: box of induced drafting, 602: suction valve, 603: air draft channel, 70: fluid infusion device.

Detailed Description

In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.

The solution of some embodiments of the invention is described below with reference to fig. 1 to 26. The embodiment of the invention provides silicon wafer cleaning equipment, which is used for cleaning a silicon wafer in the preparation process of a solar cell. The silicon wafer is an important raw material for preparing the solar cell, and the texturing and cleaning of the silicon wafer is a crucial process in the preparation process of the solar cell. The texturing and cleaning of the silicon wafer refers to: the surface of the silicon wafer is treated by an acidic or alkaline corrosive solution to remove mechanical damage, oil stains or impurities on the surface of the silicon wafer. The silicon wafer is subjected to chemical reaction in an acidic or alkaline corrosive solution, so that a textured structure is formed on the surface of the silicon wafer. In the process of solar cell preparation, several different corrosive solutions are often needed to repeatedly clean the surface of the silicon wafer for many times, and after the texturing cleaning, corresponding equipment is needed to dry the surface of the silicon wafer. The efficiency of the above process is critical to the efficiency of solar cell production.

As shown in fig. 1 and 3, the silicon wafer cleaning apparatus according to the embodiment of the present invention includes: a frame assembly 30; the number of the process mechanisms 10 is at least two, and the process mechanisms are suitable for carrying out process treatment on the silicon wafer; a transfer unit 20 for transferring the silicon wafer so that the silicon wafer is moved from any one process unit to any other process unit; a partition member 40 provided in the frame member 30 to communicate with or separate an inner space and an outer space of any one of the process units 10 by switching between an open state and a closed state; the process mechanism 10 comprises at least one cleaning assembly 12 and at least one drying assembly 14, wherein the cleaning assembly 12 is suitable for cleaning silicon wafers, the drying assembly 14 is suitable for drying the silicon wafers, and a bubbling device 16 is arranged in the cleaning assembly 12.

The bubbling device 16 can solve the problems of poor uniformity and poor temperature consistency of liquid in the tank caused by the enlargement of the tank body of the cleaning assembly, further effectively avoid the defect of unstable texture surface process of the silicon wafer, and improve the quality and the capacity of the silicon wafer.

In addition, the frame assembly 30 is provided to facilitate mounting and securing of the processing tool 10 and the transfer assembly 20. So as to enable the transfer assembly 20 to reciprocate in sequence along each process unit 10. The isolation assembly 40 can improve the acid-base gas isolation effect inside each process mechanism 10, and reduce the mutual interference of acid-base gas between adjacent process mechanisms or the influence on silicon wafers. The silicon wafer cleaning equipment is an automatic production line formed by the frame assembly 30, the process mechanisms 10 and the transmission assembly 20 together, and the silicon wafers are transmitted by the transmission assembly 20, so that the silicon wafers can be flexibly and continuously moved among the process mechanisms, and the automation degree and the production efficiency of the cleaning process are improved.

In order to more clearly illustrate the present embodiment, the respective components of the present embodiment will be described separately below. The process mechanism 10 includes a plurality of process treatment assemblies which are independent from each other and are sequentially arranged, and each process treatment assembly is used for implementing different treatment processes on the surface of the silicon wafer, so that each performance index of the silicon wafer can meet the requirement of preparing the solar cell. Wherein, the processing mechanism 10 at least comprises a cleaning component 12 and a drying component 14. The structures of the washing assembly 12 and the drying assembly 14 can be understood with reference to fig. 3 to 6 and 15 to 18. In this embodiment, the upper portion of the process mechanism 10 may be provided with an isolation cover, wherein the isolation cover may be a cover-shaped or door-shaped structure that is mutually matched with the tank body of the process mechanism 10, may also be an air curtain isolation structure that is realized by an air curtain mechanism and is formed at an opening at the upper portion of the process mechanism 10, and may also be a plastic film structure that covers the opening at the upper portion of the process mechanism 10.

The cleaning component 12 is used for cleaning and texturing the surface of the silicon wafer by adopting acid-base liquid. The number of the cleaning assemblies 12 is one or more. When the number of the cleaning assemblies 12 is plural, the respective cleaning assemblies 12 may be sequentially arranged in a linear direction. The cleaning assembly 12 is provided with a cleaning tank adapted to contain an acidic or alkaline liquid to effect cleaning of the silicon wafer. The type and concentration of the acidic or basic liquid can be selected by the person skilled in the art as a function of the circumstances. For example, one or more corrosive liquids such as nitric acid, hydrochloric acid, sulfuric acid, hydrofluoric acid, sodium hydroxide, potassium hydroxide, ammonia water, and hydrogen peroxide may be selected by those skilled in the art according to actual conditions and needs, and then placed in the cleaning assembly 12 for cleaning the silicon wafer.

The drying component 14 is used for drying the silicon wafers subjected to cleaning and texturing. The number of drying assemblies 14 may likewise be one or more. Wherein, a plurality of drying assemblies 14 may be disposed at the rear end of the cleaning assembly 12 continuously or spaced apart from the cleaning assembly 12. The drying assembly 14 is provided with a drying tank, and when the drying process is performed, the silicon wafer is placed in the drying tank and dried by means of temperature rise, infrared irradiation, air flow and the like.

The structure of the transfer assembly 20 can be understood with reference to fig. 19. The conveying assembly 20 is used for conveying the silicon wafer, so that after the processing of the previous process is completed, the silicon wafer is automatically moved from the station of the previous process to the station of the next process quickly and stably, and the silicon wafer is processed through the next process. Wherein, the conveying assembly 20 can move the silicon wafer from the position of one cleaning assembly 12 to the position of another cleaning assembly 12, and also can move the silicon wafer from the position of one cleaning assembly 12 to one drying assembly 14. The transfer assembly 20 can move the silicon wafer between two adjacent process mechanisms 10 and also between two process mechanisms 10 spaced apart from each other. The transmission assembly 20 is arranged so that the silicon wafer can be automatically and continuously transmitted and carried. The conveying assembly 20 can convey the silicon wafer by a movable and graspable manipulator, and can convey the silicon wafer by a slide device, a lifting device and the like which are matched with each other. Further, the transport assembly 20 may be controlled by a computer program or by manual mechanical operation. In the present embodiment, the number of the transfer units 20 may be one or more, and those skilled in the art can select the number of the transfer units 20 according to the number, size and distance of the process units 10. The more than two transmission assemblies 20 are matched with each other when in use, and respectively realize the transportation and the movement of the silicon wafers.

The processing tool 10 is disposed in a frame assembly 30, and the transfer assembly 20 is coupled to the frame assembly 30 and adapted to move along the frame assembly 30. Specifically, as shown in fig. 1 and 2, the process tool 10 is embedded in the frame assembly 30, and the frame assembly 30 supports and fixes the process tool 10. The transmission assembly 20 is disposed on the frame assembly 30 and slidably connected to the frame assembly 30 via a slide way or the like. A viewing door may be provided on the frame assembly 30 to allow an operator to view the interior of the frame assembly 30. The frame assembly 30 is provided to facilitate mounting and securing of the processing tool 10 and the transfer assembly 20. So as to enable the transfer assembly 20 to reciprocate in sequence along each process unit 10. The partition member 40 is provided in the frame member 30 to communicate with or separate the internal space and the external space of any one of the process units 10 by switching between an open state and a closed state. For example, the isolation assembly 40 may allow the internal space of any one process tool 10 to communicate with or be isolated from another process tool 10, and may also allow the internal space of any one process tool 10 to communicate with or be isolated from a space outside the frame assembly 30. It should be noted that the installation position and the number of installation positions of the isolation assembly 40 can be selected and adjusted by those skilled in the art. The isolation assembly 40 can improve the acid-base gas isolation effect inside each process mechanism 10, and reduce the mutual interference of the acid-base gas between adjacent process mechanisms 10 or the influence on silicon wafers.