阅读说明：本技术 点阵红外光成像技术的线路板孔缺陷检测装置及其方法 (Circuit board hole defect detection device and method of dot matrix infrared light imaging technology ) 是由 刘金建 于 2019-12-20 设计创作，主要内容包括：本发明涉及点阵红外光成像技术的线路板孔缺陷检测装置及其方法,外套管内部设为中空,外套管一端设有保护玻璃,保护玻璃内侧面中间处设有物镜,物镜外侧面沿周设有准直透镜,物镜远离保护玻璃的侧面设有棒状镜,外套管内设有点阵红外光机构,外套管远离保护玻璃的侧面设有成像透镜,棒状镜远离保护玻璃的侧面与成像透镜固定连接,成像透镜外侧面设有连接套管,连接套管内部设为中空,连接套管远离成像透镜的侧面设有CCD相机。本发明的优点：根据CCD相机可以具体查看到线路板孔内部情况,点阵红外光成像分辨率较高,内部板孔毛刺、缺铜、无铜等缺陷可以准确检测出,提高线路板孔缺陷检测效率。(The invention relates to a circuit board hole defect detection device and a method thereof in dot matrix infrared imaging technology, wherein the interior of an outer sleeve is hollow, one end of the outer sleeve is provided with protective glass, the middle of the inner side surface of the protective glass is provided with an objective lens, the outer side surface of the objective lens is provided with a collimating lens along the circumference, the side surface of the objective lens far away from the protective glass is provided with a rod-shaped lens, the outer sleeve is internally provided with a dot matrix infrared mechanism, the side surface of the outer sleeve far away from the protective glass is provided with an imaging lens, the side surface of the rod-shaped lens far away from the protective glass is fixedly connected with the imaging lens. The invention has the advantages that: can specifically look over circuit plate hole internal conditions according to the CCD camera, dot matrix infrared light imaging resolution is higher, and defects such as inside plate hole burr, lack copper, no copper can accurately be detected out, improve circuit plate hole defect detection efficiency.)

1. Circuit diaphragm hole defect detection device of dot matrix infrared light imaging technique, its characterized in that: it comprises an outer sleeve (105), the inner part of the outer sleeve (105) is hollow, one end of the outer sleeve (105) is provided with protective glass (102), an objective lens (101) is arranged in the middle of the inner side surface of the protective glass (102), a collimating lens (103) is arranged on the outer side surface of the objective lens (101) along the circumference, a rod-shaped lens (106) is arranged on the side surface of the objective lens (101) far away from the protective glass (102), a dot matrix infrared mechanism is arranged in the outer sleeve (105), an imaging lens (107) is arranged on the side surface of the outer sleeve (105) far away from the protective glass (102), the side of the rod-shaped mirror (106) far away from the protective glass (102) is fixedly connected with an imaging lens (107), a connecting sleeve (108) is arranged on the outer side surface of the imaging lens (107), the interior of the connecting sleeve (108) is hollow, the side of the connecting sleeve (108) far away from the imaging lens (107) is provided with a CCD camera (109).

2. The circuit board hole defect detection device of dot matrix infrared light imaging technology of claim 1, characterized in that: the dot matrix infrared light mechanism comprises a fixing plate (201) arranged between the outer side face of an objective lens (101) and the inner side face of an outer sleeve (105), the fixing plate (201) is far away from protective glass (102) and is arranged close to a rod-shaped lens (106), an infrared light source processor (104) is arranged on the side face, close to a collimating lens (103), of the fixing plate (201), and the infrared light source processor (104) is a JY87 type processor.

3. The circuit board hole defect detection device of dot matrix infrared light imaging technology of claim 1, characterized in that: the dot matrix infrared light mechanism comprises a guide pipe (202) which is communicated with one side in an outer sleeve (105), a dot matrix infrared light fiber light guide pipe (203) is arranged in the guide pipe (202), and the other end of the dot matrix infrared light fiber light guide pipe (203) penetrates through the outer sleeve (105) to be connected with a collimating lens (103).

4. The device for detecting the hole defect of the circuit board in the dot matrix infrared light imaging technology according to claim 3, wherein: the collimating lens (103) is in contact with the outer side surface of one end of the rod-shaped lens (106) close to the objective lens (101).

5. The circuit board hole defect detection device of the dot matrix infrared light imaging technology according to claims 1-3, characterized in that: the imaging lens (107) is configured as a convex mirror.

6. The circuit board hole defect detection device of dot matrix infrared light imaging technology of claim 1, characterized in that: the CCD camera (109) is set as an MER-032-120GM/C CCD industrial camera.

7. The circuit board hole defect detection method of the dot matrix infrared imaging technology is characterized in that: the apparatus used is the apparatus in claims 1-6, the method steps are:

step a, an infrared light source processor (104) projects infrared light to a collimating lens (103), and the collimating lens (103) projects the infrared light to a tested circuit board hole;

step b, the circuit board hole reflects the received infrared light to an objective lens (101) after the step a, and then the infrared light is fed back to a CCD camera (109) after passing through a rod lens (106) and an imaging lens (107) in sequence;

step c, after the step b, the CCD camera (109) sends the received information to the computer, calculates the phase difference through a phase recovery algorithm, and further calculates the depth information according to a phase height conversion algorithm, thereby restoring the accurate three-dimensional image inside the hole of the circuit board,

and d, after the step c, comparing the internal outlines displayed by the detected circuit boards, judging the defects, and giving a warning when the circuit boards with the defects are detected.

Technical Field

The invention relates to the technical field of circuit board production detection, in particular to a circuit board hole defect detection device and method based on a dot matrix infrared imaging technology.

Background

The existing circuit board hole detection defects are mainly used for indirectly judging whether defects exist by means of measuring resistance, reactance, current, voltage and the like, and the efficiency is low, so that the reasons of the specific defects in the holes cannot be really seen; some methods are manually observed by naked eyes to observe the defects and judge the causes of the defects, but the workload is large, and the efficiency is low; and the more certain flying needle detection method is that firstly, a special needle bed clamp is required to be manufactured for each circuit board to detect, the manufacturing period of the clamp is longer, the hole interval of the detected circuit board cannot be smaller than the interval of two probes, the circuit board hole is limited, and the whole device is complex in structure and not practical enough.

Disclosure of Invention

The invention aims to solve the technical problem and provides a circuit board hole defect detection device and method based on the dot matrix infrared imaging technology, which can directly check the internal condition of a board hole and improve the accuracy of defect detection.

In order to solve the technical problems, the technical scheme provided by the invention is as follows: dot matrix infrared light imaging technology's circuit plate hole defect detection device, it includes the outer tube, the outer tube is inside to be established to cavity, outer tube one end is equipped with protection glass, department is equipped with objective in the middle of the protection glass medial surface, the objective lateral surface is equipped with collimating lens along week, the side that protection glass was kept away from to objective is equipped with the rodlike mirror, be equipped with dot matrix infrared light mechanism in the outer tube, the side that protection glass was kept away from to the outer tube is equipped with imaging lens, the side and the imaging lens fixed connection that protection glass was kept away from to the rodlike mirror, imaging lens lateral surface is equipped with the adapter sleeve, the inside cavity that establishes of adapter sleeve, the side that imaging lens was kept away from.

As an improvement, the dot matrix infrared light mechanism comprises a fixing plate arranged between the outer side face of the objective lens and the inner side face of the outer sleeve, the fixing plate is far away from the protective glass and is arranged close to the rod-shaped lens, an infrared light source processor is arranged on the side face, close to the collimating lens, of the fixing plate, the infrared light source processor is a JY87 type processor, and the dot matrix infrared light source is lightened according to a sine rule generated by computer coding.

As an improvement, the dot matrix infrared light mechanism comprises a guide pipe which is communicated with one side surface in the outer sleeve, a dot matrix infrared light fiber light pipe is arranged in the guide pipe, and the other end of the dot matrix infrared light fiber light pipe penetrates through the outer sleeve to be connected with the collimating lens.

As an improvement, the collimating lens is contacted with the outer side surface of one end of the rod lens close to the objective lens.

As an improvement, the imaging lens is a convex mirror.

As an improvement, the CCD camera is an MER-032-120GM/C CCD industrial camera.

The circuit board hole defect detection method of the dot matrix infrared imaging technology comprises the following steps of:

step a, an infrared light source processor projects infrared light to a collimating lens, and the collimating lens projects the infrared light to a hole of a tested circuit board;

b, reflecting the received infrared light to an objective lens through the wiring board hole after the step a, and feeding back the infrared light to the CCD camera after sequentially passing through the rod lens and the imaging lens;

step c, after the step b, the CCD camera sends the received information to a computer, phase difference is calculated through a phase recovery algorithm, and depth information is further calculated according to a phase height conversion algorithm, so that an accurate three-dimensional image inside the hole of the circuit board is restored,

and d, after the step c, comparing the internal outlines displayed by the detected circuit boards, judging the defects, and giving a warning when the circuit boards with the defects are detected.

The invention has the following advantages: according to the CCD camera, the internal conditions of the holes of the circuit board can be specifically checked, the imaging resolution of the dot matrix infrared light is high, and the defects of burrs, copper deficiency, no copper and the like of the holes of the internal board can be accurately detected; the dot matrix infrared light is used for the method for detecting the defects of the circuit board holes, so that the detection efficiency of the defects of the circuit board holes is improved, and the internal conditions of the circuit board holes can be directly checked; the visual observation is liberated, and the accuracy of defect detection is improved; the circuit board is not damaged in the detection process, and the defective circuit board hole does not need to be sliced for detection; the detection process does not need to be contacted with a circuit board, is convenient and quick, and has great market popularization potential; the distance between the circuit board holes is not limited, and a special clamp does not need to be made.

Drawings

Fig. 1 is a structural schematic diagram of an embodiment of a circuit board hole defect detection device and method thereof according to the dot matrix infrared light imaging technology of the invention.

Fig. 2 is a schematic structural diagram of a second embodiment of the circuit board hole defect detection apparatus and method of the dot matrix infrared imaging technology of the present invention.

As shown in the figure: 101. an objective lens 102, a protective glass 103, a collimating lens 104, an infrared light source processor 105, an outer sleeve 106, a rod-shaped mirror 107, an imaging lens 108, a connecting sleeve 109, a CCD camera 201, a fixing plate 202, a conduit 203 and a dot matrix infrared optical fiber light guide pipe.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Combine fig. 1, fig. 2. The circuit board hole defect detection device of the dot matrix infrared light imaging technology comprises an outer sleeve 105, wherein the outer sleeve 105 is hollow, protective glass 102 is arranged at one end of the outer sleeve 105, an objective lens 101 is arranged in the middle of the inner side surface of the protective glass 102, collimating lenses 103 are arranged on the outer side surface of the objective lens 101 along the periphery, a rod-shaped lens 106 is arranged on the side surface, away from the protective glass 102, of the objective lens 101, a dot matrix infrared light mechanism is arranged in the outer sleeve 105, an imaging lens 107 is arranged on the side surface, away from the protective glass 102, of the outer sleeve 105, the rod-shaped lens 106 is fixedly connected with the imaging lens 107, a connecting sleeve 108 is arranged on the outer side surface of the imaging lens 107, the interior of the connecting sleeve 108 is hollow, and a CCD camera 109 is.

The dot matrix infrared light mechanism comprises a fixing plate 201 arranged between the outer side surface of the objective lens 101 and the inner side surface of the outer sleeve 105, the fixing plate 201 is far away from the protective glass 102 and is arranged close to the rod-shaped mirror 106, an infrared light source processor 104 is arranged on the side surface of the fixing plate 201 close to the collimating lens 103, and the infrared light source processor 104 is a JY87 type processor.

The dot matrix infrared light mechanism comprises a guide pipe 202 which is communicated with one side surface in the outer sleeve 105, a dot matrix infrared light fiber light guide pipe 203 is arranged in the guide pipe 202, and the other end of the dot matrix infrared light fiber light guide pipe 203 penetrates through the outer sleeve 105 to be connected with the collimating lens 103.

The collimator lens 103 is in contact with an outer side surface of one end of the rod lens 106 close to the objective lens 101.

The imaging lens 107 is configured as a convex mirror.

The CCD camera 109 is set as MER-032-120GM/C CCD industrial camera.

The circuit board hole defect detection method of the dot matrix infrared imaging technology comprises the following steps of:

step a, the infrared light source processor 104 projects infrared light to the collimating lens 103, and the collimating lens 103 projects the infrared light to a hole of the tested circuit board;

step b, the circuit board hole reflects the received infrared light to the objective lens 101 after the step a, and then the infrared light is fed back to the CCD camera 109 after passing through the rod lens 106 and the imaging lens 107 in sequence;

step c, after the step b, the CCD camera 109 sends the received information to the computer, calculates the phase difference through a phase recovery algorithm, further calculates the depth information according to a phase height conversion algorithm, thereby reducing the accurate three-dimensional image inside the hole of the circuit board,

and d, after the step c, comparing the internal outlines displayed by the detected circuit boards, judging the defects, and giving a warning when the circuit boards with the defects are detected.