Workpiece detection and assembly method, equipment and storage medium
阅读说明：本技术 一种工件检测和组装方法、设备及存储介质 (Workpiece detection and assembly method, equipment and storage medium ) 是由 王子锋 于 2019-11-21 设计创作，主要内容包括：本发明实施例提供一种工件检测和组装方法、设备及存储介质,方法包括：获取待组装工件进入组装工作站之前的图像,作为第一图像；通过检测第一图像中待组装工件的叠放情况,判断待组装工件是否满足组装条件；如果不满足,采用预设处理方式对待组装工件进行处理；可见,本方案中,在工件进入组装工作站之前,可以检测出不满足组装条件的工件,并对其进行处理,这样,只对满足组装条件的工件进行组装,降低了组装错误率。(The embodiment of the invention provides a workpiece detection and assembly method, equipment and a storage medium, wherein the method comprises the following steps: acquiring an image of a workpiece to be assembled before entering an assembling workstation as a first image; judging whether the workpieces to be assembled meet the assembling conditions or not by detecting the stacking condition of the workpieces to be assembled in the first image; if not, processing the workpiece to be assembled by adopting a preset processing mode; therefore, in the scheme, the workpieces which do not meet the assembly conditions can be detected and processed before the workpieces enter the assembly workstation, so that only the workpieces which meet the assembly conditions are assembled, and the assembly error rate is reduced.)
1. A method of inspecting a workpiece, comprising:
acquiring an image of a workpiece to be assembled before entering an assembling workstation, wherein the workpiece to be assembled comprises two or more overlapped workpieces as a first image;
judging whether the workpieces to be assembled meet the assembling conditions or not by detecting the stacking condition of the workpieces to be assembled in the first image;
and if not, processing the workpiece to be assembled by adopting a preset processing mode.
2. The method of claim 1, wherein said acquiring an image of the workpiece to be assembled prior to entering the assembly station as the first image comprises:
the camera arranged above the production line is used for collecting images of the workpieces to be assembled before entering the assembling workstation as first images.
3. The method of claim 1, wherein the determining whether the workpieces to be assembled satisfy the assembly condition by detecting the stacking condition of the workpieces to be assembled in the first image comprises:
detecting a positioning hole in the first image, and judging whether the positioning hole meets an alignment condition;
and if the positioning hole meets the alignment condition, judging that the workpiece to be assembled meets the assembly condition.
4. The method according to claim 3, wherein the processing the workpiece to be assembled by a preset processing mode comprises:
detecting the boundary of the workpiece to be assembled in the first image, and judging whether the boundary meets a gap condition;
if the boundary meets the gap condition, outputting first alarm information;
and if the boundary does not meet the gap condition, outputting second alarm information.
5. The method of claim 4, wherein the determining whether the boundary satisfies a gap condition comprises:
and judging whether the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece meets the gap condition or not.
6. The method of claim 5, wherein determining whether the gap between the boundary of the upper workpiece and the boundary of the lower workpiece satisfies a gap condition comprises:
judging whether a gap between the boundary of the upper layer workpiece and the inner boundary of the lower layer workpiece is within a first preset range;
and/or judging whether the gap between the boundary of the upper layer workpiece and the outer boundary of the lower layer workpiece is within a second preset range.
7. The method of claim 1, wherein the processing the workpiece to be assembled by a predetermined processing method comprises:
outputting alarm information aiming at the workpiece to be assembled;
and/or, moving the workpiece to be assembled out of the production line.
8. A method of assembling a workpiece, comprising:
acquiring an image of a workpiece to be assembled at an assembling workstation as a second image;
determining the initial position of the assembly part by detecting the second image;
determining an assembling path corresponding to the workpiece to be assembled according to the initial position;
and controlling the assembling components to sequentially move to each assembling position from the starting position along the assembling path for assembling, wherein the end point of the assembling path corresponds to the different assembling positions from the starting position.
9. The method of claim 8, wherein determining a starting position of an assembly component by detecting the second image comprises:
detecting an initial positioning hole in the second image and an adjacent boundary of the initial positioning hole, wherein the initial positioning hole is a positioning hole corresponding to the initial position of the assembly part;
and determining the initial position of the assembly part according to the position relation between the initial positioning hole and the adjacent boundary.
10. The method of claim 9, wherein said acquiring an image of said workpiece to be assembled at an assembly station as a second image comprises:
and acquiring an image of the workpiece to be assembled at an assembling workstation through a camera linked with the assembling part as a second image, wherein the second image comprises a positioning hole below the initial position of the assembling part and an adjacent boundary thereof.
11. The method of claim 9, wherein each of the assembly positions corresponds to a locating hole of the workpiece to be assembled; the method further comprises the following steps:
controlling an assembling part to move from the initial position to each assembling position along the assembling path in sequence to carry out assembling, and acquiring a third image through the camera aiming at each assembling position, wherein the third image comprises a positioning hole corresponding to the assembling position;
and judging whether the positioning hole corresponding to the assembly position is matched with the assembly position or not by detecting the third image, and if not, adjusting the assembly path.
12. The method of claim 11, wherein the adjusting the assembly path comprises:
determining deviation data of the positioning hole corresponding to the assembly position and the assembly position;
and adjusting the assembly positions in the residual assembly paths according to the deviation data, and generating a new assembly path consisting of the adjusted assembly positions.
13. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the method according to any of claims 1 to 7 when executing the program.
14. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the method according to any of claims 8 to 12 when executing the program.
15. A non-transitory computer readable storage medium storing computer instructions for causing a computer to perform the method of any one of claims 1 to 7.
16. A non-transitory computer readable storage medium storing computer instructions for causing a computer to perform the method of any one of claims 8 to 12.
Technical Field
The invention relates to the technical field of production lines, in particular to a workpiece detection and assembly method, equipment and a storage medium.
Background
In some production lines, different workpieces need to be matched and aligned, and then the aligned workpieces are assembled. In some cases, assembly errors can occur due to operator error, workpiece misalignment, and the like.
For example, in some cases, the circuit board is punched with the backplane and then aligned with and locked to the holes in the backplane. In some cases, the tolerance limits are misaligned in opposite directions due to operator error, so that the holes do not align. Or, in other cases, the hole is not formed due to the fact that the deviation of the board card is large. Thus, assembly errors can occur.
Disclosure of Invention
Accordingly, the present invention is directed to a method, an apparatus and a storage medium for inspecting and assembling workpieces to reduce the assembly error rate.
Based on the above purpose, an embodiment of the present invention provides a workpiece detection method, including:
acquiring an image of a workpiece to be assembled before entering an assembling workstation, wherein the workpiece to be assembled comprises two or more overlapped workpieces as a first image;
judging whether the workpieces to be assembled meet the assembling conditions or not by detecting the stacking condition of the workpieces to be assembled in the first image;
and if not, processing the workpiece to be assembled by adopting a preset processing mode.
Optionally, the acquiring an image of the workpiece to be assembled before entering the assembly workstation as the first image includes:
the camera arranged above the production line is used for collecting images of the workpieces to be assembled before entering the assembling workstation as first images.
Optionally, the determining whether the workpiece to be assembled meets the assembly condition by detecting the stacking condition of the workpiece to be assembled in the first image includes:
detecting a positioning hole in the first image, and judging whether the positioning hole meets an alignment condition;
and if the positioning hole meets the alignment condition, judging that the workpiece to be assembled meets the assembly condition.
Optionally, the processing the workpiece to be assembled by using a preset processing mode includes:
detecting the boundary of the workpiece to be assembled in the first image, and judging whether the boundary meets a gap condition;
if the boundary meets the gap condition, outputting first alarm information;
and if the boundary does not meet the gap condition, outputting second alarm information.
Optionally, the determining whether the boundary meets the gap condition includes:
and judging whether the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece meets the gap condition or not.
Optionally, the determining whether the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece satisfies a gap condition includes:
judging whether a gap between the boundary of the upper layer workpiece and the inner boundary of the lower layer workpiece is within a first preset range;
and/or judging whether the gap between the boundary of the upper layer workpiece and the outer boundary of the lower layer workpiece is within a second preset range.
Optionally, the processing the workpiece to be assembled by using a preset processing mode includes:
outputting alarm information aiming at the workpiece to be assembled;
and/or, moving the workpiece to be assembled out of the production line.
Based on the above object, an embodiment of the present invention further provides a workpiece assembling method, including:
acquiring an image of a workpiece to be assembled at an assembling workstation as a second image;
determining the initial position of the assembly part by detecting the second image;
determining an assembling path corresponding to the workpiece to be assembled according to the initial position;
and controlling the assembling components to sequentially move to each assembling position from the starting position along the assembling path for assembling, wherein the end point of the assembling path corresponds to the different assembling positions from the starting position.
Optionally, the determining the starting position of the assembly component by detecting the second image includes:
detecting an initial positioning hole in the second image and an adjacent boundary of the initial positioning hole, wherein the initial positioning hole is a positioning hole corresponding to the initial position of the assembly part;
and determining the initial position of the assembly part according to the position relation between the initial positioning hole and the adjacent boundary.
Optionally, the acquiring an image of the workpiece to be assembled at the assembly workstation as a second image includes:
and acquiring an image of the workpiece to be assembled at an assembling workstation through a camera linked with the assembling part as a second image, wherein the second image comprises a positioning hole below the initial position of the assembling part and an adjacent boundary thereof.
Optionally, each assembling position corresponds to a positioning hole of the workpiece to be assembled; the method further comprises the following steps:
controlling an assembling part to move from the initial position to each assembling position along the assembling path in sequence to carry out assembling, and acquiring a third image through the camera aiming at each assembling position, wherein the third image comprises a positioning hole corresponding to the assembling position;
and judging whether the positioning hole corresponding to the assembly position is matched with the assembly position or not by detecting the third image, and if not, adjusting the assembly path.
Optionally, the adjusting the assembly path includes:
determining deviation data of the positioning hole corresponding to the assembly position and the assembly position;
and adjusting the assembly positions in the residual assembly paths according to the deviation data, and generating a new assembly path consisting of the adjusted assembly positions.
In view of the above object, an embodiment of the present invention further provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, where the processor implements any one of the above workpiece detection methods when executing the program.
In view of the above object, an embodiment of the present invention further provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements any one of the workpiece assembling methods when executing the program.
In view of the above object, the embodiment of the present invention further provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute any one of the above workpiece detection methods.
In view of the above object, the embodiment of the present invention further provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute any one of the above workpiece assembly methods.
By applying the embodiment of the invention, the image of the workpiece to be assembled before entering the assembling workstation is obtained and is used as the first image; judging whether the workpieces to be assembled meet the assembling conditions or not by detecting the stacking condition of the workpieces to be assembled in the first image; if not, processing the workpiece to be assembled by adopting a preset processing mode; therefore, in the scheme, the workpieces which do not meet the assembly conditions can be detected and processed before the workpieces enter the assembly workstation, so that only the workpieces which meet the assembly conditions are assembled, and the assembly error rate is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a first flowchart of a workpiece inspection method according to an embodiment of the present invention;
FIG. 2 is a simplified schematic diagram of a manufacturing line according to an embodiment of the present invention;
FIG. 3 is a schematic view of another simplified manufacturing line provided by an embodiment of the present invention;
FIG. 4 is a schematic diagram of positioning holes of an upper workpiece and a lower workpiece according to an embodiment of the present invention;
fig. 5 is a schematic diagram of boundaries of an upper workpiece and a lower workpiece according to an embodiment of the present invention.
FIG. 6 is a second flowchart of a workpiece inspection method according to an embodiment of the present invention;
FIG. 7 is a schematic flow chart illustrating a method for assembling a workpiece according to an embodiment of the present invention;
FIG. 8 is a schematic view of a workpiece according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a positioning hole and its boundary according to an embodiment of the present invention;
FIG. 10 is a schematic view of an adjusted assembly path according to an embodiment of the present invention;
FIG. 11 is a schematic view of an automatic screw locking machine according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of a lock attachment path in a related arrangement;
fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 14 is a schematic structural diagram of another electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
It is to be noted that technical terms or scientific terms used in the embodiments of the present invention should have the ordinary meanings as understood by those having ordinary skill in the art to which the present disclosure belongs, unless otherwise defined. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
In order to achieve the above object, embodiments of the present invention provide a workpiece detecting and assembling method, a device and a storage medium, which can be applied to various electronic devices, such as a detecting device in a production line, other computers, and the like, and are not limited in particular. The workpiece inspection method will be described in detail first.
Fig. 1 is a first schematic flowchart of a workpiece detection method according to an embodiment of the present invention, including:
s101: and acquiring an image of the workpiece to be assembled before entering the assembling workstation as a first image, wherein the workpiece to be assembled comprises two or more overlapped workpieces.
For example, referring to FIG. 2, assume that a manufacturing line includes two stations, and an operator performs some manual operations at
In one case, S101 may include: the camera arranged above the production line is used for collecting images of the workpieces to be assembled before entering the assembling workstation as first images.
As shown in FIG. 3, a camera may be disposed between
S102: judging whether the workpieces to be assembled meet the assembling conditions or not by detecting the stacking condition of the workpieces to be assembled in the first image; if not, executing S103; if so, the workpieces to be assembled may be conveyed to an assembly workstation for assembly.
For example, the stacking condition of the workpieces to be assembled in the first image is detected, the positioning holes and/or the boundaries of the workpieces to be assembled can be detected, and whether the workpieces meet the assembly conditions is judged according to the detection result. In some cases, the assembling may include a locking process, in which case it may be determined whether the workpiece satisfies a locking condition based on the detection result.
In one embodiment, S102 may include: detecting a positioning hole in the first image, and judging whether the positioning hole meets an alignment condition; and if the positioning hole meets the alignment condition, judging that the workpiece to be assembled meets the assembly condition.
Still taking the locking of the circuit board and the back plate as an example, each board card can be provided with a positioning hole. Referring to fig. 4, if the operator operates correctly and the error of the board card is small, the positioning hole of each board card satisfies the alignment condition, for example, as shown in the left side of fig. 4, O in the left side of fig. 41Indicating the location hole of the lower board, O2Indicates the upper plate card positioning hole, O1Is located at O2Within the boundary of (c); if the operator has a misoperation or the error of the board card is large, the positioning hole of each board card does not meet the alignment condition, such as shown in the middle or right side of fig. 4.
For example, the alignment condition may be: the area filled by the lower layer workpiece entity below the positioning hole of the upper layer workpiece is smaller than a preset threshold value.
S103: and processing the workpiece to be assembled by adopting a preset processing mode.
In one embodiment, S103 may include: outputting alarm information aiming at the workpiece to be assembled; and/or, moving the workpiece to be assembled out of the production line.
For example, the alarm information may be a voice message of "the current workpiece does not satisfy the assembly condition" or other similar voice messages, or may also be a ring alarm, a light alarm, and the like, which is not limited specifically.
In one case, workpieces that do not satisfy the assembly condition may be processed by the relevant person; alternatively, a robot or other device may be provided in the production line to automatically remove a workpiece that does not satisfy the assembly condition from the production line so that the workpiece cannot enter the assembly station.
In the above embodiment, the positioning hole in the first image is detected, and whether the positioning hole meets the alignment condition is determined; if the positioning holes meet the alignment condition, the workpieces to be assembled can be conveyed to an assembly workstation for assembly. If the positioning hole does not meet the alignment condition, in one implementation, alarm information for the workpiece to be assembled can be output; and/or, moving the workpiece to be assembled out of the production line.
In another embodiment, if the positioning hole does not satisfy the alignment condition, the boundary of the workpiece to be assembled in the first image may be detected, and whether the boundary satisfies the gap condition is determined; if the boundary meets the gap condition, outputting first alarm information; and if the boundary does not meet the gap condition, outputting second alarm information.
The "clearance condition" in the present embodiment means a clearance condition that is satisfied by the boundary of the workpiece when the workpiece can be successfully assembled. For example, determining whether the boundary satisfies the gap condition may include: and judging whether the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece meets the gap condition or not.
Generally, if there is no large deviation of the workpiece itself due to an operator's operation mistake, in this case, the positioning hole of the workpiece does not satisfy the alignment condition, and the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece does not satisfy the gap condition. For example, if an operator places a certain board in a reverse manner, both the positioning hole and the boundary of the board are abnormal (the assembling condition is not satisfied). Under this kind of condition, can export second alarm information, second alarm information can indicate relevant personnel because misoperation has leaded to the work piece not satisfying the equipment condition, and like this, relevant personnel can in time correct this misoperation, for example will put the integrated circuit board of turning over and replace again, and the work piece after replacing can continue to convey to the equipment workstation and assemble. In one case, the production line can be stopped without stopping the production line while correcting misoperation of related personnel, so that the working efficiency of the production line can be improved.
If the locating hole of the workpiece does not meet the alignment condition, but the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece meets the gap condition, the condition is usually caused by the large deviation of the workpiece. Under this condition, can export first alarm information, first alarm information can indicate that work piece itself has the deviation, and like this, relevant personnel can move out the production line with this work piece, and follow-up can abandon this work piece or do over again.
For example, referring to fig. 5, the three cases in fig. 5 correspond one-to-one to the three cases in fig. 4: the left side is the condition that the workpiece to be assembled meets the assembly conditions, under the condition, the positioning hole of the upper-layer board card is aligned with the positioning hole of the lower-layer board card, and the boundary l of the upper-layer board card3At the inner boundary l of the lower board card1Within. The middle is the condition that the workpiece to be assembled does not meet the assembly conditions, under the condition, the positioning hole of the upper-layer board card is not aligned with the positioning hole of the lower-layer board card, and the boundary l of the upper-layer board card3At the inner boundary l of the lower board card1And (c) out. The right side is the condition that the workpiece to be assembled does not meet the assembly conditions, under the condition, the positioning hole of the upper-layer board card is not aligned with the positioning hole of the lower-layer board card, and the boundary l of the upper-layer board card3At the inner boundary l of the lower board card1And (c) out.
Referring to fig. 5, the determining whether the gap between the boundary of the upper workpiece and the boundary of the lower workpiece satisfies the gap condition may include:
judging whether a gap between the boundary of the upper layer workpiece and the inner boundary of the lower layer workpiece is within a first preset range; and/or judging whether the gap between the boundary of the upper layer workpiece and the outer boundary of the lower layer workpiece is within a second preset range.
In the intermediate case of fig. 5, when the boundary of the workpiece in the first image is detected, the boundary l of the upper layer workpiece can be detected3And the outer boundary l of the lower layer workpiece5The inner boundary l of the lower layer workpiece cannot be detected1. In one case, the gap condition may be: l3And l5The gap therebetween is within a second preset range, or may be: l3And l5Is within a second preset range, and3and l1The gap therebetween is within a preset first range. The intermediate condition of fig. 5 does not satisfy the clearance condition, and second alarm information can be output to prompt relevant personnel that the workpiece does not satisfy the assembly condition due to misoperation, so that the relevant personnel can correct the misoperation in time, for example, the inversely placed board card is replaced, and the replaced workpiece can be continuously conveyed to an assembly workstation for assembly.
In the case of the right side of fig. 5, when the boundary of the workpiece in the first image is detected, the boundary l of the upper layer workpiece can be detected3The inner boundary l of the lower layer workpiece cannot be detected1And an outer boundary l5. In one case, the gap condition may be: l3And l5The gap therebetween is within a second preset range, or may be: l3And l5Is within a second preset range, and3and l1The gap therebetween is within a preset first range. The right side condition of fig. 5 does not satisfy the clearance condition, can output second alarm information, and the suggestion relevant personnel have leaded to the unsatisfied equipment condition of work piece because misoperation, and like this, relevant personnel can in time correct this misoperation, for example will put the integrated circuit board of turning over again, and the work piece after putting again can continue to pass on and pass onAnd sending the blank to an assembly workstation for assembly.
Or, in other embodiments, the boundary of the workpiece to be assembled in the first image may be detected first, and whether the boundary meets the gap condition may be determined; and then detecting the positioning hole in the first image, and judging whether the positioning hole meets the alignment condition. And if the positioning hole and the boundary both meet the conditions, the workpiece meets the assembly conditions. And if the positioning hole and the boundary do not meet the conditions, outputting second alarm information. And if the positioning hole does not meet the alignment condition but the boundary meets the gap condition, outputting first alarm information.
In some related schemes, referring to fig. 2, if any one or more of operation errors, workpiece deviations and the like occur, assembly errors occur in the assembly work station, labor hours are wasted, and the production efficiency of the production line is reduced.
By applying the embodiment of the invention, on the first hand, before the workpieces enter the assembly workstation, the workpieces which do not meet the assembly conditions can be detected in time and processed, and only the workpieces which meet the assembly conditions are assembled, so that the assembly error rate is reduced, and the production line efficiency is improved. In the second aspect, for the condition that the assembly condition of the workpiece is not met due to misoperation, the scheme can remind relevant personnel to correct the misoperation in time, the corrected workpiece can be continuously conveyed to an assembly workstation to be assembled, and the production efficiency of the production line is further improved.
Fig. 6 is a schematic flow chart of a workpiece detecting method according to an embodiment of the present invention, including:
s601: the camera arranged above the production line is used for collecting images of the workpieces to be assembled before entering the assembling workstation, the images serve as first images, and the workpieces to be assembled comprise two or more workpieces which are stacked.
For example, as shown in FIG. 3, assuming a manufacturing line includes two stations, an operator may perform manual operations at
For example, the camera is arranged right above the production line, the acquisition range of the camera can be larger than the overall size of the workpiece, and the acquisition range of the camera can be adjusted by adjusting the height of the camera.
S602: detecting a positioning hole in the first image, judging whether the positioning hole meets the alignment condition, if not, executing S603, and if so, executing S606.
Still taking the locking of the circuit board and the back plate as an example, each board card can be provided with a positioning hole. Referring to fig. 4, if the operator operates correctly and the error of the board card is small, the positioning hole of each board card satisfies the alignment condition, for example, as shown in the left side of fig. 4, O in the left side of fig. 41Indicating the location hole of the lower board, O2Indicates the upper plate card positioning hole, O1Is located at O2Within the boundaries of (a). If the operator has a misoperation or the error of the board card is large, the positioning hole of each board card does not meet the alignment condition, such as shown in the middle or right side of fig. 4.
For example, the alignment condition may be: the area filled by the lower layer workpiece entity below the positioning hole of the upper layer workpiece is smaller than a preset threshold value.
S603: detecting the boundary of the workpiece to be assembled in the first image, and judging whether the boundary meets a gap condition; if the boundary satisfies the gap condition, executing S604; if the boundary does not satisfy the gap condition, S605 is performed.
S604: and outputting first alarm information.
S605: and outputting second alarm information.
The "clearance condition" in the present embodiment means a clearance condition that is satisfied by the boundary of the workpiece when the workpiece can be successfully assembled. For example, determining whether the boundary satisfies the gap condition may include: and judging whether the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece meets the gap condition or not.
Generally, if there is no large deviation of the workpiece itself due to an operator's operation mistake, in this case, the positioning hole of the workpiece does not satisfy the alignment condition, and the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece does not satisfy the gap condition. For example, if an operator places a certain board in a reverse manner, both the positioning hole and the boundary of the board are abnormal (the assembling condition is not satisfied). Under this kind of condition, can export second alarm information, second alarm information can indicate relevant personnel because misoperation has leaded to the work piece not satisfying the equipment condition, and like this, relevant personnel can in time correct this misoperation, for example will put the integrated circuit board of turning over and replace again, and the work piece after replacing can continue to convey to the equipment workstation and assemble. In one case, the production line can be stopped without stopping the production line while correcting misoperation of related personnel, so that the working efficiency of the production line can be improved.
If the locating hole of the workpiece does not meet the alignment condition, but the gap between the boundary of the upper layer workpiece and the boundary of the lower layer workpiece meets the gap condition, the condition is usually caused by the large deviation of the workpiece. Under this condition, can export first alarm information, first alarm information can indicate that work piece itself has the deviation, and like this, relevant personnel can move out the production line with this work piece, and follow-up can abandon this work piece or do over again.
Referring to fig. 5, the determining whether the gap between the boundary of the upper workpiece and the boundary of the lower workpiece satisfies the gap condition may include:
judging whether a gap between the boundary of the upper layer workpiece and the inner boundary of the lower layer workpiece is within a first preset range; and/or judging whether the gap between the boundary of the upper layer workpiece and the outer boundary of the lower layer workpiece is within a second preset range.
In the intermediate case of fig. 5, when the boundary of the workpiece in the first image is detected, the boundary l of the upper layer workpiece can be detected3And the outer boundary l of the lower layer workpiece5The inner boundary l of the lower layer workpiece cannot be detected1. In one case, the gap condition may be: l3And l5The gap therebetween is within a second preset range, or may be: l3And l5Is within a second preset range, and3and l1The gap therebetween is within a preset first range. The intermediate condition of fig. 5 does not satisfy the clearance condition, and second alarm information can be output to prompt relevant personnel that the workpiece does not satisfy the assembly condition due to misoperation, so that the relevant personnel can correct the misoperation in time, for example, the inversely placed board card is replaced, and the replaced workpiece can be continuously conveyed to an assembly workstation for assembly.
In the case of the right side of fig. 5, when the boundary of the workpiece in the first image is detected, the boundary l of the upper layer workpiece can be detected3The inner boundary l of the lower layer workpiece cannot be detected1And an outer boundary l5. In one case, the gap condition may be: l3And l5The gap therebetween is within a second preset range, or may be: l3And l5Is within a second preset range, and3and l1The gap therebetween is within a preset first range. The right side condition of fig. 5 does not satisfy the clearance condition, second alarm information can be output to prompt relevant personnel that the workpiece does not satisfy the assembly condition due to misoperation, so that the relevant personnel can correct the misoperation in time, for example, the inversely placed board card is replaced, and the replaced workpiece can be continuously conveyed to an assembly workstation to enterAnd (6) assembling the rows.
S606: and conveying the workpiece to be assembled to an assembling work station for assembling.
By applying the embodiment of the invention, on the first hand, before the workpieces enter the assembly workstation, the workpieces which do not meet the assembly conditions can be detected in time and processed, and only the workpieces which meet the assembly conditions are assembled, so that the assembly error rate is reduced, and the production line efficiency is improved. In the second aspect, for the condition that the assembly condition of the workpiece is not met due to misoperation, the scheme can remind relevant personnel to correct the misoperation in time, the corrected workpiece can be continuously conveyed to an assembly workstation to be assembled, and the production efficiency of the production line is further improved.
In some related approaches, when the assembly component assembles the workpiece, the assembly path is fixed, typically starting from the origin to each assembly position, and then returning to the origin to prepare for the next lock. The scheme has the advantages of longer assembly path and lower assembly efficiency.
The embodiment of the invention also provides an assembling method, and after the workpiece enters the assembling workstation, the assembling workstation assembles the workpiece. Fig. 7 is a schematic flow chart of a workpiece assembling method according to an embodiment of the present invention, including:
s701: and acquiring an image of the workpiece to be assembled at the assembling work station as a second image.
For example, a camera may be provided in the assembly workstation, and the camera performs image acquisition on the workpiece in the assembly process, and for convenience of description, the image acquired in the assembly process is referred to as a second image. The second image may comprise the entire workpiece to be assembled or may comprise only a partial region of the workpiece to be assembled.
In one embodiment, the camera may be in communication with an assembly component, the camera capturing a region of the workpiece proximate the assembly component. For example, the camera may be disposed on an outer wall of the assembly, and the camera moves with the assembly. In such an embodiment, S701 may include: and acquiring an image of the workpiece to be assembled at an assembling workstation through a camera linked with the assembling part as a second image, wherein the second image comprises a positioning hole below the initial position of the assembling part and an adjacent boundary thereof.
S702: by detecting the second image, the starting position of the assembly part is determined.
In some related schemes, the assembly components, such as the robot, are returned to the original position after the assembly of the workpiece is completed, so that the initial position of each assembly process of the assembly components is the same. In this embodiment, after the assembly of the assembly member to the workpiece is completed, the assembly member does not need to return to the original position, so that the initial position of the nth assembly process of the assembly member is different from the initial position of the (N + 1) th assembly process, where N is a positive integer. In this embodiment, each time the assembly process, the initial position of the assembly parts needs to be determined.
In one embodiment, S702 may include: detecting an initial positioning hole in the second image and an adjacent boundary of the initial positioning hole, wherein the initial positioning hole is a positioning hole corresponding to the initial position of the assembly part; and determining the initial position of the assembly part according to the position relation between the initial positioning hole and the adjacent boundary.
The "start position of the assembled component" in S702 may be expressed as "located above which positioning hole", or as "corresponding to which positioning hole".
For example, assume that the workpiece to be assembled is as shown in fig. 8, and the workpiece includes 4 positioning holes A, B, C, D. If the camera arranged in the assembly workstation acquires images of the whole workpiece to be assembled, and the second image comprises 4 positioning holes, each positioning hole can be identified in the second image, and the positioning hole closest to the assembly part is determined to be used as an initial positioning hole. And if the collected second image only comprises the positioning hole below the initial position of the assembly part through the camera linked with the assembly part, the positioning hole identified in the second image is the initial positioning hole.
Referring to fig. 9, if the initial positioning hole is a (i.e., the initial position of the assembly member is above a), the adjacent boundary of a is the lower boundary L0And a left boundary L1If, ifThe initial positioning hole is D (i.e. the initial position of the assembly part is above D), and the adjacent boundary of D is the lower boundary L0And a right boundary L2(ii) a Therefore, the initial position of the assembly member can be determined based on the positional relationship between the initial positioning hole and the adjacent boundary thereof. If a certain edge boundary of the initial positioning hole is positioned on the left side of the initial positioning hole, the initial position is positioned above the positioning hole A; if a certain edge of the initial positioning hole is located on the right side of the initial positioning hole, the initial position is above the positioning hole D.
The starting positioning hole is similar to the case of B or C, and is not described again here.
S703: and determining an assembling path corresponding to the workpiece to be assembled according to the initial position.
In one embodiment, the assembly path includes a plurality of assembly positions, and the assembly positions correspond to positioning holes of the workpieces to be assembled. Still taking fig. 8 as an example, the workpiece includes 4 positioning holes A, B, C, D, and the assembling process may include: the assembling part moves to each positioning hole of the workpiece to be locked; thus, one positioning hole corresponds to one assembling position, and the assembling path includes 4 assembling positions.
Assuming that the start position is determined to be above the pilot hole a in S702, the assembly path may be represented as a → B → C → D or a → D → C → B. Assuming that the start position is determined to be above the positioning hole D in S702, the assembly path may be represented as D → C → B → a or D → a → B → C.
The assembly path is merely an example and is not limiting. Alternatively, the initial position of the assembly member may be above the positioning hole B or the positioning hole C, and is not particularly limited.
S704: and controlling the assembling components to sequentially move to each assembling position from the starting position along the assembling path for assembling, wherein the end point of the assembling path corresponds to the different assembling positions from the starting position.
Assuming that the initial position of the assembly component is above the positioning hole a and the determined assembly path is a → B → C → D, the assembly component can be sequentially moved to each assembly position and lock the corresponding positioning hole.
As described above, the assembly path includes a plurality of assembly positions corresponding to the positioning holes of the workpieces to be assembled; in one embodiment, in the process of controlling the assembling parts to sequentially move from the initial positions to the assembling positions along the assembling path for assembling, for each assembling position, a third image is acquired by the camera, and the third image comprises a positioning hole corresponding to the assembling position; and detecting the third image to judge whether the positioning hole corresponding to the assembly position is matched with the assembly position, if so, locking the positioning hole corresponding to the assembly position, if not, adjusting the assembly path, and then locking the positioning hole corresponding to the adjusted assembly position.
For example, in one case, a third image may be captured by the camera after controlling the movement of the assembly parts to the assembly position. Alternatively, in another case, the third image of the next assembly position may be acquired by the camera before the assembly member reaches the next assembly position, but when the camera acquisition range can cover the next assembly position.
And judging whether the positioning hole corresponding to the assembling position is matched with the assembling position, namely judging whether the positioning hole corresponding to the assembling position can be normally locked when the assembling part is positioned at the assembling position. The matching condition may be set according to a specific situation, for example, a deviation between the assembly position and the actual position of the positioning hole is smaller than a preset distance threshold, and the like, which is not limited specifically.
Referring to fig. 10, assuming that the assembly path is a → B → C → D, the camera moves along with the movement of the assembly member, and the camera captures an image when moving to the position F, M represents the capture range of the camera at this time, or the content of the third image, B1 in fig. 10 represents the position of the actual positioning hole, B represents the position of the positioning hole in an ideal case, or B corresponds to the assembly position in the original assembly path. As can be seen from the detection of the third image, the deviation between B1 and B is large, and the matching condition is not satisfied, that is, the positioning hole corresponding to the assembly position does not match the assembly position.
In this case, the lock attaching path F → B may be adjusted to F → G → B1, or may be smoothly moved from the position F to above the positioning hole B1, and the specific path between the position F and above the positioning hole B1 is not limited.
For example, an assembly path may be set in advance according to ideal coordinate values of the positioning holes of the workpiece, but due to errors caused by various factors, the assembly path is not matched with the actual positioning holes, and in this case, the assembly path may be adjusted, so that the assembly component can normally lock the positioning holes. In one case, the adjustment of the assembly path may be an overall adjustment, that is, a collective adjustment of the three assembly positions corresponding to B → C → D, and a new assembly path may be obtained based on the three adjusted assembly positions. Alternatively, in another case, only the assembly position corresponding to B may be adjusted, and a new assembly route may be obtained based on the adjusted assembly position.
In one embodiment, in the case that it is determined that the positioning hole corresponding to the assembly position does not match the assembly position, the deviation data between the positioning hole corresponding to the assembly position and the assembly position can be determined; and adjusting the assembly positions in the residual assembly paths according to the deviation data, and generating a new assembly path consisting of the adjusted assembly positions.
Continuing with the example of fig. 10, assuming that B1 is located 0.5 cm on the right side of B and 1 cm below it, the deviation data may be (0.5 cm on the right side and 1 cm below), and the deviation data may also be expressed in the form of XY coordinates, or in the form of angles and distances, and the specific expression is not limited. The remaining assembly path is B → C → D, and the assembly positions corresponding to the positioning holes C and D can be continuously adjusted according to the deviation data, for example, the adjusted assembly positions are obtained by moving down 1 cm and moving right 0.5 cm based on the original position. And then continuously acquiring images through the camera according to the adjusted assembly position, detecting the images, judging whether the positioning hole is matched with the adjusted assembly position, and continuously adjusting the assembly path if the positioning hole is not matched with the adjusted assembly position.
The boundary line of the workpiece is a straight line parallel to the path, and therefore, the boundary line of the workpiece can be referenced during adjustment or during control of movement of the assembly member to improve the adjustment or movement accuracy.
By applying the embodiment, if the assembly position deviates, the assembly position can be adjusted according to the actual situation, so that the influence of the deviation is reduced, and the assembly accuracy is improved.
By applying the embodiment shown in fig. 7 of the invention, on the first hand, after the assembly of the assembly part to the workpiece is finished, the assembly part does not need to return to the original position, thereby simplifying the assembly path and improving the assembly efficiency. In the second aspect, if the assembly position has deviation, the assembly position can be adjusted according to actual conditions, so that the influence of the deviation is reduced, and the assembly accuracy is improved.
Referring to fig. 11, a specific embodiment will be described by taking an auto-screwdriving machine as an example, wherein the auto-screwdriving machine includes a full-automatic robot 100 and an auto-screwdriving unit 200, and the auto-screwdriving unit 200 includes a feeding unit and an attaching unit. The feeding unit can comprise a vibration disc, a distributor, a pipeline and the like, screws are placed in the vibration disc, the vibration disc sequences the screws, the distributor distributes the sequenced screws to the pipeline, and the screws are transmitted to the locking unit through the pipeline. The locking unit locks the screw into the workpiece. The locking path is controlled by the programming of the full-automatic manipulator 100, and the locking of the workpiece is automatically completed according to the set coordinates.
In some related embodiments, the path of the fully automatic robot 100 is fixed, and referring to fig. 12, the position-limiting
In the present embodiment, after the automatic screw locking machine unit 200 completes the assembly of the workpiece, the full-automatic manipulator 100 does not need to return to the original position, and thus the nth locking path of the automatic screw locking machine is different from the (N + 1) th locking path. Still referring to fig. 12, the lock attachment path is: the full-automatic robot 100 reaches A, B, C, D the locking positions corresponding to the four positioning holes, which can be represented as a → B → C → D, respectively, at each locking position, the auto-screwdriving unit 200 locks the screw into the positioning hole, and then the full-automatic robot 100 stays at the locking position corresponding to the positioning hole D without returning to the origin.
Therefore, compared with the related scheme, the scheme omits the distance from the full-automatic manipulator 100 and the automatic screwing machine unit 200 to the original point after the locking is finished, simplifies the locking path and improves the locking efficiency.
Alternatively, the locking path in this scheme may be: d → A → B → C, C → D → A → B, B → C → D → A, etc., not to mention one by one. Taking fig. 12 as an example, the locking path a → B → C → D and C → D → a → B is shorter than B → C → D → a and D → a → B → C, and the locking path a → B → C → D and C → D → a → B is adopted, so that the locking efficiency can be further improved.
In the related art, the movement path (lock path) of the fully automatic robot 100 is set in advance according to the sizes of the stopper die 4 and the
In one embodiment of the present disclosure, in the process of controlling the full-automatic manipulator 100 to sequentially move from the initial position to each locking position along the locking path for locking, for each locking position, a third image is acquired by a camera, where the third image includes a positioning hole below the locking position; and detecting the third image to judge whether the positioning hole corresponding to the locking position is matched with the locking position, if so, locking the positioning hole below the locking position, if not, adjusting the locking path, and then locking the positioning hole below the adjusted locking position. Therefore, when the lock is locked every time, the lock position is adjusted according to the actual situation, the error influence is reduced, and the accuracy of the lock is improved.
Moreover, in this scheme, adjust the lock and attach the route according to actual conditions, can save
It should be noted that the method of the embodiment of the present invention may be executed by a single device, such as a computer or a server. The method of the embodiment can also be applied to a distributed scene and completed by the mutual cooperation of a plurality of devices. In the case of such a distributed scenario, one of the multiple devices may only perform one or more steps of the method according to the embodiment of the present invention, and the multiple devices interact with each other to complete the method.
An embodiment of the present invention further provides an electronic device, as shown in fig. 13, which includes a
For example, the electronic device may be a detection device in a production line, other computers, or the like, and is not limited specifically.
An embodiment of the present invention further provides an electronic device, as shown in fig. 14, including a
For example, the electronic device may be an assembly device in a production line, other computers, or the like, and is not limited in particular.
The processor may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an Application Specific Integrated Circuit (ASIC), or one or more Integrated circuits, and is configured to execute a relevant program to implement the technical solutions provided in the embodiments of the present specification.
The Memory may be implemented in the form of a ROM (Read Only Memory), a RAM (Random access Memory), a static storage device, a dynamic storage device, or the like. The memory may store an operating system and other application programs, and when the technical solution provided by the embodiments of the present specification is implemented by software or firmware, the relevant program codes are stored in the memory and called by the processor to be executed.
It should be noted that although the above-described apparatus shows only a processor and a memory, in a specific implementation, the apparatus may also include other components necessary for proper operation. In addition, those skilled in the art will appreciate that the above-described apparatus may also include only those components necessary to implement the embodiments of the present description, and not necessarily all of the components shown in the figures.
Embodiments of the present invention also provide a non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform any one of the above workpiece detection methods.
Embodiments of the present invention also provide a non-transitory computer-readable storage medium storing computer instructions for causing a computer to perform any one of the above workpiece assembly methods.
Computer-readable media of the present embodiments, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the invention, also features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.
In addition, well known power/ground connections to Integrated Circuit (IC) chips and other workpieces may or may not be shown in the provided figures for simplicity of illustration and discussion, and so as not to obscure the invention. Furthermore, devices may be shown in block diagram form in order to avoid obscuring the invention, and also in view of the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the present invention is to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that the invention can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic ram (dram)) may use the discussed embodiments.
The embodiments of the invention are intended to embrace all such alternatives, modifications and variances that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements and the like that may be made without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.