Embedded circuit board and manufacturing method thereof
阅读说明:本技术 内埋式电路板及其制作方法 (Embedded circuit board and manufacturing method thereof ) 是由 李艳禄 王军花 于 2018-07-27 设计创作,主要内容包括:一种内埋式电路板的制作方法,其包括以下步骤:提供一附加电路板,包括一可挠性的基层及分别形成于基层两相对表面上的第一导电线路层及第二导电线路层;对附加电路板上第一导电线路层的表面压合感光材料以形成感光材料层,选择性移除部分感光材料层形成安装槽;将元件放置于安装槽中,安装在第一导电线路层上并与第一导电线路层导通;将两个铜板分别通过胶粘层压合至第二导电线路层与感光材料层外露的两个表面上,从而形成内埋置芯材,铜板包括挠性绝缘基膜及第三铜层;以及对内埋置芯材进行钻孔、电镀、线路加工,使元件、附加电路板及外层两个第三铜层形成的两个第三导电线路层导通,形成内埋式电路板。本发明还提供一种内埋式电路板。(A manufacturing method of an embedded circuit board comprises the following steps: providing an additional circuit board which comprises a flexible base layer, and a first conductive circuit layer and a second conductive circuit layer which are respectively formed on two opposite surfaces of the base layer; pressing a photosensitive material on the surface of the first conductive circuit layer on the additional circuit board to form a photosensitive material layer, and selectively removing part of the photosensitive material layer to form a mounting groove; placing the element in the mounting groove, mounting the element on the first conductive circuit layer and conducting the element with the first conductive circuit layer; pressing the two copper plates onto the two exposed surfaces of the second conductive circuit layer and the photosensitive material layer respectively through adhesive layers to form an embedded core material, wherein the copper plates comprise a flexible insulating base film and a third copper layer; and drilling, electroplating and processing the embedded core material to conduct two third conductive circuit layers formed by the element, the additional circuit board and the outer two third copper layers to form the embedded circuit board. The invention also provides an embedded circuit board.)
1. A manufacturing method of an embedded circuit board comprises the following steps:
providing an additional circuit board which comprises a flexible base layer, and a first conductive circuit layer and a second conductive circuit layer which are respectively formed on two opposite surfaces of the base layer;
pressing a photosensitive material on the surface of the first conductive circuit layer on the additional circuit board to form a photosensitive material layer, and selectively removing part of the photosensitive material layer to form a mounting groove;
placing a component in the mounting groove, and mounting the component on the first conductive circuit layer and conducting with the first conductive circuit layer;
pressing two copper plates onto the two exposed surfaces of the second conductive circuit layer and the photosensitive material layer respectively through adhesive layers to form an embedded core material, wherein the copper plates comprise a flexible insulating base film and a third copper layer; and
and drilling, electroplating and processing a circuit on the embedded core material to enable the element, the additional circuit board and two third conductive circuit layers formed by the outer two third copper layers to be conducted to form the embedded circuit board.
2. The method for manufacturing an embedded circuit board as claimed in claim 1, wherein the material of the base layer is selected from one of polyimide, liquid crystal polymer, polyethylene terephthalate and polyethylene naphthalate.
3. The method of claim 1, wherein the mounting groove is formed by selectively removing a portion of the photosensitive material layer through exposure, development, UV curing, and baking.
4. The method for manufacturing an embedded circuit board of claim 1, wherein the aperture of the mounting groove is larger than the size of the component, and the depth of the mounting groove is larger than or equal to the thickness of the component.
5. The method for manufacturing an embedded circuit board according to claim 1, wherein after the steps of placing components in the mounting groove, mounting the components on the first conductive trace layer and conducting with the first conductive trace layer, the method further comprises a step of dispensing the mounting groove.
6. A buried circuit board comprising:
the additional circuit board comprises a flexible base layer, a first conductive circuit layer and a second conductive circuit layer, wherein the first conductive circuit layer and the second conductive circuit layer are respectively formed on two opposite surfaces of the base layer and are electrically connected with each other;
the photosensitive material layer is arranged on one surface of the additional circuit board;
an element disposed in the mounting groove in the photosensitive material layer;
two adhesive layers; and
the copper plates comprise flexible insulating base films and third conducting circuit layers, and the flexible insulating base films are combined on the two exposed surfaces of the additional circuit board and the photosensitive material layer through the corresponding adhesive layers.
7. The embedded circuit board of claim 6, wherein the material of the base layer is selected from one of polyimide, liquid crystal polymer, polyethylene terephthalate and polyethylene naphthalate.
8. The embedded circuit board of claim 6, wherein the mounting groove is formed by selectively removing a portion of the photosensitive material layer through exposure development, UV curing, and baking processes.
9. The embedded circuit board of claim 6, wherein the aperture of the mounting groove is larger than the size of the component, and the depth of the mounting groove is larger than or equal to the thickness of the component.
10. The embedded circuit board of claim 6, further comprising glue filling a gap between the mounting slot and the component.
Technical Field
The present disclosure relates to circuit boards, and particularly to an embedded circuit board and a method for fabricating the same.
Background
In recent years, electronic products are widely used in daily work and life, and demands for miniaturization, multi-functionalization, and high performance are increasing. The circuit board is used as a main component of an electronic product, occupies a large space of the electronic product, so that the volume of the circuit board greatly influences the volume of the electronic product, and the electronic component (such as a resistor, a capacitor and the like) is embedded in the circuit substrate, so that the whole thickness of the circuit board is favorably reduced, and the thickness of the electronic product is reduced. At present, the inner embedding mode of the electronic element is to manufacture a multi-layer flexible circuit board blank product, a hole is formed in the multi-layer flexible circuit board in a fixed depth, and the electronic element is arranged in a hole of the multi-layer flexible circuit board in an embedded and embedded mode.
Disclosure of Invention
In view of the above, it is desirable to provide a method for manufacturing an embedded circuit board that can solve the above problems.
Also provides an embedded circuit board manufactured by the manufacturing method.
A manufacturing method of an embedded circuit board comprises the following steps: providing an additional circuit board which comprises a flexible base layer, and a first conductive circuit layer and a second conductive circuit layer which are respectively formed on two opposite surfaces of the base layer; pressing a photosensitive material on the surface of the first conductive circuit layer on the additional circuit board to form a photosensitive material layer, and selectively removing part of the photosensitive material layer to form a mounting groove; placing a component in the mounting groove, and mounting the component on the first conductive circuit layer and conducting with the first conductive circuit layer; pressing two copper plates onto the two exposed surfaces of the second conductive circuit layer and the photosensitive material layer respectively through adhesive layers to form an embedded core material, wherein the copper plates comprise a flexible insulating base film and a third copper layer; and drilling, electroplating and processing the embedded core material to enable the element, the additional circuit board and two third conductive circuit layers formed by the outer two third copper layers to be conducted to form the embedded circuit board.
A buried circuit board comprising: the additional circuit board comprises a flexible base layer, a first conductive circuit layer and a second conductive circuit layer, wherein the first conductive circuit layer and the second conductive circuit layer are respectively formed on two opposite surfaces of the base layer and are electrically connected with each other; the photosensitive material layer is arranged on one surface of the additional circuit board; an element disposed in the mounting groove in the photosensitive material layer; two adhesive layers; and the copper plates comprise flexible insulating base films and third conducting circuit layers, and the flexible insulating base films are combined on the two exposed surfaces of the additional circuit board and the photosensitive material layer through the corresponding adhesive layers.
According to the embedded circuit board, the photosensitive material layer is arranged on the additional circuit board, the mounting groove is formed in the photosensitive material layer, the element is accommodated in the mounting groove, and then the additional circuit board and the photosensitive material layer are laminated together, so that the embedded circuit board is manufactured.
Drawings
FIG. 1 is a schematic cross-sectional view of a substrate according to a preferred embodiment of the invention.
Fig. 2 is a schematic cross-sectional view of the substrate shown in fig. 1 being processed to provide an additional circuit board.
Fig. 3 is a schematic cross-sectional view of the additional circuit board shown in fig. 2, wherein a photosensitive material layer is laminated on a surface of the first conductive trace layer.
Fig. 4 is a schematic sectional view of mounting components in the mounting grooves of the photosensitive material layer shown in fig. 3.
Fig. 5 is a schematic cross-sectional view of dispensing and filling in the mounting groove shown in fig. 4.
FIG. 6 is a schematic cross-sectional view of the additional circuit board and the photosensitive material layer of FIG. 5 with an adhesive layer and a third copper layer laminated thereon to form an embedded core.
Fig. 7 is a schematic cross-sectional view of an embedded circuit board processed on the embedded core shown in fig. 6.
Description of the main elements
Embedded
100
10
11
Surface of
11a、11b
A
13
First
131
15
Second
151
17
20
30
31
40
50
Flexible
51
Third copper layer
52
Third
521
Embedded core material
60
90
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1 to 7, a method for manufacturing an embedded
in step S1, please refer to fig. 1, a
The material of the
Step S2, referring to fig. 2, the
The first
In step S3, referring to fig. 3, a photosensitive material is laminated on the surface of the first
In this embodiment, the
The aperture of the
Step S4, referring to fig. 4, the
In this embodiment, the
Step S5, please refer to fig. 5, glue is dispensed to the
The glue in the
In step S6, please refer to fig. 6, two
In the present embodiment, the material of the
The
The material of the flexible
In step S7, referring to fig. 7, the embedded core 60 is drilled, plated, and wired, so that the
It is understood that after step S7, steps S6 and S7 may be repeated outside the third
Referring to fig. 7, a buried
The
A
The flexible
According to the embedded
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
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