阅读说明：本技术 显示基板及其制备方法、显示装置 (Display substrate, preparation method thereof and display device ) 是由 韩林宏 张毅 秦世开 于 2019-11-07 设计创作，主要内容包括：本发明实施例提供一种显示基板及其制备方法、显示装置,该显示基板的制备方法,包括：形成衬底,所述衬底包括显示区域和弯折区域；在所述衬底之上形成无机层；在所述显示区域的无机层之上形成源漏极层；在所述弯折区域的无机层中形成凹槽；该显示基板的制备方法能够解决凹槽中金属薄膜层的残留问题,避免数据信号线之间短路。(The embodiment of the invention provides a display substrate, a preparation method thereof and a display device, wherein the preparation method of the display substrate comprises the following steps: forming a substrate, wherein the substrate comprises a display area and a bending area; forming an inorganic layer over the substrate; forming a source drain layer on the inorganic layer of the display area; forming a groove in the inorganic layer of the bending region; the preparation method of the display substrate can solve the problem of residue of the metal thin film layer in the groove and avoid short circuit between the data signal lines.)

1. A method for preparing a display substrate is characterized by comprising the following steps:

forming a substrate including a display area, a power supply area, and a bending area connecting the display area and the power supply area;

forming an inorganic layer over the substrate;

forming a first metal thin film layer over the inorganic layer;

removing the first metal film layer on the bending area to expose the inorganic layer on the bending area;

a groove is formed in the inorganic layer over the inflection region.

2. The method for manufacturing a display substrate according to claim 1, further comprising, after forming the groove in the inorganic layer over the bending region:

forming a flat layer in the groove;

forming a second metal thin film layer over the planarization layer;

and forming the second metal film layer into a data signal line for connecting the display area and the power supply area.

3. The method of claim 2, wherein the data signal line is located in a middle portion of the groove.

4. The method of claim 2, wherein the planarization layer is an organic material.

5. The method of manufacturing a display substrate according to claim 1, wherein forming an inorganic layer over the substrate comprises:

and sequentially forming a barrier layer, a buffer layer, an insulating layer and an interlayer dielectric layer on the substrate, wherein the barrier layer, the buffer layer, the insulating layer and the interlayer dielectric layer form the inorganic layer.

6. The method of manufacturing a display substrate according to claim 1, further comprising, after forming the first metal thin film layer over the inorganic layer:

and forming a source drain layer on the first metal thin film layer above the display area.

7. The method of claim 1, wherein forming a groove in the inorganic layer over the bend region comprises:

forming a first groove in the inorganic layer of the bending region through a first composition process;

and forming a second groove in the inorganic layer of the first groove by a second composition process, wherein the opening area of the second groove is smaller than that of the first groove.

8. The method of claim 1, wherein forming a groove in the inorganic layer over the bend region comprises:

and forming the groove in the inorganic layer of the bending region through a primary patterning process.

9. A display substrate produced by the production method for a display substrate according to any one of claims 1 to 8.

10. A display device comprising the display substrate according to claim 9.

Technical Field

The invention relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.

Background

With the increase of the size of the display screen and the improvement of the requirement on the display performance, the existing single-layer source/drain layer sometimes cannot meet the requirement, and two layers of source/drain layers (hereinafter referred to as a double-source/drain layer product) need to be introduced. The source and drain layers not only serve as the source and drain of the array substrate, but also serve as other electric signals such as a data signal line and a power line of the display screen. The substrate bending technology plays a great role in the current display screen, and the data signal line is bent to the back of the display screen, so that the frame of the display screen is greatly reduced. In the existing double-source drain layer product, the first source drain layer is used as a data signal line of the bending region and is used for connecting the display region and the power supply region. In the existing preparation method of the double source drain layer, a groove is generally formed in an inorganic layer of a substrate, then a first metal film is deposited on the groove, and the first metal film is etched to form a data signal line. According to the preparation method, the first metal film needs to be etched in the groove, metal residues are easily generated in the groove, short circuit between signals is caused, and the display effect is influenced.

Disclosure of Invention

The technical problem to be solved by the embodiments of the present invention is to provide a display substrate, a manufacturing method thereof, and a display device.

In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a display substrate, including:

forming a substrate including a display area, a power supply area, and a bending area connecting the display area and the power supply area;

forming an inorganic layer over the substrate;

forming a first metal thin film layer over the inorganic layer;

removing the first metal film layer on the bending area to expose the inorganic layer on the bending area;

a groove is formed in the inorganic layer over the inflection region.

Optionally, after forming the groove in the inorganic layer above the bending region, the method further includes:

forming a flat layer in the groove;

forming a second metal thin film layer over the planarization layer;

and forming the second metal film layer into a data signal line for connecting the display area and the power supply area.

Optionally, the data signal line is located in a middle of the groove.

Optionally, the planarization layer is an organic material.

Optionally, forming an inorganic layer over the substrate comprises:

and sequentially forming a barrier layer, a buffer layer, an insulating layer and an interlayer dielectric layer on the substrate, wherein the barrier layer, the buffer layer, the insulating layer and the interlayer dielectric layer form the inorganic layer.

Optionally, after forming the first metal thin film layer over the inorganic layer, the method further includes:

and forming a source drain layer on the first metal thin film layer above the display area.

Optionally, forming a groove in the inorganic layer over the inflection region comprises:

forming a first groove in the inorganic layer of the bending region through a first composition process;

and forming a second groove in the inorganic layer of the first groove by a second composition process, wherein the opening area of the second groove is smaller than that of the first groove.

Optionally, forming a groove in the inorganic layer over the inflection region comprises:

and forming the groove in the inorganic layer of the bending region through a primary patterning process.

The embodiment of the invention also provides a display substrate, which is prepared by the preparation method of the display substrate

The embodiment of the invention also provides a display device which comprises the display substrate.

The invention provides a display substrate, a preparation method thereof and a display device, wherein in the preparation process of the display substrate, an inorganic layer is firstly deposited on a substrate, a first metal thin film layer for forming a source drain electrode layer is deposited on the inorganic layer, the first metal thin film layer on a bending area is removed through an etching process to expose the inorganic layer, then a groove is formed in the inorganic layer on the bending area, a flat layer is deposited in the groove, a second metal thin film layer is deposited on the flat layer, and the second metal thin film layer on the bending area is formed into a data signal line for connecting a display area and a power supply area through the etching process. Therefore, the first metal film layer is prevented from being etched in the groove of the bending area, and the problem that the etching of the first metal film layer is remained due to the section difference of the groove, so that the data signal line is short-circuited is solved.

Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.

FIG. 1 is a schematic diagram of a conventional display substrate;

FIG. 2 is a schematic structural diagram of a conventional display substrate after forming a barrier layer and a buffer layer during a manufacturing process;

FIG. 3 is a schematic diagram of a conventional display substrate after forming a gate insulating layer and an interlayer dielectric layer during a manufacturing process;

FIG. 4 is a schematic structural diagram of a conventional display substrate after a first groove is formed during a manufacturing process;

FIG. 5 is a schematic structural diagram of a conventional display substrate after a second groove is formed during a manufacturing process;

FIG. 6 is a schematic structural diagram of a conventional display substrate after a first metal thin film layer is formed during a manufacturing process;

FIG. 7 is a schematic structural diagram of a conventional display substrate after a metal thin film layer is removed during a manufacturing process;

FIG. 8 is a schematic view of a display substrate according to a first embodiment of the present invention;

FIG. 9 is a flowchart illustrating a method for fabricating a substrate according to a first embodiment of the present invention;

FIG. 10 is a schematic view showing a barrier layer and a buffer layer formed during a substrate manufacturing process according to a first embodiment of the present invention;

FIG. 11 is a schematic view showing a structure after a gate insulating layer and an interlayer dielectric layer are formed in a substrate manufacturing process according to the first embodiment of the present invention;

FIG. 12 is a schematic view showing a structure of a first metal thin film layer formed in a process of manufacturing a substrate according to the first embodiment of the present invention;

FIG. 13 is a schematic view of a first embodiment of a substrate after a first groove is formed during a process of manufacturing the substrate;

FIG. 14 is a schematic structural view showing a substrate after a second groove is formed during a manufacturing process of the substrate according to the first embodiment of the present invention;

FIG. 15 is a schematic view showing a structure after a planarization layer is formed in the process of manufacturing a substrate according to the first embodiment of the present invention;

FIG. 16 is a schematic structural diagram illustrating a second metal thin film layer formed during a substrate manufacturing process according to a first embodiment of the present invention;

fig. 17 is a schematic structural view showing a substrate after data signal lines are formed in a manufacturing process according to the first embodiment of the present invention.

Detailed Description

The following detailed description of embodiments of the invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.

Fig. 1 is a schematic structural diagram of a conventional display substrate. As shown in fig. 1, the display substrate includes a display area 10, a bending area 11, and a power supply area 12, wherein a data signal line 13 is disposed on the bending area 11, and the data signal line 13 connects the display area 10 and the power supply area 12 for transmitting signals. The conventional display substrate bends the bending region 11 to locate the data signal line 13 at the back of the display region 10, thereby reducing the frame of the display region 10. In order to prevent the data signal line 13 from being broken due to bending, the bending region 11 is provided with a groove, and the groove is filled with a flat layer, so that the data signal line 13 is positioned on the flat layer, thereby improving the bending resistance of the data signal line 13.

Fig. 2 to 7 are schematic views illustrating a conventional process for manufacturing a display substrate, the conventional process including:

(1) and forming a barrier layer and a buffer layer. Forming the barrier layer and the buffer layer includes: firstly, coating a layer of flexible material on a glass carrier plate, and curing to form a film to form a substrate 14; subsequently depositing a barrier film on the substrate 14 to form a barrier layer 15 covering the entire substrate 14; a buffer film is then deposited on the barrier layer 15 to form a buffer layer 16 covering the entire barrier layer 15, as shown in fig. 2. The substrate 14 includes a display region, a bending region, and a power supply region.

(2) And forming a gate insulating layer and an interlayer dielectric layer. Forming the gate insulating layer and the interlayer dielectric layer includes: on the substrate 14 on which the foregoing pattern is formed, a first insulating film and an interlayer dielectric layer are deposited in this order, forming a gate insulating layer 17 covering the entire buffer layer 16 and an interlayer dielectric layer 18 covering the entire gate insulating layer 17, as shown in fig. 3.

(3) A first recess is formed. Forming the first groove includes: on the substrate 14 where the aforementioned pattern is formed, a first groove 19 is formed in the gate insulating layer 17 and the interlayer dielectric layer 18 by a plasma gas etching process, as shown in fig. 4.

(4) A second recess is formed. Forming the second groove includes: on the substrate 14 on which the aforementioned pattern is formed, in the first recess 19, a second recess 20 is formed in the barrier layer 15 and the buffer layer 16 by an etching process, as shown in fig. 5.

(5) And forming a first metal film layer. Forming the first metal thin film layer includes: on the substrate 14 on which the aforementioned pattern is formed, a first metal thin film layer 21 covering the entire substrate 14 is formed on the first groove 19 and the second groove 20, as shown in fig. 6.

(6) And forming a source drain layer. Forming the source drain layer includes: forming a source drain layer on the first metal film layer 21 above the display area by an etching process on the substrate 14 on which the pattern is formed; the first metal thin film layer 21 on the bending region 11 is formed as a data signal line for connecting the display region and the power supply region. However, since the step difference between the first groove 19 and the second groove 20 is large, the heights of the first metal thin film layer 21 in the first groove 19 and the second groove 20 are different, and the etching residue of the first metal thin film layer 21 on the first groove 19 and the second groove 20 is serious. After the first metal thin film layer 21 is formed into the data signal lines, short circuits between adjacent data signal lines are easily caused due to the first metal thin film layer remaining in the grooves, as shown in fig. 7.

As can be seen from the above, the first metal thin film layer 21 in the groove in the conventional display substrate is etched and remains seriously, and the remaining metal thin film layer 21 can be used as the data signal line 13 connecting the display region 10 and the power supply region 12, that is, the remaining metal thin film layer 21 serves as the data signal line 13, so that the adjacent data signal lines 13 are short-circuited, and the display effect is affected, as shown in fig. 1.

In order to solve the problems of short circuit between data signal lines and the like caused by the residue of a metal film layer of the existing display substrate, the embodiment of the invention provides a preparation method of the display substrate, wherein a substrate is formed, and the substrate comprises a display area, a power supply area and a bending area for connecting the display area and the power supply area; forming an inorganic layer over the substrate; forming a first metal thin film layer over the inorganic layer; removing the first metal film layer on the bending area to expose the inorganic layer on the bending area; a groove is formed in the inorganic layer over the inflection region.

The preparation method of the display substrate comprises the steps of firstly depositing a first metal thin film layer for forming a source drain layer on a substrate, then forming the source drain layer, a power line and the like on the first metal thin film layer above a display area through an etching process, removing the first metal thin film layer above a bending area, and then forming a groove in an inorganic layer above the bending area, so that the first metal thin film layer is prevented from being removed in the groove of the bending area through etching, and the problem of short circuit of a data signal line caused by etching residues of the first metal thin film layer due to the difference of the sections of the groove is solved.

The technical solution of the embodiment of the present invention is explained in detail by the specific embodiment below.

First embodiment

FIG. 8 is a schematic structural diagram of a display substrate according to a first embodiment of the invention. As shown in fig. 8, the display substrate according to the embodiment of the invention includes a display region 10, a bending region 11, and a power supply region 12, wherein the bending region 11 is located between the display region 10 and the power supply region 12. A data signal line 13 is disposed above the bending region 11, and the data signal line 13 connects the display region 10 and the power supply region 12 for signal transmission. The display substrate of the embodiment of the invention bends the bending region 11, so that the data signal line 13 is positioned at the back of the display region 10, thereby reducing the frame of the display region 10. In order to prevent the data signal line 13 from being broken due to bending, the bending region 11 is provided with a groove, and the groove is filled with a flat layer, so that the data signal line 13 is positioned on the flat layer, thereby improving the bending resistance of the data signal line 13.

FIG. 9 is a flowchart illustrating a method for fabricating a substrate according to a first embodiment of the present invention. As shown in fig. 9, the method for manufacturing a display substrate according to an embodiment of the present invention includes:

forming a substrate including a display area, a power supply area, and a bending area connecting the display area and the power supply area;

forming an inorganic layer over the substrate;

forming a first metal thin film layer over the inorganic layer;

removing the first metal film layer on the bending area to expose the inorganic layer on the bending area;

a groove is formed in the inorganic layer over the inflection region.

The technical solution of this embodiment is further described below by the manufacturing process of the array substrate of this embodiment. The "patterning process" in this embodiment includes processes of depositing a film, coating a photoresist, exposing a mask, developing, etching, and stripping the photoresist, and is a well-established manufacturing process in the related art. The deposition may be performed by a known process such as sputtering, evaporation, chemical vapor deposition, etc., the coating may be performed by a known coating process, and the etching may be performed by a known method, which is not particularly limited herein. In the description of the present embodiment, it is to be understood that "thin film" refers to a layer of a material deposited or otherwise formed on a substrate. The "thin film" may also be referred to as a "layer" if it does not require a patterning process throughout the fabrication process. If a patterning process is required for the "thin film" during the entire fabrication process, the "thin film" is referred to as a "thin film" before the patterning process and the "layer" after the patterning process. The "layer" after the patterning process includes at least one "pattern".

Fig. 10-16 are schematic views showing a substrate preparation process according to an embodiment of the present invention. The preparation process of the display substrate comprises the following steps:

(1) and forming a barrier layer and a buffer layer. Forming the barrier layer and the buffer layer includes: firstly, coating a layer of flexible material on a glass carrier plate, and curing to form a film to form a substrate 14; subsequently depositing a barrier film on the substrate 14 to form a barrier layer 15 covering the entire substrate 14; a buffer film is then deposited on the barrier layer 15 to form a buffer layer 16 covering the entire barrier layer 15, as shown in fig. 10. The substrate 14 includes a display region, a bending region, and a power supply region.

(2) And forming a gate insulating layer and an interlayer dielectric layer. Forming the gate insulating layer and the interlayer dielectric layer includes: on the substrate 14 on which the foregoing pattern is formed, a first insulating film and an interlayer dielectric film are deposited in this order, forming a gate insulating layer 17 covering the entire buffer layer 16 and an interlayer dielectric layer 18 covering the entire gate insulating layer 17, as shown in fig. 11. Wherein the barrier layer 15, the buffer layer 16, the gate insulating layer 17, and the interlayer dielectric layer 18 are combined to form an inorganic layer.

(3) And forming a first metal film layer. Forming the first metal thin film layer includes: on the substrate 14 on which the foregoing pattern is formed, a first metal thin film layer 21 covering the entire substrate 14 is formed on the interlayer dielectric layer 18, as shown in fig. 12.

(4) And forming a source drain layer. Forming the source drain layer includes: on the substrate 14 with the patterns, the first metal film layer is patterned through a patterning process, and the first metal film layer on the display area forms a source drain layer, a first power line and a first signal line; the first metal film layer over the bend region of the substrate 14 is removed to expose the inorganic layer over the bend region, as shown in fig. 11.

(5) A first recess is formed. Forming the first groove includes: on the substrate 14 where the aforementioned pattern is formed, the gate insulating layer 17 and the interlayer dielectric layer 18 over the bent region of the substrate 14 are patterned by a patterning process, and a first groove 19 is formed in the gate insulating layer 17 and the interlayer dielectric layer 18, as shown in fig. 13. Wherein, the patterning process refers to a plasma gas etching process.

(6) A second recess is formed. Forming the second groove includes: on the substrate 14 on which the foregoing pattern is formed, the barrier layer 15 and the buffer layer 16 in the first groove 19 are patterned by a patterning process, and a second groove 20 is formed in the barrier layer 15 and the buffer layer 16, as shown in fig. 14. The opening area of the second groove 20 is smaller than the opening area of the first groove 19, so that the first groove 19 and the second groove 20 form a stepped groove. Wherein, the patterning process refers to a plasma gas etching process.

(7) A planarization layer is formed. Forming the planarization layer includes: on the substrate 14 with the pattern, an organic thin film layer covering the entire substrate 14 is formed on the first groove 19 and the second groove 20, the organic thin film layer of the display region is formed into a first flat layer and a jumper hole, a second flat layer 22 is formed in the first groove 19 and the second groove 20 of the bending region, and the first groove 19 and the second groove 20 are filled with the second flat layer 22, as shown in fig. 15.

(8) And forming a second metal film layer. Forming the second metal thin film layer includes: on the substrate 14 on which the aforementioned pattern is formed, a second metal thin-film layer 23 covering the entire substrate 14 is formed over the second planarization layer 22, as shown in fig. 16.

(9) Data signal lines are formed. Patterning the second metal film layer on the substrate 14 with the patterns by a patterning process to form a second power line and a second signal line on the second metal film layer above the display region; the second metal thin film layer of the bending region is formed as the data signal line 13 for connecting the display region and the power supply region, as shown in fig. 17.

It can be seen from the above preparation process of this embodiment that, in the preparation process of the display substrate, an inorganic layer is deposited on the substrate, a first metal thin film layer is deposited on the inorganic layer, the first metal thin film layer on the display area is formed into a source drain layer, a power line and the like by an etching process, the first metal thin film layer on the bending area is completely removed, and the inorganic layer on the bending area is exposed; then forming a groove in the inorganic layer above the bending area, forming a flat layer in the groove, forming a second metal thin film layer on the flat layer, forming a data signal line on the second metal thin film layer in the bending area through an etching process, thereby avoiding etching the first metal thin film layer in the groove of the bending area, and solving the problem of short circuit of the data signal line caused by etching residue of the first metal thin film layer due to the segment difference of the groove

In some embodiments, the present invention may also form a groove in the inorganic layer through a one-time patterning process; or a step groove having a plurality of steps is formed in the inorganic layer through a patterning process of not less than 3 times, which is not described herein again.

In addition, the preparation process of the embodiment can be realized by utilizing the existing mature preparation equipment, the improvement on the existing process is small, and the preparation process can be well compatible with the existing preparation process, so that the preparation process has the advantages of low manufacturing cost, easiness in process realization, high production efficiency, high yield and the like, and has a good application prospect.

Second embodiment

The manufacturing method of the display substrate of this embodiment is basically the same as that of the first embodiment, and is different from the first embodiment in that after the first metal thin film layer is formed, a passivation layer covering the entire first metal thin film layer is formed on the first metal thin film layer, and after the passivation layer and the first metal thin film layer are respectively patterned by an etching process, a first groove and a second groove are formed by etching.

The embodiment has the technical effect of the first embodiment, that is, the problem of short circuit of the data signal line caused by etching residue of the metal film layer due to the step difference of the groove is solved.

Third embodiment

Based on the technical idea of the foregoing embodiment, the present invention also provides a display substrate prepared by the method for preparing the display substrate of the foregoing first embodiment.

Fourth embodiment

Based on the technical idea of the foregoing embodiment, the invention further provides a display device including the foregoing display substrate. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.