阅读说明：本技术 接地扣、设有该接地扣的电路板组件及其制造方法 (Grounding buckle, circuit board assembly provided with grounding buckle and manufacturing method of circuit board assembly ) 是由 特伦斯·F·李托 帕特里克·R·卡西亚 于 2019-07-23 设计创作，主要内容包括：一种电路板组件,其包括在竖直方向上设有上表面和下表面的电路板、分别设置于所述上表面和下表面的一排导电对接片、前排导电连接片、后排导电连接片、前排接地扣、后排接地扣及与所述电路板连接的线缆差分对,每排所述导电对接片、导电连接片及导电连接片均沿垂直于竖直方向的横向方向延伸,且沿垂直于竖直方向和横向方向的前后方向上相互间隔,所述前排接地扣和后排接地扣沿所述横向方向以交错的方式排列,所述前排接地扣在横向方向上彼此分离,所述后排接地扣在横向方向上彼此分离,每个所述接地扣和电路板之间设有一空间以收容线缆差分对。(A circuit board assembly comprises a circuit board, a row of conductive butt-joint sheets, a front row of conductive connecting sheets, a rear row of conductive connecting sheets, a front row of grounding buckles, a rear row of grounding buckles and cable differential pairs, wherein the upper surface and the lower surface of the circuit board are arranged in the vertical direction, the row of conductive butt-joint sheets, the front row of conductive connecting sheets, the rear row of conductive connecting sheets, the front row of grounding buckles, the rear row of grounding buckles and the cable differential pairs are respectively arranged on the upper surface and the lower surface of the circuit board, each row of conductive butt-joint sheets, the conductive connecting sheets and the conductive connecting sheets extend in the transverse direction perpendicular to the vertical direction and are mutually spaced in the front-back direction perpendicular to the vertical direction and the transverse direction, the front row of grounding buckles and the rear row of grounding buckles are arranged in a staggered mode in the transverse direction, the front row of grounding buckles are mutually separated.)

1. The utility model provides a circuit board assembly, its include be equipped with the circuit board of upper surface and lower surface in vertical direction, set up respectively in a row of electrically conductive butt joint piece, the electrically conductive connection piece of front bank, the electrically conductive connection piece of back row, front bank ground connection are detained, back row ground connection are detained and with the cable differential pair that the circuit board is connected, every row electrically conductive butt joint piece, electrically conductive connection piece and electrically conductive connection piece all extend along the horizontal direction of the vertical direction of perpendicular to, and separate each other in the fore-and-aft direction of the vertical direction of perpendicular to and horizontal direction, the edge is detained with back row ground connection to the front bank ground connection the horizontal direction is arranged with crisscross mode, its characterized in that: the front row of grounding buckles are separated from each other in the transverse direction, the rear row of grounding buckles are separated from each other in the transverse direction, and a space is arranged between each grounding buckle and the circuit board to accommodate a cable differential pair.

2. The circuit board assembly of claim 1, wherein: the front row of ground buckles are initially interconnected by a front bracket, the front bracket is connected with the front edge of the front row of ground buckles by a front connecting portion, the rear row of ground buckles are initially interconnected by a rear bracket, and the rear bracket is connected with the rear edge of the rear row of ground buckles by a rear connecting portion.

3. The circuit board assembly of claim 2, wherein: the cable differential pair comprises grounding wires, and each front row of grounding buckles and each rear row of grounding buckles are provided with notches opposite to the corresponding connecting parts in the front-rear direction so as to accommodate the grounding wires.

4. The circuit board assembly of claim 3, wherein: the notches of the front row of ground buckles are backward in direction, and the notches of the rear row of ground buckles are forward in direction.

5. The circuit board assembly of claim 1, wherein: the front row ground buckles on the upper surface are aligned in a mirror image manner in the vertical direction with the front row ground buckles on the lower surface, except that the mounting feet of the front row ground buckles on the upper surface are offset from the mounting feet of the front row ground buckles on the lower surface in the front-rear direction to prevent mutual interference.

6. A method of manufacturing a circuit board assembly, comprising the steps of:

providing a circuit board with an upper surface and a lower surface in the vertical direction, wherein the upper surface and the lower surface are respectively provided with a front end area, a rear end area and a middle area in the front-rear direction perpendicular to the vertical direction;

providing a front row of grounding buckles and a rear row of grounding buckles, wherein the front row of grounding buckles are connected with the front support through a front connecting part at the front edge of the front row of grounding buckles, and the rear row of grounding buckles are connected with the rear support through a rear connecting part at the rear edge of the rear row of grounding buckles;

mounting the front row of grounding buckles and the rear row of grounding buckles on the upper surface;

providing another front row of grounding buckles and another rear row of grounding buckles, wherein the another front row of grounding buckles are connected with the another front bracket through another front connecting part at the front edge of the another front row of grounding buckles, and the another rear row of grounding buckles are connected with the another rear bracket through another rear connecting part at the rear edge of the another rear row of grounding buckles;

installing the other front row of grounding buckles and the other rear row of grounding buckles on the lower surface; the method is characterized in that:

each grounding buckle is used for extending the cable differential pair in the front-back direction.

7. The method of manufacturing a circuit board assembly of claim 6, wherein: the front row of grounding buckles is vertically aligned with another front row of grounding buckles.

8. The method of manufacturing a circuit board assembly of claim 6, wherein: the front row grounding buckle, the other front row grounding buckle, the rear row grounding buckle and the other rear row grounding buckle extend along the transverse direction of the vertical direction and the front-rear direction, and the distance between the front row grounding buckle, the other front row grounding buckle, the rear row grounding buckle and the other rear row grounding buckle in the transverse direction is 3.38 mm.

9. The method of manufacturing a circuit board assembly of claim 6, wherein: the front row grounding buckle, the other front row grounding buckle, the rear row grounding buckle and the other rear row grounding buckle comprise U-shaped main body parts provided with bases and two side walls, and the side walls comprise a pair of mounting feet which are respectively arranged on the side walls in a mode of offsetting in the front-back direction.

10. The utility model provides a ground connection is detained, its is used for the circuit board, ground connection is detained and is included the U type main part that is equipped with base and a pair of lateral wall in the transverse direction, and a pair of installation foot and a pair of setting set up the recess on this pair of lateral wall respectively, the installation foot extends respectively and squints on the fore-and-aft direction that is perpendicular to the transverse direction, its characterized in that: the grooves are offset in the fore-aft direction, respectively, such that each of the sidewalls has a corresponding mounting leg and a groove.

[ technical field ] A method for producing a semiconductor device

The present invention relates to an electrical connector assembly, and more particularly to an electrical connector assembly provided with a plurality of cables, wherein the cables are arranged on a circuit board provided with corresponding ground buckles.

[ background of the invention ]

Currently QSFP-DD 1X 1 modules with eight electrical channels are disclosed in QSFP-DD specification revision 0.1. Each of the eight electrical channels of the QSFP runs at 25Gbit/s or 50Gbit/s, so that the QSFP-DD module can support 200Gbit/s or 400Gbit/s Ethernet application. Generally, the QSFP-DD module is provided with an internal circuit board including a mating portion at a front end region, a connecting portion at a rear end region, and a plurality of cable sets mechanically and electrically connected to the connecting portion. The connecting portion has a ground member integrally extending in a transverse direction to fix the corresponding cable group to the circuit board. The grounding pieces integrally extend along the transverse direction in a Z-shaped mode to form a plurality of hidden channels and exposed channels. The hidden channel is used for holding a corresponding cable group, such as a rear flat cable, and the rear flat cable is clamped between the circuit board and the grounding piece. The exposed channels are used to hold respective groups of cables, such as front row cables, which extend through the exposed channels from front to back. Wherein the hidden channels and the exposed channels alternate with each other in a lateral direction. Since the ground of the zigzag structure extends entirely in the transverse direction, a space occupying the transmission area between the adjacent hidden and exposed channels must be formed, and the required minimum size/diameter of the cable group is predetermined. Therefore, it is relatively difficult to shorten the size of the ground member in the lateral direction and minimize the width of the circuit board.

In conventional designs, the spacing between two adjacent exposed channels is about 3.75mm, as shown in fig. 10. Since QSFP-DD modules are mostly arranged side by side with each other in the lateral direction, it is necessary to have a small width on the QSFP-DD modules in order to easily handle the close side by side arrangement of the QSFP-DD modules. Therefore, the spacing between each adjacent two hidden channels also needs to be correspondingly reduced to less than 3.75 mm.

[ summary of the invention ]

It is a primary object of the present invention to provide an electrical connector assembly having a plurality of ground snaps in place of integral ground members to achieve a spacing between two adjacent hidden channels of less than 3.75mm, thereby reducing and minimizing the width of the circuit board to facilitate the arrangement and manufacture of QSFP-DD modules.

In order to solve the technical problems, the invention adopts the following technical scheme: a circuit board assembly comprises a circuit board, a row of conductive butt-joint sheets, a front row of conductive connecting sheets, a rear row of conductive connecting sheets, a front row of grounding buckles, a rear row of grounding buckles and cable differential pairs, wherein the upper surface and the lower surface of the circuit board are arranged in the vertical direction, the row of conductive butt-joint sheets, the front row of conductive connecting sheets, the rear row of conductive connecting sheets, the front row of grounding buckles, the rear row of grounding buckles and the cable differential pairs are respectively arranged on the upper surface and the lower surface of the circuit board, each row of conductive butt-joint sheets, the conductive connecting sheets and the conductive connecting sheets extend in the transverse direction perpendicular to the vertical direction and are mutually spaced in the front-back direction perpendicular to the vertical direction and the transverse direction, the front row of grounding buckles and the rear row of grounding buckles are arranged in a staggered mode in the transverse direction, the front row of grounding buckles are mutually separated.

Compared with the prior art, the invention has the following beneficial effects: through the design, the space between two adjacent ground buckles is smaller than 3.75mm, so that the width of a circuit board is reduced and minimized, and the QSFP-DD module is convenient to arrange and manufacture.

It is a primary object of the present invention to provide a method of manufacturing an electrical connector assembly having a plurality of ground snaps in place of integral ground tabs to achieve a spacing between two adjacent hidden channels of less than 3.75mm, thereby reducing and minimizing the width of the circuit board to facilitate the arrangement and manufacture of QSFP-DD modules.

In order to solve the technical problems, the invention adopts the following technical scheme: a method of manufacturing a circuit board assembly, comprising the steps of: providing a circuit board with an upper surface and a lower surface in the vertical direction, wherein the upper surface and the lower surface are respectively provided with a front end area, a rear end area and a middle area in the front-rear direction perpendicular to the vertical direction; providing a front row of grounding buckles and a rear row of grounding buckles, wherein the front row of grounding buckles are connected with the front support through a front connecting part at the front edge of the front row of grounding buckles, and the rear row of grounding buckles are connected with the rear support through a rear connecting part at the rear edge of the rear row of grounding buckles; mounting the front row of grounding buckles and the rear row of grounding buckles on the upper surface; providing another front row of grounding buckles and another rear row of grounding buckles, wherein the another front row of grounding buckles are connected with the another front bracket through another front connecting part at the front edge of the another front row of grounding buckles, and the another rear row of grounding buckles are connected with the another rear bracket through another rear connecting part at the rear edge of the another rear row of grounding buckles; installing the other front row of grounding buckles and the other rear row of grounding buckles on the lower surface; each grounding buckle is used for extending the cable differential pair in the front-back direction.

Compared with the prior art, the invention has the following beneficial effects: through the design, the space between two adjacent ground buckles is smaller than 3.75mm, so that the width of a circuit board is reduced and minimized, and the QSFP-DD module is convenient to arrange and manufacture.

It is a primary object of the present invention to provide a ground clip that replaces an integral ground so as to achieve a spacing between two adjacent hidden vias of less than 3.75mm, thereby reducing and minimizing the width of the circuit board to facilitate the routing and manufacture of QSFP-DD modules.

In order to solve the technical problems, the invention adopts the following technical scheme: a grounding buckle is used for a circuit board and comprises a U-shaped main body part, a pair of mounting feet and a pair of grooves, wherein the U-shaped main body part is provided with a base and a pair of side walls in the transverse direction, the pair of mounting feet are respectively arranged on the pair of side walls, the pair of mounting feet respectively extend and are offset in the front-back direction perpendicular to the transverse direction, and the grooves are respectively offset in the front-back direction, so that each side wall is provided with a corresponding mounting foot and a groove.

Compared with the prior art, the invention has the following beneficial effects: through the design, the space between two adjacent ground buckles is smaller than 3.75mm, so that the width of a circuit board is reduced and minimized, and the QSFP-DD module is convenient to arrange and manufacture.

[ description of the drawings ]

Fig. 1 is a perspective view of a ground clip provided with a corresponding bracket and a corresponding circuit board according to a first embodiment of the present invention, in a rear-down direction.

Fig. 2 is a front-down perspective view of the grounding clip shown in fig. 1 with the corresponding bracket and the corresponding circuit board.

Fig. 3 is a perspective view of the ground clip of fig. 2 with the corresponding bracket and the corresponding circuit board in the rear-up direction.

Fig. 4 is a top view of the grounding clip of fig. 3 with the corresponding bracket and corresponding circuit board.

Fig. 5 is an exploded view of the grounding clip of fig. 1 with the corresponding bracket and corresponding circuit board in a rear-down orientation.

Fig. 6 is an exploded view of the grounding clip of fig. 2 with the corresponding bracket and corresponding circuit board in a front-down orientation.

Fig. 7 is an exploded view of the grounding clip of fig. 3 with the corresponding bracket and corresponding circuit board in a rear-up orientation.

Fig. 8 is a cross-sectional view of the ground clip of fig. 1 with a corresponding bracket and corresponding circuit board.

Fig. 9 is an enlarged view of the ground clip shown in fig. 5.

Fig. 10 is a perspective view of a circuit board provided with conventional ground members having a pitch of 3.75 mm.

Fig. 11 is a partial perspective view of a circuit board assembly having corresponding ground clips and differential pairs of wires in accordance with a second embodiment of the present invention, which is very similar to the first embodiment of fig. 1-9 except for the location of the notches of the back row of ground clips.

Fig. 12 is a perspective view of the circuit board assembly shown in fig. 11.

Fig. 13 is a bottom view of the circuit board assembly shown in fig. 12.

Fig. 14 is a bottom view showing the ground clip with a corresponding bracket prior to forming the ground clip.

Fig. 15 is a schematic diagram showing the grounding clip with a corresponding bracket after the grounding clip is formed.

Fig. 16 is a schematic diagram showing how the brackets are removed from the respective ground buckles by the respective V-shaped cut-out structures.

[ detailed description ] embodiments

As shown in fig. 1-9, a circuit board 100 according to a first embodiment of the present invention includes an inner circuit board assembly 10 having an upper surface 102 and a lower surface 104 opposite to the upper surface 102, and a plurality of metal ground studs 200,250 disposed on the circuit board 100. The circuit board 100 also includes a front notch 105 and a rear notch 107 at respective edges. A row of conductive mating tabs 120 formed in a transverse direction in a front area 103 of the circuit board 100, a front row of conductive connection tabs 130 formed in a transverse direction in a middle area 108 of the circuit board 100, and a rear row of conductive connection tabs 132 formed in a transverse direction in a rear area 106 of the circuit board 100 are provided on both the upper surface 102 and the lower surface 104 of the circuit board 100. The front row of ground clips 200 are assembled to the middle region 108 of the circuit board 100 and are respectively arranged in the front-to-rear direction behind the front row of conductive mating tabs 130. A space 210 is formed between each ground clip 200 and the circuit board 100 to accommodate a differential pair of cables. Each grounding clip 200 includes an inverted U-shaped body portion including a base 212 and two sidewalls 214 on opposite sides. Each of the side walls 214 is provided with a mounting leg 216 extending through a corresponding through hole 110 in the circuit board 100, and the mounting legs 216 of the two side walls 214 are arranged diagonally to each other. The side walls 214 are provided with recesses 218 opposite the corresponding mounting feet 216. The groove 218 is formed before the grounding clip 200 is formed into the U-shaped body 211. The grooves 218 on the corresponding side walls 214 of the front row of ground studs 200 on the upper surface 102 are vertically aligned with the grooves 218 on the corresponding side walls 214 of the front row of ground studs 200 on the lower surface 104. One end of the ground buckle 200 is provided with a notch 230 for receiving the ground wire. The rear row ground buckles 250 are assembled to the circuit board 100 and arranged behind the rear row conductive docking tabs 132 in the front-rear direction, respectively, similarly to the front row ground buckles 200. Each of the rear row ground buckles 250 is identical to the front row ground buckle 200. The front row of ground clips 200 are initially integrally formed on the front bracket 300 by connecting portions 301, the connecting portions 301 being at respective front edges opposite the respective notches 230. The back row of grounding snaps 250 are initially integrally formed on the back bracket 302 by connecting portions 303, the connecting portions 303 being at respective back edges opposite the respective notches 230. After assembly, both front and rear brackets 300,302 are removed through their respective V-shaped cutout structures.

An important feature of the present invention is that since the ground clips 200,250 are mounted on the upper surface 102 and the lower surface 104 of the circuit board 100, the ground clips 200,250 on the upper surface 102 and the ground clips 200,250 on the lower surface 104 need to interfere with each other while being offset from each other. The front row ground studs 200 on the upper surface 102 are aligned in a mirror image arrangement with the front row ground studs 200 on the lower surface 104 in the vertical direction, except that the mounting feet 216 of the front row ground studs 200 on the upper surface 102 are offset in the front-to-back direction from the mounting feet 216 of the front row ground studs 200 on the lower surface 104 to prevent interference. In this embodiment, if the mounting feet 216 are longer than the thickness of the circuit board 100, the recesses 218 of the ground studs 200,250 on the upper surface 102 can receive the mounting feet 216 of the ground studs 200 on the lower surface 104, and vice versa. This is why the mounting feet 216 and the corresponding recesses 218 of the two side walls 214 need to be offset in a diagonal direction. It is noted that in this embodiment, the ground studs 200,250 on the upper surface 102 are vertically aligned with the ground studs 200,250 on the lower surface 104, respectively. The ground clips 200,250 on the upper surface 102 and the ground clips 200,250 on the lower surface 104, respectively, may be offset from each other in the front-to-rear direction, if applicable.

Another important feature of the present invention is that the front bracket 300 is coupled to the front edge of the corresponding ground clip 200 while the rear bracket 302 is coupled to the rear edge of the corresponding ground clip 250. With the above arrangement, the respective ground clips 200,250 are assembled on the same upper surface 102 or lower surface 194 without interference between the front bracket 300 and the rear bracket 302. Due to this opposite arrangement, the notches 230 of the ground clip 200 may be opposite to the corresponding connection portions 301, the connection portions 301 being located at the rear edge of the ground clip 200, while the notches 230 of the ground clip 250 may be opposite to the corresponding connection portions 303, the connection portions 303 being located at the front edge of the ground clip 250. It will be appreciated that the differential pair of cables is confined beneath the respective ground clip 200,250, which includes an inner signal conductor in mechanical and electrical connection with the tabs 130,132 and a ground wire held within the respective notch 230.

Notably, in relation to the brackets 300,302, the grooves 218 of the grounding buckles 200,250 correspond in a lateral direction to the mounting feet 216 of the adjacent grounding buckles 200,250 to allow the grounding buckles 200,250 to be closely positioned with a 3.38mm spacing of the grounding buckles 200,250 on the respective brackets 300, 302. In addition, each of the front and rear row ground buckles 200 and 250 are identical to each other, whether on the same surface or not, and thus the same manufacturing mold can be used to save costs.

It should also be noted that ground buckles 200 and 250 are staggered with respect to each other in the transverse direction, with two adjacent ground buckles 250 leaving a space therebetween to allow a differential pair of cables to extend therein to connect respective ground buckles 200.

Referring to fig. 11-16, another embodiment of an internal circuit board assembly 60, in accordance with the present invention, is similar to the internal circuit board assembly 10 of the first embodiment shown in fig. 1-9. The primary difference between the two embodiments of the inner circuit board assembly 10,60 is that the notches 730 of the front row 700 and the rear row 750 are on the same side. In the present embodiment, the cable differential pair 800 with the ground wire 810 received in the notches 730 of the front row 700 and the rear row 750 is shown connected to the circuit board 600.