Busbar and method for producing a busbar
阅读说明:本技术 母排以及用于制造母排的方法 (Busbar and method for producing a busbar ) 是由 扬·达内尔斯 帕布洛·帕斯萨格斯 唐亮 塞巴斯蒂安·德博特 扬·旺德文克尔 于 2019-07-24 设计创作,主要内容包括:本发明涉及母排以及用于制造母排的方法。母排(1),其特别地为叠层母排,该母排(1)被配置成用于将电子部件特别地无源电子部件安装在母排(1)上,其中,母排(1)包括至少一个插入区域(30),所述至少一个插入区域(30)被配置成用于将电子部件的接触元件特别地电子部件的引脚(2)插入至母排(1)中,其中,母排(1)包括第一导电层(10),其中,分配给插入区域(30)的所述第一导电层(10)沿第一平面(11)延伸并且插入区域(30)沿第二平面(12)延伸,其中,第一平面(11)和第二平面(12)沿垂直于第一平面(11)和/或第二平面(12)延伸的方向彼此间隔开以形成凹陷的插入区域(30)。(The present invention relates to a busbar and a method for manufacturing a busbar. A busbar (1), in particular a laminated busbar, the busbar (1) being configured for mounting electronic components, in particular passive electronic components, on the busbar (1), wherein the busbar (1) comprises at least one insertion region (30), the at least one insertion region (30) being configured for inserting a contact element of an electronic component, in particular a pin (2) of an electronic component, into the busbar (1), wherein the busbar (1) comprises a first electrically conductive layer (10), wherein the first electrically conductive layer (10) assigned to the insertion region (30) extends along a first plane (11) and the insertion region (30) extends along a second plane (12), wherein the first plane (11) and the second plane (12) are spaced apart from each other in a direction extending perpendicular to the first plane (11) and/or the second plane (12) to form a recessed insertion region (30).)
1. Busbar (1), in particular laminated busbar (1), the busbar (1) being configured for mounting an electronic component, in particular a passive electronic component, on the busbar (1), wherein the busbar (1) comprises at least one insertion region (30), the at least one insertion region (30) being configured for inserting a contact element of the electronic component, in particular a pin (2) of the electronic component, into the busbar (1), wherein the busbar (1) comprises a first electrically conductive layer (10), wherein the first electrically conductive layer (10) assigned to the insertion region (30) extends along a first plane (11) and the insertion region (30) extends along a second plane (12), wherein the first plane (11) and the second plane (12) are spaced apart from each other along a direction perpendicular to the extension of the first plane (11) and/or the second plane (12) to form a recessed insertion Into the region (30).
2. Busbar (1) according to claim 1, wherein the insertion region (30) is at least partially surrounded by at least one recess (4), wherein the recess (4) preferably extends between the first plane (11) and the second plane (12).
3. Busbar (1) according to claim 1 or 2, wherein the insert region (30) is connected to the first electrically conductive layer (10) of the busbar (1) via a bridging element, such as an extension element (8), to enable an electrical connection between the insert region (30) of the busbar (1) and the first electrically conductive layer (10).
4. Busbar (1) according to claim 3, wherein a first portion (41) of the insertion region (30) is assigned to the at least one recess (4) or to a plurality of recesses (4) and a second portion (42) of the insertion region (30) is assigned to the bridging element along a Surrounding Path (SP) of the hole (31) surrounding the insertion region (30), wherein the Surrounding Path (SP) preferably has the shape of the insertion region (30).
5. Busbar (1) according to claim 4, wherein the ratio of the first portion (41) to the length of the Surrounding Path (SP) is between 0.5 and 0.95, preferably between 0.7 and 0.95 and more preferably between 0.75 and 0.95.
6. Busbar (1) according to one of the preceding claims, wherein a region of a first section (A1) surrounds the recess (4) and/or the plurality of recesses (4) and the insertion region (30) and a region of a second section (A2) surrounds the insertion region (30), wherein the ratio between the area of the first section (A1) and the area of the second section (A2) is between 0.1 and 0.5, preferably between 0.2 and 0.4 and more preferably between 0.25 and 0.35.
7. Busbar (1) according to one of the preceding claims, wherein a region of a third cross section (A3) is assigned to the recess (4) and/or the plurality of recesses (4), wherein the ratio between the area of the third cross section (A3) and the area of the second cross section (A2) is between 0.5 and 1.5, preferably between 0.7 and 1.3 and most preferably between 0.9 and 1.1.
8. Busbar (1) according to one of the preceding claims, wherein the insertion region (30) comprises a hole (31), wherein the form of the hole (31) is adapted to the form of the contact element of the electronic component, in particular such that the contact element can be inserted into the hole (31) according to the key-lock principle.
9. Busbar (1) according to one of the preceding claims, wherein, in a direction perpendicular to the first plane (11) and/or the second plane (12), the distance between the first plane (11) and the second plane (12) is greater than half the thickness (D) of the first electrically conductive layer (10), preferably greater than the thickness (D) of the first electrically conductive layer (10) and more preferably greater than twice the thickness (D) of the first electrically conductive layer (10).
10. Busbar (1) according to claim 9, wherein the bridging element has a curved shape to provide a distance (D1) between the first plane (11) and the insertion region (30).
11. Busbar (1), in particular according to the preceding claim, the busbar (1) being configured for mounting an electronic component, in particular a passive electronic component, on the busbar (1), wherein the busbar (1) comprises at least one insertion region (30), the at least one insertion region (30) being configured for inserting a contact element of the electronic component, in particular a pin (2) of the electronic component, into the busbar (1), wherein the insertion region (30) is at least partially surrounded by at least one recess (4), wherein the recess (4) preferably extends between a first plane (11) and a second plane (12).
12. Busbar (1) according to any of the preceding claims, wherein the busbar (1) comprises a second conductive layer (20) spaced apart from the first conductive layer (10) by an isolating layer (15), wherein a further recess (50) is provided in the second conductive layer (20) and/or the isolating layer (15), wherein the dimension of the further recess (50) in the second conductive layer (20) and/or the isolating layer (15) mainly corresponds to the area of the first cross section (A1).
13. Method for manufacturing a busbar (1) and/or for connecting an electrical component to a busbar (1), the busbar (1) in particular being a busbar (1) according to one of the preceding claims, wherein at least one recess (4) is cut in a first electrically conductive layer (10) of the busbar (1).
14. Method according to claim 13, wherein contact elements of electronic components are inserted into an insertion region (30) of the busbar (1), wherein the contact elements are soldered and/or welded to the insertion region (30), preferably automatically by a robot.
15. Method according to claim 14, wherein the contact element is a pin (2) and the pin (2) is bent before soldering and/or fusing.
Technical Field
The present invention relates to a busbar and a method for manufacturing a busbar, in particular to a busbar on which several capacitors may be arranged.
Background
Laminated busbars typically include layers of processed copper separated by thin dielectric materials laminated into a unified structure. Examples of laminated busbars may be found in CN 203504394U, CN 104022414 a1 or CN 202474475U. Typically, an "insertion" area is included in the busbar to directly connect the electrodes of an electronic component, such as a capacitor, to different conductive layers, wherein each of the conductive layers is assigned to one of the poles provided by each capacitor. Typically, the capacitor is connected to the insertion region by inserting the pins into the holes of the insertion region. The pins are then bonded to the busbar, for example by soldering and/or welding.
However, a certain amount of energy is required to achieve the adhesion between the busbar and the pins. Furthermore, the creation of an adhesive joint may result in a bending of the busbar protruding from the busbar, which usually has a flat surface, especially in case the connection is achieved by soldering. In certain applications of busbars, this bending may be a problem. In addition, when the pin area is heated, a large amount of heat energy is lost to the flat layer of the conductive material of the busbar.
Disclosure of Invention
It is therefore an object of the present invention to improve laminated busbars known from the prior art, in particular with respect to their production and their potential fields of application.
This object is achieved by a busbar and a method for manufacturing a busbar and/or for connecting an electrical component to a busbar according to embodiments of the present invention. Preferred embodiments are included in the alternative embodiments, description and drawings of the present invention.
According to a first aspect of the invention, a busbar, in particular a laminated busbar, is provided, wherein the busbar is configured for mounting an electronic component, in particular a passive electronic component such as a capacitor, on the busbar. The busbar comprises at least one insertion region configured for inserting a contact element of an electronic component into the busbar, wherein the busbar comprises a first conductive layer, wherein the first conductive layer assigned to the insertion region extends along a first plane and the insertion region extends along a second plane. In particular, the contact elements are pins of an electronic component. Furthermore, the first plane and the second plane are spaced apart from each other in a direction extending perpendicular to the first plane and/or the second plane to form a recessed insertion region.
In contrast to the prior art, it is provided according to the invention that the recessed insertion region is realized by spacing the first plane and the second plane apart from each other. Thus, even after the pin is connected to the busbar, for example by soldering, a flat surface may be provided, since the pin and/or the soldering material may fill the recessed insertion region and no longer protrude from the surface of the busbar. In particular, it is advantageously possible to connect the capacitor-equipped busbar to another component, in particular to another flat component, for example in a vehicle. Therefore, the busbar can be used in different application fields. Preferably, the recessed insertion region represents a bottom of the can-like shape of the first conductive layer.
In particular, the busbar comprises a second conductive layer, wherein the first and second conductive layers are separated from each other by an isolating layer. In particular, the first conductive layer, the second conductive layer and the isolation layer form a sandwich system. Preferably, the laminated busbar comprises a further isolating layer covering a sandwich system comprising a first conductive layer, an isolating layer and a second conductive layer. Furthermore, it is provided that the busbar has a rectangular or disc-like shape to carry several electrical components, such as capacitors, which are arranged adjacent to each other, in particular in rows. In principle, the main function of the busbar is to collect the power provided by several capacitors, e.g. by connecting to corresponding terminals of the first and/or second conductive layer and to provide the collected power to a user or machine through the corresponding terminals.
The term "dispensing" means that there is an electrical connection between the intervening region and the first conductive layer. In particular, the insertion region is comprised in the first conductive layer or is an integral part of the conductive layer. The insertion region is realized, for example, by deforming a portion of the first electrically conductive layer, in particular by stamping. However, it is also conceivable to add the insertion region to the conductive layer in a separate manufacturing step. In addition, it is provided that the second electrically conductive layer has a further insertion region, wherein the second electrically conductive layer extends along a further first plane and the further insertion region extends along a further second plane, wherein the further first plane and the further second plane are spaced apart from one another. In particular, the further first plane is spaced apart from the further second plane by a distance different from the distance by which the first plane is spaced apart from the second plane.
According to a preferred embodiment, it is provided that the insertion region is at least partially surrounded by at least one recess, wherein the recess preferably extends between a first plane and a second plane. Due to the recess, heat transfer from the insertion region to the first conductive layer may be limited or restricted. Thus, the heat generated and required by soldering is not dissipated to the conductive layer. Instead, heat is concentrated to the insertion region to achieve an adhesive or welded or soldered connection between the pin and the insertion region. Preferably, the form of the recess is adapted to limit or reduce heat transfer from the insertion region to the conductive layer. In particular, it is provided that the recesses are configured, for example in size, number and/or form, such that the heat transfer from the insertion region to the first conductive layer is reduced by more than about 10%, preferably more than 25% and most preferably more than 35% compared to a corresponding insertion region connected to the first conductive layer without the recess or recesses.
It is preferably provided that the insertion region is connected to the conductive layer of the busbar via a bridging element, for example an extension element (rip element), to enable an electrical connection between the insertion region of the busbar and the conductive layer. The bridging element is responsible for establishing an electrically conductive connection between the insertion region and the first electrically conductive layer. Preferably, the bridging element is formed as an extension element. Such extension elements extend mainly radially from the center of the insertion region. It is also conceivable that the insertion area is connected to the first conductive layer via several extension elements, for example extending radially from the center of the insertion area. For example, the insertion region is connected to the first conductive layer via two, three or four extension elements. Preferably, the two extension elements are arranged at opposite ends of the insertion region.
In a further embodiment, provision is made for the first portion to be assigned to the at least one recess or the plurality of recesses and the second portion to be assigned to the bridging element along a surrounding path, wherein the surrounding path preferably has the shape of the insertion region. In particular, it is provided that the insertion region is limited by the recess. The insertion region in the second plane may have a cross-section formed in a circle, an ellipse, a rectangle, or the like. Preferably, several recesses are provided, wherein the recesses are spaced apart from each other along the surrounding path, in particular evenly spaced apart along the surrounding path. In particular, the surrounding path is denoted as a closed path surrounding the insertion region. For example, a circumferential path is suitable for the insertion region, i.e. a circumferential path extends parallel to the insertion region.
Furthermore, it is provided that the ratio of the first portion to the length of the surrounding path is between 0.5 and 0.95, preferably between 0.7 and 0.95 and more preferably between 0.75 and 0.95. By selecting such small bridging elements, it is advantageously possible to substantially reduce the heat transfer during the connection between the pin and the insertion region by at least 20% or 50%. At the same time, it has been shown that a rather thin bridge element is able to withstand/resist the pressure during the welding process, in particular during the self-mating welding process.
Preferably, is arranged as
The region of the first cross section surrounds the recess and/or recesses and the insertion region, and
the area of the second cross section surrounds the insertion area,
wherein the ratio between the area of the first cross section and the area of the second cross section is between 0.1 and 0.5, preferably between 0.2 and 0.4 and more preferably between 0.25 and 0.35. Thus, a relatively small area between the insertion area and the conductive layer is provided for the recess or recesses. In other words: the recess does not extend too much into the first conductive layer. Instead, the recess is located near the insertion region. Therefore, the influence of the recess on the first conductive layer is small. In particular, the recess has a strip-like shape and extends mainly arcuately around the insertion region. Furthermore, the insertion region has a disc-shaped form, in particular a circular or annular disc-shaped form.
According to another embodiment, a region provided as a third cross section is assigned to a recess and/or recesses, wherein the ratio between the area of the third cross section and the area of the second cross section is between 0.5 and 1.5, preferably between 0.7 and 1.3 and most preferably between 0.9 and 1.1. In other words: the insertion region corresponds to a region formed by a recess surrounding the insertion region. Thus, the heat generated for forming the adhesive connection between the pin and the insertion region can advantageously be concentrated to a relatively small area or zone.
According to a further embodiment, it is provided that the insertion region comprises a hole, wherein the form of the hole is adapted to the form of the contact element of the electronic component, in particular such that the contact element can be inserted into the hole according to the key-lock principle. For example, the insertion region has a circular or elliptical shape and the corresponding cross-section of the pin has a complementary shape. By adapting the holes and pins in the key-lock principle, it is advantageously possible to avoid connecting inappropriate capacitors to the busbar. It is also conceivable to adapt the position of the different insertion areas to avoid an inappropriate connection of the capacitors to the busbar.
In a preferred embodiment of the invention it is provided that the distance between the first plane and the second plane in a direction perpendicular to the first plane and/or the second plane is more than half the thickness of the conductive layer, preferably more than the thickness of the conductive layer and more preferably more than twice the thickness of the conductive layer. Therefore, it is advantageously possible to form the recessed insertion region using almost the entire thickness of the busbar. Thus, a considerable volume is provided for the pins and the solder material.
In another embodiment it is provided that the bridging element has a curved shape to provide a distance between the first plane and the second plane. In particular, the bridging element extends perpendicularly to the first plane and/or the second plane or the bridging element extends obliquely to the first plane and/or the second plane.
Preferably, the busbar comprises a second conductive layer spaced apart from the first conductive layer by an isolating layer, wherein a recess is provided in the second conductive layer and/or the isolating layer, wherein the size of the recess in the conductive layer and/or the isolating layer mainly corresponds to the area of the first cross-sectional area. Thus, it is advantageously possible to stack the first conductive layer, the isolation layer and the second conductive layer, wherein the recessed insertion region penetrates the second conductive layer and/or the isolation layer.
Another aspect of the invention is a busbar, in particular a laminated busbar, configured for mounting an electronic component, in particular a passive electronic component, on the busbar, wherein the busbar comprises at least one insertion region configured for inserting a contact element of the electronic component, in particular a pin of the electronic component, into the busbar, wherein the insertion region is at least partially surrounded by at least one recess, wherein the recess preferably extends between a first plane and a second plane.
Another aspect of the invention relates to a method for manufacturing a busbar, in particular a busbar according to an embodiment of the invention, and/or for connecting an electrical component to the busbar, wherein the recess is cut in a conductor layer of the busbar. The recess is realized, for example, by stamping. In addition, it is provided that the insertion region is realized by deforming the first conductive layer.
Furthermore, it is preferably provided to insert contact elements of the electronic component into an insertion region of the busbar, wherein the contact elements are soldered and/or welded, preferably automatically by a robot, to the insertion region. By using a robot, the forming of the connection between the insertion region and the pin can be advantageously accelerated.
According to a further embodiment of the invention, it is provided that the contact elements are pins and that the pins are bent before soldering and/or fusing. It is also conceivable to remove the parts protruding from the surface of the busbar after soldering, welding and/or bending. Therefore, the surface flatness of the bus bar can be ensured.
The individual embodiments or their individual aspects and features can be combined or exchanged with one another without restricting or widening the scope of the described invention without explicit description, as long as such a combination or exchange is meaningful in the sense of the present invention. Where applicable, the advantages described in relation to one embodiment of the invention may also be advantageous in relation to other embodiments of the invention.
Drawings
In the drawings:
figure 1 schematically shows a perspective view of a busbar according to a preferred embodiment of the invention,
figure 2 schematically shows a side view of the busbar of figure 1,
figure 3 schematically shows a first conductive layer comprising an insertion area for a busbar according to a preferred embodiment,
figure 4A schematically shows in top view an insertion region of a busbar according to a preferred embodiment,
fig. 4B schematically shows an insertion region of a busbar according to a preferred embodiment in a sectional side view, an
Fig. 5 schematically shows a busbar according to another preferred embodiment of the present invention.
Detailed Description
In fig. 1, a
In particular, the first
In fig. 2, a side view of the
In fig. 3, a detailed view of the
Preferably arranged along a surrounding path SP surrounding the
The
the second portion 42 is assigned to the bridging element,
the surrounding path SP corresponds in particular to the
Furthermore, is arranged to
The area of the first cross section or the area of the first cross section a1 surrounds the recess 4 and/or the recesses 4 and the
the area of the second cross section or the area of the second cross section a2 surrounds the
wherein the ratio between the area of the first section a1 and the area of the second section a2 is between 0.1 and 0.5, preferably between 0.2 and 0.4 and more preferably between 0.25 and 0.35. In addition, the area of the third cross section a3 is assigned to one recess 4 and/or to a plurality of recesses 4, wherein the ratio between the area of the third cross section and the area of the second cross section is between 0.5 and 1.5, preferably between 0.7 and 1.3 and most preferably between 0.9 and 1.1.
According to fig. 4B, it is preferably provided that the
In fig. 5, a
Reference numerals:
1 bus bar
2 pin
4 concave part
5 capacitor
8 extending element
10 first conductive layer
11 first plane
12 second plane
15 isolating layer
17 terminal
20 second conductive layer
30 insertion region
31 holes
40 third conductive layer
41 first part
42 second part
45 outer shape
50 another recess
S stacking direction
M main extension plane
SP enclosing a path
A1 first section
A2 second section
Third section A3
Thickness D
Distance D1
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