阅读说明：本技术 一种低介电常数玻璃配合料 (Low-dielectric-constant glass batch ) 是由 彭寿 马立云 王巍巍 仲召进 曹欣 石丽芬 崔介东 单传丽 王萍萍 高强 赵凤阳 于 2019-11-16 设计创作，主要内容包括：本发明公开一种低介电常数玻璃配合料,其特征在于由以下重量百分比的原料组成：SiO<Sub>2</Sub>：59~61.9%,Al<Sub>2</Sub>O<Sub>3</Sub>：4~10%,B<Sub>2</Sub>O<Sub>3</Sub>：18~22.9%,Li<Sub>2</Sub>O：0.5~2%,Na<Sub>2</Sub>O：0.1~3%,K<Sub>2</Sub>O：0.5~5%,CaO：0~5%,MgO：1~5%,SrO:0.1~5%,BaO：0.1~5%,澄清剂SnO<Sub>2</Sub>：0.1~3%。本发明的优点：1.低介电常数玻璃配合料的组分简单,成本较低；2.适合浮法成型生产,制备方法简便易行；3.制得的玻璃介电常数和介电损耗较低,在频率为1MHz时介电常数为4.0~4.6,介电正切为5×10<Sup>-4</Sup>~12×10<Sup>-4</Sup>。(The invention discloses a low dielectric constant glass batch, which is characterized by comprising the following raw materials in percentage by weight: SiO 2 2 ：59~61.9%，Al 2 O 3 ：4~10%，B 2 O 3 ：18~22.9%，Li 2 O：0.5~2%，Na 2 O：0.1~3%，K 2 O: 0.5-5%, CaO: 0-5%, MgO: 1-5%, SrO 0.1-5%, BaO: 0.1-5% of a clarifying agent SnO 2 :0.1 to 3 percent. The invention has the advantages that: 1. the low dielectric constant glass batch has simple components and lower cost; 2. is suitable for float molding production, and the preparation method is simple and easy; 3. the prepared glass has low dielectric constant and dielectric loss, the dielectric constant is 4.0-4.6 when the frequency is 1MHz, and the dielectric tangent is 5 multiplied by 10 ‑4 ~12×10 ‑4 。)

1. A low dielectric constant glass batch is characterized by comprising the following raw materials in percentage by weight:

SiO₂：59~61.9%，Al₂O₃：4~10%，B₂O₃：18~22.9%，Li₂O：0.5~2%，Na₂O：0.1~3%，K₂o: 0.5-5%, CaO: 0-5%, MgO: 1-5%, SrO 0.1-5%, BaO: 0.1-5% of a clarifying agent SnO₂：0.1~3%。

2. The low dielectric constant glass batch according to claim 1, characterized by consisting of the following raw materials in percentage by weight: SiO 2₂：60~61%，Al₂O₃：6~8%，B₂O₃：19.5~21.5%，Li₂O：1~1.5%，Na₂O：1~2%，K₂O: 2-3%, CaO: 1-2%, MgO: 2-3%, SrO 1-2%, BaO: 1-2% of a clarifying agent SnO₂：0.2~0.5%。

3. A low dielectric constant glass batch according to claim 1, wherein: SiO in the low-dielectric-constant glass batch₂+Al₂O₃+B₂O₃Is 86-94%.

4. A low dielectric constant glass batch according to claim 1, wherein: li in low-dielectric-constant glass batch₂O+Na₂O+K₂O is 1.1 to 5%.

5. A low dielectric constant glass batch according to claim 1, wherein: li in low-dielectric-constant glass batch₂O/（Li₂O+Na₂O+ K₂O) is 0.2 to 0.5.

6. A low dielectric constant glass batch according to any one of claims 1 to 5, wherein: in the low-dielectric-constant glass batch, CaO + MgO + SrO + BaO is 3.1-6%.

7. A low dielectric constant glass batch according to claim 2, wherein: SiO in the low-dielectric-constant glass batch₂+Al₂O₃+B₂O₃86 to 94 percent of Li₂O+Na₂O+K₂1.1 to 5% of O and Li₂O/（Li₂O+Na₂O+ K₂O) is 0.2 to 0.5, and CaO + MgO + SrO + BaO is 3.1 to 6%.

Technical Field

The invention relates to the field of electronic glass, in particular to a low-dielectric-constant glass batch.

Background

The smaller the dielectric constant of a material, the faster the propagation rate of a signal, while the smaller the dielectric loss of a material, the smaller its propagation loss at a fixed propagation frequency. The development of electronic industry technology has made the miniaturization and miniaturization of electronic devices a trend, and the frequency of electromagnetic waves used in transmission has reached the MHz and GHz levels, which requires sealing glass to have a low dielectric constant and dielectric loss.

Low dielectric constant glass is a highly desirable candidate for use in electronic packaging applications such as circuit protection, isolation and signal distortion prevention, and has a low dielectric constant and dielectric loss that are substantially invariant with test temperature and frequency. In recent years, the integration level of integrated circuits has been rapidly increased, the operating frequency ranges of radio frequency connectors, microwave devices and the like have been greatly increased, and in order to reduce impedance delay and power loss caused by the operating frequency ranges, it is necessary to reduce the parasitic capacitance of a dielectric layer in addition to using low-resistivity metal. The capacitance C is in direct proportion to the dielectric constant epsilon, and a low-dielectric-constant material can be used as an interconnection medium to reduce impedance delay.

The low dielectric constant sealing glass used under the condition of high-frequency microwave is mainly used for input and output of microwave signals and control signals of modules and components, the low dielectric constant is used for reducing relaxation and cross interference of signals, and the low dielectric loss is used for reducing excessive heat consumption under high frequency and large resistivity and better heat dissipation. At present, the manufacturers providing low dielectric constant glass mainly include a few companies such as corning in the United states.

Disclosure of Invention

The invention aims to provide a low-dielectric-constant glass batch which is suitable for float forming, the prepared low-dielectric-constant glass has the characteristics of low dielectric constant, low dielectric loss and the like, meets the use requirements of the electronic industry, and has lower cost and process characteristics suitable for large-scale industrial production.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

a low dielectric constant glass batch is characterized by comprising the following raw materials in percentage by weight:

SiO₂：59~61.9%，Al₂O₃：4~10%，B₂O₃：18~22.9%，Li₂O：0.5~2%，Na₂O：0.1~3%，K₂o: 0.5-5%, CaO: 0-5%, MgO: 1-5%, SrO 0.1-5%, BaO: 0.1-5% of a clarifying agent SnO₂：0.1~3%。

Further, the low dielectric constant glass is characterized by being prepared from the following raw materials in percentage by weight:

SiO₂：60~61%，Al₂O₃：6~8%，B₂O₃：19.5~21.5%，Li₂O：1~1.5%，Na₂O：1~2%，K₂o: 2-3%, CaO: 1-2%, MgO: 2-3%, SrO 1-2%, BaO: 1-2% of a clarifying agent SnO₂：0.2~0.5%。

Further, SiO in the low dielectric constant glass batch₂+Al₂O₃+B₂O₃Is 86-94%.

Further, Li in the low-dielectric-constant glass batch₂O+Na₂O+K₂O is 1.1 to 5%.

Further, Li in the low-dielectric-constant glass batch₂O/（Li₂O+Na₂O+ K₂O) is 0.2 to 0.5.

Furthermore, CaO + MgO + SrO + BaO in the low-dielectric-constant glass batch is 3.1-6%.

SiO in the invention₂The glass is a glass network forming body, the increase of the content is beneficial to reducing the dielectric constant, but the high content can cause the phenomena of high viscosity and difficult melting of the glass liquid; CaO can reduce the high-temperature viscosity of the molten glass and promote the melting and the clarification of the molten glass, but the excessive use amount can increase the crystallization tendency of the glass and lead to the increase of the dielectric constant of the glass, and proper MgO is introduced for adjustment; by increasing B₂O₃In an amount to achieve the object of lowering the dielectric constant of the glass, B₂O₃But also is good fluxing agent and can effectively reduce the high-temperature viscosity of the glass, B₂O₃Too high content of (A) can directly cause the problems of reduction of mechanical property of the glass, poor water resistance and the like; selecting high-temperature fining agent SnO₂Can achieve the purpose of clarifying high-viscosity low dielectric glass better.

Compared with the prior art, the invention has the following advantages:

1. by controlling the framework oxide SiO₂、Al₂O₃And B₂O₃The low dielectric constant glass is obtained by the types and the contents of various conventional oxides, the batch has simple components, low cost and obvious effect; 2. is suitable for float molding production, and the preparation method is simple and easy; 3The prepared glass has low dielectric constant and dielectric loss, the dielectric constant is 4.0-4.6 when the frequency is 1MHz, and the dielectric tangent is 5 multiplied by 10^-4~12×10^-4。

Drawings

FIG. 1 is a graph showing the change of dielectric constant with frequency of samples of examples;

fig. 2 shows the dielectric loss of the example samples as a function of frequency.

Detailed Description