阅读说明：本技术 一种电子元器件的制造方法 (Method for manufacturing electronic component ) 是由 闫一方 于 2019-10-25 设计创作，主要内容包括：本发明提供一种电子元器件的制造方法,涉及电子元器件技术领域。该电子元器件的制造方法,包括以下步骤：S1.将石英片使用清洗液进行清洗,然后使用真空电镀法在石英片蒸发上一定厚度的金属导电薄膜；S2.将振子固定安装在基座组件上；S3.将金属壳罩与基座组件焊接成一个密封整体,并在密封体内保留氮气；S4.对石英晶体元件进行密封性检查,剔除不良品；S5.测量石英晶体元件的谐振频率、谐振电阻、绝缘电阻、并电容与串并间隔。通过合理的制备方法,对晶振生产工艺进行了明显的优化,使得生产制造出的晶振良品率大大提高,同时也提高了晶振的生产效率,从而减少了企业的生产成本。(The invention provides a manufacturing method of an electronic component, and relates to the technical field of electronic components. The manufacturing method of the electronic component comprises the following steps: s1, cleaning a quartz plate by using a cleaning solution, and evaporating a metal conductive film with a certain thickness on the quartz plate by using a vacuum plating method; s2, fixedly mounting the oscillator on the base assembly; s3, welding the metal shell cover and the base assembly into a sealed whole, and reserving nitrogen in the sealed body; s4, carrying out tightness inspection on the quartz crystal element, and removing defective products; and S5, measuring the resonant frequency, the resonant resistance, the insulation resistance, the parallel capacitance and the serial-parallel interval of the quartz crystal element. Through a reasonable preparation method, the crystal oscillator production process is obviously optimized, so that the yield of the produced crystal oscillator is greatly improved, and meanwhile, the production efficiency of the crystal oscillator is also improved, thereby reducing the production cost of enterprises.)

1. A method for manufacturing an electronic component, characterized in that: the method comprises the following steps:

s1, cleaning a quartz plate by using a cleaning solution, and evaporating a metal conductive film with a certain thickness on the quartz plate by using a vacuum plating method;

s2, fixedly mounting the oscillator on the base assembly;

s3, welding the metal shell cover and the base assembly into a sealed whole, and reserving nitrogen in the sealed body;

s4, carrying out tightness inspection on the quartz crystal element, and removing defective products;

and S5, measuring the resonant frequency, the resonant resistance, the insulation resistance, the parallel capacitance and the serial-parallel interval of the quartz crystal element.

2. A method for manufacturing an electronic component as claimed in claim 1, characterized in that: in the step 1, the quartz plate is cleaned by using a cleaning solution, and then a metal conductive film with a certain thickness is evaporated on the quartz plate by using a vacuum plating method, which comprises the following steps:

1) putting the quartz wafer into a coating device, removing psoriasis and dust in the coating device, and adding a proper amount of silver wires into a molybdenum boat;

2) adjusting the vacuum degree of the coating equipment, and when the vacuum degree reaches 6KPa, adjusting the current of the coating equipment to ensure that the equipment starts to evaporate, and coating a first surface on the quartz plate;

3) after the first surface of the quartz plate is plated with silver, the quartz plate is turned over, and after the quartz plate is turned over, the current plating second surface of the film plating equipment is adjusted.

3. A method for manufacturing an electronic component as claimed in claim 1, characterized in that: in the step 2, the vibrator is fixedly installed on the base assembly, and the method specifically comprises the following steps:

1) dipping a little conductive adhesive by a tool, and dispensing a proper amount of conductive adhesive on the outer side of the contact part of the vibrator and the reed clamping hole;

2) putting the resonance part with the glue in a drying device together with the plug-in tray, controlling the temperature in the drying device at 140-160 ℃, heating for more than 2 hours, and cooling to room temperature after heating.

4. A method for manufacturing an electronic component as claimed in claim 1, characterized in that: in the step 3, the metal shell and the base assembly are welded into a sealed whole, and nitrogen is reserved in the sealed body, which is as follows:

1) putting the to-be-welded part into a vacuum drying oven, closing a door, switching on a power supply of the vacuum drying oven, vacuumizing, and baking in vacuum when the vacuum degree reaches-0.1 Mpa;

2) setting a vacuum drying box at the temperature of 100-;

3) and after the temperature of the vacuum drying oven is cooled to 30-40 ℃, taking out the to-be-welded part and putting the to-be-welded part into a vacuum chamber, switching on a power supply of the vacuum chamber, vacuumizing, filling nitrogen into the chamber when the vacuum degree reaches-0.1 Mpa, and welding the to-be-welded part when the nitrogen amount reaches a preset value.

5. A method for manufacturing an electronic component as claimed in claim 1, characterized in that: in the step 4, the tightness of the quartz crystal element is checked, and defective products are removed, which specifically comprises the following steps:

1) putting the prepared quartz crystal elements into a high-pressure device, and injecting a proper amount of liquid alcohol into the device until the liquid level of the alcohol is known to overflow all the quartz crystal elements;

2) compressing the gas in the high-pressure device, closing the compression device after 10-20min, and taking out the quartz crystal element and drying after the pressure in the high-pressure device is recovered to normal pressure;

3) and testing the quartz crystal element by using the insulation resistance tester, observing the reading of the insulation resistance tester, and judging whether the quartz crystal element is qualified.

6. A method for manufacturing an electronic component as claimed in claim 1, characterized in that: in the step 5, the resonant frequency, the resonant resistance, the insulation resistance, the parallel capacitance and the series-parallel interval of the quartz crystal element are measured, specifically as follows:

1) placing the quartz crystal element to be tested at a reference temperature, adjusting a frequency meter impedance meter, and testing the resonant frequency and the resonant resistance of the quartz crystal element to be tested on the impedance meter;

2) touching the shell of the quartz crystal element to be measured and the lead wire by using a measuring pen, and measuring the insulation resistance of the quartz crystal element;

3) measuring the parallel capacitance of the quartz crystal element to be measured by using an instrument pen;

4) and respectively measuring the frequencies of the tested quartz crystal element under the condition of various load capacitances on the impedance, and performing serial-parallel interval test by calculating the frequency difference.

Technical Field

The invention relates to the technical field of electronic components, in particular to a manufacturing method of an electronic component.

Background

The electronic components are components of electronic elements and small-sized electric machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general term for some parts of the industries of electric appliances, radios, instruments and the like, such as capacitors, transistors, balance springs, springs and other sub-devices, and commonly refers to resistors, capacitors, potentiometers, electron tubes, heat sinks, electromechanical elements, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, photoelectric devices and the like.

The crystal resonator is one of electronic components, is a quartz crystal resonator made of quartz materials, is commonly called a crystal oscillator, mainly plays a role in generating frequency, has the characteristics of stability and good anti-interference performance, and is widely applied to various electronic products.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a manufacturing method of an electronic component, which solves the problems that the existing crystal oscillator production process has certain defects, the yield of the produced crystal oscillator is low, and the production cost of enterprises is increased.

(II) technical scheme

In order to achieve the purpose, the invention is realized by the following technical scheme: a method for manufacturing an electronic component includes the steps of:

s1, cleaning a quartz plate by using a cleaning solution, and evaporating a metal conductive film with a certain thickness on the quartz plate by using a vacuum plating method;

s2, fixedly mounting the oscillator on the base assembly;

s3, welding the metal shell cover and the base assembly into a sealed whole, and reserving nitrogen in the sealed body;

s4, carrying out tightness inspection on the quartz crystal element, and removing defective products;

and S5, measuring the resonant frequency, the resonant resistance, the insulation resistance, the parallel capacitance and the serial-parallel interval of the quartz crystal element.

Preferably, in the step 1, the quartz plate is cleaned by using a cleaning solution, and then a metal conductive film with a certain thickness is evaporated on the quartz plate by using a vacuum plating method, specifically as follows:

1) putting the quartz wafer into a coating device, removing psoriasis and dust in the coating device, and adding a proper amount of silver wires into a molybdenum boat;

2) adjusting the vacuum degree of the coating equipment, and when the vacuum degree reaches 6KPa, adjusting the current of the coating equipment to ensure that the equipment starts to evaporate, and coating a first surface on the quartz plate;

3) after the first surface of the quartz plate is plated with silver, the quartz plate is turned over, and after the quartz plate is turned over, the current plating second surface of the film plating equipment is adjusted.

Preferably, in the step 2, the vibrator is fixedly mounted on the base assembly, specifically as follows:

1) dipping a little conductive adhesive by a tool, and dispensing a proper amount of conductive adhesive on the outer side of the contact part of the vibrator and the reed clamping hole;

2) putting the resonance part with the glue in a drying device together with the plug-in tray, controlling the temperature in the drying device at 140-160 ℃, heating for more than 2 hours, and cooling to room temperature after heating.

Preferably, in step 3, the metal casing and the base assembly are welded into a sealed whole, and nitrogen gas is retained in the sealed body, which is as follows:

1) putting the to-be-welded part into a vacuum drying oven, closing a door, switching on a power supply of the vacuum drying oven, vacuumizing, and baking in vacuum when the vacuum degree reaches-0.1 Mpa;

2) setting a vacuum drying box at the temperature of 100-;

3) and after the temperature of the vacuum drying oven is cooled to 30-40 ℃, taking out the to-be-welded part and putting the to-be-welded part into a vacuum chamber, switching on a power supply of the vacuum chamber, vacuumizing, filling nitrogen into the chamber when the vacuum degree reaches-0.1 Mpa, and welding the to-be-welded part when the nitrogen amount reaches a preset value.

Preferably, in the step 4, the quartz crystal element is subjected to tightness inspection to remove defective products, specifically as follows:

1) putting the prepared quartz crystal elements into a high-pressure device, and injecting a proper amount of liquid alcohol into the device until the liquid level of the alcohol is known to overflow all the quartz crystal elements;

2) compressing the gas in the high-pressure device, closing the compression device after 10-20min, and taking out the quartz crystal element and drying after the pressure in the high-pressure device is recovered to normal pressure;

3) and testing the quartz crystal element by using the insulation resistance tester, observing the reading of the insulation resistance tester, and judging whether the quartz crystal element is qualified.

Preferably, the resonant frequency, the resonant resistance, the insulation resistance, the parallel capacitance and the series-parallel interval of the quartz crystal element are measured in the step 5, specifically as follows:

1) placing the quartz crystal element to be tested at a reference temperature, adjusting a frequency meter impedance meter, and testing the resonant frequency and the resonant resistance of the quartz crystal element to be tested on the impedance meter;

2) touching the shell of the quartz crystal element to be measured and the lead wire by using a measuring pen, and measuring the insulation resistance of the quartz crystal element;

3) measuring the parallel capacitance of the quartz crystal element to be measured by using an instrument pen;

4) and respectively measuring the frequencies of the tested quartz crystal element under the condition of various load capacitances on the impedance, and performing serial-parallel interval test by calculating the frequency difference.

(III) advantageous effects

The invention provides a method for manufacturing an electronic component. The method has the following beneficial effects:

according to the manufacturing method of the electronic component, the crystal oscillator production process is obviously optimized through a reasonable preparation method, so that the yield of the produced crystal oscillator is greatly improved, the production efficiency of the crystal oscillator is improved, and the production cost of enterprises is reduced.

Detailed Description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.