Method for rapidly and accurately judging air tightness of LED bracket
阅读说明：本技术 可快速精准判定led支架气密性方法 (Method for rapidly and accurately judging air tightness of LED bracket ) 是由 刘法湧 梁双窍 肖会华 徐右交 王世平 刘株兵 于 2019-09-23 设计创作，主要内容包括：本申请公开了可快速精准判定LED支架气密性方法,包括步骤：S1,选备待检LED支架；S2,在所选待检LED支架杯腔内点注封装胶水；S3,将已点注封装胶水的LED支架放至加热平台上进行加热；S4,调试检测装置,观察记录已点注封装胶水的LED支架杯腔内塑胶部与金属部间在受热状态下所逃逸出气体在封装胶水内形成气泡的呈现情况；S5,分析对比已点注封装胶水的LED支架杯腔内塑胶部与金属部间所出现气泡的呈现情况,随之判别已检LED支架气密性是否符合各标准量级。本申请不仅可实现快速检测LED支架气密性的目的,且还可精准检测LED支架气密性是否符合生产应用要求,以使有利于指导生产符合应用要求的LED支架,同时还有利于提高LED灯珠的适用性。(The application discloses a method for rapidly and accurately judging the air tightness of an LED bracket, which comprises the following steps: s1, selecting an LED bracket to be detected; s2, injecting packaging glue into the cavity of the selected LED bracket cup to be detected; s3, placing the LED bracket which is injected with the packaging glue on a heating platform for heating; s4, debugging the detection device, observing and recording the appearance that air bubbles are formed in the packaging glue by escaping gas between the plastic part and the metal part in the heated state in the cavity of the LED bracket cup in which the packaging glue is injected; and S5, analyzing and comparing the appearance of bubbles between the plastic part and the metal part in the cavity of the LED bracket cup which is injected with the packaging glue, and then judging whether the air tightness of the detected LED bracket meets various standard magnitudes. The purpose of rapidly detecting the air tightness of the LED support can be achieved, and whether the air tightness of the LED support meets the production application requirements or not can be accurately detected, so that the LED support meeting the application requirements can be guided to produce, and meanwhile, the applicability of the LED lamp bead can be improved.)
1. The method for rapidly and accurately judging the air tightness of the LED bracket is characterized by comprising the following steps of:
s1, selecting an LED bracket to be detected;
s2, injecting packaging glue into the cavity of the selected LED bracket cup to be detected;
s3, placing the LED bracket which is injected with the packaging glue on a heating platform for heating;
s4, debugging the detection device, observing and recording the appearance that air bubbles are formed in the packaging glue by escaping gas between the plastic part and the metal part in the heated state in the cavity of the LED bracket cup in which the packaging glue is injected;
and S5, analyzing and comparing the appearance of bubbles between the plastic part and the metal part in the cavity of the LED bracket cup which is injected with the packaging glue, and then judging whether the air tightness of the detected LED bracket meets various standard magnitudes.
2. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 1, characterized in that: in the step S5, if bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support disappear within 10 seconds, it is determined that the LED support has very good air tightness, and the air tightness of the LED support is judged to be of a superior level;
if bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support are lost within 30s, the LED support is better in air tightness, and the air tightness of the LED support is judged to be good.
3. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 2, characterized in that: in the step S5, if bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support disappear within 60 seconds, it is determined that the LED support has a general air-tightness, and the air-tightness of the LED support is determined to be of a middle level;
and if the disappearance time of the bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support exceeds 60s, the air tightness of the LED support is poor, and the air tightness of the LED support is judged to be a difference level.
4. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 1, characterized in that: in step S1, 1 LED support is taken out from the upper left position, the lower left position, the upper right position, the lower right position, and the middle position of the whole injection-molded LED support, and then each LED support is dehumidified and then left empty.
5. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 4, characterized in that: the dehumidification temperature of the dehumidification operation is 140-180 ℃, the dehumidification time is 1.5-2.5 h, and the vacant treatment is vacant for 1.5-2.5 h under the condition of room temperature.
6. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 1, characterized in that: in the step S2, the packaging glue is an epoxy resin AB glue, and the glue is prepared by gluing a glue a and a glue b in the following steps: and stirring and mixing the glue B4 according to the proportion, then putting the mixture into a vacuum machine for vacuumizing treatment, and then extracting the mixture by using an injector and injecting the mixture into the LED support cup cavity to package the LED support cup cavity.
7. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 6, wherein the method comprises the following steps: the stirring mode of the epoxy resin AB glue is clockwise stirring, the stirring time is 2-4 min, and the vacuumizing treatment time is 5-15 min.
8. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 1, characterized in that: in the step S3, the heating temperature of the LED support with the spot injection of the packaging glue is 120-160 ℃, and the heating time is 10-80S.
9. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 1, characterized in that: in step S3, the heating platform includes:
the heating flat plate is used for heating the LED bracket which is injected with the packaging glue, and the upper side of the heating flat plate is provided with a positioning and placing part for positioning and placing the LED bracket which is injected with the packaging glue;
and the heating controller is arranged on the lower side of the heating flat plate, is connected with the heating flat plate, and is used for being externally connected with a power supply to control the heating temperature and the heating time of the heating flat plate.
10. The method for rapidly and accurately judging the air tightness of the LED bracket according to claim 9, wherein the method comprises the following steps: in step S4, the detection device includes:
the mounting bracket is arranged on one side of the heating flat plate;
the camera is arranged on the mounting bracket and used for recording the appearance of bubbles between the plastic part and the metal part in the cup cavity of the LED bracket which is injected with the packaging glue;
the high-power lens is arranged on the lower side of the camera and positioned on the upper side of the positioning and placing part and is used for displaying the condition of bubbles between the plastic part and the metal part in the cavity of the LED bracket cup in which the packaging glue is poured;
and the imaging display is arranged on one side of the mounting bracket and connected with the camera, and the external power supply is used for displaying the condition of bubbles generated between the plastic part and the metal part in the cavity of the LED bracket cup in which the packaging glue is dispensed.
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of LEDs, in particular to a method for rapidly and accurately judging the air tightness of an LED bracket.
[ background of the invention ]
The LED is widely applied to various fields of daily life due to environmental protection and low carbon, different application fields have different requirements on the LED, and the LED bracket is one of three important components of the LED and has important influence on the performance of the LED.
The LED support is a substrate of the LED lamp bead before packaging, plays a role in protecting die bond bonding wires and silica gel molding, can be used for conducting circuits, and influences the characteristics of light, electricity and the like. However in the current LED lamp pearl production process, there are a lot of LED lamp pearls that are unusual not bright, observe through the microscope and learn, the chip in the LED lamp pearl is unusual not appearing, but the alloy line of connecting the chip breaks away from and causes and open circuit with metal substrate, in addition, the discovery causes the LED lamp pearl of this kind of phenomenon to all directly or indirectly expose and light in the air, there is steam in the air, can deduce from this, the gas tightness of LED support is not conform to the practical application demand, then lead to in the moisture infiltration lamp pearl easily, thereby cause the encapsulation glue easily to break away from with metal substrate under the environment that LED lamp pearl was lighted for a long time, make and pull out the alloy line of disconnected welding on metal substrate, thereby broken connecting circuit.
In the production process, in order to detect whether the air tightness of the produced LED support is qualified, the common practice in the industry is to immerse the LED support in red ink (alcohol is poured into the red ink, and the red ink is stirred and mixed according to the proportion of 1: 1), the red ink slightly covers the pins of the LED support, the experiment is terminated after 5 minutes, the condition in the cup body of the support is observed by a microscope in the whole process, and the obtained detection result is as follows: some LED brackets seep quickly, some LED brackets seep slowly, some LED brackets seep slightly, some LED brackets seep seriously, then, the LED holder was taken out, and the slit between the plastic part and the metal substrate was cut with a pair of scissors to observe the surface and edge of the metal substrate and the surface and edge of the plastic part, however, because the pins and the cup wall are soaked in the red ink, the red ink on the cup wall is taken to all parts of the LED bracket by the cutting nippers in the process that the cutting nippers cut the LED bracket, so that misjudgment is easy to cause, and for 1010/1212 and other LED supports with very small size, the LED supports can not be normally cut by using cutting pliers, further, it can be found that the existing method for detecting the air tightness of the LED bracket by mixing the red ink with the alcohol cannot quickly detect, and whether the air tightness of the LED bracket is qualified or not cannot be accurately detected, therefore, a method for rapidly and accurately judging the air tightness of the LED bracket needs to be researched and developed by a person skilled in the art.
[ summary of the invention ]
The above-mentioned prior art problem that this application will be solved is to provide a can judge LED support gas tightness method fast and accurately.
In order to solve the technical problem, the method is realized by the following technical scheme:
the method for rapidly and accurately judging the air tightness of the LED bracket comprises the following steps:
s1, selecting an LED bracket to be detected;
s2, injecting packaging glue into the cavity of the selected LED bracket cup to be detected;
s3, placing the LED bracket which is injected with the packaging glue on a heating platform for heating;
s4, debugging the detection device, observing and recording the appearance that air bubbles are formed in the packaging glue by escaping gas between the plastic part and the metal part in the heated state in the cavity of the LED bracket cup in which the packaging glue is injected;
and S5, analyzing and comparing the appearance of bubbles between the plastic part and the metal part in the cavity of the LED bracket cup which is injected with the packaging glue, and then judging whether the air tightness of the detected LED bracket meets various standard magnitudes.
In the step S5, if the bubbles appearing between the plastic part and the metal part in the cup cavity of the LED holder disappear within 10 seconds, it indicates that the air tightness of the LED holder is very good, and the air tightness of the LED holder is determined to be of high grade;
if bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support are lost within 30s, the LED support is better in air tightness, and the air tightness of the LED support is judged to be good.
In the step S5, if the bubbles appearing between the plastic part and the metal part in the cup cavity of the LED holder disappear within 60 seconds, indicating that the LED holder has general air tightness, and determining that the air tightness of the LED holder is of a middle level;
and if the disappearance time of the bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support exceeds 60s, the air tightness of the LED support is poor, and the air tightness of the LED support is judged to be a difference level.
In the step S1, 1 LED support is taken out from the upper left position, the lower left position, the upper right position, the lower right position and the middle position of the injection molded integral LED support, and then each LED support is dehumidified and then is left empty.
According to the lower coupler which can be simply assembled, the dehumidification temperature of the dehumidification operation is 140-180 ℃, the dehumidification time is 1.5-2.5 h, and the vacancy treatment is performed for 1.5-2.5 h under the room temperature condition.
In the step S2, the encapsulation glue is an epoxy resin AB glue, and the ratio of the adhesive a to the adhesive b is 5: and stirring and mixing the glue B4 according to the proportion, then putting the mixture into a vacuum machine for vacuumizing treatment, and then extracting the mixture by using an injector and injecting the mixture into the LED support cup cavity to package the LED support cup cavity.
According to the lower coupler which can be simply and conveniently assembled, the epoxy resin AB glue is stirred clockwise, the stirring time is 2-4 min, and the vacuumizing treatment time is 5-15 min.
In the step S3, the heating temperature of the LED support with the potting adhesive dispensed thereon is 120 to 160 ℃, and the heating time is 10 to 80 seconds.
In the easily assemblable lower coupler as described above, in step S3, the heating platform includes:
the heating flat plate is used for heating the LED bracket which is injected with the packaging glue, and the upper side of the heating flat plate is provided with a positioning and placing part for positioning and placing the LED bracket which is injected with the packaging glue;
and the heating controller is arranged on the lower side of the heating flat plate, is connected with the heating flat plate, and is used for being externally connected with a power supply to control the heating temperature and the heating time of the heating flat plate.
In the conveniently assembled lower coupler as described above, in step S4, the detecting device includes:
the mounting bracket is arranged on one side of the heating flat plate;
the camera is arranged on the mounting bracket and used for recording the appearance of bubbles between the plastic part and the metal part in the cup cavity of the LED bracket which is injected with the packaging glue;
the high-power lens is arranged on the lower side of the camera and positioned on the upper side of the positioning and placing part and is used for displaying the condition of bubbles between the plastic part and the metal part in the cavity of the LED bracket cup in which the packaging glue is poured;
and the imaging display is arranged on one side of the mounting bracket and connected with the camera, and the external power supply is used for displaying the condition of bubbles generated between the plastic part and the metal part in the cavity of the LED bracket cup in which the packaging glue is dispensed.
Compared with the prior art, the application has the following advantages:
according to the method for rapidly and accurately judging the air tightness of the LED support, the purpose of rapidly detecting the air tightness of the LED support can be achieved, whether the air tightness of the LED support meets the production application requirements can be accurately detected, so that the LED support meeting the application requirements can be guided to produce, the production qualification rate of the LED lamp beads can be greatly improved, meanwhile, the applicability of the LED lamp beads can be greatly improved, the service life of the LED lamp beads can be prolonged to the maximum extent, and further the market competitiveness of the LED lamp beads can be integrally improved.
[ description of the drawings ]
Fig. 1 is an operation flow block diagram of the method for rapidly and accurately determining the air tightness of the LED bracket according to the present application.
Fig. 2 is a schematic diagram of the heating platform and the detection device in the method for rapidly and accurately determining the air tightness of the LED support.
FIG. 3 is a schematic view of the heating platform in the method for rapidly and accurately determining the air tightness of the LED support.
[ detailed description ] embodiments
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.
As shown in fig. 1 to 3, the method for rapidly and accurately judging the air tightness of the LED bracket comprises the following steps:
s1, selecting an LED bracket to be detected;
s2, injecting packaging glue into the cavity of the selected LED bracket cup to be detected;
s3, placing the LED bracket which is injected with the packaging glue on the
s4, debugging the
and S5, analyzing and comparing the appearance of bubbles between the plastic part and the metal part in the cavity of the LED bracket cup which is injected with the packaging glue, and then judging whether the air tightness of the detected LED bracket meets various standard magnitudes.
According to the method for rapidly and accurately judging the air tightness of the LED support, the purpose of rapidly detecting the air tightness of the LED support can be achieved, whether the air tightness of the LED support meets the production application requirements can be accurately detected, so that the LED support meeting the application requirements can be guided to produce, the production qualification rate of the LED lamp beads can be greatly improved, meanwhile, the applicability of the LED lamp beads can be greatly improved, the service life of the LED lamp beads can be prolonged to the maximum extent, and further the market competitiveness of the LED lamp beads can be integrally improved.
Further, in step S5, if bubbles appearing between the plastic part and the metal part in the cavity of the LED holder cup disappear within 10 seconds, it is determined that the LED holder has excellent air tightness, and the LED holder air tightness is judged to be of high grade;
if bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support are lost within 30s, the LED support is better in air tightness, and the air tightness of the LED support is judged to be good;
if bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support are lost within 60s, the air tightness of the LED support is general, and the air tightness of the LED support is judged to be a middle level;
and if the disappearance time of the bubbles appearing between the plastic part and the metal part in the cup cavity of the LED support exceeds 60s, the air tightness of the LED support is poor, and the air tightness of the LED support is judged to be a difference level. The LED bracket detection device has the advantages that the grade of each detected LED bracket can be conveniently judged, and the improvement work of guiding field production is facilitated.
Furthermore, when the bubbles generated between the plastic part and the metal part in the cavity of the LED bracket cup are extra-large bubbles and have the diameter range of 0.6-1 mm, the gap between the plastic part and the metal part formed by PPA injection molding is proved to be very large and deep, and then the fact that an injection molding runner is not full during injection molding can be inferred;
when the bubbles generated between the plastic part and the metal part in the LED bracket cup cavity are large bubbles and the diameter range is 0.3-0.5 mm, the expansion coefficient of the plastic part formed by PPA injection molding can be proved to be very large, so that the gap between the metal part and the plastic part is gradually increased in heating;
when the bubbles generated between the plastic part and the metal part in the cup cavity of the LED bracket are small bubbles and the diameter range is 0.1-0.2 mm, the PPA injection molded plastic part can be proved to be thermally decomposed and gas emerges when being heated;
when the bubbles generated between the plastic part and the metal part in the cup cavity of the LED bracket are dense and have the diameter range of 0.05-0.1 mm, the water absorption rate of the plastic part formed by PPA injection molding is very high, and the water absorption in the gap is particularly serious.
Furthermore, in step S1, 1 LED support is taken out from the upper left position, the lower left position, the upper right position, the lower right position and the middle position of the whole injection molded LED support, and then each LED support is dehumidified and then left empty.
The dehumidification temperature of the dehumidification operation is 140-180 ℃, the dehumidification time is 1.5-2.5 h, the dehumidification time is 2h, and the vacancy treatment is performed for 1.5-2.5 h, preferably 2h at room temperature. The method has the advantages that the moisture on the LED support which is just formed by injection molding is removed, and the accuracy of the air tightness detection of the LED support is prevented from being influenced as much as possible.
Furthermore, in step S2, the packaging glue is an epoxy resin AB glue, and the adhesive ratio of the packaging glue to the adhesive tape a is 5: and stirring and mixing the glue B4 according to the proportion, then putting the mixture into a vacuum machine for vacuumizing treatment, and then extracting the mixture by using an injector and injecting the mixture into the LED support cup cavity to package the LED support cup cavity.
The stirring mode of the epoxy resin AB glue is clockwise stirring, the stirring time is 2-4 min, preferably 3min, and the vacuumizing treatment time is 5-15 min, preferably 10 min. The method has the advantages that the epoxy resin AB glue compounded according to the method has no bubbles, and further, the detection accuracy of the air tightness of the LED bracket is prevented from being influenced by the bubbles carried by the glue to the maximum extent.
Furthermore, in the step S3, the heating temperature of the LED support with the potting adhesive dispensed is 120 to 160 ℃, preferably 150 ℃, and the heating time is 10 to 80 seconds, preferably 30 seconds. The purpose is to heat the LED support for 30s at the heating temperature of 150 ℃, so that whether bubbles generated between the plastic part and the metal part in the cup cavity of the LED support can be dispersed within 30s can be quickly obtained, and when the bubbles can be dispersed within 30s, the production requirement of good grade is met, so that the judgment time can be further shortened, the production qualification rate of the LED support can be further improved, and the air tightness of the produced LED support is required to be higher than the requirements of good grade and good grade.
Further, in step S3, the
Further, in step S4, the detecting
As described above, the embodiments of the present application have been described in detail, but the present application is not limited to the above embodiments. Even if various changes are made in the present application, the protection scope of the present application is still included.
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