阅读说明：本技术 电路板结构及其制造方法 (Circuit board structure and manufacturing method thereof ) 是由 娄微卡 孙奇 吕政明 于 2018-07-16 设计创作，主要内容包括：本发明公开一种电路板结构及其制造方法,该电路板结构的制造方法包含：提供具有N层的导电层的多层板(N为大于2的正整数)；自N层所述导电层中的第一层所述导电层进行一激光钻孔,以形成有未贯穿至N层所述导电层中的第N层所述导电层的一第一激光孔；自N层所述导电层中的第N层所述导电层进行一激光钻孔,以形成有连通至所述第一激光孔的一第二激光孔；及于所述第一激光孔与所述第二激光孔内形成有连接所述第一层所述导电层与第N层所述导电层的一传导体。此外,本发明另公开一种电路板结构。(The invention discloses a circuit board structure and a manufacturing method thereof, wherein the manufacturing method of the circuit board structure comprises the following steps: providing a multilayer board having N conductive layers (N being a positive integer greater than 2); performing laser drilling on the first conductive layer in the N conductive layers to form a first laser hole which does not penetrate through the Nth conductive layer in the N conductive layers; performing laser drilling on the Nth conductive layer in the N conductive layers to form a second laser hole communicated to the first laser hole; and a conductor connected with the first layer of the conducting layer and the Nth layer of the conducting layer is formed in the first laser hole and the second laser hole. In addition, the invention also discloses a circuit board structure.)

1. A method of manufacturing a circuit-board structure, comprising:

the implementation preparation step comprises: providing a multilayer board, wherein the multilayer board comprises N conductive layers, and N is a positive integer greater than 2;

implementing a first laser drilling step: performing laser drilling on the first conductive layer in the N conductive layers to form a first laser hole which does not penetrate through the Nth conductive layer in the N conductive layers;

performing a second laser drilling step: laser drilling is carried out on the conducting layer of the Nth conducting layer in the N conducting layers to form a second laser hole communicated to the first laser hole; and

and (3) conducting: and a conductor for connecting the first layer of the conducting layer and the Nth layer of the conducting layer is formed in the first laser hole and the second laser hole.

2. The method for manufacturing a circuit board structure as claimed in claim 1, wherein in the conducting step, the conductive body is plated on the hole wall of the first laser hole and the hole wall of the second laser hole, and an inner edge of the conductive body surrounds and forms a space.

3. The method of manufacturing a circuit board structure as defined in claim 1, wherein in said conducting step, said conductor is plated on said first laser via and said second laser via, and said first laser via and said second laser via are plated with said conductor.

4. The method of manufacturing a circuit board structure of claim 1, wherein said first laser via and said second laser via are commonly routed through all of said N conductive layers, and said conductor connects all of said N conductive layers.

5. The method for manufacturing a circuit board structure as claimed in claim 1, wherein the number of laser drilling performed is greater than 1 and not greater than N-2, and N is further limited to 4-10.

6. The method of manufacturing a circuit-board structure as claimed in claim 1, further comprising, after the step of conducting, the step of performing a build-up: at least one laminated structure is additionally arranged on each of two opposite plate surfaces of the multilayer plate.

7. A circuit-board structure, characterized in that it is made by the method of manufacturing a circuit-board structure according to any one of claims 1 to 6.

8. A circuit board structure, comprising:

a multilayer board including N conductive layers, N being a positive integer greater than 2, and the multilayer board being formed with a first laser hole and a second laser hole which are communicated with each other, the first laser hole being formed by recessing a first one of the N conductive layers from the conductive layer, and the second laser hole being formed by recessing an Nth one of the N conductive layers from the conductive layer; the aperture of the first laser hole and the aperture of the second laser hole are gradually increased from the junction of the first laser hole and the second laser hole to the direction away from each other; and

and the conductor is positioned in the first laser hole and the second laser hole and is connected with the first layer of the conducting layer and the Nth layer of the conducting layer.

9. The circuit board structure of claim 8, wherein the conductive body is plated on the hole wall of the first laser hole and the hole wall of the second laser hole, and an inner edge of the conductive body surrounds a space.

10. The circuit board structure of claim 8, wherein the conductor is plated to the first laser via and the second laser via, and the first laser via and the second laser via are plated with the conductor.

Technical Field

The present invention relates to a circuit board, and more particularly, to a circuit board structure and a method for manufacturing the same without using mechanical drilling.

Background

As shown in fig. 1, the conventional circuit board structure 100 ' is mostly implemented by mechanical drilling when forming a through hole 2 ' penetrating through the multi-layer board 1 '. However, it is expected that the design density of the circuit board structure is higher and higher, and the use of the mechanical drilling method not only lengthens the production time, but also reduces the wiring density of the circuit board structure.

In addition, in another conventional circuit board structure, which is not shown, each layer of the multi-layer board is penetrated through by laser drilling and then plated, so that the multi-layer board is formed with through holes and conductors plated in the through holes. However, the laser drilling on each layer of board obviously lengthens the production time, thereby increasing the production cost of the circuit board structure.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.

Disclosure of Invention

The present invention is directed to a circuit board structure and a method for manufacturing the same, which can effectively overcome the defects of the conventional circuit board structure.

The invention discloses a manufacturing method of a circuit board structure, which comprises the following steps: implementing a preparation step: providing a multilayer board, wherein the multilayer board comprises N conductive layers, and N is a positive integer greater than 2; performing a first laser drilling step: performing laser drilling on the first conductive layer in the N conductive layers to form a first laser hole which does not penetrate through the Nth conductive layer in the N conductive layers; performing a second laser drilling step: performing laser drilling on the Nth conductive layer in the N conductive layers to form a second laser hole communicated to the first laser hole; and implementing a conducting step: and a conductor connected with the first layer of the conducting layer and the Nth layer of the conducting layer is formed in the first laser hole and the second laser hole. The embodiment of the invention also discloses a circuit board structure which is manufactured by the manufacturing method of the circuit board structure.

The present invention also discloses a circuit board structure, comprising: a multilayer board comprising N conductive layers, wherein N is a positive integer greater than 2, and the multilayer board is formed with a first laser hole and a second laser hole which are communicated with each other, the first laser hole is formed by recessing a first one of the N conductive layers from the conductive layer, and the second laser hole is formed by recessing an Nth one of the N conductive layers from the conductive layer; the aperture of the first laser hole and the aperture of the second laser hole are gradually increased from the junction of the first laser hole and the second laser hole to the direction away from each other; and the conductor is positioned in the first laser hole and the second laser hole and is connected with the first layer of the conducting layer and the Nth layer of the conducting layer.

In summary, the circuit board structure and the manufacturing method thereof disclosed by the present invention are capable of forming the first laser hole and the second laser hole penetrating through the multi-layer board by using a laser drilling method and using a small number of laser drilling times, so as to eliminate the need of mechanical drilling, and further enable the circuit board structure and the manufacturing method thereof to have a short production time and a low production and manufacturing cost, and to be applied to a higher-density wiring design.

For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.

Drawings

FIG. 1 is a schematic diagram of a conventional circuit board structure;

FIG. 2 is a schematic view of step S110 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 3 is a schematic view of step S120 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 4 is a schematic diagram of step S130 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 5A is a schematic view of step S141 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 5B is a schematic view of step S142 of the method for manufacturing a circuit board structure according to the present invention;

FIG. 6A is a first schematic view of a step S150 of the method for manufacturing a circuit board structure according to the present invention;

fig. 6B is a schematic view (ii) of step S150 of the method for manufacturing a circuit board structure according to the present invention.

Description of the symbols

Detailed Description

Please refer to fig. 2 to fig. 6B, which are exemplary embodiments of the present invention, and it should be noted that, in the embodiments, the related numbers and shapes mentioned in the accompanying drawings are only used for describing the embodiments of the present invention in detail, so as to facilitate the understanding of the contents of the present invention, and not for limiting the protection scope of the present invention.

The present embodiment discloses a circuit board structure and a method for manufacturing the same, and the circuit board structure is manufactured by the method for manufacturing the circuit board structure in the present embodiment, but the invention is not limited thereto. That is, in other embodiments not shown in the present disclosure, the circuit board structure may be manufactured by other manufacturing methods.

Furthermore, in order to facilitate understanding of the specific structure of the circuit board structure, the method for manufacturing the circuit board structure of the present embodiment will be described first, and then the specific structure of the circuit board structure will be described.

[ method for manufacturing Circuit Board Structure ]

It should be noted that, for the convenience of describing the present embodiment, the drawings only show the relevant partial configurations. As shown in fig. 2 to fig. 6B, the method for manufacturing a circuit board structure in this embodiment includes a preparation step S110, a first laser drilling step S120, a second laser drilling step S130, a conducting step S140, and a layer-adding step S150, but the present invention is not limited to the sequence or implementation manner of the steps S110 to S150.

For example, in other embodiments not shown in the present invention, the steps S110 to S150 may also be changed or increased or decreased according to actual design requirements. In addition, the respective steps S110 to S150 of the method for manufacturing the circuit board structure of the present embodiment will be described below.

As shown in fig. 2, the preparation step S110 is implemented: a multilayer board 1 is provided, and the multilayer board 1 includes a multilayer board body 11 and N conductive layers 12 disposed on the surface of the multilayer board body 11, where N is a positive integer greater than 2. In the present embodiment, the number of the board bodies 11 of the multi-layer board 1 is N-1, and N is preferably 4 to 10 (for example, the drawing shows that N is 4), but not limited thereto.

As shown in fig. 3, the first laser drilling step S120 is implemented: a laser drilling is performed from a first conductive layer 12 (e.g., the uppermost conductive layer 12 in fig. 3) of the N conductive layers 12, thereby forming a first laser hole 13 that does not penetrate through to an nth conductive layer 12 (e.g., the lowermost conductive layer 12 in fig. 3) of the N conductive layers 12.

The aperture D13 of the first laser hole 13 preferably decreases from the first conductive layer 12 to the nth conductive layer 12 (e.g., downward in fig. 3) to form a truncated cone-like structure, but the invention is not limited thereto. Furthermore, the maximum aperture of the first laser holes 13 (e.g., the aperture of the first laser holes 13 corresponding to the first conductive layer 12) is preferably not larger than the minimum aperture of the existing mechanical drilling.

As shown in fig. 4, the second laser drilling step S130 is implemented: a laser drilling is performed from the nth conductive layer 12 (e.g., the lowermost conductive layer 12 in fig. 4) among the N conductive layers 12 to form a second laser hole 14 connected to the first laser hole 13.

The aperture of the second laser hole 14 is preferably decreased from the nth conductive layer 12 toward the first conductive layer 12 (e.g., upward in fig. 4) for forming a structure similar to a truncated cone, but the invention is not limited thereto. Furthermore, the maximum aperture of the second laser via 14 (e.g., the aperture of the second laser via 14 corresponding to the Nth conductive layer 12) is preferably not larger than the minimum aperture of the conventional mechanical drilling.

In more detail, in the embodiment, the maximum value of the aperture of the first laser hole 13 is substantially equal to the maximum value of the aperture of the second laser hole 14, and the aperture of the first laser hole 13 and the aperture of the second laser hole 14 are gradually increased from the boundary of the two towards the directions away from each other (for example, upward and downward in fig. 4), and the boundary is the plate body 11 located at the substantially center, but the invention is not limited thereto.

Furthermore, the first laser via 13 and the second laser via 14 commonly pass through all the N conductive layers 12 in the present embodiment, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, among the other conductive layers 12 located between the first and nth conductive layers 12, at least one conductive layer 12 (i.e., at least one conductive layer 12 of the second to nth-1 conductive layers 12) may not be formed at the positions corresponding to the first and second laser holes 13 and 14, and thus, the laser drilling holes do not penetrate through the conductive layers. In addition, in the method for manufacturing the circuit board structure carried by the present embodiment, the number of laser drilling performed is preferably greater than 1 and not greater than N-2.

As shown in fig. 5A and 5B, the conducting step S140 is implemented: a conductor 2a, 2b connecting the first conductive layer 12 and the nth conductive layer 12 is formed in the first laser hole 13 and the second laser hole 14. In other words, the conductive bodies 2a and 2b of the present embodiment are excluded from being disposed in the holes formed by mechanical drilling.

Furthermore, since the first laser via 13 and the second laser via 14 of the present embodiment commonly pass through all the conductive layers 12 of the N conductive layers 12, the conductors 2a and 2b are connected to all the conductive layers 12 of the N conductive layers 12 in the present embodiment, but the present invention is not limited thereto.

In more detail, the conductive bodies 2a and 2b are formed by electroplating, and the conducting step S140 can be selectively performed by a first electroplating step S141 or a second electroplating step S142 different from the first electroplating step S141 according to different design requirements. The first electroplating step S141 and the second electroplating step S142 included in the conduction step S140 will be described below.

As shown in fig. 5A, the first plating step S141 is performed: the conductor 2a is plated on the hole wall of the first laser hole 13 and the hole wall of the second laser hole 14, and a space 21a is formed by the inner edge of the conductor 2 a. That is, the conductor 2a formed in the first plating step S141 of the present embodiment is a hollow structure.

As shown in fig. 5B, the second electroplating step S142 is performed: the conductor 2b is plated in the first laser hole 13 and the second laser hole 14, and the first laser hole 13 and the second laser hole 14 are fully plated by the conductor 2 b. That is, the conductor 2b formed in the second plating step S142 of the present embodiment is a solid structure.

As shown in fig. 6A and 6B, the step of adding layers S150 is performed: at least one laminated structure 3 is additionally arranged on each of two opposite plate surfaces (for example, an upper plate surface of the uppermost plate body 11 and a lower plate surface of the lowermost plate body 11 in fig. 6A or 6B) of the multilayer plate 1. Wherein the conductors 2a, 2b are sandwiched (or embedded) between the at least two layered structures 3. In fig. 6A, the space 21a inside the conductor 2a is filled with the layered structure 3.

As described above, after the steps S110 to S150 are performed, the method for manufacturing the circuit board structure can manufacture the circuit board structure 100 which can be applied to a higher wiring density and has a shorter production time, but the manufacturing of the circuit board structure 100 of the present invention is not limited to the steps S110 to S150. The following generally describes the specific structure of the circuit board structure 100 of the present embodiment, and please refer to the detailed features already described above.

[ Circuit Board Structure ]

It should be noted that, for the convenience of describing the present embodiment, the drawings only show the relevant partial configurations. As shown in fig. 6A and 6B, the circuit board structure 100 in this embodiment includes a multi-layer board 1, a conductive body 2a, 2B embedded in the multi-layer board 1, and two layered structures 3 respectively covering opposite sides of the multi-layer board 1 and the conductive body 2a, 2B.

The multilayer board 1 includes a multilayer board body 11 and N conductive layers 12 disposed on the board surface of the multilayer board body 11, where N is a positive integer greater than 2. The multilayer board 1 is formed with a first laser hole 13 and a second laser hole 14 which are communicated with each other, and the first laser hole 13 and the second laser hole 14 together form a through hole which is equivalent to a through hole penetrating through the multilayer board 1.

Further, the first laser holes 13 are formed by recessing from the first conductive layer 12 (e.g., the uppermost conductive layer 12 in fig. 6A or 6B) of the N conductive layers 12, the second laser holes 14 are formed by recessing from the nth conductive layer 12 (e.g., the lowermost conductive layer 12 in fig. 6A or 6B) of the N conductive layers 12, and the aperture of the first laser holes 13 and the aperture of the second laser holes 14 are gradually increased from the junction therebetween toward a direction away from each other.

As shown in fig. 6A and 6B, the conductors 2a and 2B are located in the first laser via 13 and the second laser via 14 of the multi-layer board 1, and the conductors 2a and 2B connect the first conductive layer 12 and the nth conductive layer 12, and the conductors 2a and 2B connect all the conductive layers 12 in the N conductive layers 12 in this embodiment, but the invention is not limited thereto.

In more detail, the conductor includes two types as shown in fig. 6A and 6B in the present embodiment. As shown in fig. 6A, the conductive body 2a is plated on the hole wall of the first laser hole 13 and the hole wall of the second laser hole 14, and a space 21a is formed by the inner edge of the conductive body 2 a. That is, the conductor 2a shown in fig. 6A has a hollow structure. Furthermore, as shown in fig. 6B, the conductor 2B is plated in the first laser hole 13 and the second laser hole 14, and the first laser hole 13 and the second laser hole 14 are fully plated by the conductor 2B; that is, the conductor 2B shown in fig. 6B is a solid structure.

[ technical effects of embodiments of the present invention ]

In summary, the circuit board structure 100 and the manufacturing method thereof disclosed in the embodiments of the present invention are configured to form the first laser hole 13 and the second laser hole 14 penetrating through the multi-layer board 1 by using a laser drilling method and using a small number of laser drilling times, so as to eliminate the need of using mechanical drilling, and further enable the circuit board structure 100 and the manufacturing method thereof to have a short production time and a low production cost, and to be applied to a higher-density wiring design.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the present invention, which is defined by the appended claims.