阅读说明：本技术 分类装置 (Sorting device ) 是由 原佳明 于 2018-07-19 设计创作，主要内容包括：本发明提供能准确地对大量电子零件进行分类而不误分类的分类装置。分类装置(1)基于由检查装置判定的分类级别将电子零件分类收纳于多个收纳部(2A～2F)中对应的收纳部,具有：投入口构件(3),具有与多个收纳部(2A～2F)分别对应的多个投入口(3A～3F)；移动机构(5),基于由检查装置判定的分类级别使投入口构件(3)移动来使多个投入口(3A～3F)中对应的投入口向电子零件的投入位置移动；多个滑道(4A～4F),将电子零件分别引导至多个收纳部(2A～2F),入口侧分别固定于投入口构件(3)的多个投入口(3A～3F),无论投入口构件(3)的移动位置如何,出口侧分别位于多个收纳部(2A～2F)内。(The invention provides a sorting device capable of accurately sorting a large number of electronic parts without erroneous sorting. The sorting device (1) sorts and stores electronic components in corresponding storage parts of a plurality of storage parts (2A-2F) based on the sorting level determined by the inspection device, and comprises: an inlet member (3) having a plurality of inlets (3A-3F) corresponding to the plurality of receiving sections (2A-2F); a moving mechanism (5) for moving the inlet member (3) based on the classification level determined by the inspection device to move the corresponding inlet of the plurality of inlets (3A-3F) to the input position of the electronic component; and a plurality of slideways (4A-4F) for guiding the electronic components to the plurality of accommodating parts (2A-2F), wherein the inlet sides are respectively fixed on the plurality of input ports (3A-3F) of the input port member (3), and the outlet sides are respectively positioned in the plurality of accommodating parts (2A-2F) regardless of the moving position of the input port member (3).)

1, kinds of sorting devices for sorting and storing electronic parts in corresponding ones of a plurality of storage sections based on a sorting level determined by an inspection device, the sorting device comprising:

an inlet member having a plurality of inlets corresponding to the plurality of receiving portions, respectively;

a moving mechanism that moves the inlet member based on the classification level determined by the inspection device, thereby moving a corresponding inlet of the plurality of inlets to the electronic component input position; and

and a plurality of slide rails for guiding the electronic components to the plurality of receiving portions, wherein inlet sides are fixed to the plurality of inlets of the inlet member, and outlet sides are located in the plurality of receiving portions, respectively, regardless of a moving position of the inlet member.

2. The sorting apparatus of claim 1,

in the inlet member, the plurality of inlets are disposed on the same plane.

3. The sorting apparatus of claim 2,

in the inlet member, the plurality of inlets are arranged on the same circle,

the moving mechanism causes the inlet member to perform a translational motion within a plane in which the plurality of inlets are arranged.

4. The sorting apparatus according to claim 1 or 2,

the plurality of inlets are arranged on the same line on the inlet member,

the moving mechanism moves the inlet member in the direction in which the plurality of inlets are arranged.

Technical Field

The present invention relates to kinds of sorting devices for sorting and storing electronic components such as small semiconductors in storage units based on inspection results such as electrical characteristic inspection and appearance inspection.

Background

In this case, after the electronic components are taken out from the lead frame, typically, they are transported by using a rotary transport apparatus composed of a rotary table, and in this transportation process, series processing necessary for shipment such as measurement of external dimensions and electrical characteristics and marking is performed, and then the electronic components are inserted into a carrier tape for packaging (carrier tape).

However, even if a lot of kinds of electronic components are handled and manufactured by the same process and the same apparatus, considerable variation occurs in the lot due to the reference value characteristics, however, even if the variation occurs, all the electronic components having the characteristic values that deviate from the reference value are not regarded as defective products, and are classified according to the characteristic values and used for a circuit that is suitable for the characteristic value, or are classified again and used separately, and therefore, it is necessary to classify the electronic components by classification level (rank) based on the inspection result.

Conventionally, as a sorting apparatus for sorting electronic components by sort levels based on inspection results, there is known, for example, an apparatus described in patent document 1, the sorting apparatus including an input pipe arranged at a predetermined position to input electronic components after quality inspection, a swing pipe connected to the input pipe so as to be swingable, a distribution member having a number of distribution ports corresponding to the level of the quality of the electronic components, and a driving device swinging the swing pipe so that a lower end portion of the swing pipe is positioned at any of () of the distribution ports, the sorting apparatus being configured to separate the electronic components according to the level of the quality by passing the electronic components after quality inspection through the input pipe, the swing pipe, and the distribution ports.

Disclosure of Invention

Therefore, an object of the present invention is to provide kinds of sorting devices capable of accurately sorting a large number of electronic components without misclassification.

Means for solving the problems

The present invention provides a sorting apparatus for sorting and storing electronic components in corresponding storage sections of a plurality of storage sections based on a sorting level determined by an inspection apparatus, the sorting apparatus including: an inlet member having a plurality of inlets corresponding to the plurality of receiving portions, respectively; a moving mechanism for moving the inlet member based on the classification level determined by the inspection device, thereby moving the corresponding inlet of the plurality of inlets to the input position of the electronic component; and a plurality of slide ways for guiding the electronic components to the plurality of receiving parts respectively, wherein the inlet sides are fixed to the plurality of input openings of the input member respectively, and the outlet sides are positioned in the plurality of receiving parts respectively no matter how the input member moves.

According to the sorting apparatus of the present invention, the drop port member is moved based on the sorting level determined by the inspection apparatus, so that the corresponding drop port among the plurality of drop ports is moved to the drop position of the electronic component, and when the electronic component is dropped from the drop position, the dropped electronic component is guided to the corresponding storage section through the drop port and guided by the chute, and at this time, regardless of the moving position of the drop port member, the outlet sides of the plurality of chutes are positioned in the corresponding storage sections, respectively, and the electronic component is dropped in a state where the inlet side of the chute guiding to the correct storage section is positioned at the drop port, and therefore, the electronic component is guided to the correct storage section.

Effects of the invention

According to the sorting apparatus of the present invention, since the electronic components are thrown in with the inlet side of the chute leading to the correct storage section positioned at the inlet, erroneous sorting does not occur, and high-speed sorting can be accurately performed.

Drawings

Fig. 1 is a plan view of an electronic component sorting apparatus according to an embodiment of the present invention.

Fig. 2 is a sectional view taken along line II-II of fig. 1.

Fig. 3 is a sectional view taken along line III-III of fig. 2.

Fig. 4 is a front perspective view of the sorting apparatus of fig. 1.

Fig. 5 is an explanatory view showing a state where the inlet member is moved, fig. 5(a) is a view showing a cross section taken along line V-V of fig. 4, and fig. 5(B) is a front perspective view.

Fig. 6 is an explanatory view showing a state where the inlet member is moved, fig. 6(a) is a view showing a cross section taken along line V-V of fig. 4, and fig. 6(B) is a front perspective view.

Fig. 7 is an explanatory view showing a state where the inlet member is moved, fig. 7(a) is a view showing a cross section taken along line V-V of fig. 4, and fig. 7(B) is a front perspective view.

Fig. 8 is an explanatory view showing a state where the inlet member is moved, fig. 7(a) is a view showing a cross section taken along line V-V of fig. 4, and fig. 7(B) is a front perspective view.

Fig. 9 is a diagram showing the operation of the sorting apparatus according to another embodiment of the present invention, in which fig. 9 (a) is a plan view in which an upper surface cover is omitted, and fig. 9(B) is a front perspective view.

Fig. 10 is a diagram showing the operation of the sorting apparatus according to another embodiment of the present invention, in which fig. 10(a) is a plan view in which an upper surface cover is omitted, and fig. 10(B) is a front perspective view.

Fig. 11 is a diagram showing the operation of the sorting apparatus according to another embodiment of the present invention, in which fig. 11(a) is a plan view in which an upper surface cover is omitted, and fig. 11(B) is a front perspective view.

Fig. 12 is a diagram showing the entire configuration of an electronic component manufacturing apparatus incorporating the sorting apparatus according to the present embodiment, in which fig. 12(a) is a plan view and fig. 12(B) is a side view.

Fig. 13 is a configuration diagram of an electronic component supply device.

Description of reference numerals:

1. 1A sorting device

2A-2F, 6A-6C containing parts

3. 7 inlet component

3A-3F, 7A-7C inlet

4A-4F, 8A-8C slideway

5. 9 moving mechanism

9A, 9B cylinder

10 casing

11 upper surface cover

12 throwing-in mouth

50 rotating electric machine

50A rotary shaft

51 moving axis

52 eccentric rotating plate

53 guide part

100 electronic component manufacturing apparatus

101A spherical feeder

101B linear feeder

102 process unit

102A discharge step

102B polarity determination step

102C left-right reversing process

102D test contact procedure

102E marking Process

102F appearance inspection step

102G picking Process

102H encapsulation Process

102I defective removal process

103 operating unit

103A support part

103B adsorption nozzle

Tip of 103C mouth

104 turntable

105 direct drive motor

106 drive unit

200 electronic component supply device

204 holder

205 pick-up device

210 feed tray

241 sliding piece

242 pin

251 arm

252 adsorption nozzle

Detailed Description

Fig. 1 is a plan view of a sorting apparatus for electronic components according to an embodiment of the present invention, fig. 2 is a sectional view taken along line II-II of fig. 1, fig. 3 is a sectional view taken along line III-III of fig. 2, and fig. 4 is a front perspective view of the sorting apparatus of fig. 1.

As shown in fig. 1 to 4, the electronic component sorting apparatus 1 according to the embodiment of the present invention includes a plurality of storage units 2A, 2B, 2C, 2D, 2E, and 2F in a casing 10, and sorts and stores electronic components in the storage units 2A to 2F of the plurality of storage units 2A to 2F of the corresponding sort level based on the results of inspections such as electrical characteristic inspection, appearance inspection, and optical characteristic inspection performed by an unillustrated inspection device and the determined sort level. Here, the classification level refers not only to a level at which electronic components regarded as defective products are classified according to the degree of failure, but also to a level at which electronic components are classified according to the degree of non-defective products, and a level at which defective products are classified according to the degree of non-defective products.

The classification device 1 further includes: an inlet member 3 having a plurality of inlets 3A, 3B, 3C, 3D, 3E, 3F corresponding to the plurality of storage sections 2A to 2F, respectively; a plurality of slideways (shooters) 4A, 4B, 4C, 4D, 4E, 4F that guide the electronic components that are respectively put into the plurality of input ports 3A to 3F of the input port member 3 to the corresponding storage sections 2A to 2F; and a moving mechanism 5 for moving the inlet member 3. An inlet 12 is provided in an upper surface cover 11 of the housing 10 at a position (input position) where the electronic component inspected by the inspection apparatus is input.

The inlet member 3 is a plate (plate) that moves along the lower surface 11A of the upper surface cover 11 of the housing 10, the plurality of inlets 3A to 3F are arranged at 60 ° intervals on the same circle 30 on the same plane facing the lower surface 11A of the upper surface cover 11 of the housing 10, the inlet sides of the plurality of runners 4A to 4F are fixed to the plurality of inlets 3A to 3F of the inlet member 3, respectively, the outlet sides of the plurality of runners 4A to 4F are arranged in the corresponding storage sections 2A to 2F, respectively, and it is noted that, as will be described later in detail, the outlet (lower end) sides of the plurality of runners 4A to 4F are positioned in the plurality of storage sections 2A to 2F regardless of the movement position of the inlet member 3.

The moving mechanism 5 moves the inlet member 3 based on the determination level determined by the inspection device, not shown, and thereby moves the corresponding inlet 3A to 3F among the plurality of inlets 3A to 3F to the position where the electronic component is to be put, that is, to the position of the inlet 12.

The moving mechanism 5 includes: a rotary motor 50 as a driving device; a moving shaft 51 connected to the inlet member 3 to move the inlet member 3; an eccentric rotating plate 52 fixed to a rotating shaft 50A of the rotating motor 50 and supporting the moving shaft 51 to be rotatable about an axis eccentric to the rotating shaft 50A; and a guide portion 53 that supports the inlet member 3 so as to be capable of translational movement along the lower surface 11A of the upper surface cover 11 of the housing 10. The guide 53 allows the inlet member 3 to slide and move in both the X-axis and Y-axis directions shown in fig. 3.

In the moving mechanism 5, the eccentric rotary plate 52 rotates with the rotation of the rotary shaft 50A of the rotary motor 50, and the moving shaft 51 rotates. At this time, the rotation of the rotary shaft 50A is converted into the translation of the inlet member 3 by guiding the inlet member 3 by the guide portion 53, and the plurality of inlets 3A to 3F on the inlet member 3 move in a circle while maintaining the positional relationship therebetween.

Fig. 5 to 8 are explanatory views showing a state in which the inlet member 3 is moved, each of which is a view showing a cross section taken along line V-V in fig. 4 (a), and a front perspective view (B). As shown in fig. 5, when an electronic component is input into the input port 12 in a state where the input port 3A among the plurality of input ports 3A to 3F of the input port member 3 is located at a position overlapping the input port 12 as an input position of the electronic component, the input electronic component is guided to the storage section 2A through the input port 3A and the slide 4A and stored in the storage section 2A (see a hatched portion in fig. 5). At this time, the exit sides of the slideways 4B to 4F fixed to the other input ports 3B to 3F are located in the corresponding storage sections 2B to 2F, respectively.

When the rotary electric machine 50 is rotated 60 ° in the direction of the arrow R (clockwise) from the state shown in fig. 5, as shown in fig. 6, the inlet member 3 is translated along the lower surface 11A of the upper surface cover 11 of the housing 10, that is, in the plane in which the plurality of inlets 3A to 3F are arranged, and the inlet 3B of the plurality of inlets 3A to 3F of the inlet member 3 is arranged at a position overlapping the inlet 12 which is the input position of the electronic component. In this state, when the electronic component is introduced into the inlet 12, the introduced electronic component is guided to the housing portion 2B through the inlet 3B and the chute 4B and is housed in the housing portion 2B (see a hatched portion in fig. 6). At this time, the exit sides of the slideways 4A and 4C to 4F fixed to the other input ports 3A and 3C to 3F are located in the corresponding storage sections 2A and 2C to 2F, respectively.

When the rotary electric machine 50 is rotated by 60 ° in the direction of the arrow R from the state shown in fig. 6 (or by 120 ° from the state shown in fig. 5), as shown in fig. 7, the inlet port member 3 is translated in the plane in which the plurality of inlet ports 3A to 3F are arranged, and the inlet port 3C of the plurality of inlet ports 3A to 3F of the inlet port member 3 is arranged at a position overlapping the inlet port 12 as the input position of the electronic component. In this state, when the electronic component is introduced into the inlet 12, the introduced electronic component is guided to the housing portion 2C through the inlet 3C and the chute 4C and is housed in the housing portion 2C (see a hatched portion in fig. 7). At this time, the exit sides of the slideways 4A, 4B, 4D to 4F fixed to the other input ports 3A, 3B, 3D to 3F are located in the corresponding receiving portions 2A, 2B, 2D to 2F, respectively.

When the rotary electric machine 50 is rotated 60 ° in the direction of the arrow R from the state shown in fig. 7 (or rotated 120 ° from the state shown in fig. 6 or rotated 180 ° from the state shown in fig. 5), as shown in fig. 8, the inlet member 3 is translated in the plane in which the plurality of inlets 3A to 3F are arranged, and the inlet 3D of the plurality of inlets 3A to 3F of the inlet member 3 is arranged at a position overlapping the inlet 12 that is the input position of the electronic component (see the hatched portion in fig. 8). In this state, when the electronic component is thrown into the throw-in port 12, the thrown-in electronic component is guided to the storage section 2D through the throw-in port 3D and the chute 4D and stored in the storage section 2D. At this time, the exit sides of the slideways 4A to 4C, 4E, 4F fixed to the other input ports 3A to 3C, 3E, 3F are located in the corresponding receiving portions 2A to 2C, 2E, 2F, respectively.

Similarly, when the rotary motor 50 is rotated by 60 ° in the direction of the arrow R, the input ports 3E and 3F are sequentially arranged at positions overlapping the input port 12 as the input position of the electronic component, and the electronic component input to the input port 12 is stored in the storage sections 2E and 2F through the input ports 3E and 3F and the slideways 4E and 4F, respectively. At this time, the exit side of each of the slideways 4A to 4F is always positioned in the storage sections 2A to 2F. Fig. 5 shows the lower end positions of the respective slide paths 4A to 4F by imaginary lines (two-dot chain lines) when the inlet member 3 is moved by rotating the rotary motor 50 by 360 ° at 60 ° each time. The inlet member 3 may be moved by rotating the rotary motor 50 in the direction opposite to the arrow R.

As described above, in the sorting apparatus 1 of the present embodiment, the exit sides of the slideways 4A to 4F are always located in the storage sections 2A to 2F corresponding to , respectively, regardless of the rotation angle of the rotating motor 50, therefore, in the sorting apparatus 1, the drop port member 3 is moved according to the sorting level determined by the inspection apparatus, any (any ) of the drop ports 3A to 3F corresponding to the sorting level are arranged at positions overlapping with the drop port 12 as the drop position of the electronic component, and the electronic component is dropped into the drop port 12, and even immediately after the dropped electronic component enters the slideways 4A to 4F through the drop ports 3A to 3F, that is, the electronic component is still located in the slideways 4A to 4F and before being stored in the storage sections 2A to 2F, the drop port member 3 can be moved.

That is, in the sorting apparatus 1 of the present embodiment, regardless of the moving position of the inlet member 3, the outlet sides of the slideways 4A to 4F are positioned in the corresponding storage sections 2A to 2F, respectively, and the electronic component is introduced in a state where the inlet side of the slideways 4A to 4F that guide the correct storage sections 2A to 2F is positioned in the inlet 12, so that the electronic component is guided to the correct storage sections 2A to 2F, and erroneous sorting does not occur, and further, even if the inlet member 3 is moved based on the sorting level of the electronic component that is introduced next after the electronic component is introduced into the inlet 3A to 3F, sorting is performed to the corresponding storage sections 2A to 2F, so that a large number of electronic components can be sorted accurately at high speed.

The following configuration may be adopted: the slides 4A to 4F are formed of a flexible material such as rubber, and the upper surface openings of the storage sections 2A to 2F are covered with a cover, thereby preventing the electronic components, which are put into the storage sections 2A to 2F from the slides 4A to 4F, from flying out.

Further, in the above-described embodiment, the example in which the inlets 3A to 3F are changed by the rotation angle of the rotating electric machine 50 has been described, but the present invention is not limited to the rotating electric machine 50, and a configuration in which the inlets 3A to 3F are changed by combining linear motion devices such as groups or a plurality of groups of cylinders (cyclinders) may be adopted.

Fig. 9 to 11 are views showing the operation of the sorting apparatus according to another embodiment of the present invention, wherein each of the views (a) is a plan view with the upper surface cover omitted and (B) is a front perspective view.

The sorting device 1A shown in fig. 9 to 11 includes a plurality of storage units 6A, 6B, and 6C. The inlet member 7 is a classification plate with a slide formed with a plurality of slides 8A, 8B, and 8C. The sorting device 1A further includes a moving mechanism 9 for moving the inlet member 7 in the X direction along the lower surface 11A of the upper surface cover 11.

On the upper surface of the inlet member 7, inlet ports 7A, 7B, 7C, which are inlet ports of the plurality of slideways 8A, 8B, 8C, are formed on the same line extending in the X direction, outlet sides of the slideways 8A, 8B, 8C are arranged in the corresponding storage portions 6A, 6B, 6C, respectively, and are provided so as to be located in the corresponding storage portions 6A, 6B, 6C, respectively, regardless of the movement position of the inlet member 7.

The moving mechanism 9 moves the inlet port members 7 in the arrangement direction (X direction) of the plurality of inlet ports 7A to 7C, thereby moving the inlet ports 7A to 7C to the position (inlet position P) of the inlet port 12 of the upper surface cover 11, and the moving mechanism 9 is constituted by, for example, point positioning type cylinders 9A and 9B connected in series.

In the state shown in fig. 9, the input port 7A is located at the input position P, and the electronic component input from the input position P to the input port 7A is input to the housing 6A through the slide 8A (see the hatched portion of fig. 9B), when the -side cylinder 9A is retracted from the state shown in fig. 9, the input port 7B is moved to the input position P as shown in fig. 10, in this state, the electronic component input from the input position P to the input port 7B is input to the housing 6B through the slide 8B (see the hatched portion of fig. 10B), and when both cylinders 9A and 9B are retracted, the input port 7C is moved to the input position P as shown in fig. 11, and the electronic component input from the input position P to the input port 7C is input to the housing 6C through the slide 8C (see the hatched portion of fig. 11B).

As described above, even if the plurality of inlet ports 7A to 7C are arranged on the same line and the inlet port member 7 is moved in the arrangement direction (X direction) of the plurality of inlet ports 7A to 7C by the moving mechanism 9, the electronic component is introduced in a state where the inlet side of the slide ways 8A to 8C that guide the electronic component to the correct storage sections 6A to 6C is positioned at the inlet port 12, and therefore, the electronic component is surely guided to the correct storage sections 6A to 6C, and erroneous classification does not occur.

The above description has explained an example in which the moving mechanism 9 is configured by point positioning type cylinders 9A and 9B connected in series, but may be configured by a multipoint positioning type cylinder, a linear motor, a combination of a ball screw and various motors, a combination of a rack and pinion (rack pinion) and various motors, or the like.

Next, a device in which the sorting devices 1 and 1A in the above embodiments are assembled will be described. Fig. 12 is a diagram showing the entire configuration of an electronic component manufacturing apparatus incorporating the sorting apparatus 1, 1A of the present embodiment, in which fig. 12(a) is a plan view and fig. 12(B) is a side view.

The electronic component manufacturing apparatus 100 shown in fig. 12 is an apparatus for sequentially conveying a plurality of electronic components S to a plurality of process units 102 as process means which are arranged in an arc shape in order at equal intervals. The electronic component manufacturing apparatus 100 includes: a plurality of handling units (handling units) 103 as electronic component holders for holding the electronic components S, and a turn table (turn table)104 as a conveying mechanism for conveying the handling units 103 to the process unit 102.

The electronic component manufacturing apparatus 100 further includes: a direct drive motor (direct drive motor)105 as a drive source for conveying that drives the turntable 104, and a plurality of drive units 106 as holding portion drive mechanisms that are provided independently of each other so as to individually drive the operation units 103.

The turn table 104 is horizontally disposed above the plurality of process units 102 arranged in an arc shape, separately from the process units 102. The plurality of operation units 103 are disposed on the outer periphery of the turntable 104 at the same intervals as the plurality of process units 102.

The operation unit 103 includes an adsorption nozzle 103B and a support portion 103A that supports the adsorption nozzle 103B to be movable in the vertical direction. The support portion 103A is provided above the turntable 104.

As shown in FIG. 12A, the plurality of operation units 103 are arranged on the outer periphery of the turn table 104 such that, when operation units 103 and process positions P of the process treatment units 102 are overlapped, the other operation units 103 are also overlapped with any (certain ) process positions P, respectively, that is, the plurality of process treatment units 102 are arranged such that the process treatment positions P for performing the process treatment on the electronic component S are provided, and the centers on the horizontal plane of the process treatment positions P are arranged at equal intervals on circles coaxial with the turn table 104, and then the plurality of operation units 103 are arranged such that the center on the horizontal plane of the nozzle tip portion 103C of the suction nozzle 103B is positioned at the center on the horizontal plane of the process treatment position P.

The process unit 102 is constituted by: a discharge step 102A of transferring the electronic component S, which is conveyed in line from the ball feeder (ballfeeder)101A and the linear feeder (linear feeder)101B, from the discharge port (escape) to the operation unit 103; a polarity determination step 102B for determining the polarity of the electronic component S; a left-right reversing step 102C of rotating the electronic component S to replace the polarity based on the polarity determination; a test contact (test contact) step 102D of inspecting electrical characteristics of the electronic component S; a marking (marking) step 102E; an appearance inspection step 102F; a sorting step 102G for removing the electronic component S determined as a defective in the above step; a packaging (taping) step 102H; and a defective removal step 102I for removing the residual parts. The electronic component S is held by the suction nozzle 103B and is rotated and conveyed in the order of the steps 102A to 102I.

The sorting devices 1 and 1A in the present embodiment are incorporated in the sorting step 102G. The sorting apparatus 1, 1A incorporated in the sorting step 102G moves the drop port member 3 according to the classification level of the defective product determined in the test contact step 102D, the marking step 102E, and the appearance inspection step 102F, and sorts the electronic component S dropped into the drop port 12 into the storage sections 2A to 2F by the corresponding drop ports 3A to 3F and the corresponding slideways 4A to 4F, respectively. At this time, as described above, immediately after the electronic component S introduced into the introduction port 12 enters the corresponding introduction ports 3A to 3F, the introduction port member 3 can be moved in preparation for the introduction of the next electronic component S, and therefore, the overall processing time of the electronic component manufacturing apparatus 100 can be shortened.

The electronic component supply apparatus 200 shown in fig. 13 may be used instead of the spherical feeder 101A and the linear feeder 101B. Fig. 13 is a configuration diagram of the electronic component supply apparatus 200.

The electronic component supply device 200 includes: a holder (holder)204 that holds a supply tray 210; and a pick-up (pickup) device 205 that rotates an arm 251 holding the electronic parts S to transfer the electronic parts S from the supply tray 210 to the turn table 104. The pickup device 205 is disposed between the holder 204 and the turntable 104. In particular, the turntable 104, the pickup device 205, and the holder 204 are arranged such that the plane 104A of the turntable 104, the disk surface 204A of the holder 204 on which the disk 210 is supplied, and the rotation surface 205A of the arm 251 are orthogonal to each other.

The holder 204 holds the supply tray 210 in the vertical direction. The holder 204 has a slider (slider)241 for moving the supply tray 210 parallel to the tray surface 204A, and the electronic components S of the supply tray 210 are sequentially arranged toward the predetermined position 212. The slider 241 is, for example, a lead screw (lead screw). Further, particularly in the case where the supply tray 210 is a wafer ring (wafer ring), the holder 204 has the lift-off pin 242 at the center of the movable range of the supply tray 210. The lift pins 242 extend from the opposite side of the parallel mounting surface of the electronic component S toward the supply tray 210. The jacking pin 242 is axially advanceable. The slider 241 causes the electronic components S to sequentially face the lift-up pins 242, and the lift-up pins 242 cause the facing electronic components S to be lifted up from the back side of the supply tray 210. The predetermined position 212 is a predetermined position where the electronic component S to be picked up moves, and is a position facing the knock-up pin 242 when the supply tray 210 is a wafer (wafer).

The pickup device 205 causes the arm 251 to pick up and transfer the electronic part S, which is directed to the actual position 213, to the turntable 104 by the arm 251. The actual position 213 is a position where the electronic part S to be picked up is currently located, and is deviated from the predetermined position 212. The actual position 213 is generated due to the movement accuracy of the slider 241 of the holder 204. A suction nozzle 252 is attached to the tip of the arm 251. The suction nozzle 252 is a holding portion for picking up the electronic component S by suction.

The interior of the suction nozzle 252 is hollow and has an end opened, and the open end projects from the tip end of the arm 251, the interior of the suction nozzle 252 communicates with an air pressure circuit of a negative pressure generating device such as a vacuum pump or an ejector (ejector), and the electronic component S is sucked to the open end by the negative pressure generated by the air pressure circuit, and the electronic component S is detached by breaking the vacuum and opening the atmosphere.

The pickup device 205 rotates the arm 251 about the base end of the arm 251 to displace the elevation angle of the arm 251. The arm 251 faces the supply tray 210 of the holder 204 when oriented in the lateral direction, and can pick up the electronic component S. When the arm 251 is directed upward, it faces the turntable 104 directly above, and can transfer the electronic component S. Further, in addition to the revolution of the arm 251, the pickup 205 moves the arm 251 in parallel at a fixed height in a direction orthogonal to the revolution surface.

In this pickup device 205, in addition to the relay of the electronic part S, the rotation of the arm 251 involves pickup preparation in the longitudinal direction toward the actual position 213. further, the parallel movement of the arm 251 involves pickup preparation in the lateral direction toward the actual position 213. the pickup preparation is a process of aligning the arm 251 with the position of the actual position 213, compensating for the movement deviation of the supply tray 210 on the pickup device 205 side, and correcting the position of the arm 251. the pickup device 205 picks up the electronic part S by aligning the arm 251 with the actual position 213 in straight lines by the rotation and parallel movement of the arm 251, and rotates the arm 251 forward to transfer the electronic part S to the suction nozzle 103B of the turntable 104.

By using the electronic component supply apparatus 200 configured as described above, it is possible to process the electronic components S arranged in an array on the supply tray 210.

Industrial applicability

The sorting device of the present invention is effective as a device for sorting and storing electronic components such as small semiconductors in a storage section based on the results of inspection such as electrical characteristic inspection and appearance inspection.