阅读说明：本技术 一种印制版装联用助焊剂及其制备方法 (soldering flux for printing plate assembly and preparation method thereof ) 是由 詹建朝 于 2018-10-25 设计创作，主要内容包括：本发明提供了一种印制版装联用助焊剂及其制备方法,包括以下重量份组分制备而成：成膜剂24-36份、偶氮异丁腈2-6份、表面活性剂12-16份、氯化锡2-7份、硬脂酸铜3-9份、2-氨基-N-癸烷-乙酰胺4-8份、十六烷基苯基二甲基季铵盐7-11份、二盐基亚磷酸铅8-14份、丁二酸胺6-11份、戊二酸7-16份、乙二醇丁醚40-52份、已二酸二甲酯36-44份。本发明制备得到的助焊剂稳定性高,焊后无残留,能够满足工业应用需求。(The invention provides scaling powder for printing plate assembly and a preparation method thereof, wherein the scaling powder is prepared from the following components, by weight, 24-36 parts of a film-forming agent, 2-6 parts of azoisobutyronitrile, 12-16 parts of a surfactant, 2-7 parts of stannic chloride, 3-9 parts of copper stearate, 4-8 parts of 2-amino-N-decane-acetamide, 7-11 parts of hexadecyl phenyl dimethyl quaternary ammonium salt, 8-14 parts of dibasic lead phosphite, 6-11 parts of ammonium succinate, 7-16 parts of glutaric acid, 40-52 parts of ethylene glycol butyl ether and 36-44 parts of dimethyl adipate.)

1, kinds of scaling powder for printing plate assembly, which is characterized by comprising the following components in parts by weight:

24-36 parts of film-forming agent,

2-6 parts of azoisobutyronitrile,

12-16 parts of surfactant,

2-7 parts of tin chloride,

3-9 parts of copper stearate,

4-8 parts of 2-amino-N-decane-acetamide,

7-11 parts of hexadecyl phenyl dimethyl quaternary ammonium salt,

8-14 parts of dibasic lead phosphite,

6-11 parts of ammonium succinate,

7-16 parts of glutaric acid,

40-52 parts of ethylene glycol butyl ether,

36-44 parts of dimethyl adipate.

2. The flux for printing plate assembly according to claim 1, wherein the film-forming agent is prepared by the following method:

dehydrating polytetrahydrofuran glycol at 120 ℃ for 90min in vacuum, adding 10g of polytetrahydrofuran glycol into a reactor, heating to 60 ℃, adding 18g of acetone for reacting for 20min, then dropwise adding 6g of toluene 2, 4-diisocyanate, stirring for 10min, then adding 18g of acetone, dropwise adding g of dibutyltin dilaurate, reacting for 1h while keeping the temperature, dropwise adding 1.1g of dimethylolpropionic acid, 0.4g of diethylene glycol and 3.2g of modifier, reacting for 3h, cooling to 40 ℃, adding 0.5g of triethylamine for reacting for 20min, then rapidly adding 30mL of deionized water, stirring at high speed for 1h, and removing acetone under reduced pressure to obtain the modified waterborne polyurethane film-forming agent.

3. The process for preparing a film forming agent according to claim 2, wherein the modifying agent is retinol.

4. The scaling powder for printing plate assembly according to claim 1, wherein the surfactant is a mixture of dibromobutenediol, cocamidopropyl betaine, and dioctyl sodium sulfosuccinate at a weight ratio of 0.7:3: 2.

5, preparation method of the soldering flux for printing plate assembly, which is characterized by comprising the following preparation steps:

(1) adding 40-52 parts of ethylene glycol monobutyl ether and 36-44 parts of dimethyl adipate into a reactor, uniformly mixing, heating to 65 ℃, then adding 24-36 parts of a film-forming agent, 6-11 parts of ammonium succinate, 7-16 parts of glutaric acid, 2-6 parts of azoisobutyronitrile and 12-16 parts of a surfactant, and stirring for 30min under heat preservation;

(2) reducing the temperature to 50 ℃, adding 2-7 parts of stannic chloride, 3-9 parts of copper stearate, 4-8 parts of 2-amino-N-decane-acetamide, 7-11 parts of hexadecyl phenyl dimethyl quaternary ammonium salt and 8-14 parts of dibasic lead phosphite, and mixing for 40min to obtain the soldering flux for printing and assembling.

Technical Field

The invention relates to the field of soldering flux, in particular to soldering flux for printing plate assembly and a preparation method thereof.

Background

With the rapid development of the electronic industry, the electronic elements, equipment and circuit design is more advanced, the process is more refined, and the requirement on the welding process of each device is higher and higher, the reliability of the welding process is crucial to ensuring the quality of the whole electronic equipment, the reliability of a welding point is the key to ensuring the product quality in the electronic industry and the instrument and meter industry, the surface tension is a main factor influencing the infiltration of the solder, which is the main function of the soldering flux is to reduce the surface tension of the solder in the welding process, film forming agents and surfactants in the soldering flux play an important role in reducing the surface tension of the solder, the wettability and the flow expansion performance of the solder can be improved, and in order to adapt to the development of the whole electronic industry and improve the welding performance, the soldering flux with good wettability, high stability and good use performance is necessary to be developed.

Disclosure of Invention

The technical problem to be solved is as follows:

the invention aims to provide soldering fluxes for printing plate assembly and a preparation method thereof, and the prepared soldering flux has high stability and no residue and can meet the requirements of industrial application.

The technical scheme is as follows:

the invention provides kinds of soldering flux for printing plate assembly, which is prepared from the following components in parts by weight:

24-36 parts of film-forming agent,

2-6 parts of azoisobutyronitrile,

12-16 parts of surfactant,

2-7 parts of tin chloride,

3-9 parts of copper stearate,

4-8 parts of 2-amino-N-decane-acetamide,

7-11 parts of hexadecyl phenyl dimethyl quaternary ammonium salt,

8-14 parts of dibasic lead phosphite,

6-11 parts of ammonium succinate,

7-16 parts of glutaric acid,

40-52 parts of ethylene glycol butyl ether,

36-44 parts of dimethyl adipate.

Preferably, the scaling powders for printing and assembling are prepared by the following steps of dehydrating polytetrahydrofuran diol at 120 ℃ for 90min in vacuum, adding 10g of polytetrahydrofuran diol into a reactor, heating to 60 ℃, adding 18g of acetone for reacting for 20min, then dropwise adding 6g of toluene 2, 4-diisocyanate, stirring for 10min, then adding 18g of acetone, dropwise adding g of dibutyltin dilaurate, reacting for 1h while keeping the temperature, dropwise adding 1.1g of dimethylolpropionic acid, 0.4g of diethylene glycol and 3.2g of modifier, reacting for 3h, cooling to 40 ℃, adding 0.5g of triethylamine for reacting for 20min, then rapidly adding 30mL of deionized water, and decompressing and removing acetone after stirring for 1h at high speed to obtain the modified waterborne polyurethane film-forming agent.

the preferable method is that the modifier is retinol.

Preferably, the scaling powders for printing plate assembly are prepared by mixing dibromobutenediol, cocamidopropyl betaine and dioctyl sodium sulfosuccinate according to the weight ratio of 0.7:3: 2.

The invention also provides a preparation method of the soldering flux for printing plate assembly, which comprises the following preparation steps:

(1) adding 40-52 parts of ethylene glycol monobutyl ether and 36-44 parts of dimethyl adipate into a reactor, uniformly mixing, heating to 65 ℃, then adding 24-36 parts of a film-forming agent, 6-11 parts of ammonium succinate, 7-16 parts of glutaric acid, 2-6 parts of azoisobutyronitrile and 12-16 parts of a surfactant, and stirring for 30min under heat preservation;

(2) reducing the temperature to 50 ℃, adding 2-7 parts of stannic chloride, 3-9 parts of copper stearate, 4-8 parts of 2-amino-N-decane-acetamide, 7-11 parts of hexadecyl phenyl dimethyl quaternary ammonium salt and 8-14 parts of dibasic lead phosphite, and mixing for 40min to obtain the soldering flux for printing and assembling.

Has the advantages that:

(1) the invention selects the waterborne polyurethane as the film forming agent, modifies the film forming agent, and utilizes the conjugated double bond and hydroxyl structure in the retinol to improve the film forming performance of the film forming agent, so that the spreading performance of the soldering flux is better, and the thermal stability of the soldering flux is improved.

(2) The compound system of the surfactant effectively improves the wettability of the soldering flux, and the prepared soldering flux has good comprehensive performance and can meet industrial application.

Detailed Description

The following examples are presented to enable one of ordinary skill in the art to more fully understand the present invention and are not intended to limit the invention in any way.