阅读说明：本技术 一种电路板用环氧树脂材料 (epoxy resin material for circuit board ) 是由 张玉涛 陈印平 于 2019-11-13 设计创作，主要内容包括：本发明公开了一种电路板用环氧树脂材料,由下述组分按重量份组成,环氧树脂100-150重量份、玻璃纤维230-270重量份、环氧固化剂180-200重量份、环氧聚酯胶150-220重量份、增韧剂20-60重量份和有机硅树脂材料40-120重量份,本发明结构科学合理,使用安全方便,该电路板用环氧树脂材料在制备过程中,通过选取环氧树脂、玻璃纤维和增韧剂进行混合,并向原料混合物中加入环氧固化剂进行固化,使得制得的环氧树脂材料韧性更佳,通过选取纳米SiO2加入二甲苯、分散剂和醋酸丁酯混合液中进行分散,随后加入有机硅树脂材料,进行超生分散,得到有机硅涂料,对环氧树脂基板表面喷涂有机硅涂料,使得制备得出的环氧树脂燃点提高,表面阻燃性能更好。(The invention discloses epoxy resin materials for circuit boards, which are composed of the following components, by weight, 100 parts of epoxy resin, 270 parts of glass fiber, 200 parts of epoxy curing agent, 150 parts of epoxy polyester adhesive, 220 parts of toughening agent, 20-60 parts of toughening agent and 40-120 parts of organic silicon resin material.)

1, kinds of epoxy resin material for circuit board, which is characterized by comprising the following components by weight:

100-150 parts of epoxy resin, 270 parts of glass fiber, 180-200 parts of epoxy curing agent, 150-220 parts of epoxy polyester adhesive, 20-60 parts of toughening agent and 40-120 parts of organic silicon resin material.

2. The kinds of epoxy resin materials for circuit boards, according to claim 1, wherein the length-diameter ratio of the glass fiber is 25:1-5:1, the epoxy curing agent is specifically a T-99 multifunctional epoxy curing agent, and the toughening agent is specifically kinds of carboxyl liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, polysulfide rubber and liquid silicone rubber.

3. The method of preparing kinds of epoxy resin material for circuit board as claimed in any of claim 1-2, comprising the steps of:

s1, mixing the raw materials: selecting epoxy resin, glass fiber and a toughening agent, and stirring and mixing to obtain a raw material mixture;

s2, preparing the coating: adding nano SiO2 into dimethylbenzene, a dispersing agent and butyl acetate, performing ultrasonic dispersion, then adding an organic silicon resin material, and uniformly dispersing to obtain an organic silicon coating;

s3, preparing immersion liquid: selecting epoxy polyester adhesive, adding the epoxy polyester adhesive into a mixed solution of a dispersing agent and acetone, oscillating and dispersing the epoxy polyester adhesive, and uniformly dispersing the epoxy polyester adhesive to obtain an epoxy resin impregnation solution:

s4, curing injection: adding an epoxy curing agent into the raw material mixture obtained in the step S1, uniformly stirring, injecting the uniformly stirred mixture into a pressing die, and molding to obtain an epoxy resin substrate;

s5, immersing and air drying: putting the epoxy resin substrate which is formed by pressing into the epoxy resin soaking liquid, taking out and air-drying;

s6, cleaning and finishing: after cleaning the air-dried epoxy resin substrate, trimming corners of the epoxy resin substrate;

s7, spraying and air drying: and uniformly spraying the organic silicon coating on the surface of the cleaned and trimmed epoxy resin substrate, and air-drying the sprayed epoxy resin substrate.

4. The method for preparing epoxy resin materials for circuit boards as claimed in claim 3, wherein in the step S1, epoxy resin, glass fiber and toughening agent are selected and fully mixed to obtain a raw material mixture, the added epoxy resin is 150 parts by weight, the glass fiber is 230-270 parts by weight, the toughening agent is 40-120 parts by weight, and the time for mixing the epoxy resin, the glass fiber and the toughening agent by stirring is 20-30 min.

5. The method as claimed in claim 3, wherein in step S2, the selected nano SiO2 is added to xylene, a dispersant and butyl acetate for ultrasonic dispersion, and then the silicone resin material is added for uniform dispersion to obtain the silicone coating, wherein the selected nano SiO2 is 30-50 parts by weight, the xylene is 10-15 parts by weight, the dispersant is 20-30 parts by weight, the butyl acetate is 5-12 parts by weight, the silicone resin material is 60-80 parts by weight, the ultrasonic dispersion time is 10-15min, and the dispersant is of triethylhexylphosphoric acid, sodium dodecyl sulfate, methylpentanol and polyacrylamide.

6. The method for preparing epoxy resin materials for circuit boards, according to claim 3, wherein in the step S3, epoxy polyester glue is selected and added into a mixed solution of a dispersing agent and acetone, the mixture is subjected to oscillation dispersion, and the epoxy resin is uniformly dispersed to obtain an epoxy resin immersion solution, wherein the added dispersing agent is 50-60 parts by weight, the added acetone is 40-50 parts by weight, and the weight ratio of the added epoxy polyester glue to the mixed solution of the dispersing agent and the acetone is 1: 3-1: 5.

7. The kinds of epoxy resin material for circuit boards, according to claim 3, wherein in step S4, the epoxy hardener is added to the raw material mixture obtained in step S1, the mixture is uniformly stirred, the uniformly stirred mixture is injected into a stamper, and an epoxy resin substrate is obtained by molding, the epoxy hardener is added in an amount of 80 to 90 parts by weight per 100 parts by weight of the raw material mixture, and the stirring time of the raw material mixture and the epoxy hardener is 5 to 10 min.

8. The method for preparing the epoxy resin material for circuit boards according to claim 3, wherein the step S5 comprises the steps of placing the compression-molded epoxy resin substrate into an epoxy resin impregnation solution, taking out the epoxy resin substrate, and air-drying the epoxy resin substrate, wherein the time for immersing the epoxy resin substrate in the epoxy resin impregnation solution is 20-30S, the temperature for taking out the epoxy resin substrate and air-drying the epoxy resin substrate is 70-85 ℃, and the times for immersing the epoxy resin substrate in the epoxy resin impregnation solution and air-drying the epoxy resin substrate are 1-3 times.

9. The method for preparing the epoxy resin material for circuit boards, according to the step S6, wherein the edges and corners of the epoxy resin substrate are trimmed after the epoxy resin substrate is cleaned, the cleaning solution for cleaning the epoxy resin substrate comprises 30-50 parts by weight of water and 1-3 parts by weight of nitric acid, and the temperature of the environment for trimming the epoxy resin substrate is 60-70 ℃ when the edges and corners of the epoxy resin substrate are trimmed.

10. The method for preparing the epoxy resin material for circuit boards, according to the step S7, wherein the silicone coating is uniformly sprayed on the surface of the cleaned and trimmed epoxy resin substrate, the sprayed epoxy resin substrate is air-dried, the thickness of the silicone coating sprayed in one time is kept between 0.2mm and 0.5mm, the air-drying temperature of the sprayed epoxy resin substrate is kept between 50 ℃ and 60 ℃, and the times of spraying the silicone coating on the epoxy resin substrate and air-drying are 1 to 3.

Technical Field

The invention relates to the technical field of electronic composite materials, in particular to epoxy resin materials for circuit boards.

Background

The name of the circuit board is circuit board, PCB board, aluminum base board, etc., the circuit board makes the circuit miniaturized, visualized, play an important role in the batch production of the fixed circuit and optimizing the electric appliance layout, the epoxy resin is the general name of kinds of polymers containing more than two epoxy groups in the molecule, it is the polycondensation product of epichlorohydrin and bisphenol A or polyol, it is kinds of thermosetting resin, not only the output is the biggest, the variety is the most complete, but also the new modified variety is increasing continuously, because the preparation of the epoxy resin material is convenient, the physical property of the epoxy resin material is excellent, the circuit board has been prepared more and more by using the epoxy resin material;

however, when the existing epoxy resin material in the market is used, the flame retardance and the ignition point of the prepared circuit board are difficult to guarantee, and the epoxy resin material is not completely insulated, so that the insulativity cannot meet the requirements of the prior art.

Disclosure of Invention

The technical scheme provided by the invention can effectively solve the problems that the flame retardance and the ignition point of the prepared circuit board in the background technology are difficult to guarantee, and the epoxy resin material is not completely insulated, so that the insulativity cannot meet the requirements of the prior art.

In order to achieve the purpose, the invention provides the following technical scheme that epoxy resin materials for circuit boards are composed of the following components in parts by weight:

100-150 parts of epoxy resin, 270 parts of glass fiber, 180-200 parts of epoxy curing agent, 150-220 parts of epoxy polyester adhesive, 20-60 parts of toughening agent and 40-120 parts of organic silicon resin material.

According to the technical characteristics, the length-diameter ratio of the glass fiber is 25:1-5:1, the epoxy curing agent is specifically T-99 multifunctional epoxy curing agent produced by chemical Limited of Likun, , and the toughening agent is specifically of carboxyl liquid nitrile rubber, carboxyl-terminated liquid nitrile rubber, polysulfide rubber and liquid silicone rubber.

According to the technical characteristics, the preparation method of the epoxy resin materials for the circuit board comprises the following steps:

s1, mixing the raw materials: selecting epoxy resin, glass fiber and a toughening agent, and stirring and mixing to obtain a raw material mixture;

s2, preparing the coating: adding nano SiO2 into dimethylbenzene, a dispersing agent and butyl acetate, performing ultrasonic dispersion, then adding an organic silicon resin material, and uniformly dispersing to obtain an organic silicon coating;

s3, preparing immersion liquid: selecting epoxy polyester adhesive, adding the epoxy polyester adhesive into a mixed solution of a dispersing agent and acetone, oscillating and dispersing the epoxy polyester adhesive, and uniformly dispersing the epoxy polyester adhesive to obtain an epoxy resin impregnation solution:

s4, curing injection: adding an epoxy curing agent into the raw material mixture obtained in the step S1, uniformly stirring, injecting the uniformly stirred mixture into a pressing die, and molding to obtain an epoxy resin substrate;

s5, immersing and air drying: putting the epoxy resin substrate which is formed by pressing into the epoxy resin soaking liquid, taking out and air-drying;

s6, cleaning and finishing: after cleaning the air-dried epoxy resin substrate, trimming corners of the epoxy resin substrate;

s7, spraying and air drying: and uniformly spraying the organic silicon coating on the surface of the cleaned and trimmed epoxy resin substrate, and air-drying the sprayed epoxy resin substrate.

According to the technical characteristics, in the step S1, epoxy resin, glass fiber and a toughening agent are selected and fully mixed to obtain a raw material mixture, wherein the added epoxy resin accounts for 150 parts by weight, the added glass fiber accounts for 270 parts by weight, the added toughening agent accounts for 40-120 parts by weight, and the stirring and mixing time of the epoxy resin, the glass fiber and the toughening agent is 20-30 min.

According to the technical characteristics, in the step S2, nano SiO2 is selected and added into xylene, a dispersing agent and butyl acetate for ultrasonic dispersion, then an organic silicon resin material is added for uniform dispersion to obtain the organic silicon coating, the selected nano SiO2 accounts for 30-50 parts by weight, the xylene accounts for 10-15 parts by weight, the dispersing agent accounts for 20-30 parts by weight, the butyl acetate accounts for 5-12 parts by weight, the organic silicon resin material accounts for 60-80 parts by weight, and the ultrasonic dispersion time is 10-15 min.

According to the technical characteristics, in the step S3, epoxy polyester glue is selected and added into a mixed solution of a dispersing agent and acetone, oscillation dispersion is carried out, and uniform dispersion is carried out to obtain an epoxy resin immersion liquid, the added dispersing agent is 50-60 parts by weight, the added acetone is 40-50 parts by weight, the weight ratio of the added epoxy polyester glue to the mixed solution of the dispersing agent and the acetone is 1: 3-1:5, and the dispersing agent is specifically of triethylhexylphosphoric acid, sodium dodecyl sulfate, methylpentanol and polyacrylamide.

According to the technical characteristics, in the step S4, the epoxy curing agent is added into the raw material mixture obtained in the step S1, the mixture is uniformly stirred, the uniformly stirred mixture is injected into a compression mold, and the epoxy resin substrate is obtained by molding, wherein the epoxy curing agent is added into each 100 parts by weight of the raw material mixture in an amount of 80-90 parts by weight, and the stirring time of the raw material mixture and the epoxy curing agent is 5-10 min.

According to the technical characteristics, in the step S5, the epoxy resin substrate which is formed by pressing is placed in the epoxy resin soaking liquid and taken out for air drying, the time for soaking the epoxy resin substrate in the epoxy resin soaking liquid is 20-30S, the temperature for taking out and air drying the epoxy resin substrate is 70-85 ℃, and the times for soaking and air drying the epoxy resin substrate in the epoxy resin soaking liquid are 1-3 times.

According to the technical characteristics, in the step S6, after the air-dried epoxy resin substrate is cleaned, corners of the epoxy resin substrate are trimmed, and the cleaning solution for cleaning the epoxy resin substrate comprises the following specific components: 30-50 parts of water and 1-3 parts of nitric acid, wherein the trimming ambient temperature of the epoxy resin substrate is 60-70 ℃ when the corners of the epoxy resin substrate are trimmed.

According to the technical characteristics, in the step S7, the organosilicon paint is uniformly sprayed on the surface of the cleaned and trimmed epoxy resin substrate, the sprayed epoxy resin substrate is air-dried, the thickness of the organosilicon paint sprayed once is kept at 0.2-0.5mm, the air-drying temperature of the sprayed epoxy resin substrate is kept at 50-60 ℃, and the times of spraying the organosilicon paint on the epoxy resin substrate and air-drying are 1-3 times.

Compared with the prior art, the invention has the beneficial effects that:

in the preparation process of the epoxy resin material for the circuit board, the epoxy resin, the glass fiber and the toughening agent are selected and mixed to obtain a raw material mixture, and an epoxy curing agent is added into the raw material mixture to cure the raw material mixture, so that the prepared epoxy resin material has better toughness;

the preparation method comprises the steps of adding nano SiO2 into a mixed solution of xylene, a dispersing agent and butyl acetate for ultrasonic dispersion, adding an organic silicon resin material for ultrasonic dispersion to obtain an organic silicon coating, and uniformly spraying the organic silicon coating on the surface of an epoxy resin substrate, so that the ignition point of the prepared epoxy resin is improved, and the surface flame retardant property is better;

mixing a dispersing agent and acetone, adding epoxy polyester glue to obtain epoxy resin impregnation liquid, and immersing the epoxy resin substrate formed by pressing into the epoxy resin impregnation liquid to improve the insulating property of the prepared epoxy resin material;

the cleaning liquid is prepared from the water and the nitric acid, the epoxy resin substrate is cleaned, and corners of the epoxy resin substrate are trimmed, so that the surface flatness of the prepared epoxy resin material is better.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification , illustrate embodiment of the invention and do not constitute a limitation on the invention.

In the drawings:

FIG. 1 is a schematic flow diagram of the present invention.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.