阅读说明：本技术 半导体加工设备 (Semiconductor processing equipment ) 是由 孙晋博 于 2019-11-27 设计创作，主要内容包括：本发明提供一种半导体加工设备,包括工艺腔室、晶舟、固定套管、升降装置、悬臂梁、热电偶和连接结构,其中,固定套管设置于工艺腔室中,晶舟能够竖直的放置在固定套管中,热电偶可通过水平设置的悬臂梁与升降装置连接,以在固定套管中升降,连接结构分别与悬臂梁和热电偶连接,并能够使热电偶相对于悬臂梁在水平方向上的预设范围内移动。本发明提供的半导体加工设备能够降低热电偶损坏的风险,提高半导体加工设备工作的稳定性,并且能够便于热电偶的安装。(The invention provides semiconductor processing equipment, which comprises a process chamber, a crystal boat, a fixed sleeve, a lifting device, a cantilever beam, a thermocouple and a connecting structure, wherein the fixed sleeve is arranged in the process chamber, the crystal boat can be vertically placed in the fixed sleeve, the thermocouple can be connected with the lifting device through the horizontally arranged cantilever beam to lift in the fixed sleeve, and the connecting structure is respectively connected with the cantilever beam and the thermocouple and can enable the thermocouple to move in a preset range in the horizontal direction relative to the cantilever beam.)

The semiconductor processing equipment is characterized by further comprising a connecting structure, wherein the connecting structure is respectively connected with the cantilever beam and the thermocouple and can enable the thermocouple to move in a preset range in the horizontal direction relative to the cantilever beam.

2. The semiconductor processing apparatus of claim 1, wherein the connection structure comprises an th connection and a second connection, wherein the th connection is connected with the cantilevered beam;

the second connection member is connected to the thermocouple and connected to the th connection member, and the second connection member is movable within a predetermined range in a horizontal direction with respect to the th connection member.

3. The semiconductor processing apparatus according to claim 2, wherein the second connecting member comprises a connecting post connected to the thermocouple, and an annular projection is provided on a circumferential wall of the connecting post;

the th connecting piece comprises a connecting main body connected with the cantilever beam, a containing hole used for containing the connecting column is arranged in the connecting main body, and an annular groove used for containing and supporting the annular bump is arranged in the containing hole;

an th horizontal distance is arranged between the hole wall of the accommodating hole and the peripheral wall of the connecting column, and a second horizontal distance is arranged between the inner side wall of the annular groove and the outer side wall of the annular bump.

4. The semiconductor processing apparatus of claim 3, wherein the th horizontal spacing is greater than or equal to 6mm and the second horizontal spacing is greater than or equal to 6 mm.

5. The semiconductor processing apparatus of claim 3, wherein a vertical spacing is provided between a lower surface of the annular recess and an upper surface of the annular bump.

6. The semiconductor processing apparatus of claim 5, wherein the vertical spacing has a value in the range of 1mm to 2 mm.

7. The semiconductor processing apparatus according to claim 3, wherein a plurality of the annular projections are provided at intervals in the axial direction of the connection column, a plurality of the annular grooves are provided at intervals in the axial direction of the accommodation hole, the number of the annular grooves is the same as the number of the annular projections, and correspondingly accommodates the annular projections.

8. The semiconductor processing apparatus of any , wherein the connecting body comprises a main body portion and a second main body portion that are detachably connected, and wherein a arcuate recess is provided in the main body portion, a second arcuate recess is provided in the second main body portion, and the main body and of the second main body are connected to the cantilever beam;

and the th main body part and the second main body part can be connected to form the connecting body, and the th arc-shaped groove and the second arc-shaped groove form the annular groove.

9. The semiconductor processing apparatus of claim 2, wherein said th connector and said second connector are each made of a material having self-lubricating properties.

10. The semiconductor processing apparatus of claim 9, wherein the material having self-lubricating properties comprises polyoxymethylene.

Technical Field

The invention relates to the technical field of semiconductor equipment, in particular to types of semiconductor processing equipment.

Background

In a semiconductor processing technology, a silicon wafer is usually subjected to a heat treatment reaction in a vertical oxidation furnace device, and the temperature affects the film formation thickness of the silicon wafer after the heat treatment reaction, so that the temperature control requirement in the longitudinal direction in the vertical oxidation furnace is very strict, and the temperature of each section in the longitudinal direction in the vertical oxidation furnace needs to be measured through a thermocouple.

In the existing vertical oxidation furnace equipment, a quartz boat bears a silicon wafer and is placed in a quartz chamber, the silicon wafer is subjected to heat treatment reaction in the quartz chamber, a sleeve is further arranged in the quartz chamber, a thermocouple is connected with a lifting driving device through a horizontal extension arm, and the lifting driving device is used for driving the thermocouple to lift in the sleeve so as to adjust the longitudinal position of the upper end part of the thermocouple in the quartz chamber and measure the temperature of different positions in the longitudinal direction in the quartz chamber.

However, since the thermocouple and the sleeve are slender and very fragile and are very easily damaged, if the concentricity of the thermocouple and the sleeve deviates or an external force touches the fixing device in the process of lifting the thermocouple, the thermocouple and the sleeve are easily locked by friction, even broken and damaged. Therefore, when the driving device and the thermocouple are installed, the levelness of the extension arm needs to be adjusted after the thermocouple and the extension arm are fixed, and repeated adjustment and test are carried out, so that the thermocouple moves smoothly in the lifting process, no scratch is generated between the thermocouple and the sleeve, the thermocouple and the sleeve are easily broken in the process of adjusting the levelness of the extension arm, and the installation of the thermocouple is very complicated due to repeated adjustment and test of the levelness of the extension arm.

Disclosure of Invention

The invention aims to at least solve technical problems in the prior art, and provides types of semiconductor processing equipment, which can reduce the risk of thermocouple damage, improve the working stability of the semiconductor processing equipment and facilitate the installation of the thermocouple.

The semiconductor processing equipment comprises a process chamber, a wafer boat, a fixed sleeve, a lifting device, a cantilever beam and a thermocouple, wherein the fixed sleeve is arranged in the process chamber, the wafer boat can be vertically placed in the fixed sleeve, the thermocouple can be connected with the lifting device through the cantilever beam which is horizontally arranged so as to lift in the fixed sleeve, and the semiconductor processing equipment further comprises a connecting structure which is respectively connected with the cantilever beam and the thermocouple and can enable the thermocouple to move in a preset range in the horizontal direction relative to the cantilever beam.

Preferably, the connecting structure comprises a th connecting piece and a second connecting piece, wherein the th connecting piece is connected with the cantilever beam;

the second connection member is connected to the thermocouple and connected to the th connection member, and the second connection member is movable within a predetermined range in a horizontal direction with respect to the th connection member.

Preferably, the second connecting piece comprises a connecting column, the connecting column is connected with the thermocouple, and an annular bump is arranged on the peripheral wall of the connecting column;

the th connecting piece comprises a connecting main body connected with the cantilever beam, a containing hole used for containing the connecting column is arranged in the connecting main body, and an annular groove used for containing and supporting the annular bump is arranged in the containing hole;

an th horizontal distance is arranged between the hole wall of the accommodating hole and the peripheral wall of the connecting column, and a second horizontal distance is arranged between the inner side wall of the annular groove and the outer side wall of the annular bump.

Preferably, the value range of the th horizontal distance is greater than or equal to 6mm, and the value range of the second horizontal distance is greater than or equal to 6 mm.

Preferably, a vertical distance is provided between the lower surface of the annular groove and the upper surface of the annular projection.

Preferably, the vertical distance ranges from 1mm to 2 mm.

Preferably, the connecting column is provided with a plurality of annular lugs at intervals in the axial direction, the accommodating hole is provided with a plurality of annular grooves at intervals in the axial direction, the number of the annular grooves is the same as that of the annular lugs, and correspondingly accommodates the annular lugs.

Preferably, the connecting body comprises th and second body parts detachably connected, and th arc groove is arranged in the th body part, and second arc groove is arranged in the second body part, of the th body and the second body is connected with the cantilever beam;

and the th main body part and the second main body part can be connected to form the connecting body, and the th arc-shaped groove and the second arc-shaped groove form the annular groove.

Preferably, the th connector and the second connector are made of materials with self-lubricating property.

Preferably, the material having self-lubricating properties comprises polyoxymethylene.

The invention has the following beneficial effects:

according to the semiconductor processing equipment provided by the invention, the thermocouple can move in the preset range in the horizontal direction relative to the cantilever beam by virtue of the connecting structures respectively connected with the cantilever beam and the thermocouple, so that when the thermocouple is driven by the lifting device to lift in the fixed sleeve and contacts with the fixed sleeve to generate friction or collision, the thermocouple can move in the preset range in the horizontal direction, and the thermocouple can be timely separated from the fixed sleeve to avoid the breakage of the thermocouple, thereby reducing the damage risk of the thermocouple and improving the working stability of the semiconductor processing equipment. And because the thermocouple can in time separate with the fixed sleeving when taking place the contact and produce the friction with the fixed sleeving, also make when installing the thermocouple, to the required reduction of precision of the levelness of cantilever beam to can reduce the adjustment number of times to the levelness of cantilever beam, and then can be convenient for the installation of thermocouple.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor processing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a front view of a connection structure in a semiconductor processing apparatus according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram illustrating a top view of a connection structure in a semiconductor processing apparatus according to an embodiment of the present invention;

description of reference numerals:

11-crystal boat, 12-process chamber, 13-fixed sleeve, 14-thermocouple, 15-lifting device, 16-cantilever beam, 21-connecting column, 22-annular bump, 23-accommodating hole, 24-annular groove, 25- main body part, 26-second main body part, 27-bolt, 281-fixed seat and 282-fixed piece.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the semiconductor processing equipment provided by the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 3, the present embodiment provides semiconductor processing apparatuses, including a process chamber 12, a boat 11, a fixed sleeve 13, a lifting device 15, a cantilever 16, and a thermocouple 14, wherein the fixed sleeve 13 is disposed in the process chamber 12, the boat 11 can be vertically placed in the fixed sleeve 13, the thermocouple 14 can be connected to the lifting device 15 through the horizontally disposed cantilever 16 to be lifted in the fixed sleeve 13, and the semiconductor processing apparatus further includes a connection structure that is respectively connected to the cantilever 16 and the thermocouple 14 and can move the thermocouple 14 within a preset range in a horizontal direction with respect to the cantilever 16.

In the semiconductor processing equipment provided by this embodiment, by means of the connection structures respectively connected to the cantilever 16 and the thermocouple 14, the thermocouple 14 can move within a preset range in the horizontal direction relative to the cantilever 16, so that when the thermocouple 14 contacts with the fixed sleeve 13 to generate friction or collision in the process of being driven by the lifting device 15 to lift in the fixed sleeve 13, the thermocouple 14 can move within the preset range in the horizontal direction, and the thermocouple 14 can be timely separated from the fixed sleeve 13, so as to avoid breaking of the thermocouple 14, thereby reducing the risk of damage to the thermocouple 14, and improving the working stability of the semiconductor processing equipment. Moreover, when the thermocouple 14 is in contact with the fixed sleeve 13 to generate friction, the thermocouple 14 can be separated from the fixed sleeve 13 in time, so that the requirement on the accuracy of the levelness of the cantilever beam 16 is lowered when the thermocouple 14 is installed, the adjustment times of the levelness of the cantilever beam 16 can be reduced, and the installation of the thermocouple 14 can be facilitated.

Specifically, the lifting device 15 drives the thermocouple 14 to lift and lower in the process chamber 12 through the cantilever beam 16, in order to measure the temperature of the process chamber 12 at each position in the vertical direction, the lifting device 15 needs to frequently lift and lower the thermocouple 14 to different heights in the vertical direction, so that the thermocouple 14 can measure the temperature in the process chamber 12 at the height, and in order to avoid pollution of the thermocouple 14 to the semiconductor processing process, a fixed sleeve 13 is arranged in the process chamber 12, the fixed sleeve 13 is sleeved on the outer side of the thermocouple 14, namely, the thermocouple 14 lifts and lowers in the fixed sleeve 13 during lifting, in the embodiment, since the thermocouple 14 is connected with the horizontally arranged thermocouple 16 through a connecting structure, and the connecting structure can move the thermocouple 14 in a preset range in the horizontal direction relative to the cantilever beam 16, in the process that the lifting device 15 drives the thermocouple 14 to lift and lower in the preset range in the horizontal direction relative to the cantilever beam 16, when the thermocouple 14 contacts and collides with the fixed sleeve 13, the thermocouple 14 causes friction or the second thermocouple connected with the thermocouple 14 to break in the second fixed sleeve , and the thermocouple 14 is prevented from moving in the preset range in the horizontal direction, and the thermocouple 14 is prevented from being separated from the fixed sleeve 13, and the thermocouple 14, so that the thermocouple 14 is continuously moved in the fixed sleeve 13, and the fixed sleeve 14, and the fixed sleeve 13, and the fixed sleeve 14, thus, the fixed sleeve 14 is prevented from being damaged by the fixed sleeve 13, and the fixed sleeve 13.

In this embodiment, the connection structure includes a th connection member and a second connection member, wherein the th connection member is connected to the cantilever 16, the second connection member is connected to the thermocouple and is connected to the th connection member, and the second connection member is movable within a predetermined range in a horizontal direction with respect to the th connection member.

Specifically, the second connecting member can move in a preset range in the horizontal direction relative to the th connecting member, so that the thermocouple 14 connected with the second connecting member can move in a preset range in the horizontal direction relative to the cantilever beam 16 connected with the th connecting member, when the thermocouple 14 contacts with the fixed sleeve to generate friction or collision in the lifting process, the thermocouple 14 and the fixed sleeve 13 generate interaction force, the second connecting member connected with the thermocouple 14 moves in the horizontal direction relative to the th connecting member, so that the thermocouple 14 and the fixed sleeve 13 are separated in time, the thermocouple 14 is prevented from being broken, the risk of damage to the thermocouple 14 is reduced, and the stability of the operation of the semiconductor processing equipment is improved.

As shown in fig. 2, in the present embodiment, the second connecting element is connected to the thermocouple 14 through a fixing component, the fixing component includes a fixing seat 281 and a fixing element 282, wherein the fixing seat 281 is connected to the second connecting element and is sleeved around the bottom of the thermocouple 14, the fixing element 282 is sleeved outside a portion of the fixing seat 281 that is sleeved around the bottom of the thermocouple 14, and the portion of the fixing seat 281 that is sleeved around the bottom of the thermocouple 14 is pressed toward the axial direction of the thermocouple 14, so that the fixing seat 281 is connected to the thermocouple 14, thereby realizing connection between the second connecting element and the thermocouple 14. However, the connection manner of the second connection member to the thermocouple 14 is not limited thereto. In addition, in the present embodiment, the fixing seat 281 and the second connecting member may be connected by adhesion, but the present invention is not limited thereto, and may be connected by welding or other methods.

As shown in fig. 2 and 3, in the present embodiment, the second connector includes a connection post 21, the connection post 21 is connected to the thermocouple 14, and an annular protrusion 22 is disposed on a circumferential wall of the connection post 21, the th connector includes a connection body connected to the cantilever beam 16, the connection body has a receiving hole 23 for receiving the connection post 21, the receiving hole 23 has an annular groove 24 for receiving and supporting the annular protrusion 22, a th horizontal distance is provided between a hole wall of the receiving hole 23 and the circumferential wall of the connection post 21, and a second horizontal distance is provided between an inner side wall of the annular groove 24 and an outer side wall of the annular protrusion 22.

Specifically, the connection body is provided with a receiving hole 23 for receiving the connection column 21, the receiving hole 23 may form a through hole through the thickness of the connection body, or may form a blind hole without penetrating through the thickness of the connection body, and only the connection column 21 needs to be able to be received, so that the connection column 21 extends into the receiving hole, an annular protrusion 22 surrounding the peripheral wall of the connection column 21 is provided on the peripheral wall of the connection column 21, an annular groove 24 surrounding the hole wall of the receiving hole 23 is provided in the receiving hole 23, the annular groove 24 is used for receiving the annular protrusion 22, when the connection column 21 extends into the receiving hole 23, the annular protrusion 22 also extends into the annular groove 24, the annular groove 24 may support the annular protrusion 22 in the vertical direction, so that the connection body can support the connection column 21 in the vertical direction, and the hole wall of the receiving hole 23 has a horizontal distance with the peripheral wall of the connection column 21, a second horizontal distance is provided between the inner side wall of the annular groove 24 and the outer side wall of the annular protrusion 22, so that the annular protrusion 22 can move in the horizontal direction in the accommodating hole 23, thereby enabling the horizontal distance of the connection column 21 and the thermocouple to move in the horizontal direction, and the horizontal distance of the second horizontal distance of the thermocouple 3514 is preset horizontal distance, and the horizontal distance of the thermocouple connection body is set in.

In the present embodiment, the th horizontal space has a value in a range of 6mm or more, and the second horizontal space has a value in a range of 6mm or more, the horizontal space, that is, the space between the hole wall of the receiving hole 23 and the peripheral wall of the connecting column 21 has a value in a range of 6mm or more, so that the connecting column 21 can have a sufficient space for movement in the receiving hole 23 in the horizontal direction, so that the thermocouple 14 can have a sufficient space for movement in the horizontal direction, however, the th horizontal space has a value in a range of not limited thereto.

The second horizontal distance, i.e., the distance between the inner sidewall of the annular groove 24 and the outer sidewall of the annular protrusion 22, is greater than or equal to 6mm, so that the annular protrusion 22 can have enough movement space in the annular groove 24 in the horizontal direction, and the thermocouple 14 can have enough movement space in the horizontal direction. However, the range of the second horizontal interval is not limited thereto

In the present embodiment, the diameter of the connection post 21 ranges from 8mm to 12mm, and the diameter of the accommodation hole 23 ranges from 16mm to 20mm, however, in any case, it is necessary to set the distance between the hole wall of the accommodation hole 23 and the peripheral wall of the connection post 21 to be greater than or equal to 6mm, that is, the horizontal distance to be greater than or equal to 6mm, for example, when the diameter of the connection post 21 is 8mm, the diameter of the accommodation hole 23 may be equal to or greater than 16mm and less than 20mm, when the diameter of the connection post 21 is 10mm, the diameter of the accommodation hole 23 may be equal to or greater than 16mm and less than 20mm, and when the diameter of the connection post 21 is 12mm, the diameter of the accommodation hole 23 may be equal to or greater than 18mm and less than 20 mm.

In the present embodiment, the th horizontal pitch is equal to the second horizontal pitch, so that the distance that the connecting rod 21 moves in the horizontal direction in the accommodating hole 23 is the same as the distance that the annular protrusion 22 moves in the horizontal direction in the annular groove 24, so as to avoid affecting the movement of the connecting rod 21 due to the blocking of the annular protrusion 22 by the annular groove 24 when the connecting rod 21 moves in the accommodating hole 23, or avoiding affecting the movement of the annular protrusion 22 due to the blocking of the connecting rod 21 by the accommodating hole 23 when the annular protrusion 22 moves in the annular groove 24.

In the embodiment, the diameter of the inner side wall of the annular groove 24 ranges from 15mm to 25mm, and the diameter of the inner side wall of the annular groove 24 ranges from 23mm to 33 mm. The diameter of the outer side wall of the annular projection 22 and the diameter of the inner side wall of the annular groove 24 may be adjusted within respective ranges, however, it is required to make the distance between the inner side wall of the annular groove 24 and the outer side wall of the annular projection 22 to be greater than or equal to 6mm, that is, the second horizontal distance to be greater than or equal to 6mm, for example, when the diameter of the inner side wall of the annular groove 24 is 15mm, the diameter of the inner side wall of the annular groove 24 may be equal to or greater than 23mm and less than 33mm, when the diameter of the outer side wall of the annular projection 22 is 20mm, the diameter of the inner side wall of the annular groove 24 may be equal to or greater than 26mm and less than 33mm, and when the diameter of the inner side wall of the annular groove 24 is 25mm, the diameter of the inner side wall of the annular groove 24 may be equal to or greater. However, the range of values of the diameter of the outer side wall of the annular projection 22 and the diameter of the inner side wall of the annular groove 24 is not limited thereto.

In the present embodiment, a vertical distance is provided between the lower surface of the annular groove 24 and the upper surface of the annular bump 22, so that when the annular bump 22 moves in the annular groove 24, the upper surface of the annular bump 22 is prevented from contacting the lower surface of the annular groove 24, and thus a friction force is prevented from being generated between the upper surface of the annular bump 22 and the lower surface of the annular groove 24, so that the resistance of the annular bump 22 moving in the annular groove 24 is reduced, the smoothness of the annular bump 22 moving in the annular groove 24 is improved, and further reduces the risk of damage to the thermocouple 14, and improves the working stability of the semiconductor processing apparatus.

In this embodiment, the value range of the vertical distance is 1mm-2mm, so that the annular bump 22 can move smoothly in the annular groove 24, and the annular bump 22 can be prevented from inclining at a large angle in the vertical direction in the horizontal movement process, so as to prevent the connecting column 21 from inclining at a large angle in the vertical direction, thereby preventing the thermocouple 14 from colliding with the fixed sleeve 13 at a large angle, further lowering the risk of damage to the thermocouple 14 by , and improving the working stability of the semiconductor processing equipment.

In the present embodiment, the thickness of the annular protrusion 22 ranges from greater than 0mm to less than or equal to 6mm, and therefore, the distance of the annular groove 24 in the vertical direction ranges from greater than 1mm to less than or equal to 8 mm. However, the range of the thickness of the annular bump 22 is not limited thereto.

In this embodiment, a plurality of annular protrusions 22 are arranged at intervals in the axial direction of the connecting column 21, a plurality of annular grooves 24 are arranged at intervals in the axial direction of the accommodating hole 23, the number of the annular grooves 24 is the same as that of the annular protrusions 22, correspond to the annular protrusions 22, the plurality of annular grooves 24 are used for limiting the plurality of annular protrusions 22 in the vertical direction, and is used for preventing the connecting column 21 from inclining in the vertical direction, so that is used for preventing the thermocouple 14 from inclining and colliding with the fixed sleeve 13, and furthermore is used for further reducing the risk of damage to the thermocouple 14 and improving the working stability of the semiconductor processing equipment.

As shown in FIG. 3, in the present embodiment, the connecting body comprises a th main body part 25 and a second main body part 26 which are detachably connected, a th arc-shaped groove is arranged in the th main body part 25, a second arc-shaped groove is arranged in the second main body part 26, of the th main body and the second main body is connected with the cantilever beam 16, the th main body part 25 and the second main body part 26 can be connected to form the connecting body, the th arc-shaped groove and the second arc-shaped groove form the annular groove 24, and the detachable connection of the th main body part 25 and the second main body part 26 is used for facilitating the detachment of the thermocouple 14, thereby facilitating the replacement or adjustment of the thermocouple 14.

In this embodiment, the th and 26 th main body parts 25 and 26 are semicircular cylinders, the th and 26 th main body parts are connected to form a cylindrical connection body, the th arc-shaped groove is a semicircular groove provided on the inner wall of the semicircular cylinder of the th main body part 25, the second arc-shaped groove is a semicircular groove provided on the inner wall of the semicircular cylinder of the second main body part 26, and the th arc-shaped groove and the second arc-shaped groove form the circular groove 24 when the th and 26 th main body parts 25 and 26 are connected, but the shapes of the th and 26 th main body parts 25 and 26 are not limited thereto, and the shapes of the th arc-shaped groove and the second arc-shaped groove are not limited thereto.

In this embodiment, a screw hole may be provided in the th main body portion 25, a through hole may be provided in the second main body portion 26, and the bolt 27 may be passed through the through hole and engaged with the screw hole to detachably connect the th main body portion 25 and the second main body portion 26, or of course, a screw hole may be provided in the second main body portion 26, and a through hole may be provided in the th main body portion 25.

In this embodiment, the main body portion may be connected to the cantilever beam 16, or the second main body portion 26 may be connected to the cantilever beam 16.

In this embodiment, the th connector and the second connector are made of materials with self-lubricating properties, the solid self-lubricating material is to reduce the friction and wear between two bearing surfaces by using solid powder, a film or some integral materials, so that when the annular protrusion 22 moves in the annular groove 24, the friction between the lower surface of the annular protrusion 22 and the upper surface of the annular groove 24 is reduced, thereby improving the smoothness of the movement of the annular protrusion 22 in the annular groove 24, further reducing the risk of damage to the thermocouple 14 by , and improving the working stability of the semiconductor processing equipment.

In this embodiment, the material with self-lubricating property includes polyoxymethylene, which does not contain metal substances to prevent metal contamination of the th connector and the second connector to the semiconductor process.

In summary, the semiconductor processing equipment provided by the embodiment can reduce the risk of damage to the thermocouple 14, improve the working stability of the semiconductor processing equipment, and facilitate the installation of the thermocouple 14.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.