阅读说明：本技术 一种改性的环氧树脂及其制备方法 (Modified epoxy resin and preparation method thereof ) 是由 林仁宗 袁铭辉 王成俊 华韵之 陈景朗 于 2019-09-20 设计创作，主要内容包括：本发明涉及一种改性的环氧树脂及其制备方法。其中,改性的环氧树脂包括的组分按质量百分含量计：缩水甘油醚类环氧树脂50％～70％,有机硅化合物10％～30％,硅烷偶联剂5％～15％,催化剂0.3％～0.5％,稀释剂14.5％～20％。本发明改性的环氧树脂降低了树脂的玻璃化转变温度,提高了树脂的柔韧性、增强树脂的耐湿热性。(The invention relates to a modified epoxy resin and a preparation method thereof. Wherein the modified epoxy resin comprises the following components in percentage by mass: 50-70% of glycidyl ether epoxy resin, 10-30% of organic silicon compound, 5-15% of silane coupling agent, 0.3-0.5% of catalyst and 14.5-20% of diluent. The modified epoxy resin reduces the glass transition temperature of the resin, improves the flexibility of the resin and enhances the humidity resistance of the resin.)

1. The modified epoxy resin is characterized by comprising the following components in percentage by mass: 50-70% of glycidyl ether epoxy resin, 10-30% of organic silicon compound, 5-15% of silane coupling agent, 0.3-0.5% of catalyst and 14.5-20% of diluent.

2. The modified epoxy resin according to claim 1, wherein the glycidyl ether type epoxy resin is bisphenol a type glycidyl ether type epoxy resin.

3. The modified epoxy resin of claim 1, wherein said organosilicon compound is a polysiloxane organic compound having hydroxyl reactive functional groups.

4. The modified epoxy resin according to claim 1, wherein said silane coupling agent is a silane coupling agent having an amino group as an organic functional group.

5. The modified epoxy resin of claim 1, wherein the catalyst is one or more of dibutyltin dilaurate, stannous octoate, and stannic tin.

6. A process for the preparation of a modified epoxy resin according to any one of claims 1 to 5, characterized in that it comprises the following steps:

1) adding 50-70% of glycidyl ether epoxy resin into a reaction container, and heating to 80-120 ℃ under stirring;

2) adding 5-15% of silane coupling agent, 0.3-0.5% of catalyst and 10-30% of organic silicon compound into the reaction container in the step 1), and stirring for 6 hours;

3) and (3) cooling the polymer reacted in the step 2) to room temperature, adding 14.5-20% of diluent, and stirring for 1h to finish the reaction.

7. The method for preparing a modified epoxy resin according to claim 6, wherein the stirring rate in said step is 50 to 400 rmp/min.

Technical Field

The invention relates to the technical field of polymer resin, in particular to modified epoxy resin and a preparation method thereof.

Background

Epoxy resins have excellent physical and mechanical properties and electrical insulation properties, and their adhesion to various materials and flexibility in the use process are not possessed by other thermosetting resins. Accordingly, epoxy resins are widely used in various fields such as paints, composite materials, molding materials, electronic packaging materials, adhesives for high-end structures, and the like. In the application process, the cross-linking density formed after the epoxy resin is cured is higher and the internal stress is large, so that the product manufactured by adopting the epoxy resin has the defects of poor flexibility, poor impact toughness, brittleness and frangibility, and the humidity resistance and the heat resistance can not meet the application requirements of engineering technology, so that the application of the epoxy resin is limited, and the application and the development of the epoxy resin in composite materials such as structural materials and the like are restricted.

Disclosure of Invention

In view of the above, it is desirable to provide a modified epoxy resin, which is intended to lower the glass transition temperature of the resin, improve the flexibility, and enhance the resistance to moist heat.

In order to achieve the purpose, the invention provides a modified epoxy resin which comprises the following components in percentage by mass: 50-70% of glycidyl ether epoxy resin, 10-30% of organic silicon compound, 5-15% of silane coupling agent, 0.3-0.5% of catalyst and 14.5-20% of diluent.

Preferably, the glycidyl ether epoxy resin is bisphenol a glycidyl ether epoxy resin.

Preferably, the organosilicon compound is a polysiloxane organic compound having hydroxyl-reactive functional groups.

Preferably, the silane coupling agent is a silane coupling agent having an amino group as an organic functional group.

Preferably, the catalyst is one or more of dibutyltin dilaurate, stannous octoate and stannic oxide.

The invention also provides a preparation method of the modified epoxy resin, which comprises the following steps:

1) adding 50-70% of glycidyl ether epoxy resin into a reaction container, and heating to 80-120 ℃ under stirring;

2) adding 5-15% of silane coupling agent, 0.3-0.5% of catalyst and 10-30% of organic silicon compound into the reaction container in the step 1), and stirring for 6 hours;

3) and (3) cooling the polymer reacted in the step 2) to room temperature, adding 14.5-20% of diluent, and stirring for 1 h.

Preferably, the stirring rate in said step is 50rpm to 400 rpm.

According to the technical scheme, the glycidyl ether epoxy resin, the silane coupling agent, the organic silicon compound, the catalyst and the diluent are adopted, under the action of the catalyst, the glycidyl ether epoxy resin is polymerized with the organic silicon compound through the silane coupling agent, the organic silicon compound is introduced into a branched chain of the glycidyl ether epoxy resin, and the epoxy resin is modified through high branching. On one hand, the high degree of branching is beneficial to reducing the high regularity of the epoxy resin, so that the glass transition temperature of the modified epoxy resin is reduced, and the flexibility of the modified epoxy resin is improved; on the other hand, the introduction of the branched chain enables the polar group in the framework to be substituted, the reduction of the polar group in the resin enables the interaction between the modified resin and water to be reduced, and the wet heat resistance of the modified resin is enhanced.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.