阅读说明：本技术 一种电子设备元器件加温控制系统及控制方法 (Electronic equipment component heating control system and control method ) 是由 姚先秀 李科连 马文超 邹利伟 徐森 王小江 吴斌 周向华 徐全堂 章文静 黎超 于 2019-09-02 设计创作，主要内容包括：本发明涉及电子产品环境温度适应性技术领域,具体是一种电子设备元器件加温控制系统,所述该系统包括线路板,以及安装有加热器的电加热板,所述电加热板设置有两个,且呈平行分布在所述线路板的两侧；其中,所述线路板底部设有传感器,而传感器上连接有控制器,控制器与电加热板连接,同时控制器上连接有直流供电模块,直流供电模块与加热器连接,进而直流供电模块可以给控制器、加热器供电；加热功率需求小、加热快,在不提高电子设备成本解决传统方法带来的电路干扰等问题的情况下,解决电子设备元器件低温适应性问题。(The invention relates to the technical field of environmental temperature adaptability of electronic products, in particular to a heating control system for electronic equipment components, which comprises a circuit board and two electric heating plates provided with heaters, wherein the two electric heating plates are distributed on two sides of the circuit board in parallel; the bottom of the circuit board is provided with a sensor, the sensor is connected with a controller, the controller is connected with the electric heating plate, meanwhile, the controller is connected with a direct current power supply module, the direct current power supply module is connected with the heater, and then the direct current power supply module can supply power to the controller and the heater; the heating power requirement is small, the heating is fast, and the low-temperature adaptability problem of electronic equipment components is solved under the condition that the cost of the electronic equipment is not increased and the problems of circuit interference and the like caused by the traditional method are solved.)

1. The electronic equipment component heating control system is characterized by comprising a circuit board (1) and two electric heating plates (2) provided with heaters (6), wherein the two electric heating plates (2) are distributed on two sides of the circuit board (1) in parallel;

the electric heating device is characterized in that a sensor (4) is arranged at the bottom of the circuit board (1), a controller (5) is connected onto the sensor (4), the controller (5) is connected with the electric heating plate (2), a direct current power supply module (3) is connected onto the controller (5), and the direct current power supply module (3) is connected with the heater (6).

2. The system for controlling heating of the electronic device components as claimed in claim 1, wherein the circuit board (1) and the sensor (4) are fixed by adhesion.

3. The system for controlling the heating of the electronic equipment components as claimed in claim 1, wherein the heater (6) is a thin film heater and is adhered to the electric heating plate (2).

4. The system for controlling the heating of the electronic equipment components as claimed in claim 3, wherein the heater (6) is adhered to the electric heating plate (2) by silicone rubber.

5. The system for controlling heating of electronic device components as claimed in claim 4, wherein the silicone rubber is GD414 silicone rubber.

6. The electronic device component heating control system according to claim 1, wherein the thickness of the heater (6) is not more than 2 mm.

7. A control method of an electronic device component heating control system according to any one of claims 1 to 6, characterized by comprising the steps of:

the temperature of the circuit board (1) is collected in real time by the aid of the sensor (4), the collected temperature is fed back to the controller (5), the collected temperature is compared with a set heating threshold temperature by the controller (5), if the temperature does not exceed the heating threshold temperature, the heater (6) is controlled to start heating, the temperature of the working environment of the circuit board (1) rises, meanwhile, the temperature of the circuit board (1) is collected in real time by the controller (5) and the set heating stopping threshold temperature are compared, and if the temperature exceeds the heating stopping threshold temperature, the heater (6) is controlled to stop heating.

Technical Field

The invention relates to the technical field of environmental temperature adaptability of electronic products, in particular to a heating control system and a heating control method for electronic equipment components.

Background

Along with the development of various fields of sea, land and air related to the electronic equipment carrying platform in a more profound direction, higher requirements, particularly low-temperature adaptability requirements, are put forward on the environmental temperature adaptability of electronic equipment components, some platforms already put forward the requirements of normal work in a low-temperature environment of minus 55 ℃, and even lower, and most industrial components cannot meet the requirements; in order to solve the problem of adaptability of the electronic equipment to the low-temperature environment, components with higher grade and higher price cost can be selected, and a method for actively heating and compensating the components can be adopted; the conventional temperature compensation method has two types:

firstly, a shell of the electronic equipment is heated, a film heater is adhered to the inner wall of a shell of the electronic equipment, most of heating power is dissipated to a low-temperature environment from the outer surface of the shell of the instrument, meanwhile, heat capacity of the shell of the instrument absorbs part of heat, and the rest can heat a circuit board, so that the heating efficiency is low and the heating power requirement is very high;

secondly, heating the key components, and welding resistance heaters around or at the bottom of the key components. The device is directly heated, the heating power requirement is low, the heating time is short, but great troubles are brought to the design of the circuit board of the electronic equipment, and the interference of the heating power supply of the heater to the components of the circuit board of the electronic equipment is also a problem which needs to be considered and solved.

The invention provides a heating control system and a heating control method for electronic equipment components, which have the advantages of low heating power requirement and quick heating, and can solve the problem of low-temperature adaptability of the electronic equipment components under the condition of not increasing the cost of the electronic equipment and solving the problems of circuit interference and the like brought by the traditional method.

Disclosure of Invention

The present invention is directed to a system and a method for controlling heating of electronic device components, so as to solve the problems in the background art.

In order to achieve the purpose, the invention provides the following technical scheme:

a heating control system for electronic equipment components comprises a circuit board and two electric heating plates provided with heaters, wherein the two electric heating plates are distributed on two sides of the circuit board in parallel;

the bottom of the circuit board is provided with a sensor, the sensor is connected with a controller, the controller is connected with the electric heating plate, meanwhile, the controller is connected with a direct current power supply module, the direct current power supply module is connected with the heater, and then the direct current power supply module can supply power to the controller and the heater;

furthermore, the heating power requirement is low, the heating is fast, and the low-temperature adaptability problem of electronic equipment components is solved under the condition that the cost of the electronic equipment is not increased and the problems of circuit interference and the like caused by the traditional method are solved.

The further scheme of the invention is as follows: the circuit board and the sensor are fixed in a sticking way.

The invention further comprises the following scheme: the heater is a film heater and is adhered to the electric heating plate.

The invention further comprises the following scheme: the heater is adhered to the electric heating plate through silicon rubber glue.

The invention further comprises the following scheme: the silicon rubber is GD414 silicon rubber.

The invention further comprises the following scheme: the thickness of the heater is not more than 2 mm.

Another object of the present invention is to provide a method for controlling a system for controlling heating of components of electronic devices, including the steps of:

the temperature of the circuit board is collected in real time by using the sensor, the collected temperature is fed back to the controller, the controller compares the collected temperature with a set heating threshold temperature, if the temperature is not higher than the heating threshold temperature, the heater is controlled to start heating, the temperature of the working environment of the circuit board is raised, meanwhile, the controller compares the temperature of the circuit board collected in real time with the set heating stop threshold temperature, and if the temperature exceeds the heating stop threshold temperature, the heater is controlled to stop heating.

Compared with the prior art, the invention has the beneficial effects that:

1. the invention has small heating power requirement and quick heating, and solves the problem of low-temperature adaptability of components of the electronic equipment under the condition of not increasing the cost of the electronic equipment and solving the problems of circuit interference and the like brought by the traditional method;

2. when the temperature is higher than a certain temperature, the heating is stopped, the low-temperature adaptability problem of the electronic equipment components is solved under the conditions that the cost of the electronic equipment is not increased, the problems of circuit interference and the like caused by the traditional method are eliminated, the upper heating limit is restricted by the method, and the energy is saved.

Drawings

Fig. 1 is a schematic structural diagram of a component heating control system of an electronic device according to the present invention.

In the figure: 1-a circuit board; 2-electric heating plate; 3-a direct current power supply module; 4-a sensor; 5-a controller; 6-a heater.

Detailed Description

The technical solution of the present invention will be described in further detail with reference to specific embodiments.

Along with the development of various fields of sea, land and air related to the electronic equipment carrying platform in a more profound direction, higher requirements, particularly low-temperature adaptability requirements, are put forward on the environmental temperature adaptability of electronic equipment components, some platforms already put forward the requirements of normal work in a low-temperature environment of minus 55 ℃, and even lower, and most industrial components cannot meet the requirements; in order to solve the problem of adaptability of the electronic equipment to the low-temperature environment, components with higher grade and higher price cost can be selected, and a method for actively heating and compensating the components can be adopted; the conventional temperature compensation method has two types:

firstly, a shell of the electronic equipment is heated, a film heater is adhered to the inner wall of a shell of the electronic equipment, most of heating power is dissipated to a low-temperature environment from the outer surface of the shell of the instrument, meanwhile, heat capacity of the shell of the instrument absorbs part of heat, and the rest can heat a circuit board, so that the heating efficiency is low and the heating power requirement is very high;

secondly, heating the key components, and welding resistance heaters around or at the bottom of the key components. The device is directly heated, the heating power requirement is low, the heating time is short, but great troubles are brought to the design of the circuit board of the electronic equipment, and the interference of the heating power supply of the heater to the components of the circuit board of the electronic equipment is also a problem which needs to be considered and solved.

The invention provides a heating control system and a heating control method for electronic equipment components, which have the advantages of low heating power requirement and quick heating, and can solve the problem of low-temperature adaptability of the electronic equipment components under the condition of not increasing the cost of the electronic equipment and solving the problems of circuit interference and the like brought by the traditional method, and please refer to fig. 1 and embodiments 1-3.