阅读说明：本技术 通信电路层结构及其电路印刷方法 (Communication circuit layer structure and circuit printing method thereof ) 是由 孔令海 于 2018-06-26 设计创作，主要内容包括：本发明公开了一种通信电路层结构,包括软性线路板,所述薄膜线路板印刷有若干条信号线路,所述信号线路包括调节段,所述调节段由阻值不同的电子浆料印刷制成,通过上述设置,在每条信号线路上印刷阻值不同的电子浆料,从而每条信号线路有单独的阻值范围,产生不同范围的触发信号；信号线路选用小阻值材料,利用调节段的电子浆料调节电阻,控制准确,电阻控制范围增大,从而通信电路可以具有更广范围的通信信号的选择；由信号范围的扩大,同一电路结构可以适用的场合更多,从而在各信号线路间的组合控制时,避免出现多组合键相互干扰的情况,方便编程设计。(The invention discloses a communication circuit layer structure, which comprises a flexible circuit board, wherein a plurality of signal circuits are printed on the thin film circuit board, each signal circuit comprises an adjusting section, the adjusting section is made by printing electronic paste with different resistance values, and through the arrangement, the electronic paste with different resistance values is printed on each signal circuit, so that each signal circuit has a single resistance value range and generates trigger signals in different ranges; the signal line is made of a low-resistance material, the resistor is adjusted by using the electronic paste of the adjusting section, the control is accurate, and the control range of the resistor is enlarged, so that the communication circuit can select communication signals in a wider range; by enlarging the signal range, the same circuit structure can be applied to more occasions, thereby avoiding the condition of mutual interference of a plurality of combination keys when the combination control among signal lines is carried out, and facilitating the programming design.)

1. A communication circuit layer structure comprises a flexible circuit board (1), and is characterized in that: the thin film circuit board is printed with a plurality of signal lines (2), each signal line (2) comprises an adjusting section (3), and each adjusting section (3) is made of electronic paste with different resistance values through printing.

2. A communication circuit layer structure according to claim 1, wherein: the electronic paste is one or more of flaky particle conductive silver paste, round particle conductive silver paste, nano conductive silver paste, transparent conductive silver paste, graphene conductive silver paste, conductive carbon paste and graphene conductive carbon paste.

3. A communication circuit layer structure according to claim 1, wherein: the signal line (2) is formed by printing mixed slurry, and the mixed slurry is prepared by mixing flaky particle conductive silver paste and round particle conductive silver paste.

4. A communication circuit layer structure according to claim 1, wherein: the signal lines (2) are provided with a plurality of layers, and the plurality of layers of signal lines (2) are connected in a bridging mode.

5. A communication circuit layer structure according to claim 1, wherein: the two ends of the adjusting section (3) are provided with connecting points (4), and the diameter of each connecting point (4) is larger than the width of the adjusting section (3).

6. A method of circuit printing of a communication circuit layer structure according to any of claims 1 to 5, characterized by: the method comprises the following steps:

step 1, preparing two plastic films, namely a first plastic film and a second plastic film which are respectively used for manufacturing a flexible circuit board (1) and a cover plate;

step 2, printing a signal line (2) on the first plastic film by using the electronic paste, and reserving a printing space of the adjusting section (3);

step 3, printing an adjusting section (3) by using electronic paste with different resistances;

and 4, connecting the flexible circuit board (1) and the cover plate by ultrasonic welding.

7. The circuit printing method of a communication circuit layer structure according to claim 6, wherein: and (3) printing different electronic pastes in batches in the step 3.

8. The circuit printing method of a communication circuit layer structure according to claim 6, wherein: and (3) printing the signal circuit (2) in the step (1) by adopting a bridging process for multilayer printing.

9. The circuit printing method of a communication circuit layer structure according to claim 6, wherein: and 3, selecting the electronic paste according to the resistance requirement.

Technical Field

The invention relates to the field of thin film circuit boards, in particular to a communication circuit layer structure and a circuit printing method thereof.

Background

The popularization range of electronic communication products is wider and wider, and the existence of the electronic communication products is indispensable in life, study and work, and the development and the popularization of the electronic communication products are accelerated by the generation and the application of the printed communication circuit. The printed communication circuit has the advantages of low cost, light weight, good flexibility, simple design and the like.

At present, chinese patent publication No. CN1247056C discloses a method for manufacturing a thin film circuit board, which mainly includes, after arranging a key position circuit and a Matrix (Matrix) under the condition of no jumper wire and avoiding generating unknown key signals, when manufacturing the thin film circuit board, performing PET heating pre-shrinking of the thin film circuit board, then printing a circuit silver paste on the thin film circuit board, then printing an insulating layer or printing carbon powder on the printed circuit silver paste, folding the thin film circuit board in half for ultrasonic bonding, then punching a structural hole on the thin film circuit board, and after the punching of the structural hole is completed, completing the manufacturing of the thin film circuit board.

When the thin film circuit board is printed, the arrangement state of the key position circuit and the matrix needs to be judged in advance, and then the arrangement of the combination keys is carried out, so that the generation of unknown key signals when the combination keys are used is avoided.

Disclosure of Invention

The invention aims to provide a communication circuit layer structure which has the advantages of simple design and wide application range.

The technical purpose of the invention is realized by the following technical scheme:

a communication circuit layer structure comprises a flexible circuit board, wherein a plurality of signal circuits are printed on the thin film circuit board, each signal circuit comprises an adjusting section, and the adjusting sections are made by printing electronic paste with different resistance values.

By adopting the technical scheme, the electronic paste with different resistance values is printed on each signal line, so that each signal line has a single resistance value range, and trigger signals in different ranges are generated; the signal line is made of a low-resistance material, the resistor is adjusted by using the electronic paste of the adjusting section, the control is accurate, and the control range of the resistor is enlarged, so that the communication circuit can select communication signals in a wider range; by enlarging the signal range, the same circuit structure can be applied to more occasions, thereby avoiding the condition of mutual interference of a plurality of combination keys when the combination control among signal lines is carried out, and facilitating the programming design. When in design, the width, the thickness and the length of the electronic paste of the adjusting section are adjusted, and key positions and circuits are not required to be redesigned, so that the design is simple, and the printing efficiency is high.

Further setting: the electronic paste is one or more of flaky particle conductive silver paste, round particle conductive silver paste, nano conductive silver paste, transparent conductive silver paste, graphene conductive silver paste, conductive carbon paste and graphene conductive carbon paste.

By adopting the technical scheme, different types of electronic paste have different sheet resistances, and the adjusting sections with different resistance values can be printed under the same printing condition; the sheet resistance of the nano conductive silver paste is small, the current generated when the signal circuit is triggered is large, the non-conductive insulating ink has large resistance, the current generated by the signal circuit is small, the current range is controlled in a large range through the selection of the electronic paste, the applicability is wide, and only the electronic paste in printing needs to be replaced during processing; the mixed electronic paste can adjust the sheet resistance in a larger range, accurately control the current in a circuit and adjust the signal range; the conductive carbon paste and the conductive silver paste are mixed, so that the use of the conductive silver paste can be reduced, and the cost is greatly reduced; the graphene conductive carbon paste has lower resistivity than the conductive carbon paste, and has good curing state and heat resistance after being printed, and the mechanical property is enhanced; the distance between graphene and nano silver in the graphene conductive silver paste is smaller than the distance between graphene sheet layers and the distance between nano silver, so that the resistivity is further reduced, and the conductivity is good; in the case of using a plurality of electronic pastes, the particle gaps in the electronic paste can be filled with each other at the same particle size level, the proportion of the conductive material per unit volume is increased, and the resistivity can be further reduced.

Further setting: the signal line adopts mixed thick liquids printing to form, mixed thick liquids adopt the electrically conductive silver thick liquid of slice granule and the electrically conductive silver thick liquid of circular granule to mix and make.

By adopting the technical scheme, the flaky particle conductive silver paste and the round particle conductive silver paste are mixed, and the flaky particles and the round particles are complementary in microstructure, so that the silver content in unit volume is increased, the sheet resistance of the mixed silver paste is reduced, the influence of the resistance change of the adjusting section on the overall resistance of the signal line is increased, and the adjusting effect is better; meanwhile, the mixed slurry adopts two common conductive silver pastes, and compared with the nano conductive silver paste, the mixed slurry is low in cost and suitable for mass production.

Further setting: the signal lines are provided with a plurality of layers, and the plurality of layers of signal lines are connected in a bridging mode.

By adopting the technical scheme, the multilayer signal circuits are laid on the flexible circuit board simultaneously, so that the problem that the multilayer circuit boards need to be attached is avoided, the construction efficiency is improved, and the accuracy of the circuits is guaranteed simultaneously.

Further setting: the both ends of adjusting the section are provided with the tie point, the diameter of tie point is greater than the width of adjusting the section.

By adopting the technical scheme, the contact area of the connecting point is larger, the printing of the adjusting section is more convenient, and the breakpoint generated between the adjusting section and the signal line is avoided.

Another object of the present invention is to provide a circuit printing method of the above communication circuit layer structure, which has the advantages of simple manufacturing and wide signal range.

The technical purpose of the invention is realized by the following technical scheme:

a circuit printing method of a communication circuit layer structure, comprising the steps of:

step 1, preparing two plastic films, namely a first plastic film and a second plastic film, which are respectively used for manufacturing a flexible circuit board and a cover plate;

step 2, printing a signal circuit on the first plastic film by using common conductive silver paste, and reserving a printing space of the adjusting section;

step 3, printing an adjusting section by using electronic paste with different resistors;

and 4, connecting the flexible circuit board and the cover plate by ultrasonic welding.

By adopting the technical scheme, the signal line and the adjusting section are all printed on the first plastic film, the processing is convenient, and an alignment and lamination process is not required; meanwhile, the stable access of the adjusting section to the signal line is ensured, and the connection stability of the adjusting section is improved.

Further setting: and (3) printing different electronic pastes in batches in the step 3.

Further setting: and (3) printing the signal circuit in the step 1 by adopting a bridging process for multi-layer printing.

By adopting the technical scheme, the mutual influence between the signal circuits is avoided by utilizing the bridging process, and the signal circuits are printed on one side of the circuit board.

Further setting: and 3, selecting the electronic paste according to the resistance requirement.

By adopting the technical scheme, the electronic paste is selected and allocated after calculation, so that the communication circuit board with actual requirements can be produced, and the process has a wide application range.

Drawings

FIG. 1 is a schematic structural view of example 1;

fig. 2 is an enlarged view of a in fig. 1.

In the figure, 1, a flexible circuit board; 2. a signal line; 3. an adjustment section; 4. and connecting points.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.