阅读说明：本技术 制冷装置和温度控制装置 (Refrigeration device and temperature control device ) 是由 佐保卓哉 桑畑智 三塚宾耶 于 2018-05-11 设计创作，主要内容包括：抑制装置尺寸,并且高效地对多个温度控制对象物或空间进行冷却。本发明的制冷装置具有第1制冷回路、过冷却回路以及第2制冷回路。过冷却回路具有：过冷却用旁通流路,其使第1制冷回路的位于冷凝器的下游侧且第1膨胀阀的上游侧的部分与压缩机连通；过冷却用控制阀；以及过冷却用热交换器,其设置于过冷却用旁通流路的过冷却用控制阀的下游侧,对在第1制冷回路的比与过冷却用旁通流路连接的连接位置靠下游侧的部分中流通的制冷剂进行冷却。第2制冷回路具有：分支流路,其从第1制冷回路的比与过冷却用旁通流路连接的连接位置靠上游侧的部分分支；第2膨胀阀,其设置于分支流路；以及第2蒸发器,其设置于分支流路的第2膨胀阀的下游侧,用于使从第2膨胀阀流出的制冷剂蒸发。(The size of the device is suppressed, and a plurality of temperature control objects or spaces are efficiently cooled. A refrigeration device of the present invention includes a 1 st refrigeration circuit, a supercooling circuit, and a 2 nd refrigeration circuit. The subcooling circuit includes: a bypass flow path for supercooling which communicates a portion of the 1 st refrigeration circuit located downstream of the condenser and upstream of the 1 st expansion valve with the compressor; a control valve for supercooling; and a supercooling heat exchanger that is provided downstream of the supercooling control valve in the supercooling bypass passage and cools the refrigerant flowing through a portion of the 1 st refrigeration circuit downstream of a connection position to the supercooling bypass passage. The 2 nd refrigeration circuit has: a branch flow path that branches from a portion of the 1 st refrigeration circuit upstream of a connection position to the bypass flow path for subcooling; a 2 nd expansion valve provided in the branch flow path; and a 2 nd evaporator provided downstream of the 2 nd expansion valve in the branch flow path, for evaporating the refrigerant flowing out of the 2 nd expansion valve.)

1. A refrigeration apparatus, characterized by comprising:

a 1 st refrigeration circuit including a compressor, a condenser, a 1 st expansion valve, and a 1 st evaporator connected in this order so as to circulate a refrigerant;

a subcooling circuit including a subcooling bypass flow path that communicates a portion of the 1 st refrigeration circuit located downstream of the condenser and upstream of the 1 st expansion valve with the compressor of the 1 st refrigeration circuit or a portion of the 1 st refrigeration circuit located upstream of the compressor and downstream of the 1 st evaporator so that the refrigerant can flow therethrough, a subcooling control valve that controls a flow rate of the refrigerant flowing through the subcooling bypass flow path, and a subcooling heat exchanger that is provided downstream of the subcooling bypass flow path and that causes a ratio between the refrigerant flowing downstream of the subcooling control valve and a portion of the 1 st refrigeration circuit located downstream of the condenser and upstream of the 1 st expansion valve to be equal to a ratio between the refrigerant flowing through the subcooling bypass flow path and the subcooling control valve The refrigerant flowing through a portion on the downstream side of the connection position of the flow path connection exchanges heat; and

a 2 nd refrigeration circuit including a branch flow path that communicates a portion of the 1 st refrigeration circuit on a downstream side of the condenser and on an upstream side of the 1 st expansion valve, the portion being on an upstream side of a connection position with the subcooling bypass flow path, with a portion of the 1 st refrigeration circuit on a downstream side of the 1 st evaporator and on an upstream side of the compressor so that the refrigerant can flow therethrough, a 2 nd expansion valve provided in the branch flow path and configured to expand and flow out the received refrigerant, and a 2 nd evaporator provided in the branch flow path on a downstream side of the 2 nd expansion valve and configured to evaporate the refrigerant flowing out of the 2 nd expansion valve.

2. A cold appliance according to claim 1,

the refrigeration device also has an injection circuit having:

an injection flow path that communicates a portion downstream of a position where the refrigerant is heat-exchanged by the supercooling heat exchanger, in a portion downstream of the condenser and upstream of the 1 st expansion valve in the 1 st refrigeration circuit, with a portion downstream of the 2 nd evaporator in the branch flow path or downstream of the 1 st evaporator and upstream of the compressor in the 1 st refrigeration circuit, so that the refrigerant can flow therethrough; and

and an injection valve capable of adjusting a flow rate of the refrigerant flowing through the injection flow path.

3. A cold appliance according to claim 1,

the refrigeration device also has a return circuit having:

a return flow path that connects a portion of the 1 st refrigeration circuit downstream of the compressor and upstream of the condenser to a portion of the 1 st refrigeration circuit downstream of the 1 st evaporator and upstream of the compressor so that the refrigerant can flow therethrough; and

and a return regulating valve capable of regulating a flow rate of the refrigerant flowing through the return flow path.

4. A cold appliance according to claim 3,

the return adjustment valve is configured to adjust an opening degree of the return adjustment valve based on a pressure difference between a pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit downstream of the compressor and upstream of the condenser and a pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit downstream of the 1 st evaporator and upstream of the compressor and downstream of a connection position of the branch flow passage.

5. A cold appliance according to claim 1,

the refrigeration device further includes a heat medium circulation device having:

a 1 st cooling flow path connected to the condenser, supplying a heat medium for condensing the refrigerant flowing through the condenser into the condenser, and flowing the heat medium flowing out of the condenser;

a 2 nd cooling channel that communicates a portion of the 1 st cooling channel located on an upstream side and a portion located on a downstream side with respect to the condenser so that the heat medium can flow therethrough; and

and a cooling heat exchanger provided in the 2 nd cooling flow path.

6. A temperature control apparatus, characterized by comprising:

the refrigeration unit of claim 1;

a 1 st liquid flow device having a 1 st liquid flow path, the 1 st liquid flow path being connected to the 1 st evaporator of the 1 st refrigeration circuit, supplying a 1 st liquid, which is cooled by the refrigerant flowing through the 1 st evaporator, into the 1 st evaporator, and flowing the 1 st liquid flowing out from the 1 st evaporator; and

and a 2 nd liquid flow device having a 2 nd liquid flow path, the 2 nd liquid flow path being connected to the 2 nd evaporator of the 2 nd refrigeration circuit, supplying a 2 nd liquid cooled by the refrigerant flowing through the 2 nd evaporator into the 2 nd evaporator, and flowing the 2 nd liquid flowing out from the 2 nd evaporator.

7. The temperature control apparatus according to claim 6,

the 1 st liquid circulation device has a 1 st heater for heating the 1 st liquid cooled by the refrigerant,

the 2 nd liquid circulation device has a 2 nd heater, and the 2 nd heater heats the 2 nd liquid cooled by the refrigerant.

Technical Field

The present invention relates to a refrigeration apparatus capable of efficiently cooling a plurality of temperature control objects or spaces, and a temperature control apparatus provided with the refrigeration apparatus.

Background

Conventionally, there is known a temperature control device including: a refrigeration device having a compressor, a condenser, an expansion valve, and an evaporator; and a liquid circulation device that circulates a liquid such as a nonfreezing liquid, and cools the liquid in the liquid circulation device by an evaporator of the refrigeration device (for example, JP 2006-38323A). In such a temperature control device, a heater for heating a liquid is generally provided in the liquid circulation device. This makes it possible to cool and heat the liquid, and to accurately control the temperature of the liquid to a desired temperature.

Disclosure of Invention

Problems to be solved by the invention

In the temperature control device described above, it may be desirable to supply the temperature-controlled liquid to a plurality of temperature control objects, and in this case, a configuration may be adopted in which a plurality of liquid circulation devices are provided for a plurality of refrigeration devices. However, in this structure, the apparatus size is large, and the power consumption is also increased.

In particular, when the temperature control range required for some of the plurality of temperature control objects is different from that of the other object, the performance is excessively high in each combination of the refrigeration apparatus and the liquid circulation apparatus in the case where the temperature control apparatus is configured by using the same refrigeration apparatus and liquid circulation apparatus, and thus, the energy consumption and the manufacturing cost undesirably increase. On the other hand, in each combination of the refrigeration apparatus and the liquid circulation apparatus, even when the temperature control apparatus is configured by using different refrigeration apparatuses and liquid circulation apparatuses depending on the temperature control range required, the problem of the increase in size of the apparatus cannot be sufficiently solved, and the problem of the increase in the number of components used increases, which leads to an increase in the burden of the assembly work.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a refrigeration apparatus capable of efficiently cooling a plurality of temperature control objects or spaces while suppressing the apparatus size, and a temperature control apparatus including the refrigeration apparatus.

Means for solving the problems

The refrigeration apparatus of the present invention is characterized by comprising:

a 1 st refrigeration circuit including a compressor, a condenser, a 1 st expansion valve, and a 1 st evaporator connected in this order so as to circulate a refrigerant;

a subcooling circuit including a subcooling bypass flow path that communicates a portion of the 1 st refrigeration circuit located downstream of the condenser and upstream of the 1 st expansion valve with the compressor of the 1 st refrigeration circuit or a portion of the 1 st refrigeration circuit located upstream of the compressor and downstream of the 1 st evaporator so that the refrigerant can flow therethrough, a subcooling control valve that controls a flow rate of the refrigerant flowing through the subcooling bypass flow path, and a subcooling heat exchanger that is provided downstream of the subcooling bypass flow path and that causes a ratio between the refrigerant flowing downstream of the subcooling control valve and a portion of the 1 st refrigeration circuit located downstream of the condenser and upstream of the 1 st expansion valve to be equal to a ratio between the refrigerant flowing through the subcooling bypass flow path and the subcooling control valve The refrigerant flowing through a portion on the downstream side of the connection position of the flow path connection exchanges heat; and

a 2 nd refrigeration circuit including a branch flow path that communicates a portion of the 1 st refrigeration circuit on a downstream side of the condenser and on an upstream side of the 1 st expansion valve, the portion being on an upstream side of a connection position with the subcooling bypass flow path, with a portion of the 1 st refrigeration circuit on a downstream side of the 1 st evaporator and on an upstream side of the compressor so that the refrigerant can flow therethrough, a 2 nd expansion valve provided in the branch flow path and configured to expand and flow out the received refrigerant, and a 2 nd evaporator provided in the branch flow path on a downstream side of the 2 nd expansion valve and configured to evaporate the refrigerant flowing out of the 2 nd expansion valve.

In the refrigeration apparatus of the present invention, the 1 st expansion valve and the 1 st evaporator and the 2 nd expansion valve and the 2 nd evaporator are connected to a common compressor and a common condenser on the upstream sides thereof. Further, the refrigerant discharged from the compressor and flowing out of the condenser can be made to flow to the 1 st evaporator via the 1 st expansion valve and can be made to flow to the 2 nd evaporator via the 2 nd expansion valve, and thus different temperature control objects or spaces can be cooled by the respective evaporators. This makes it possible to efficiently cool a plurality of temperature control objects or spaces while suppressing the size of the apparatus. In particular, when the temperature control range required for one of the plurality of temperature control objects or spaces is different from that for the other, the 1 st evaporator through which the refrigerant supercooled by the supercooling heat exchanger flows is used to cool the temperature control object or space requiring a large temperature control range, and the 2 nd evaporator is used to cool the other temperature control object or space.

The present invention may be such that the refrigeration apparatus further includes an injection circuit, the injection circuit including: an injection flow path that communicates a portion downstream of a position where the refrigerant is heat-exchanged by the supercooling heat exchanger, in a portion downstream of the condenser and upstream of the 1 st expansion valve in the 1 st refrigeration circuit, with a portion downstream of the 2 nd evaporator in the branch flow path or downstream of the 1 st evaporator and upstream of the compressor in the 1 st refrigeration circuit, so that the refrigerant can flow therethrough; and an injection valve capable of adjusting a flow rate of the refrigerant flowing through the injection flow path.

In this configuration, the condensed refrigerant branched by the injection circuit can be mixed with the refrigerant flowing out to the downstream side of the 1 st evaporator, and therefore the temperature or pressure of the refrigerant flowing into the compressor can be easily controlled to a desired state. This stabilizes the operation of the compressor and improves the stability of temperature control.

In addition, the refrigeration apparatus according to the present invention may further include a return circuit including: a return flow path that connects a portion of the 1 st refrigeration circuit downstream of the compressor and upstream of the condenser to a portion of the 1 st refrigeration circuit downstream of the 1 st evaporator and upstream of the compressor so that the refrigerant can flow therethrough; and a return control valve capable of controlling the flow rate of the refrigerant flowing through the return flow path.

In this configuration, when the refrigerant upstream of the compressor is undesirably low in temperature or low in pressure, the high-temperature and high-pressure refrigerant discharged from the compressor is returned to the upstream side of the compressor via the return circuit, whereby the refrigerant upstream of the compressor can be adjusted to a desired state and can flow into the compressor.

The return adjustment valve may be configured to adjust an opening degree of the return adjustment valve based on a pressure difference between a pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit downstream of the compressor and upstream of the condenser and a pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit downstream of the 1 st evaporator and upstream of the compressor and downstream of a connection position of the branch flow passage.

In this structure, when the refrigerant upstream of the compressor is undesirably at a low temperature or a low pressure, the refrigerant upstream of the compressor can be adjusted to a desired state and flow into the compressor without complicating the structure.

In addition, the refrigeration apparatus of the present invention may further include a heat medium circulating device including: a 1 st cooling flow path connected to the condenser, supplying a heat medium for condensing the refrigerant flowing through the condenser into the condenser, and flowing the heat medium flowing out of the condenser; a 2 nd cooling channel that communicates a portion of the 1 st cooling channel located on an upstream side and a portion located on a downstream side with respect to the condenser so that the heat medium can flow therethrough; and a cooling heat exchanger provided in the 2 nd cooling flow path.

In this configuration, by circulating the heat medium for condensing the refrigerant circulating in the 1 st refrigeration circuit to the cooling heat exchanger side, temperature control can be performed by the cooling heat exchanger, and the temperature control target object or space that can be temperature controlled can be further increased while suppressing an increase in size of the apparatus.

In addition, a temperature control device according to the present invention is a temperature control device including: the refrigeration device; a 1 st liquid flow device having a 1 st liquid flow path, the 1 st liquid flow path being connected to the 1 st evaporator of the 1 st refrigeration circuit, supplying a 1 st liquid, which is cooled by the refrigerant flowing through the 1 st evaporator, into the 1 st evaporator, and flowing the 1 st liquid flowing out from the 1 st evaporator; and a 2 nd liquid flow device having a 2 nd liquid flow path, the 2 nd liquid flow path being connected to the 2 nd evaporator of the 2 nd refrigeration circuit, supplying a 2 nd liquid cooled by the refrigerant flowing through the 2 nd evaporator into the 2 nd evaporator, and flowing the 2 nd liquid flowing out from the 2 nd evaporator.

In this configuration, the 1 st liquid and the 2 nd liquid different from each other can be efficiently cooled while suppressing the size of the apparatus.

In the temperature control device according to the present invention, the 1 st liquid flow device may include a 1 st heater that heats the 1 st liquid cooled by the refrigerant, and the 2 nd liquid flow device may include a 2 nd heater that heats the 2 nd liquid cooled by the refrigerant.

In this configuration, by heating the cooled 1 st liquid or 2 nd liquid, it is possible to control the respective liquids to desired temperatures with high accuracy.

Effects of the invention

According to the present invention, it is possible to efficiently cool a plurality of temperature control objects or spaces while suppressing the size of the apparatus.

Drawings

Fig. 1 is a diagram showing a schematic configuration of a temperature control device according to an embodiment of the present invention.

Fig. 2 is a diagram showing an example of a mollier diagram of the refrigeration apparatus of the temperature control apparatus shown in fig. 1.

Fig. 3 is an enlarged view of the refrigeration apparatus conveniently illustrated in the refrigeration apparatus in fig. 2, showing the points of the states of a plurality of refrigerants shown on the mollier diagram.

Fig. 4 is a schematic view of a semiconductor manufacturing system configured by connecting the temperature control apparatus shown in fig. 1 and a plasma etching apparatus.

Detailed Description

Hereinafter, one embodiment of the present invention will be described.

< schematic Structure of temperature control device >

Fig. 1 is a diagram showing a schematic configuration of a temperature control device 1 according to an embodiment of the present invention. As shown in fig. 1, the temperature control device 1 of the present embodiment includes a refrigeration device 10, a 1 st liquid flow device 101, a 2 nd liquid flow device 102, and a 3 rd liquid flow device 103. In the temperature control device 1, the refrigeration device 10 cools the 1 st liquid flowing through the 1 st liquid flow device 101, the 2 nd liquid flowing through the 2 nd liquid flow device 102, and the 3 rd liquid flowing through the 3 rd liquid flow device 103, respectively, whereby the temperature of the object or space to be temperature-controlled, which are different from each other, can be controlled by the respective liquids. In the present embodiment, it is assumed that the 1 st to 3 rd liquids are not frozen liquids, but other liquids may be used.

(refrigerating apparatus)

First, the refrigeration apparatus 10 will be described in detail. The refrigeration apparatus 10 includes a 1 st refrigeration circuit 20, a subcooling circuit 30, a 2 nd refrigeration circuit 40, a heat medium circulation device 50, an injection circuit 60, and a return circuit 70.

The 1 st refrigeration circuit 20 is configured by connecting a compressor 21, a condenser 22, a 1 st expansion valve 23, and a 1 st evaporator 24 in this order by pipes so as to circulate a refrigerant. In the 1 st refrigeration circuit 20, the refrigerant compressed by the compressor 21 flows into the condenser 22, and the refrigerant flowing into the condenser 22 is condensed by the heat medium flowing through the heat medium flow device 50 in the present embodiment. Thereafter, the refrigerant is decompressed by the 1 st expansion valve 23 to become a low temperature, and flows into the 1 st evaporator 24. The refrigerant flowing into the 1 st evaporator 24 exchanges heat and then flows into the compressor 21, and is then compressed again by the compressor 21. The 1 st refrigeration circuit 20 of the present embodiment is configured to cool the 1 st liquid by exchanging heat between the refrigerant flowing through the 1 st evaporator 24 and the 1 st liquid flowing through the 1 st liquid flow device 101.

The subcooling circuit 30 includes a subcooling bypass passage 31, a subcooling control valve 32, and a subcooling heat exchanger 33. The subcooling bypass flow path 31 communicates (connects) a portion of the 1 st refrigeration circuit 20 that is located downstream of the condenser 22 and upstream of the 1 st expansion valve 23 with the compressor 21 of the 1 st refrigeration circuit 20 so that the refrigerant can flow therethrough. In the present embodiment, one end of the pair of ends of the bypass passage 31 for supercooling is connected to the pipe portion located on the downstream side of the condenser 22 and on the upstream side of the 1 st expansion valve 23, and the other end is connected to the compressor 21, but the other end may be connected to the portion located on the upstream side of the compressor 21 and on the downstream side of the 1 st evaporator 24.

The subcooling control valve 32 controls the flow rate of the refrigerant flowing through the subcooling bypass passage 31. The supercooling heat exchanger 33 is provided on the downstream side of the supercooling control valve 32 of the supercooling bypass passage 31, and exchanges heat between the refrigerant flowing to the downstream side of the supercooling control valve 32 and the refrigerant flowing to the downstream side of the 1 st refrigeration circuit 20 at the downstream side of the condenser 22 and the upstream side of the 1 st expansion valve 23, which is downstream side of the connection position with the supercooling bypass passage 31). In the supercooling heat exchanger 33, the supercooling control valve 32 is opened, and the condensed refrigerant flowing on the downstream side of the condenser 22 is expanded on the downstream side of the supercooling control valve 32 in the supercooling bypass passage 31 to become a low temperature, whereby the degree of supercooling can be given to the refrigerant flowing from the condenser 22 to the 1 st expansion valve 23 side through the supercooling heat exchanger 33. On the other hand, the refrigerant flowing through the subcooling bypass passage 31 flows into the compressor 21. At this time, the refrigerant from the subcooling bypass passage 31 flows into the compressor 21 in the middle of the compression step in which the compressor 21 compresses the refrigerant from the 1 st evaporator 24 side, and is compressed together with the refrigerant from the 1 st evaporator 24 side.

The 2 nd refrigeration circuit 40 has a branch flow path 41, a 2 nd expansion valve 42, and a 2 nd evaporator 43. The branch flow path 41 communicates (connects) a portion of the 1 st refrigeration circuit 20 downstream of the condenser 22 and upstream of the 1 st expansion valve 23, the portion being upstream of the connection position with the subcooling bypass flow path 31, with a portion of the 1 st refrigeration circuit 20 downstream of the 1 st evaporator 24 and upstream of the compressor 21, through which the refrigerant can flow. The 2 nd expansion valve 42 is provided in the branch flow path 41, and expands and discharges the received refrigerant. The 2 nd evaporator 43 is provided downstream of the 2 nd expansion valve 42 in the branch flow path 41, and evaporates the refrigerant flowing out of the 2 nd expansion valve 42. The 2 nd refrigeration circuit 40 is configured to cool the 2 nd liquid by heat exchange between the refrigerant flowing through the 2 nd evaporator 43 and the 2 nd liquid flowing through the 2 nd liquid flow device 102.

The heat medium circulation device 50 includes: a 1 st cooling channel 51 connected to the condenser 22, supplying a heat medium for condensing the refrigerant flowing through the condenser 22 into the condenser 22, and flowing the heat medium flowing out of the condenser 22; a 2 nd cooling channel 52 which communicates (connects) a portion of the 1 st cooling channel 51 located on the upstream side and a portion located on the downstream side with respect to the condenser 22 so that the heat medium can flow therethrough; and a cooling heat exchanger 53 provided in the 2 nd cooling passage 52.

The 1 st cooling channel 51 is connected to the condenser 22 so as to pass through the condenser 22, and circulates the heat medium discharged by a pump, not shown. The heat medium is cooling water for cooling the refrigerant passing through the condenser 22, and in the present embodiment, water is used as the heat medium, but other cooling water may be used. In addition, in the 1 st cooling channel 51, valves for adjusting the flow rate of the heat medium flowing through the condenser 22 are provided on the upstream side and the downstream side of the condenser 22, respectively. In the present embodiment, the configuration is adopted in which the water discharged by the pump is circulated through the 1 st cooling flow path 51 and discharged after passing through the condenser 22, but the 1 st cooling flow path 51 may be a part of a refrigerator that performs a refrigeration cycle.

The 2 nd cooling channel 52 of the heat medium circulating device 50 is provided to return the heat medium branched from the 1 st cooling channel 51 to the 1 st cooling channel 51 via the cooling heat exchanger 53. The cooling heat exchanger 53 is configured to be able to cool the temperature control object or the space with the heat medium, and in the present embodiment, cools the 3 rd liquid by exchanging heat between the circulating heat medium and the 3 rd liquid flowing through the 3 rd liquid flowing device 103.

The injection circuit 60 includes: an injection flow path 61 that communicates (connects) a portion of the 1 st refrigeration circuit 20 on the downstream side of the condenser 22 and on the upstream side of the 1 st expansion valve 23, which portion is on the downstream side of the position where the refrigerant is heat-exchanged by the supercooling heat exchanger 33, with a portion of the branch flow path 41 on the downstream side of the 2 nd evaporator 43, through which the refrigerant can flow; and an injection valve 62 capable of adjusting the flow rate of the refrigerant flowing through the injection flow path 61.

In the injection circuit 60, the refrigerant cooled by the supercooling heat exchanger 33 on the downstream side of the condenser 22 can be branched to the upstream side of the compressor 21 by adjusting the opening degree of the injection valve 62. This can reduce the temperature or pressure of the refrigerant flowing out of the 1 st evaporator 24. In the present embodiment, one end of the pair of ends of the injection circuit 60 is connected to a piping portion on the downstream side of the position where the refrigerant is heat-exchanged by the supercooling heat exchanger 33 in a portion on the downstream side of the condenser 22 and on the upstream side of the 1 st expansion valve 23, and the other end is connected to the branch flow passage 41, but the other end may be connected to a portion on the downstream side of the 1 st evaporator 24 and on the upstream side of the compressor 21 of the 1 st refrigeration circuit 20.

The return circuit 70 includes: a return flow path 71 that connects (connects) a portion of the 1 st refrigeration circuit 20 on the downstream side of the compressor 21 and on the upstream side of the condenser 22 and a portion of the 1 st evaporator 24 on the downstream side and on the upstream side of the compressor 21 so that a refrigerant can flow therethrough; and a return regulating valve 72 capable of regulating the flow rate of the refrigerant flowing through the return channel 71.

In the present embodiment, the return regulating valve 72 is configured to regulate the opening degree of the return regulating valve 72 based on a pressure difference between the pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit 20 on the downstream side of the compressor 21 and on the upstream side of the condenser 22 and the pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit 20 on the downstream side of the connection position of the 1 st evaporator 24 and on the upstream side of the compressor 21 with respect to the branch flow passage 41. More specifically, the larger the pressure difference between the upstream side and the downstream side of the compressor 21, the larger the opening degree of the return regulator valve 72. This enables the pressure on the upstream side of the compressor 21 to be automatically adjusted to a desired value.

As shown in fig. 1, the refrigeration apparatus 10 is provided with a plurality of temperature sensors and a plurality of control devices. For example, a compressor upstream temperature sensor 81 is provided on the upstream side of the compressor 21 of the 1 st refrigeration circuit 20. The compressor upstream temperature sensor 81 detects the temperature of the refrigerant flowing through a portion of the 1 st refrigeration circuit 20 on the upstream side of the compressor 21 and on the downstream side of the 1 st evaporator 24, the portion being on the downstream side of the connection position of the branch flow path 41 and on the downstream side of the connection position of the return flow path 71. The compressor upstream temperature sensor 81 is electrically connected to the injection control device 91, and the injection control device 91 is electrically connected to the injection valve 62. The injection control device 91 of the present embodiment can control the opening degree of the injection valve 62 so that the temperature detected by the compressor upstream temperature sensor 81 becomes a desired value.

Further, a subcooling downstream temperature sensor 82 is provided downstream of the subcooling heat exchanger 33 in the 1 st refrigeration circuit 20. The subcooling downstream temperature sensor 82 detects the temperature of the refrigerant flowing through a portion of the 1 st refrigeration circuit 20 downstream of the position where the refrigerant is heat-exchanged by the subcooling heat exchanger 33 and upstream of the 1 st expansion valve 23. The subcooling downstream temperature sensor 82 is electrically connected to the subcooling control device 92, and the subcooling control device 92 is electrically connected to the subcooling control valve 32. The subcooling control device 92 of the present embodiment can control the opening degree of the subcooling control valve 32 so that the temperature detected by the subcooling downstream temperature sensor 82 becomes a desired value.

The 1 st expansion valve 23 is electrically connected to a 1 st expansion valve control device 93, and the 1 st expansion valve control device 93 is electrically connected to a 1 st temperature sensor 111 provided on the cooling side of the 1 st liquid flow device 101, so that the opening degree of the 1 st expansion valve 23 can be controlled in accordance with the temperature of the 1 st liquid. The 2 nd expansion valve 42 is electrically connected to the 2 nd expansion valve control device 94, and the 2 nd expansion valve control device 94 is electrically connected to a cooling side 2 nd temperature sensor 121 provided in the 2 nd liquid flow device 102, so that the opening degree of the 2 nd expansion valve 42 can be controlled in accordance with the temperature of the 2 nd liquid.

(liquid circulation device)

Next, the 1 st to 3 rd liquid flow devices 101 to 103 will be explained.

First, the 1 st liquid flow device 101 has a 1 st liquid flow path 101A, and the 1 st liquid flow path 101A is connected to the 1 st evaporator 24 of the 1 st refrigeration circuit 20, supplies the 1 st liquid cooled by the refrigerant flowing through the 1 st evaporator 24 into the 1 st evaporator 24, and flows the 1 st liquid flowing out of the 1 st evaporator 24. The 1 st liquid flow path 101A includes: a downstream portion 101D that receives the 1 st liquid flowing out from the 1 st evaporator 24 and circulates the 1 st liquid; and an upstream part 101U that supplies the 1 st liquid into the 1 st evaporator 24, wherein the cooling side 1 st temperature sensor 111, the 1 st heater 112, the 1 st pump 113, and the heating side 1 st temperature sensor 114 described above are provided on the downstream part 101D side.

A discharge portion 115 for discharging the 1 st liquid is provided at an end portion of the downstream portion 101D opposite to the 1 st evaporator 24 side, the discharge portion 115 being connectable to a pipe for circulating the 1 st liquid, while a receiving portion 116 for receiving the 1 st liquid is provided at an end portion of the upstream portion 101U opposite to the 1 st evaporator 24 side, the receiving portion 116 being connectable to a pipe for circulating the 1 st liquid.

The cooling side 1 st temperature sensor 111 detects the temperature of the 1 st liquid immediately after flowing out from the 1 st evaporator 24, and is electrically connected to the 1 st expansion valve control device 93 as described above. The 1 st heater 112 is disposed downstream of the cooling side 1 st temperature sensor 111 of the downstream portion 101D, and heats and flows out the 1 st liquid flowing in from the 1 st evaporator 24 side. The 1 st pump 113 is disposed downstream of the 1 st heater 112 in the downstream portion 101D, and is driven to circulate the 1 st liquid in the downstream portion 101D from the 1 st evaporator 24 side to the discharge portion 115 side. Further, the heating-side 1 st temperature sensor 114 is provided downstream of the 1 st pump 113 in the downstream portion 101D. Here, the heating-side 1 st temperature sensor 114 and the 1 st heater 112 are electrically connected to the 1 st heating amount control device 117, and the 1 st heating amount control device 117 of the present embodiment can control the heating amount of the 1 st heater 112 so that the temperature detected by the heating-side 1 st temperature sensor 114 becomes a desired value.

In the 1 st liquid flow device 101 according to the present embodiment as described above, for example, as shown in fig. 1, a pipe X1 shown by a two-dot chain line is provided between the discharge unit 115 and the receiving unit 116, and heat of the object to be temperature controlled X2 is absorbed by the 1 st liquid or heat is radiated to the object to be temperature controlled X2 in the middle of the pipe X1, whereby the object to be temperature controlled X2 can be temperature-controlled. Specifically, in the present embodiment, the heat of the object to be temperature controlled X2 is absorbed by the 1 st liquid, and the object to be temperature controlled X2 can be cooled.

Next, the 2 nd liquid circulation device 102 has a 2 nd liquid circulation path 102A, and the 2 nd liquid circulation path 102A is connected to the 2 nd evaporator 43 of the 2 nd refrigeration circuit 40, and supplies the 2 nd liquid cooled by the refrigerant circulating through the 2 nd evaporator 43 into the 2 nd evaporator 43, and circulates the 2 nd liquid flowing out from the 2 nd evaporator 43. The 2 nd liquid flow path 102A includes: a downstream portion 102D that receives the 2 nd liquid flowing out of the 2 nd evaporator 43 and circulates the 2 nd liquid; and an upstream part 102U that supplies the 2 nd liquid into the 2 nd evaporator 43, wherein the cooling side 2 nd temperature sensor 121, the 2 nd heater 122, the 2 nd pump 123, and the heating side 2 nd temperature sensor 124 described above are provided on the downstream part 102D side.

A discharge unit 125 for discharging the 2 nd liquid is provided at an end of the downstream portion 102D opposite to the 2 nd evaporator 43 side, and the discharge unit 125 can be connected to a pipe for circulating the 2 nd liquid. On the other hand, a receiving portion 126 capable of receiving the 2 nd liquid is provided at an end portion of the upstream portion 102U opposite to the 2 nd evaporator 43 side, and the receiving portion 126 is connectable to a pipe for circulating the 2 nd liquid.

The cooling-side 2 nd temperature sensor 121 detects the temperature of the 2 nd liquid immediately after flowing out of the 2 nd evaporator 43, and is electrically connected to the 2 nd expansion valve control device 94 as described above. The 2 nd heater 122 is disposed downstream of the cooling side 2 nd temperature sensor 121 of the downstream portion 102D, and heats and flows out the 2 nd liquid flowing in from the 2 nd evaporator 43 side. The 2 nd pump 123 is disposed downstream of the 2 nd heater 122 in the downstream portion 102D, and is driven to circulate the 2 nd liquid in the downstream portion 102D from the 2 nd evaporator 43 side to the discharge portion 125 side. Further, the heating-side 2 nd temperature sensor 124 is provided downstream of the 2 nd pump 123 in the downstream portion 102D. Here, the heating-side 2 nd temperature sensor 124 and the 2 nd heater 122 are electrically connected to the 2 nd heating amount control device 127, and the 2 nd heating amount control device 127 of the present embodiment can control the heating amount of the 2 nd heater 122 so that the temperature detected by the heating-side 2 nd temperature sensor 124 becomes a desired value.

In the 2 nd liquid flow device 102 of the present embodiment as described above, for example, as shown in fig. 1, the pipe Y1 shown by a two-dot chain line is provided between the discharge portion 125 and the receiving portion 126, and heat of the object to be temperature controlled Y2 is absorbed by the 2 nd liquid or heat is radiated to the object to be temperature controlled Y2 in the middle of the pipe Y1, whereby temperature control of the object to be temperature controlled Y2 is possible. Specifically, in the present embodiment, the heat of the object to be temperature controlled Y2 is absorbed by the 2 nd liquid, and the object to be temperature controlled Y2 can be cooled.

The 3 rd liquid circulation device 103 includes a 3 rd liquid circulation path 103A, and the 3 rd liquid circulation path 103A is connected to the cooling heat exchanger 53 of the heat medium circulation device 50, supplies the 3 rd liquid cooled by the heat medium circulating through the cooling heat exchanger 53 into the cooling heat exchanger 53, and circulates the 3 rd liquid flowing out from the cooling heat exchanger 53. The 3 rd liquid flow path 103A includes: a downstream portion 103D that receives the 3 rd liquid flowing out of the cooling heat exchanger 53 and circulates the 3 rd liquid; and an upstream portion 103U that supplies the 3 rd liquid into the cooling heat exchanger 53, wherein a 3 rd heater 132, a 3 rd pump 133, and a heating side 3 rd temperature sensor 134 are provided on the downstream portion 103D side.

A discharge unit 135 for discharging the 3 rd liquid is provided at an end of the downstream portion 103D opposite to the cooling heat exchanger 53 side, and the discharge unit 135 can be connected to a pipe for circulating the 3 rd liquid. On the other hand, a receiving portion 136 capable of receiving the 3 rd liquid is provided at an end portion of the upstream portion 103U opposite to the cooling heat exchanger 53 side, and the receiving portion 136 is connectable to a pipe for flowing the 3 rd liquid.

The 3 rd heater 132 heats and discharges the 3 rd liquid flowing in from the cooling heat exchanger 53 side, and the 3 rd pump 133 is disposed downstream of the 3 rd heater 132 in the downstream portion 103D, and is driven to circulate the 3 rd liquid in the downstream portion 103D from the cooling heat exchanger 53 side to the discharge portion 135 side. Further, a heating side 3 rd temperature sensor 134 is provided downstream of the 3 rd pump 133 of the downstream portion 103D. Here, the heating-side 3 rd temperature sensor 134 and the 3 rd heater 132 are electrically connected to the 3 rd heating amount control device 137, and the 3 rd heating amount control device 137 of the present embodiment can control the heating amount of the 3 rd heater 132 so that the temperature detected by the heating-side 3 rd temperature sensor 134 becomes a desired value.

In the 3 rd liquid circulation device 103 according to the present embodiment as described above, for example, as shown in fig. 1, a pipe Z1 shown by a two-dot chain line is provided between the discharge unit 135 and the receiving unit 136, and heat of the object Z2 is absorbed by the 3 rd liquid or heat is radiated to the object Z2 in the middle of the pipe Z1, whereby temperature control of the object Z2 can be performed. Specifically, in the present embodiment, the 3 rd liquid absorbs heat of the object Z2 to cool the object Z2.

(operation of temperature control device)

Next, an example of the operation of the temperature control device 1 will be described. In this example, first, the 1 st to 3 rd liquid flow devices 101 to 103 are connected to the corresponding pipes X1, Y1, and Z1, respectively, so that the 1 st liquid can cool the object to be temperature controlled X2, the 2 nd liquid can cool the object to be temperature controlled Y2, and the 3 rd liquid can cool the object to be temperature controlled Z2. Then, the compressor 21, the heat medium circulation device 50, and the 1 st, 2 nd, and 3 rd pumps 113, 123, and 133 are driven.

When the compressor 21 is driven, in the 1 st refrigeration circuit 20 of the refrigeration apparatus 10, the refrigerant compressed by the compressor 21 flows into the condenser 22 and is condensed by the heat medium of the heat medium circulation device 50. Then, the refrigerant passes through the supercooling heat exchanger 33. At this time, in the present embodiment, the subcooling control valve 32 is normally open, and a part of the condensed refrigerant flowing downstream of the condenser 22 flows into the subcooling bypass passage 31, expands to a low temperature downstream of the subcooling control valve 32, and thereby a degree of subcooling is applied to the refrigerant flowing from the condenser 22 to the 1 st expansion valve 23 side via the subcooling heat exchanger 33. The refrigerant expanded by the subcooling control valve 32 flows into the compressor 21 in a heat-absorbed state. The refrigerant having passed through the 1 st expansion valve 23 is decompressed to a low temperature, and flows into the 1 st evaporator 24.

The refrigerant flowing into the 1 st evaporator 24 exchanges heat with the 1 st liquid flowing through the 1 st liquid flow device 101, and cools the 1 st liquid. Here, the 1 st liquid circulation device 101 heats the 1 st liquid cooled by the refrigerant flowing into the 1 st evaporator 24 by the 1 st heater 112, and adjusts the 1 st liquid to a desired value. Then, the temperature of the object X2 to be temperature controlled is controlled by the 1 st liquid adjusted to the desired value in this way. The refrigerant having exchanged heat with the 1 st liquid flows to the compressor 21 side and is compressed again by the compressor 21.

In the 2 nd refrigeration circuit 40, the refrigerant that has branched into the branch flow path 41 on the upstream side of the supercooling heat exchanger 33 is decompressed by the 2 nd expansion valve 42 to become a low temperature, and flows into the 2 nd evaporator 43. Then, the refrigerant flowing into the 2 nd evaporator 43 exchanges heat with the 2 nd liquid flowing through the 2 nd liquid flow device 102, and cools the 2 nd liquid. Here, the 2 nd liquid circulation device 102 heats the 2 nd liquid cooled by the refrigerant flowing into the 2 nd evaporator 43 by the 2 nd heater 122, and adjusts the 2 nd liquid to a desired value. Then, the temperature of the object to be temperature controlled Y2 is controlled by the 2 nd liquid adjusted to the desired value in this way. The refrigerant that has exchanged heat with the 2 nd liquid is mixed or not mixed with the refrigerant from the injection flow path 61, flows to the downstream side of the 1 st evaporator 24 of the 1 st refrigeration circuit 20, and is compressed again by the compressor 21.

In the heat medium circulating device 50, the heat medium circulating through the 2 nd cooling channel 52 circulates through the cooling heat exchanger 53 and then returns to the 1 st cooling channel 51 on the downstream side of the condenser 22. The refrigerant flowing into the cooling heat exchanger 53 exchanges heat with the 3 rd liquid flowing through the 3 rd liquid flow device 103, and cools the 3 rd liquid. Here, the 3 rd liquid circulation device 103 heats the 3 rd liquid cooled by the refrigerant flowing into the cooling heat exchanger 53 by the 3 rd heater 132, and adjusts the 3 rd liquid to a desired value. Then, the temperature of the object Z2 is controlled by the 3 rd liquid adjusted to the desired value.

In the present embodiment, the refrigerant flowing out of the 1 st evaporator 24 and the refrigerant flowing out of the 2 nd evaporator 43 are mixed and flow into the compressor 21 side, and in this case, the temperature and pressure of the mixed refrigerant are likely to fluctuate. In order to suppress such variations, the present embodiment is provided with an injection circuit 60 and a return circuit 70. Specifically, when the temperature or pressure of the refrigerant on the upstream side of the compressor 21 is higher than a desired value, the injection circuit 60 supplies the low-temperature and low-pressure refrigerant having passed through the supercooling heat exchanger 33 from the injection flow path 61 to the upstream side of the compressor 21. When the temperature or pressure of the refrigerant on the upstream side of the compressor 21 is lower than a desired value, the return circuit 70 supplies the high-temperature and high-pressure refrigerant from the return passage 71 to the upstream side of the compressor 21. Thus, in the present embodiment, it is possible to suppress the inflow of the refrigerant in an undesired state into the compressor 21, and to suppress the temperature control from becoming unstable.

Here, fig. 2 shows a mollier diagram of the 1 st refrigeration circuit 20 when the injection circuit 60 and the return circuit 70 are operated, and fig. 3 is an enlarged view of the refrigeration apparatus 10 (particularly, the 1 st refrigeration circuit 20) conveniently showing states of a plurality of refrigerants shown on the mollier diagram of fig. 2 on the refrigeration apparatus 10. In the refrigeration cycle of the 1 st refrigeration circuit 20 shown in fig. 2 and 3, the refrigerant sucked by the compressor 21 is compressed as indicated by the transition from point a to point B. The refrigerant discharged from the compressor 21 is condensed and cooled by the condenser 22, and its specific enthalpy decreases as indicated by the transition from point B to point C.

Next, a part of the refrigerant condensed by the condenser 22 is given a degree of subcooling in the subcooling heat exchanger 33, and its specific enthalpy decreases as shown by the transition from point C to point C'. At this time, the refrigerant flowing through the subcooling bypass passage 31 to which the degree of subcooling is imparted in the subcooling heat exchanger 33 is expanded by the subcooling control valve 32, and, as indicated by the transition from the point C to the point E, is reduced in pressure to, for example, an intermediate pressure level, and the degree of subcooling is imparted in the subcooling heat exchanger 33 in this state. Then, the refrigerant to which the degree of subcooling has been applied is mixed with the refrigerant compressed during the transition between point a and point B from point E in a state where the specific enthalpy increases, and reaches point B.

Next, as described above, the refrigerant having the degree of supercooling in the supercooling heat exchanger 33 is decompressed by the 1 st expansion valve 23 to become a low temperature as indicated by the transition from the point C' to the point D. Then, the refrigerant discharged from the 1 st expansion valve 23 exchanges heat with the 1 st liquid in the 1 st evaporator 24, and in this example, absorbs heat as indicated by the transition from the point D to the point a', and the specific enthalpy thereof increases.

At this time, when the refrigerant is excessively superheated as indicated by the point a ', the injection circuit 60 mixes the refrigerant having passed through the supercooling heat exchanger 33 as a low-temperature low-pressure refrigerant with the refrigerant excessively superheated as indicated by the transition from the point C' to the point D ', and can reduce the degree of superheat of the refrigerant as indicated by the transition from the point a' to the point a ″. At this time, although the specific enthalpy of the refrigerant is excessively reduced as indicated by the point a ″ and the temperature or pressure of the refrigerant is undesirably reduced in this example, in this case, as indicated by the transition from the point B to the point B', the high-temperature and high-pressure refrigerant on the downstream side of the compressor 21 is mixed with the refrigerant having an excessively reduced temperature or pressure by the return circuit 70, and the refrigerant can be brought into a desired state as indicated by the transition from the point a ″ to the point a. In this way, the inflow of the refrigerant in an undesired state into the compressor 21 can be suppressed, and the temperature control can be suppressed from becoming unstable.

In the present embodiment described above, the 1 st expansion valve 23 and the 1 st evaporator 24, and the 2 nd expansion valve 42 and the 2 nd evaporator 43 are connected to the common compressor 21 and the condenser 22 on the upstream sides thereof, respectively. The refrigerant discharged from the compressor 21 and flowing out of the condenser 22 can be made to flow through the 1 st expansion valve 23 to the 1 st evaporator 24 and through the 2 nd expansion valve 42 to the 2 nd evaporator 43, and thus different temperature control objects or spaces can be cooled by the evaporators. This makes it possible to efficiently cool a plurality of temperature control objects or spaces while suppressing the size of the apparatus. In particular, when the temperature control range required for one of the plurality of temperature control objects or spaces is different from that for the other, the 1 st evaporator 24 through which the refrigerant supercooled by the supercooling heat exchanger 33 flows cools the temperature control object or space requiring a large temperature control range, and the 2 nd evaporator 43 cools the other temperature control object or space, whereby the apparatus size of the refrigeration apparatus can be more effectively reduced, and the energy consumption can be reduced.

Further, since the refrigeration apparatus 10 can mix the condensed refrigerant branched by the injection circuit 60 with the refrigerant flowing out to the downstream side of the 1 st evaporator 24, the temperature and pressure of the refrigerant flowing into the compressor 21 can be easily controlled to desired states. This stabilizes the operation of the compressor 21 and improves the stability of temperature control. Further, when the refrigerant upstream of the compressor 21 is undesirably low in temperature or low in pressure, the refrigeration apparatus 10 can adjust the refrigerant upstream of the compressor 21 to a desired state and flow into the compressor 21 by returning the high-temperature and high-pressure refrigerant discharged from the compressor 21 to the upstream side of the compressor 21 via the return circuit 70. This stabilizes the operation of the compressor 21 and improves the stability of temperature control.

The return regulating valve 72 of the present embodiment is configured to regulate the opening degree of the return regulating valve 72 based on a pressure difference between the pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit 20 on the downstream side of the compressor 21 and on the upstream side of the condenser 22 and the pressure of the refrigerant flowing through a portion of the 1 st refrigeration circuit 20 on the downstream side of the connection position of the 1 st evaporator 24 and on the upstream side of the compressor 21 with respect to the branch flow passage 41. Thus, when the refrigerant upstream of the compressor 21 is undesirably low in temperature or pressure, the refrigerant upstream of the compressor 21 can be adjusted to a desired state and can flow into the compressor without complicating the structure.

The refrigeration apparatus 10 further includes a heat medium circulation device 50, and the heat medium circulation device 50 includes: a 1 st cooling channel 51 which supplies a heat medium for condensing the refrigerant flowing through the condenser 22 into the condenser 22 and flows the heat medium flowing out of the condenser 22; a 2 nd cooling passage 52 which communicates a portion of the 1 st cooling passage 51 on the upstream side and a portion on the downstream side with respect to the condenser 22 so that the heat medium can flow therethrough; and a cooling heat exchanger 53 provided in the 2 nd cooling passage 52. Thus, by circulating the heat medium for condensing the refrigerant flowing through the 1 st refrigeration circuit 20 to the cooling heat exchanger 53 side, the temperature can be controlled by the cooling heat exchanger 53, and the temperature-controllable objects and spaces can be further increased while suppressing the size increase of the apparatus.

(application example of temperature control device)

Fig. 4 is a schematic diagram of a semiconductor manufacturing system configured by connecting the temperature control apparatus 1 of the present embodiment to the plasma etching apparatus 200. The plasma etching apparatus 200 includes a lower electrode 201, an upper electrode 202, and a container 203 for housing the lower electrode 201 and the upper electrode 202. In the case of performing etching, the temperature is increased in the order of the lower electrode 201, the upper electrode 202, and the container 203. In the temperature control apparatus 1 of the present embodiment, the plasma etching apparatus 200 is configured such that the 1 st liquid flow device 101 is connected to the lower electrode 201, the 2 nd liquid flow device 102 is connected to the upper electrode 202, and the 3 rd liquid flow device 103 is connected to the container 203. Thus, the plasma etching apparatus 200 can be efficiently cooled by the temperature control apparatus 1 of the present embodiment.

In the present embodiment, the temperature control device 1 includes the refrigeration device 10 and the 1 st to 3 rd liquid circulation devices 101 to 103, but the refrigeration device 10 may be used as an air conditioner without providing a liquid circulation device.

Description of the reference symbols

1: a temperature control device; 10: a refrigeration device; 20: 1 st refrigeration loop; 21: a compressor; 22: a condenser; 23: 1 st expansion valve; 24: 1 st evaporator; 30: a subcooling circuit; 31: a bypass flow path for supercooling; 32: a control valve for supercooling; 33: a supercooling heat exchanger; 40: a 2 nd refrigeration loop; 41: a branch flow path; 42: a 2 nd expansion valve; 43: a 2 nd evaporator; 50: a heat medium circulating device; 51: a 1 st cooling flow path; 52: a 2 nd cooling flow path; 53: a heat exchanger for cooling; 60: an injection loop; 61: an injection flow path; 62: an injection valve; 70: a return loop; 71: a return flow path; 72: a return regulating valve; 101: 1 st liquid flow-through device; 101A: a 1 st liquid flow path; 112: the 1 st heater; 102: a 2 nd liquid flow-through device; 102A: a 2 nd liquid flow path; 122: a 2 nd heater; x1, Y1, Z1: piping; x2, Y2, Z2: a temperature control object; 200: a plasma etching apparatus; 201: a lower electrode; 202: an upper electrode; 203: a container.