阅读说明：本技术 流体控温系统及其方法、以及控制流体温度装置 (Fluid temperature control system and method thereof, and device for controlling fluid temperature ) 是由 敖小强 姜加龙 曾立民 潘本锋 贺鹏飞 于 2019-09-25 设计创作，主要内容包括：本申请涉及一种流体控温系统及其方法、以及控制流体温度装置。该流体控温系统包括导热块,具有第一端、第二端以及侧面,第一端和第二端相对；流体管,缠绕于侧面；加热单元,贴附第一端,用于提高导热块的温度；制冷单元,贴附第二端,用于降低导热块的温度；温度传感器,用于测量导热块温度。本申请提供的流体控温系统实现流体加热或制冷装置的小型化和/或一体化。(The application relates to a fluid temperature control system, a method thereof and a device for controlling the temperature of fluid. The fluid temperature control system includes a thermally conductive block having a first end, a second end, and a side, the first end and the second end being opposite; a fluid pipe wound around the side; the heating unit is attached to the first end and used for increasing the temperature of the heat conducting block; the refrigerating unit is attached to the second end and used for reducing the temperature of the heat conducting block; and the temperature sensor is used for measuring the temperature of the heat conducting block. The fluid temperature control system provided by the application realizes miniaturization and/or integration of a fluid heating or refrigerating device.)

1. A fluid temperature control system, comprising:

a heat conducting block having a first end, a second end and a side, the first end and the second end being opposite;

a fluid pipe wound around the side;

the heating unit is attached to the first end and used for increasing the temperature of the heat conducting block;

the refrigerating unit is attached to the second end and used for reducing the temperature of the heat conducting block;

and the temperature sensor is used for measuring the temperature of the heat conducting block.

2. The fluid temperature control system of claim 1, further comprising a heat retention box, wherein the heat conduction block, the fluid tube, the heating unit, the refrigeration unit, and the temperature sensor are disposed in the heat retention box.

3. The fluid temperature control system of claim 1, wherein the heat conducting block is a cylinder with an oval or circular cross-section.

4. The fluid temperature control system of claim 1, wherein the material of the heat conducting block is aluminum or copper.

5. The fluid temperature control system of claim 1, further comprising a heat dissipation unit disposed at an end of the refrigeration unit distal from the heat conductive block.

6. The fluid temperature control system of claim 5, wherein the refrigeration unit is a semiconductor refrigeration sheet, a refrigeration surface of the semiconductor refrigeration sheet is attached to the second end, and a heat release surface of the semiconductor refrigeration sheet faces the heat dissipation unit.

7. The fluid temperature control system of claim 1, wherein the material of the fluid tube is stainless steel or polytetrafluoroethylene.

8. The fluid temperature control system of claim 1, wherein the heating unit is a PTC heater chip or a ceramic heater chip.

9. A method of controlling the temperature of a fluid for use in a fluid temperature control system according to any one of claims 1 to 8, comprising:

acquiring the temperature of the heat conducting block measured by the temperature sensor;

comparing the temperature of the heat conducting block with a preset value to obtain a comparison result;

and controlling the heating unit and the refrigerating unit according to the comparison result.

10. A device for controlling the temperature of a fluid, for use in a fluid temperature control system according to any one of claims 1 to 8, comprising:

the acquisition module is used for acquiring the temperature of the heat conduction block measured by the temperature sensor;

the comparison module is used for comparing the temperature of the heat conduction block with a preset value;

and the control module is used for controlling the heating unit and the refrigerating unit according to the comparison result.

Technical Field

The present application relates generally to the field of fluid temperature control, and more particularly to a fluid temperature control system and method, and a device for controlling fluid temperature.

Background

Fluid refers to a substance capable of flowing, and is a generic term for liquid and gas.

Flow Injection Analysis (FIA) is a novel continuous Flow Analysis technique proposed in 1974 by the Danish chemist Luzika (Ruzicka J) and Hansen (Hansen E H). The technique is to inject a certain volume of sample solution into a flowing reagent solution (or water) carrier fluid with non-air space, the injected sample solution flows into a reaction coil to form a region, and the region is mixed and reacted with the reagent in the carrier fluid, and then the region enters a flow detector for measurement, analysis and recording. Since the sample solution is dispersed in the reagent carrier under strictly controlled conditions, the concentration of the analyte in the sample solution can be determined from a working curve drawn from the standard solution according to a comparative method without requiring the equilibrium state of the reaction as long as the conditions of the retention time, temperature and dispersion process in the pipe are the same in the sample solution injection method.

In water quality and soil analysis, a Flow Injection Analysis (FIA) method is often used to determine the content of ammonia nitrogen, total phosphorus, potassium permanganate index, and the like. Some of the reactions need to be controlled at a certain temperature and a certain reaction time needs to be kept, so that a device capable of controlling the temperature of the fluid needs to be designed.

Disclosure of Invention

The application aims to provide a small temperature control device capable of realizing integration of fluid heating and refrigeration.

According to one aspect of the present application, there is provided a fluid temperature control system comprising: a heat conducting block having a first end, a second end and a side, the first end and the second end being opposite; a fluid pipe wound around the side; the heating unit is attached to the first end and used for increasing the temperature of the heat conducting block; the refrigerating unit is attached to the second end and used for reducing the temperature of the heat conducting block; and the temperature sensor is used for measuring the temperature of the heat conducting block.

Optionally, the fluid temperature control system according to the above further comprises a thermal insulation box. The heat conduction block, the fluid pipe, the heating unit, the refrigerating unit and the temperature sensor are placed in the heat preservation box.

Optionally, according to the above fluid temperature control system, the heat conduction block is a cylindrical body with an oval or circular cross section.

Optionally, according to the above fluid temperature control system, the material of the heat conducting block is aluminum or copper.

Optionally, the fluid temperature control system further includes a heat dissipation unit, and the heat dissipation unit is disposed at one end of the refrigeration unit, which is far away from the heat conduction block.

Optionally, according to the above fluid temperature control system, the refrigeration unit is a semiconductor refrigeration sheet, a refrigeration surface of the semiconductor refrigeration sheet is tightly attached to the second end, and a heat release surface of the semiconductor refrigeration sheet faces the heat dissipation unit.

Optionally, according to the above-mentioned fluid temperature control system, the material of the fluid pipe is stainless steel or polytetrafluoroethylene.

Optionally, according to the above fluid temperature control system, the heating unit is a PTC heating plate or a ceramic heating plate.

According to an aspect of the present application, the present invention also provides a method for controlling the temperature of a fluid, for use in a fluid temperature control system as described above, comprising:

acquiring the temperature of the heat conducting block measured by the temperature sensor;

comparing the temperature of the heat conducting block with a preset value to obtain a comparison result;

and controlling the heating unit and the refrigerating unit according to the comparison result.

According to an aspect of the present application, the present invention also provides a device for controlling the temperature of a fluid, for use in a fluid temperature control system as described above, comprising:

the acquisition module is used for acquiring the temperature of the heat conduction block measured by the temperature sensor;

the comparison module is used for comparing the temperature of the heat conduction block with a preset value;

and the control module is used for controlling the heating unit and the refrigerating unit according to the comparison result.

According to an exemplary embodiment, the fluid temperature control system provided herein achieves that the fluid is in the conduit for a sufficient amount of time to achieve a desired temperature of the fluid.

According to an example embodiment, the fluid temperature control system provided herein enables miniaturization and/or integration of a fluid heating or cooling device.

Drawings

FIG. 1 is a schematic diagram of a fluid temperature control system according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a fluid temperature control system according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a fluid temperature control system according to an embodiment of the present application;

FIG. 4 is a flowchart of a method for controlling the temperature of a fluid by the fluid temperature control system according to an embodiment of the present application;

FIG. 5 is a block diagram of a device for controlling fluid temperature according to an embodiment of the present application;

fig. 6 is a schematic diagram of a connection between a fluid temperature control device and a fluid temperature control system according to an embodiment of the present application.

Detailed Description

The following detailed description of the present application, taken in conjunction with the accompanying drawings and examples, is provided to enable the aspects of the present application and its advantages to be better understood. However, the specific embodiments and examples described below are for illustrative purposes only and are not limiting of the present application.

The execution sequence of each step in the method mentioned in this application is not limited to the sequence presented in the text unless otherwise specified, that is, the execution sequence of each step may be changed, and other steps may be inserted between two steps as required.

As used herein, the terms "connected," "mounted," "connected," and the like are intended to be broadly construed, and unless otherwise expressly specified or limited, to either directly or through intervening media. In the description of the present application, it is to be understood that the directions or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", "top", "bottom", and the like are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

FIG. 1 illustrates a fluid temperature control system according to an embodiment of the present application.

Referring to fig. 1, a fluid temperature control system according to one embodiment of the present application includes: a heat conduction block 110, a fluid pipe 120, a heating unit 130, a cooling unit 140, and a temperature sensor 150.

The heat conduction block 110 has a first end 111, a second end 112, and a side surface 113, the first end 111 and the second end 112 being opposite.

The heating unit 130 is attached to the first end 111 for increasing the temperature of the heat conductive block 110. For example, the heating unit 130 may employ a PTC heater chip or a ceramic heater chip.

The cooling unit 140 is attached to the second end 112 for reducing the temperature of the heat conductive block 110. For example, the cooling unit 140 may employ a semiconductor cooling fin.

The temperature probe of the temperature sensor 150 is disposed on the heat-conducting block 110 for measuring the temperature of the heat-conducting block. Alternatively, the temperature probe of the temperature sensor is placed in the middle of the heat conducting block 110, or at a distance from the heat conducting block. The position is not limited, and the temperature sensor can measure the temperature of the heat-conducting block. The temperature sensor 150 may be, for example, a thermocouple or a thermistor.

Fluid tube 120 is wound around side 113.

Fluid flows within the fluid tube 120. For example, a peristaltic pump or air pump may be used to flow fluid within fluid tube 120. The system takes the fluid pipe as a heat conducting medium, and exchanges heat of the heat conducting block or the fluid to the other side so as to realize refrigeration or heating of the fluid.

According to an exemplary embodiment, the fluid tube is wrapped around the heat-conducting block, which extends the residence time of the fluid in the tube to achieve a desired temperature of the fluid.

According to the exemplary embodiment, the heating unit and the refrigerating unit are respectively arranged at two ends of the heat conducting block, and the temperature probes of the temperature sensors are arranged on the heat conducting block, so that the problem that the temperature probes are too close to the heating unit or the refrigerating unit, so that the difference between the measured temperature and the actual temperature is too large can be avoided.

According to an exemplary embodiment, the system enables miniaturization and integration of a fluid heating or cooling device. The system can be also independently disassembled into a fluid refrigerating device or a fluid heating device according to the requirement so as to have smaller volume and wider application scenes.

FIG. 2 illustrates a fluid temperature control system according to an embodiment of the present application.

Referring to fig. 2, in some embodiments, a heat dissipation unit 170 is further included.

The heat radiating unit 170 is disposed at an end of the cooling unit 140 away from the heat conductive block 110.

The heat dissipation unit 170 may be a heat sink or a combination of a heat sink and a heat dissipation fan.

According to an exemplary embodiment, when the heat dissipating unit includes a heat dissipating fin made of aluminum or copper and a heat dissipating fan, one end of the heat dissipating fin is closely attached to the end of the cooling unit 140 away from the heat conducting block 110, and the other end is closely attached to the heat dissipating fan.

In some embodiments, the cooling unit is a semiconductor cooling plate, the cooling surface of the semiconductor cooling plate is tightly attached to the second end, and the heat releasing surface of the semiconductor cooling plate faces the heat dissipating unit.

In some embodiments, the heating unit is a PTC heating plate or a ceramic heating plate.

The heating piece and/or the refrigerating piece are/is tightly attached to the two opposite ends of the heat conducting block, and the temperature sensor cannot be influenced to measure the temperature of the heat conducting block even if the length of the heat conducting block is short.

In some embodiments, the heat conducting block is a cylindrical body with an oval or circular cross section. The material of the heat conduction block is aluminum or copper. For example, a cylindrical aluminum block may be used as the heat conductive block.

In some embodiments, the material of the fluid tube is stainless steel or polytetrafluoroethylene. For example, a corrosion resistant 316 stainless steel tube having an outer diameter of 1/16 "or 1/8" may be used.

FIG. 3 illustrates a fluid temperature control system according to an embodiment of the present application.

Referring to fig. 3, in some embodiments, the system further includes a holding box 180.

The heat conduction block 110, the fluid pipe 120, the heating unit 130, the cooling unit 140, and the temperature sensor 150 are placed in the thermal insulation box 180.

The heat preservation box is used for further unifying the temperature of the fluid in the heat conduction block and the fluid pipe. The heat preservation box can be a plastic heat preservation box or a metal heat preservation box with the inner wall stuck with heat preservation materials.

Fig. 4 is a flowchart illustrating a method for controlling the temperature of the fluid by the above-mentioned fluid temperature control system according to an embodiment of the present application.

Referring to fig. 4, the present application also discloses a method for controlling the temperature of the fluid by the above-mentioned fluid temperature control system, which includes:

s10 obtains the temperature of the heat-conductive block measured by the temperature sensor.

S20, comparing the temperature of the heat conducting block with a preset value to obtain a comparison result.

S30 controls the heating unit and the cooling unit according to the comparison result.

According to an embodiment, step S30 may include:

and when the temperature of the heat conduction block is higher than the preset value, starting the refrigeration unit to reduce the temperature of the heat conduction block until the temperature is stabilized to the preset value.

And when the temperature of the heat conduction block is lower than the preset value, starting the heating unit to enable the temperature of the heat conduction block to rise until the temperature is stabilized to the preset value.

FIG. 5 shows a block diagram of an apparatus for controlling fluid temperature according to an embodiment of the present application.

Referring to fig. 5, the present application further discloses a device for controlling the temperature of a fluid, comprising: an acquisition module 610, a comparison module 620, and a control module 630.

And an obtaining module 610, configured to obtain the temperature of the heat conducting block measured by the temperature sensor.

And the comparison module 620 is used for comparing the temperature of the heat conduction block with a preset value to obtain a comparison result.

And a control module 630 for controlling the heating unit and the cooling unit according to the comparison result.

FIG. 6 shows a schematic connection diagram of a device for controlling the temperature of a fluid and a fluid temperature control system according to an embodiment of the present application.

In some embodiments, referring to fig. 6, the fluid temperature control device 160 is electrically connected to the heating unit 130, the cooling unit 140, and the temperature sensor 150, respectively.

The fluid temperature control device is used for acquiring a temperature value measured by the temperature sensor and controlling the heating unit and the refrigerating unit according to the temperature value and a preset value so as to enable the temperature of the fluid in the fluid pipe to reach the preset value.

According to an exemplary embodiment, the apparatus for controlling the temperature of a fluid for use in the above-mentioned fluid temperature control system comprises:

when the fluid temperature control system is just started, the fluid is continuously introduced into the fluid pipe.

The temperature of the heat conducting block is monitored by a temperature sensor and sent to a fluid temperature control device.

The fluid temperature control device compares the received heat conduction block temperature with a preset value.

When the temperature of the heat conduction block is higher than the preset value, the fluid temperature control device sends a control signal to the refrigeration unit, and the refrigeration unit is started according to the received control signal. At this moment, the temperature of the heat conduction block can be continuously reduced, and the temperature measured by the temperature sensor can be reduced until the temperature is stabilized to a preset value, so that the refrigeration of the fluid is realized.

When the temperature of the heat conduction block is lower than the preset value, the fluid temperature control device is controlled to send a control signal to the heating unit, and the heating unit is started according to the received control signal. At this time, the temperature of the heat conducting block will continuously rise, and the temperature measured by the temperature sensor will also rise until the temperature stabilizes to a preset value, so as to heat the fluid.

Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present application and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of this invention may be made without departing from the spirit or scope of the invention.