阅读说明：本技术 用于处理物体的设备、减少物体上的污染物的方法及系统 (Apparatus for treating objects, method and system for reducing contaminants on objects ) 是由 林重佑 郭仕奇 莫竣傑 于 2019-06-28 设计创作，主要内容包括：一种用于处理物体的设备、减少物体上的污染物的方法及系统。本揭示案描述用于处理一或多个物体的设备。设备包括：载体,配置以保持一或多个物体；水槽,装满处理剂且配置以接收载体；及自旋部分,配置以接触一或多个物体且自旋一或多个物体以扰动处理剂的流场。(An apparatus for treating an object, a method and a system for reducing contaminants on an object. The present disclosure describes an apparatus for processing one or more objects. The apparatus comprises: a carrier configured to hold one or more objects; a water tank filled with a treating agent and configured to receive a carrier; and a spinning portion configured to contact the one or more objects and spin the one or more objects to perturb the flow field of the treatment agent.)

1. An apparatus for processing one or more objects, comprising:

a carrier configured to hold the one or more objects;

a tank including a treatment agent and configured to receive the carrier; and

a spinning portion configured to contact the one or more objects and spin the one or more objects to perturb a flow field of the treatment agent.

2. The apparatus of claim 1, wherein the carrier comprises a lifting device configured to separate the one or more objects from each other, and wherein the spinning portion is attached to the lifting device.

3. The apparatus of claim 1, wherein the spinning portion is configured to support the one or more objects from a lower portion of the one or more objects.

4. The apparatus of claim 1, wherein the spinning portion is attached to a bottom surface of the basin, a sidewall surface of the basin, a frame above the basin, or a combination thereof.

5. A method of reducing contaminants on one or more objects, comprising:

fixing the one or more objects in a carrier;

immersing the carrier in a treatment agent;

spinning the one or more objects in the carrier to form a flow path that is different from a flow field path of the treatment agent; and

the one or more objects are rinsed.

6. The method of claim 5, wherein spinning the one or more objects in the carrier comprises: at least two of the one or more objects are spun in opposite directions.

7. The method of claim 5, wherein spinning the one or more objects comprises: a roller in driving contact with the one or more objects.

8. The method of claim 7, further comprising:

attaching the roller in a water bath in a direction to align the one or more objects;

by the roller, contact the one or more objects, and

spinning the one or more objects by the roller.

9. The method of claim 8, further comprising: a plurality of sub-rollers are attached in the water tank to contact and spin the one or more objects from a plurality of directions.

10. A system for reducing contaminants on one or more objects, comprising:

a processing tool, comprising:

a carrier configured to hold the one or more objects;

a tank including a treatment agent and configured to receive the carrier; and

a spinning device configured to spin the one or more objects based on a control signal;

a control device configured to determine the control signal for the spin device, wherein the control signal includes a spin speed of the spin device; and

a communication device configured to transmit the control signal from the control device to the spinning device.

Technical Field

The present disclosure relates to an apparatus for treating an object, a method of reducing contaminants on an object, and a system for reducing contaminants on an object.

Background

Wet cleaning stations are widely used in semiconductor manufacturing for chemical processing and etching of materials. The wet bench may have a tank (e.g., a wet bench tank) containing a treatment agent (e.g., a fluid) for various purposes. For example, the wet clean station may include an acid for etching materials, a photoresist stripper for stripping photoresist from a surface, and/or a cleaning solution for cleaning wafers/components. The wafer may be placed in a wet clean station and immersed in a treatment agent. The wafer carrier (e.g., a structure that carries wafers) may be part of a water bath or may be placed in a water bath to immerse a batch of wafers to be processed (e.g., cleaned or etched) in a processing agent. The treating agent is circulated in the water tank and may be used to treat multiple batches of wafers.

Disclosure of Invention

The present disclosure provides an apparatus for processing one or more objects comprising a carrier, a water bath, and a spinning section. The carrier is configured to hold an object. The tank includes a treatment agent and is configured to receive a carrier. The spinning portion is configured to contact the object and spin the object to perturb the flow field of the treatment agent.

The present disclosure provides a method of reducing contamination on one or more objects, comprising immobilizing an object in a carrier; immersing the carrier in a treatment agent; spinning the object in the carrier to form a flow path different from a flow field path of the treating agent; and rinsing the object.

The present disclosure provides a system for reducing contaminants on one or more objects, including a process tool, a control device, and a communication device. The processing tool includes a carrier, a water tank, and a spin portion. The carrier is configured to hold an object. The tank includes a treatment agent and is configured to receive a carrier. The spinning device is configured to spin the object based on the control signal. The control device is configured to determine a control signal for the spin device, wherein the control signal includes a spin speed of the spin device. The communication device is configured to transmit a control signal from the control device to the spinning device.

Drawings

Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that in accordance with industry conventional practice, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of illustration and discussion.

FIG. 1A depicts a cross-sectional view of a wet bench basin, according to some embodiments of the present disclosure;

FIG. 1B illustrates a side view of the wet bench basin of FIG. 1A;

2A-2E illustrate cross-sectional views of wet clean station structures, according to some embodiments of the present disclosure;

FIGS. 3A and 3B each show a side view of another wet clean station structure, according to some embodiments of the present disclosure;

FIG. 4 depicts a process flow for cleaning a wafer using a wet clean station structure, according to some embodiments of the present disclosure;

FIG. 5 shows a control system according to some embodiments of the present disclosure;

FIG. 6 shows a computer system for implementing various embodiments of the present disclosure, according to some embodiments.

[ notation ] to show

100 sink (or basin) cross-sectional view along x-z plane

101 base

102 wafer

103 vector

104 handle

104-1 lifting device

104-2 lifting device

104-3 lifting device

105-1 inlet

105-2 inlet

106 water tank

107 treating agent

108 flow field path

110 sink side view shown at a non-zero angle (e.g., about 4 degrees) to the x-axis (or y-axis)

200 wet type cleaning table structure

201 base

202 wafer

202-1 wafer

202-2 wafer

202-11 wafer

202-12 wafer

202-13 wafer

202-14 wafer

203 vector

204 handle

204-1 lifting device

204-2 lifting device

204-3 lifting device

205-1 inlet

205-2 inlet

206 sink

207 treating agent

208 flow field path

209-1 roller

209-2 roller

210 wet type cleaning table structure

211 roller

212 roller

213-1 roller

213-2 roller

214-1 roller

214-2 roller

214-3 roller

220 wet type cleaning table structure

230 wet type cleaning table structure

240 wet type cleaning table structure

300 wet type cleaning table structure

301-1 roller

301-2 roller

302-1 roller

302-2 roller

303-1 roller

303-2 roller

303-3 roller

310 wet type cleaning table structure

400 method

401 operation

402 operation

403 operation

500 system

501 control unit/device

502 communication means

503 wet type cleaning table

504 wet type cleaning table structure

600 computer system

602 input/output interface

603 input/output device

604 processor

606 communication infrastructure/bus

608 Main memory

610 auxiliary memory

612 hard disk drive

614 removable storage drive/drive

618 removable storage unit

620 interface

622 removable storage unit

624 communication interface

626 communication path

628 remote device/network/entity

Detailed Description

The following disclosure provides many different embodiments, or examples, for implementing different features of various embodiments. Specific examples of components and arrangements are described below to simplify the present disclosure. These examples are merely examples and are not intended to be limiting. Additionally, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed unless otherwise noted.

In semiconductor manufacturing, a wet clean station may contain different processing agents for different operations. To perform these operations, the wet bench tank may be filled with the desired treatment agent. The wafer to be processed may be immersed in the treating agent for a suitable period of time to undergo a chemical/physical reaction. Such wafers may be subjected to processing/manipulation, such as etching, cleaning, or stripping, in a processing agent. For example, the wafer may be immersed in a wet bench water bath filled with an etchant solution to remove/etch away desired portions or structures on the wafer. The wet clean station tank may also be filled with photoresist stripper or cleaner for stripping photoresist or cleaning wafers, respectively.

The processing agent contained in the wet bench tank may be used to process multiple batches of wafers. For example, the treating agent may be circulated in the wet bench water tank for a predetermined period of time until it is replaced with a new treating agent. The circulation of the treating agent forms a flow field (e.g., a distribution of density and velocity of the treating agent over space and time) that may not change during treatment in a constant circulation direction. The flow field may form a flow field path in the water tank that allows the treating agent to flow therealong. The flow may generate process residue (e.g., residue resulting from the process) to move along the flow field path. The processing residues may include undesirable particles formed during processing of the wafers (e.g., current lot wafers or previous lot wafers). For example, if the processing agent comprises an etchant, the processing residue may include undesirable semiconductor particles; and if the treatment agent comprises a photoresist stripper, the treatment residue may comprise unwanted photoresist particles/debris and the like.

Because the flow field paths are formed proximate to and/or opposite the wafer and the carrier holding the wafer, process residues resulting from the flow may deposit on the wafer, causing damage and/or contamination to structures/components on the wafer. The process residues may also be deposited on the support. The deposition residue may further peel under the force of the flow/water stream and may move toward the wafer, causing further damage (e.g., scratches and flaking) and/or contamination to the wafer. Damage and/or contamination may result in device degradation and/or reduced yield. Furthermore, because the wafers are placed close to each other, the flow/water stream can impact the wafers and cause adjacent wafers to collide with each other, thereby damaging the components/structures on the colliding wafers. As a result, wafers in a wet etch tank may suffer from low throughput, damage and/or degradation due to invariant flow fields and residue deposition.

Fig. 1A shows a cross-sectional view 100 of a wet bench basin (or basin) along the x-z plane. The y-axis is perpendicular to the x-z plane. FIG. 1B depicts a side view 110 of the sink shown along a non-zero angle (e.g., about 45 degrees) with the x-axis (or y-axis). As shown in fig. 1A and 1B, the water tank 106 is located on the base 101. The tank 106 is filled with a treating agent 107, and the treating agent 107 may be, for example, an etchant, a photoresist stripper, or a cleaning agent/solution. A batch of wafers 102 is carried by a carrier 103 and immersed in a treating agent 107. Wafer 102 includes a structure to be processed. The carrier 103 includes a handle 104 and lifting devices (104-1, 104-2, and 104-3) connected to each other. The handle 104 extends from the treating agent 107 so that the carrier 103 can be moved in and out of the water tank 106. The lifting device 104-1, the lifting device 104-2, and the lifting device 104-3 all extend along the y-axis and hold the batch of wafers 102 vertically (e.g., along the z-axis) and spaced apart from each other so that the surfaces of the wafers 102 are immersed in the treating agent 107. Both inlet 105-1 and inlet 105-2 allow the treating agent 107 to circulate into the tank 106 at a desired velocity and direction.

The arrows in fig. 1A depict the flow field path 108 of the treating agent 107, which is formed by the circulation of the treating agent 107. During processing, processing residues/particles (e.g., etching particles/residues or photoresist debris) may form and be suspended in the treating agent 107. Such processing residues/particles may collide with the wafer 102 and lifting devices (e.g., 104-1, 104-2, and 104-3) by flowing along the flow field path 108 towards the wafer 102 and lifting devices. Because the flow/water stream remains flowing along the flow field path 108, the wafer 102 and lift devices may be sensitive to residue/particulate residue due to the constant flow field path 108-particularly certain areas of the wafer 102 and lift devices (e.g., areas proximate to the flow field path 108) may be deposited with a layer of processing residue. As the treating agent 107 circulates along the flow field path 108, the deposited layer of residue/particles may thicken. Under the effect of the flow, the deposited process residues may peel off and fragments of the cracked deposits may rush along the flow field path 108 toward the wafer 102, colliding with the wafer 102. Such collisions may cause damage (e.g., scratches and peeling) and/or contamination to the wafer 102. Devices/structures on wafer 102 may suffer from low yield and degradation caused by damage and/or contamination.

The present disclosure provides an apparatus and method for reducing or preventing process residues from damaging/contaminating wafers in a wet bench basin. The apparatus uses a mechanism (e.g., a roller) to perturb the flow field of the treating agent. Under the disturbed flow field, the flow and the suspended residues are dispersed. The residue is thus less likely to collide with or deposit on the wafer and certain areas of the lift device (e.g., areas near the flow field path), thereby reducing damage (e.g., scratches and surface flaking) and contamination. Also, because the residue is less likely to collide with the wafer, adjacent wafers are less susceptible to collision with each other.

An additional benefit of the disclosed apparatus is its miniaturization, with minimal or no additional space being used by the apparatus in the sump of the wet station. The water bath may thus contain substantially the same volume of treatment agent. Also, the apparatus spins the wafer to disperse the flow field path, thereby maximizing the force to disperse the flow field with minimal additional space. In the present disclosure, the terms "process residue" and "residue" are used interchangeably; and the terms "process deposits", "residue deposits" and "deposits" are used interchangeably.

The apparatus can be used in different tank/wet stations to improve process efficiency and product throughput. For illustrative purposes, the rollers of spinning wafers are described in this disclosure as examples of apparatus. The apparatus may perturb the flow field in the water tank and thus may reduce damage and contamination caused by the invariant flow field and residue deposition. The apparatus may also take the form of various other structures/devices that may perturb the flow field in the water bath. The disclosed principles of operation may be implemented in the form of various devices/structures, such as fan/propeller shaped structures that create a turbulent flow field in a wet bench basin. The particular forms and variations of the devices/structures should not be limited by the embodiments of the present disclosure. By using the apparatus and method of the present disclosure, processing efficiency may be improved and damage and/or contamination to the wafer may be reduced.

Fig. 2A-2E illustrate different arrangements of wet bench structures (e.g., rollers) fixed/mounted in a wet bench basin. The rollers spin/move so that the flow field of the treating agent in the wet station tank can be disturbed. As a result, process residues are less likely to impinge on and/or deposit on the wafer and/or lift devices in the wet clean station tank. Also, the flow to the wafers and the residue are dispersed to minimize the impact of the processing residue on the wafers, thereby reducing the possibility of adjacent wafers colliding with each other.

The rollers illustrated in fig. 2A-2E may be used for one or more wafers along a direction along which the one or more wafers are arranged (e.g., along a direction perpendicular to the x-z plane or along a y-axis similar to the y-axis of fig. 1B). The one or more wafers may thus be spun relative to/in/near the flow field of the treatment agent to perturb the flow field. For example, the roller may have a rod shape extending along the y-axis and may contact and spin all wafers along the y-axis. In another example, the roller may include a plurality of sub-rollers extending along the y-axis. The sub rollers may or may not be connected to each other. Each sub-roller is accessible for spinning one or more wafers. The sub rollers may spin in the same direction or in different directions. The cross-section of the roller or sub-roller (e.g., along the x-z plane) may have any suitable shape, such as a circular shape along the x-z plane.

When the roller or sub-roller contacts the wafer, the friction between the roller/sub-roller and the wafer may be high enough to spin the wafer. The rollers/sub-rollers may be formed of a suitable material that is chemically stable in the treating agent. The material may have sufficiently high erosion and corrosion resistance to the treatment agent. In various applications, the material forming the roller/sub-roller may vary based on the treatment agent, so the roller/sub-roller may be chemically stable in the treatment agent. For example, if the treating agent includes an acid, the roller/sub-roller may include an acid-resistant material. In some embodiments, the roller/sub-roller comprises polytetrafluoroethylene.

The roller/sub-roller may be driven by any suitable drive means that drives the roller/sub-roller to spin in a desired direction (e.g., clockwise or counterclockwise). The spin (e.g., speed, duration, and direction) of the roller/sub-roller may also be controlled by a control unit/device (e.g., a computer) so that the spin of the roller/sub-roller may be controlled and adjusted automatically or manually. For example, the control unit/device may be equipped with programs and data to control/determine the speed, duration and/or spin direction of the roller/sub-roller. The speed, duration, and/or spin direction may be changed automatically or manually based on various conditions of the process, such as lot and/or load of wafers. In an example, the sub-wheels are controlled separately (e.g., via wired or wireless communication means), so the control unit/device can control the speed, duration, and/or spin direction of the different sub-wheels. If necessary, the flow fields at different portions of the water tank may be disturbed separately. For example, the wheel/sub-wheel may communicate with the control unit/device via a Local Area Network (LAN) and/or WiFi network to receive instructions (e.g., start/stop spinning of the wheel/sub-wheel). For simplicity, communication between the roller/sub-roller and the control unit/device and communication between the roller/sub-roller and the transmission are not shown in the drawings of the present disclosure.

Fig. 2A depicts a cross-sectional view of a wet clean station structure 200, according to some embodiments. Wet station structure 200 may include rollers 209-1 and 209-2 that are affixed/mounted on both sides of wafer 202 and contact wafer 202 substantially in the middle portion of the wafer. In some embodiments, the roller 209-1 and the roller 209-2 may be horizontally (e.g., along the x-axis) aligned. In some embodiments, the geometric centers of the roller 209-1 and roller 209-2 and wafer 202 may be substantially horizontally aligned. The rollers 209-1 and 209-2 may support the wafer horizontally (e.g., along the x-axis) and thus improve the spin stability of the wafer 202.

The wet clean station structure 200 may be located in a water tank 206. The water tank 206 may be filled with a processing agent 207, which may include any suitable chemistry (e.g., etchant, photoresist stripper, or cleaner) for processing the wafer 202. The carrier 203 may include a handle 204 and a plurality of lifting devices (e.g., 204-1, 204-2, and 204-3) connected to the handle 204. The handle 204 may extend beyond the treating agent 207 to facilitate placement/treatment of the carrier 203. The lift device may extend along the y-axis and may be used to support the wafer 202 in the treating agent 207. In some embodiments, the lifting device has a rod shape extending along the y-axis and has a groove along the y-axis to hold the wafer 202 in place. The wafers 202 may be separated from each other and may be held vertically along the z-axis. In some embodiments, lift 204-1 supports wafer 202 on the bottom of wafer 202, and lift 204-2 and lift 204-3 support wafer 202 on either side of lift 204-1 below wafer 202. In some embodiments, lift 204-1 is located at a point intermediate between lifts 204-2 and 204-3, substantially along the x-axis. The wafers 202 may be placed vertically and spaced apart from each other. The water tank 206 may include one or more inlets (e.g., 205-1 and 205-2) for circulating the treating agent 207. In some embodiments, the inlet faces the wafer 202, and the treating agent 207 may flow into the water tank 206 through the inlet. The dashed arrows indicate the flow field path 208 of the treating agent 207. The flow of the treating agent 207 circulating from the inlet 205-1 and the inlet 205-2 may flow along the flow field path 208. In some embodiments, the flow field paths 208 include clockwise and counterclockwise paths, as depicted in fig. 2A.

The rollers 209-1 and 209-2 may be fixed or mounted in any suitable manner. For example, the rollers 209-1 and 209-2 may be fixed or mounted to a side wall of the sink 206 and/or to a bottom of the sink 206. For example, the rollers 209-1 and 209-2 may be secured or mounted via suitable support structures (not shown), such as a frame suspended above the wafer 202 and/or extending along a sidewall of the water tank 206. If the rollers 209-1 and 209-2 comprise sub-rollers, the sub-rollers may be fixed/mounted together or separately. For example, more than one sub-roller may be fixed/mounted on the same support structure, or each sub-roller may be fixed/mounted on a different support structure.

The roller 209-1 and the roller 209-2 may be driven to spin clockwise or counterclockwise, thereby spinning the wafer 202 clockwise or counterclockwise. The speed at which the wafer spins may be proportional to the speed of the roller 209-1 and the roller 209-2. In some embodiments, the roller 209-1 and the roller 209-2 spin counterclockwise and spin the wafer 202 clockwise as shown in FIG. 2A. In some embodiments, both roller 209-1 and roller 209-2 have a rod shape extending along the y-axis and spin each wafer 202 clockwise or counter-clockwise at the same speed. In some embodiments, both roller 209-1 and roller 209-2 include a plurality of sub-rollers extending along the y-axis and spin each wafer 202 clockwise or counterclockwise. The sub-rollers may be driven to spin at the same speed or at different speeds. For example, based on the position of wafer 202, the first and last wafers may spin at a higher speed than the wafers between the first and last wafers. In some embodiments, rollers 209-1 and 209-2 may spin wafer 202 at any speed greater than 0 revolutions per minute (rpm). In some embodiments, the rollers 209-1 and 209-2 may spin at a speed based on the speed at which the treating agent 207 flows from the inlets 205-1 and 205-2. For example, when the inflow velocity is relatively low, the rollers 209-1 and 209-2 may spin the wafer 202, etc., at a lower velocity. In some embodiments, the treating agent 207 is circulated through more than two inlets (205-1 and 205-2), and the sub-rollers may be controlled to spin at different speeds based on the flow fields formed by the more than two inlets.

Each of the rollers 209-1 and 209-2 may contact one or more of the wafers 202 and spin the contacted wafers. For example, each of the roller 209-1 and the roller 209-2 may be a unitary structure extending along the y-axis. In some embodiments, at least one of the wafer 202 is contacted/supported and spun by the roller 209-1 and the roller 209-2. In some embodiments, roller 209-1 and roller 209-2 each support/contact and spin each of the wafers 202. In another example, the roller 209-1 and the roller 209-2 may each include a plurality of sub-rollers. Each sub-roller supports/contacts and spins one or more of the wafers 202. In some embodiments, each sub-roller supports/contacts and spins a different one of the wafers 202. The sub-rollers of roller 209-1 and roller 209-2 may be controlled to spin at the same speed and/or in the same direction or at different speeds and/or in different directions. The rollers 209-1 and 209-2 may be made of suitable materials that are chemically stable in the processing agent 207 and have sufficient friction to spin the wafer 202. In some embodiments, the rollers 209-1 and 209-2 may comprise PTFE.

Fig. 3A shows a side view of a wet clean station structure 300, and fig. 3B shows a side view of another wet clean station structure 310, according to some embodiments. As shown in FIG. 3A, wet clean station structure 300 includes a roller 301-1 and a roller 301-2, wherein each roller has a rod shape along the y-axis. In some embodiments, rollers 301-1 and 301-2 each comprise a unitary structure that contacts and spins each wafer 202. The wafer 202 may spin in the same direction and at the same speed. For example, wafer 202-1 and wafer 202-2 in the dashed box of FIG. 3A may spin clockwise at the same speed.

As shown in FIG. 3B, wet clean station structure 310 includes rollers 302-1 and 302-2, where each roller has a rod shape along the y-axis. In some embodiments, both roller 302-1 and roller 302-2 include a plurality of sub-rollers (e.g., sub-roller 303-1, sub-roller 303-2, and sub-roller 303-3). Each sub-roller may support/contact and spin one or more of the wafers 202. In some embodiments, the wafer 202 is spun to have non-uniform spin direction and speed. For example, wafer 202-11 and wafer 202-12 may both spin on different sub-rollers (e.g., sub-roller 303-1 and sub-roller 303-2) and may spin in different directions (e.g., clockwise and counterclockwise). Wafer 202-11 and wafer 202-12 may spin at the same speed or at different speeds (e.g., in opposite directions). In another example, wafers 202-13 and 202-14 may be spun by one sub-roller (e.g., 303-3) and may be spun in the same direction (e.g., clockwise). The arrangement of the sub-rollers should be determined by, for example, the flow field in the water tank 206, the wafer size, and the structures/elements on the wafer, and should not be limited by embodiments of the present disclosure.

The spin of the wafer 202 may perturb the flow field in the water tank 206, so the flow field path 208 may, for example, change to a more dispersed pattern. Instead of impacting the wafer 202 and certain areas of the lift device (e.g., near the flow field path 208 and areas more affected by deposition) and depositing thereon, the residue may be dispersed. The dispersed residue is less likely to impact and deposit on the wafer 202 and such certain areas of the lifting device. As a result, less residue and/or flaking deposits may migrate toward the wafer 202 and the lift devices, thereby reducing damage and/or contamination caused by residue and/or flaking deposits.

Fig. 2B and 2C illustrate cross-sectional views of the wet clean station structure 210 and the wet clean station structure 220, according to some embodiments. A single roller may be positioned below wafer 202 (e.g., roller 211 in fig. 2B) or above wafer 202 (e.g., roller 212 in fig. 2C) to spin wafer 202. Roller 211 and roller 212 may both be substantially at a centerline of wafer 202 (e.g., a line along the z-axis that bisects wafer 202 into two portions). The roller 211 and the roller 212 may both be fixed or mounted in a suitable manner to support/contact and spin the wafer 202. For example, the rollers 211 may be fixed or mounted to the lift 204-1 and/or the bottom of the sink 206. The rollers 212 may be secured to the side walls of the tank 206, one or more lifts (e.g., 204-1, 204-2, and 204-3), the handle 204, and/or an appropriate object (e.g., an object of sufficient rigidity and support) above the tank 206. In some embodiments, the rollers 212 may be fixed in a frame, wherein the frame may be placed over the wafer 202 so the rollers 212 may properly support/contact and spin the wafer 202. Roller 211 and roller 212 may be similar or identical to roller 209-1 and roller 209-2. Details of the structure, materials, and operation of roller 211 and roller 212 may be found in reference to the description of wet station structure 200 of fig. 2A.

Fig. 2D depicts a cross-sectional view of a wet clean station structure 230 according to some embodiments. The wet station structure 230 includes rollers 213-1 and 213-2 fixed or mounted to the lifting device 204-2 and the lifting device 204-3, respectively. The roller 210-1 and the roller 210-2 may be horizontally aligned (e.g., along the x-axis) and may be positioned lower than the roller 209-1 and the roller 209-2 along the z-axis. In some embodiments, the rollers 213-1 and 213-2 may also be fixed or mounted on the side walls of the basin 206. Each of the roller 213-1 and the roller 213-2 may be similar or identical to the roller 209-1 and the roller 209-2 described in FIG. 2A. The details of the structure, materials, and operation of the rollers 213-1 and 213-2 can be found in the description of the rollers 209-1 and 209-2.

Fig. 2E depicts a cross-sectional view of a wet clean station structure 240, according to some embodiments. Wet station structure 240 includes rollers 214-1, 214-2, and 214-3 mounted or mounted on lift 204-1, lift 204-2, and lift 204-3, respectively. Roller 214-2 and roller 214-3 may be horizontally aligned (e.g., along the x-axis) and may be positioned higher along the z-axis than roller 214-1. In some embodiments, rollers 214-1, 214-2, and 214-3 may be fixed or mounted on a side wall and/or bottom of the basin 206. Roller 214-1, roller 214-2, and roller 214-3 may spin at the same speed and in the same direction (e.g., clockwise or counterclockwise). Each of roller 214-1, roller 214-2, and roller 214-3 may be similar or identical to roller 209-1 and roller 209-2 described in FIG. 2A. Details of the structure, materials, and operation of roller 214-1, roller 214-2, and roller 214-3 may be found in relation to the description of roller 209-1 and roller 209-2 of FIG. 2A.

In some embodiments, the wet clean station structure may include at least four rollers for spinning the wafer. For example, three rollers (e.g., mounted on a lifting device) may support/contact and spin the wafer from a lower portion of the wafer, while one roller (e.g., mounted on a frame above the wafer) may support/contact and spin the wafer from a top portion of the wafer. The particular number of components (e.g., rollers), arrangement (e.g., relative positions of the components with respect to the wafer and the water bath), and operation of the wet clean station structure should be determined based on processing conditions and should not be limited by embodiments of the present disclosure.

Fig. 4 depicts a method 400 of processing one or more wafers using a wet clean station configuration, according to some embodiments. In some embodiments, the operations of method 400 may be performed in a different order. Variations of the method 400 are within the scope of the present disclosure.

In operation 401, the wafer is placed in a water tank of a wet clean station and immersed in a treating agent. The wafer may be processed (e.g., etched, stripped, or cleaned) in a processing agent that is circulated in a water bath through an inlet and an outlet. The circulation of the treating agent forms a flow field in the water tank. The wafers may be placed vertically and spaced apart from each other. The rollers may contact and/or support the wafer after the wafer is placed in the water bath. The rollers may include sub-rollers of each spinning wafer. Details of the rollers and their relative positions with respect to the wafer can be found in the descriptions of fig. 2A-2E and fig. 3A and 3B.

At operation 402, a flow field of a treating agent is perturbed while a wafer is being processed. In some embodiments, the rollers spin in a predetermined direction to spin the wafer in an opposite direction. A water flow circulating in a direction different from the flow field path may be formed by spinning the wafer, thereby perturbing the flow field of the treating agent. The direction and speed of the rollers may be determined based on various factors, such as the position of the wafer, the size of the wafer, and the flow field of the treating agent. The wafers may spin in the same direction at the same speed. In some embodiments, the rollers may spin in opposite directions and at the same speed or different speeds. In some embodiments, the speed may be any suitable non-zero value. In some embodiments, a portion of the wafer has a velocity of zero (e.g., no spin). The spin of the wafer may perturb the flow field in the water tank caused by the circulation of the treatment agent. Perturbing the flow field may reduce or prevent residue from being deposited on or impacting the wafer. Residue is also less likely to deposit on the lifting device under the turbulent flow field. Details of the operation of the roller can be found in the descriptions of fig. 2A-2E and fig. 3A and 3B.

At operation 403, the wafer is rinsed after processing is complete. The wafer may be rinsed in the tank or outside the tank.

Fig. 5 depicts a system 500 using a wet clean station structure, according to some embodiments. As shown in fig. 5, system 500 includes a control unit/device 501, a communication means 502, and a wet bench 503 having a wet bench structure 504.

The control unit/device 501 may include any suitable computer system (e.g., workstation and portable electronic device) for storing programs and data for controlling the movement (e.g., spinning) of the wet bench structure 504 (e.g., roller). For example, acceleration, deceleration, and changes in spin direction of the wet clean station structure 504 may control signal transmission for automatically or manually adjusting/controlling the movement of the wet clean station structure 504. Communication means 502 may include any suitable network connection between control unit/device 501 and wet bench structure 504, and control signals transmitted thereby. For example, the communication means 502 may include a Local Area Network (LAN) and/or a WiFi network. In some embodiments, control unit/device 501 transmits control signals via communication means 502 to adjust/control the movement of wet bench structure 504.

The wet clean station structure 504 may include structures/devices that disturb the flow field in the wet clean station 503. The wet clean bench structure 504 may have various forms, and each form may have different variations. For example, the wet clean station structure 504 may take the form of a roller that spins the wafer to perturb the flow field. The rollers may have different arrangements and/or variations in the wet clean station 503 depending on the process conditions and/or application. The wet clean station structure 504 may have other forms such as a propeller/fan-shaped structure that creates a rotating and turbulent flow field in the treatment agent. One or more propeller/fan shaped wet clean bench structures 504 may be placed/mounted at different locations in the wet clean bench 503. The wet station structure 504 may also be used to process any other suitable object, such as an object having a disk shape and being capable of spinning in a liquid/fluid. The particular shape and arrangement of the wet clean station structure 504 and the objects cleaned by the wet clean station structure 504 should not be limited by embodiments of the present disclosure.

The wet clean station structure 504 may further include a power section (not shown) and a communication section (not shown). For example, the power portion of the wet clean station structure 504 may include a power line connected to a power source or power supply of the wet clean station 503. The communication portion may include a cable and/or a receiving device for receiving control signals from the control unit/device 501. In some embodiments, the communication section is connected to the power section so that the driving power provided to the wet bench structure 504 can be adjusted/controlled based on control signals from the control unit/device 501.

FIG. 6 is an illustration of a computer system 600 in which various embodiments of the present disclosure may be implemented, according to some embodiments. The computer system 600 may be used in the control unit/arrangement 501 as described above. Computer system 600 may be any known computer capable of performing the functions and operations described herein. For example, and not by way of limitation, computer system 600 may be capable of processing and transmitting signals. The computer system 600 may be used, for example, to control the movement of a wet bench structure.

Computer system 600 includes one or more processors (also referred to as central processing units, or CPUs), such as processor 604. The processor 604 is connected to a communication infrastructure or bus 606. The computer system 600 also includes an input/output device 603, such as a monitor, keyboard, pointing device, etc., which communicates with a communication infrastructure or bus 606 via an input/output interface 602. The control facility may receive instructions via the input/output device 603 to implement the functions and operations described herein, such as the method/process 400 described in fig. 4. Computer system 600 also includes a main or main memory 608, such as Random Access Memory (RAM). Main memory 608 may include one or more levels of cache memory. Main memory 608 has stored therein control logic (e.g., computer software) and/or data. In some embodiments, the control logic (e.g., computer software) and/or data may include one or more of the functions described above with respect to the wet station structure.

The computer system 600 may also include one or more secondary storage devices or memories 610. The secondary memory 610 may include, for example, a hard disk drive 612 and/or a removable storage device or drive 614. Removable storage drive 614 may be a floppy disk drive, a magnetic tape drive, an optical disk drive, an optical storage device, a tape backup device, and/or any other storage device/drive.

Removable storage drive 614 may interact with a removable storage unit 618. Removable storage unit 618 includes a computer usable or readable storage device having stored thereon computer software (control logic) and/or data. Removable storage unit 618 may be a floppy disk, magnetic tape, optical disk, DVD, optical storage disk, and/or any other computer data storage device. Removable storage drive 614 reads from and/or writes to removable storage unit 618 in a known manner.

According to some embodiments, secondary memory 610 may include other means, media, or other means for allowing computer programs and/or other instructions and/or data to be accessed by computer system 600. Such means, media, or other means may include, for example, a removable storage unit 622 and an interface 620. Examples of removable storage unit 622 and interface 620 may include a program cartridge and cartridge interface (such as that found in video game devices), a removable memory chip (such as an EPROM, or PROM) and associated socket, a memory stick and USB port, a memory card and associated memory card slot, and/or any other removable storage unit and associated interface. In some embodiments, auxiliary memory 610, removable storage unit 618, and/or removable storage unit 622 may include one or more of the functions described above with respect to the wet station structure.

Computer system 600 may further include a communications or network interface 624. Communication interface 624 enables computer system 600 to communicate and interact with any combination of remote devices, remote networks, remote entities, and the like, individually and collectively referenced by numeral 628. For example, communication interface 624 may allow computer system 600 to communicate with remote devices 628 over a communication path 626, which may be wired and/or wireless and which may include any combination of a LAN, WAN, the Internet, or the like. Control logic and/or data may be transferred from computer system 600 via communications path 626.

The functions/operations of the above-described embodiments may be implemented in a wide range of configurations and architectures. Accordingly, some or all of the operations in the above-described embodiments, such as the method/process 400 described in fig. 4, may be performed in hardware, software, or both. In some embodiments, tangible apparatuses and articles of manufacture, including tangible computer usable or readable media having control logic (software) stored thereon, may also be referred to herein as computer program products or program storage devices. Including, but not limited to, the computer system 600, the main memory 608, the auxiliary memory 610, and the removable storage units 618 and 622, as well as tangible articles of manufacture embodying any combination of the foregoing. Such control logic, when executed by one or more data processing devices (such as computer system 600), causes such data processing devices to operate as described above. For example, the hardware/devices may be connected to or belong to element 628 (remote device, network, entity 628) of computer system 600.

By using the wet clean station structure and method of the present disclosure, damage and contamination on the wafer caused by the invariant flow fields and process deposits may be reduced, and throughput may be increased. The wet clean station structure may have any suitable form that perturbs the flow field of the treating agent in the water bath. The wet clean station structure of the present disclosure can spin wafers and create turbulent flow field paths and occupy little additional space in the water tank so that the capacity of the water tank is not affected by the installation of the wet clean station structure. The wet clean station structure may be flexibly fixed or mounted at any suitable position in the tank, depending on, for example, the size and capacity of the tank, the location of the inlet, the size of the wafer, etc. For example, the wet clean station structure may be fixed or mounted on a lift so that the wet clean station structure can support and spin the wafer. In another example, the wet clean station structure may be fixed or mounted in a sink. The wet bench structure may also be fixed or mounted on both the lift and the tank. The particular arrangement and operation of the wet clean station structure should be determined based on the process conditions and should not be limited by embodiments of the present disclosure.

In some embodiments, an apparatus for processing one or more objects comprises: a carrier configured to hold one or more objects; a water tank filled with a treating agent and configured to receive a carrier; and a spinning portion configured to contact the one or more objects and spin the one or more objects to perturb the flow field of the treatment agent. In some embodiments, the carrier includes a lifting device configured to separate the objects from one another, and wherein the spinning portion is attached to the lifting device. In some embodiments, the spinning portion is configured to support the object from below the object. In some embodiments, the spin portion comprises one or more sub-spin portions, each of the sub-spin portions attached to a different location of the lifting device, and wherein the sub-spin portions are configured to contact the object and the spinning object to perturb the flow field of the treatment agent. In some embodiments, each of the sub-spinning portions includes a roller configured to extend along a direction in which the object is aligned and spin the object. In some embodiments, the roller comprises a plurality of sub-rollers, each of the sub-rollers configured to at least one of contact and spin an object. In some embodiments, the spinning portion is attached to a bottom surface of the sink, a sidewall surface of the sink, a frame above the sink, or a combination thereof. In some embodiments, the spinning portion is configured to contact the object at one or more of a middle portion of the object and a top of the object. In some embodiments, the spinning portion includes a roller configured to extend in a direction in which the object is aligned. In some embodiments, the roller comprises a plurality of sub-rollers, each sub-roller configured to attach to a different location of the carrier, and wherein the sub-rollers are configured to at least one of contact and spin the object to perturb the flow field of the treatment agent.

In some embodiments, a method of reducing contamination on one or more objects comprises the steps of: fixing one or more objects in a carrier; immersing the carrier in a treatment agent; spinning one or more objects in a carrier to form a flow path that is different from a flow field path of a treatment agent; and rinsing the one or more objects. In some embodiments, the object in the spin carrier comprises: at least two of the objects are spun in opposite directions. In some embodiments, a spinning object comprises: a roller that contacts the object is driven. In some embodiments, the method further comprises: attaching a roller in the water tank in a direction to align the object; by means of the roller contacting the object and by means of the roller spinning the object. In some embodiments, the method further comprises attaching a plurality of sub-rollers in the water bath to contact and spin the object from multiple directions.

In some embodiments, a system for reducing contaminants on one or more objects includes a process tool. The process tool includes: a carrier configured to hold one or more objects; a water tank filled with a treating agent and configured to receive a carrier; and a spinning device configured to spin one or more objects based on the control signal. The system also includes a control device configured to determine a control signal for the spin device. The control signal may include a spin speed of the spinning device. The system further includes a communication device configured to transmit a control signal from the control device to the spinning device. In some embodiments, the carrier includes a lifting device configured to separate the objects from one another, and wherein the spinning portion is attached to the lifting device. In some embodiments, the spinning device is configured to extend in a direction along which the objects are aligned. In some embodiments, the spinning device comprises a plurality of sub-spinning portions, and wherein each of the sub-spinning portions contacts and spins at least one of the objects in a direction different from at least one other of the objects. In some embodiments, the control signal is transmitted between the control device and the spinning device via one or more of a Local Area Network (LAN) and a WiFi network.

It is to be understood that the foregoing detailed description, and not the abstract of the disclosure, is intended to be used to interpret the claims. The abstract of the disclosure may set forth one or more, but not all exemplary embodiments contemplated, and is therefore not intended to limit the scope of the appended claims.

The foregoing outlines features or examples of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that the present disclosure may be readily utilized as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the appended claims.