阅读说明：本技术 带电源的电路板、具有电路板的电器件和用于制造电路板的方法 (Circuit board with power supply, electric device having circuit board, and method for manufacturing circuit board ) 是由 S.克斯特纳 大石昌弘 F.林纳 于 2018-05-30 设计创作，主要内容包括：说明了一种具有经改善的电源的电路板(LP)。该电路板包括载体衬底(TS)和具有固态电解质(E)的蓄能器(ES、B1)。(A circuit board (LP) with an improved power supply is described. The circuit board comprises a carrier substrate (TS) and an energy store (ES, B1) having a solid electrolyte (E).)

1. A circuit board (LP) with power supply, the circuit board comprising:

-a carrier substrate (TS);

-an accumulator (ES) having a first layer stack (LS 1) with:

a first electrode layer having a first electrode (EL 1),

a second electrode layer having a second electrode (EL 2), and

an electrolyte layer with an electrolyte (E) arranged therebetween,

wherein

-the first electrode (EL 1), the second electrode (EL 2) and the electrolyte (E) are all solid.

2. Circuit board according to the preceding claim, wherein said energy accumulator (ES) is a solid electrolyte or a solid accumulator.

3. The circuit board according to one of the preceding claims, wherein the first layer stack (LS 1) further comprises a first active layer (AL 1) between the first electrode (EL 1) and the electrolyte (E) and a second active layer (AL 2) between the electrolyte (E) and the second electrode (EL 2).

4. Circuit board according to one of the preceding claims, further comprising one or more additional layer stacks (LS 2, LS 3) each having a first electrode (EL 1), a second electrode (EL 2) and an electrolyte (E) arranged therebetween.

5. The circuit board according to the preceding claim,

-wherein the layer stacks (LS 1, LS2, LS 3) together constitute a block (B1),

-the circuit board further comprises one or more further blocks (B2, B3) with a layer stack (LS 1, LS2, LS 3),

-wherein each block (B1, B2, B3) provides a potential.

6. Circuit board according to one of the preceding claims, further comprising one or more Metallization Layers (ML) with a metallization (M) structured in the carrier substrate (TS), wherein the metallization (M) is connected with the first electrode (EL 1) and the second electrode (EL 2) of the energy reservoir via through-holes (V).

7. The circuit board of one of the preceding claims, further comprising:

-an electrical assembly (EK 1);

-a switch connected with the electrical component (EK 1) and the accumulator (ES).

8. The circuit board of one of the preceding claims, further comprising an external power supply line.

9. Circuit board according to one of the preceding claims, further comprising a chip with an integrated switching circuit, which is arranged and adapted to monitor, control or adjust a parameter of the energy accumulator.

10. An electric device (EB) comprising:

-a circuit board (LP) according to one of the preceding claims;

-an electrical or electronic circuit component (SK) connected and wired with the circuit board (LP),

wherein

-the accumulator (ES) is arranged to: at least some of the time, the circuit component (SK) is supplied with electrical energy.

11. A method for manufacturing a circuit board (LP), the method comprising the steps of:

-providing a material for a carrier substrate (TS);

-arranging a Layer Stack (LS) with electrode layers and a solid-state electrolyte on the material of the carrier substrate (TS) for forming one or more energy accumulators (ES);

-arranging a dielectric material (D) on the Layer Stack (LS) of the energy accumulator (ES).

Technical Field

The invention relates to the energy supply for an electrical switching circuit, for example for a circuit board.

Background

Electrical switching circuits typically require electrical energy to operate. It is possible that: the electrical switching circuit is supplied with electrical energy from an external energy source via a power supply line. Alternatively, it is possible: a battery pack or a secondary battery is arranged on the upper side of the circuit board and serves as an energy source.

The continuing trend in the miniaturization of electrical components has led to: the volume of the battery pack, as opposed to occupying an increasing fraction of the total volume of the electrical device.

In the case of devices without a battery pack, there is always the risk of a sudden loss of contact and therefore of no longer supplying the switching circuit with electric power.

Therefore, there is a need for an alternative possibility of supplying the circuit board with electrical energy. In particular, the alternative energy supply should have improved reliability, allow a higher energy density than batteries and be compatible with the continuing trend of miniaturization.

Disclosure of Invention

For this purpose, independent claim 1 describes an improved circuit board. The dependent claims specify advantageous embodiments.

The circuit board with power supply includes a carrier substrate and an energy accumulator. The energy accumulator has a first layer stack with a first electrode layer, a second electrode layer and an electrolyte layer arranged therebetween. The first electrode layer has a first electrode, the second electrode layer has a second electrode, and an electrolyte is disposed in the electrolyte layer. The first electrode, the second electrode and the electrolyte are all solid.

Thus, a circuit board with a solid-state energy store is specified, which can be used for supplying power to the circuit board.

The use of solid state accumulators, such as solid state batteries or solid state accumulators, is free of fluid components, such as liquid electrolytes, which may spill over or evolve gases. Thus, the solid state accumulator is virtually maintenance free and is more resistant to temperature changes than conventional batteries or batteries.

The solid state accumulator is compatible with the process steps used to manufacture the circuit board and can be manufactured in a number of different forms. A circuit board with such a power supply has a much better ratio of energy density to volume and is thereby well suited for further miniaturization.

Correspondingly, it is possible that: the accumulator is a solid state battery or a solid state accumulator.

It is possible that: the energy accumulator is directly embedded in the circuit board. Alternatively or additionally, it is possible: the energy accumulator or other energy accumulators are arranged on the lower side or on the upper side of the circuit board.

The solid-state energy store has a layer structure consisting of thin layers and allows a much higher energy density than conventional batteries or conventional accumulators. Such an energy store therefore increases the overall height of the printed circuit board only to a small extent.

It is possible that: the first stack of layers further includes a first active layer between the first electrode and the electrolyte and a second active layer between the electrolyte and the second electrode.

The active layer can contain or consist of an active material, which conducts not only electrons but also ions.

The solid electrolyte of the energy accumulator is a material that is permeable to ions but impermeable to electrons.

The first electrode and the second electrode may comprise or consist of different materials. It is preferable that: the two electrodes of the stack of the energy store have distinctly different electrode potentials.

It is possible that: the circuit board has one or more additional stacks of layers. Here, each of these additional layer stacks likewise has a first electrode, a second electrode and an electrolyte arranged therebetween.

It is possible that: two or more layer stacks together form a block. The circuit board can comprise further blocks of layer stacks. Here, each block provides a potential.

For this purpose, provision can be made for: the stacks within a block are wired to each other in a suitable manner, for example in series or in parallel with each other. In this way, it is possible to: multiple stacks within a block are connected in parallel so that a block provides greater capacity and the voltage provided by the block corresponds to the voltage of a stack.

Here, different blocks may be connected in series to provide different voltages.

The voltage supplied by the single block or the single layer stack depends substantially on the material used for the electrodes.

Common electrode materials of batteries or accumulators can be considered as electrode materials.

It is possible that: the circuit board additionally has one or more metallization layers. The metallization layer can have a metallization structured in the carrier substrate. These metallizations are connected via through-holes (through-hole metallization) to the first and second electrodes of the energy store and, if necessary, to further electrodes of additional stacks and/or additional blocks of the energy store.

The structured metallizations can form energy supply lines or signal lines. It is also possible that: circuit components, such as inductive, capacitive, or resistive elements, are formed in these metallization layers.

The different metallization layers can be insulated by the dielectric material of the carrier substrate.

It is possible that: the circuit board also includes an electrical component. Additionally, the circuit board may include a switch that is coupled to the electrical component and the accumulator.

Via the switch, the electrical component can be connected in an electrically conductive manner to the energy store. Alternatively, the switch may be used to separate the electrical component from the accumulator current.

Thus, via such a switch, it is possible to: the two circuit elements are separated from one another in the event of a malfunction of the electrical component or in the event of a malfunction of the energy store.

It is possible that: the circuit board has an external power supply line. Via the external power supply line, the circuit board and circuit components arranged on and wired to the circuit board can be supplied with electric power. In the case of an interruption of the external energy supply, the energy store of the circuit board can assume a short-term or medium-term energy supply.

Via the external power line, the energy storage of the circuit board can also be charged.

It is possible that: the circuit board additionally comprises a chip with an integrated switching circuit. The chip or the integrated switching circuit of the chip is provided and adapted to monitor, control or regulate a parameter of the energy accumulator.

Such a parameter may be, for example, the state of charge of the accumulator. Monitoring of the maintenance state of the energy storage is also possible. In this way, the service life of the accumulator may be increased and, if necessary, maintenance measures, such as Recovery (Recovery) routines, may be performed.

Correspondingly, it is possible that: the circuit board is part of an electrical device. In addition to the circuit board, the electrical component also has one or more electrical or electronic circuit components, which are connected or wired to the circuit board. The accumulator is configured to: at least sometimes to supply electrical energy to the circuit assembly.

The circuit board or the electrical component operates without maintenance, is resistant to temperature changes and is non-flammable.

Due to resistance to temperature variability, it is possible to: in the field of the production of circuit boards and circuits, usual process steps are carried out, for example soldering, for example reflow soldering, in order to arrange and to wire electrical components such as SMD components (SMD = Surface-Mounted Device = Surface-Mounted circuit component).

Depending on the way and method (series, parallel) of contacting different blocks or different stacks of layers from the outside of the carrier substrate, a variety of different voltages and capacities may be provided by the accumulator.

During the integration of the layer stack of the energy accumulator in the material of the circuit board, it is possible to: contact is made to the electrodes by means of electroplating. Therefore, the sputtering step in the back-end process can be saved. Copper may be used as the material of the metallization layer and thereby as the material of the wire.

The method for manufacturing such a circuit board may comprise the steps of:

-providing a material for a carrier substrate;

-arranging a layer stack with electrode layers and a solid-state electrolyte on the material of the carrier substrate for forming one or more energy accumulators;

-arranging a dielectric material on the layer stack of the energy accumulator.

Other possible additional or alternative steps are:

-arranging dielectric layers and a metallization layer therebetween;

-structuring the metallization layers between the dielectric layers before arranging further dielectric materials of the further dielectric layers on the respective metallization layers;

-producing a through-hole plating from the upper side of the circuit board to the electrode layer of the energy accumulator;

connecting and wiring these through-holes to the electrical components on the upper side of the carrier substrate.

Drawings

The details of the main aspects and embodiments of the circuit board are further elucidated in the schematic drawings.

Wherein:

fig. 1 shows a possible arrangement of energy stores in a carrier substrate;

fig. 2 shows an arrangement of energy stores on a carrier substrate;

fig. 3 shows the arrangement of the energy stores on the underside of the carrier substrate;

FIG. 4 shows a multi-layer structure of an accumulator;

FIG. 5 shows an accumulator with additional layers;

FIG. 6 shows a circuit board with additional layers and electrical components;

FIG. 7 shows a circuit board having a plurality of blocks;

fig. 8 shows an electric device with a circuit board.

Detailed Description

Fig. 1 shows a possibility of a circuit board LP, in which the energy stores ES are arranged inside a carrier substrate TS. In order to be able to contact the energy storage ES inside the carrier substrate TS, a through-hole coating (through-hole) V is provided, via which the potential provided by the energy storage ES can be contacted.

The energy accumulator ES is preferably designed as a multilayer system having a first electrode and a second electrode and an electrolyte arranged therebetween. All components of the accumulator are preferably solid. The accumulator ES has no fluid component. The energy accumulator is thus virtually maintenance-free, resistant to temperature variations and substantially insensitive to different forms of external harmful influences.

Fig. 2 shows a possibility of arranging the energy stores ES on the upper side of the carrier substrate TS.

Fig. 3 shows a possibility of arranging the energy store on the underside of the carrier substrate TS. In order to be able to arrange and to connect the circuit components and the electrical components on the upper side of the carrier substrate and to be able to supply the circuit components and the electrical components with electrical energy, there is at least one through-hole application V via which the circuit components on the upper side can be connected to the energy storage ES on the lower side.

Irrespective of the respective layer of the energy stores in the carrier substrate, on the upper side of the carrier substrate or on the lower side of the carrier substrate, the energy stores ES can extend substantially over the entire width of the circuit board LP. It is also possible that: the energy accumulator occupies only one area of the base surface of the circuit board.

The design of the energy storage device ES as a stack of thin layers enables an extremely low height, so that a high specific energy density is achieved. The overall height of the circuit board and of the associated electrical components is virtually unaffected by the additional layers of the energy store.

Fig. 4 shows a possibility for arranging a stack of energy accumulators ES: the energy store has a first electrode EL1 and a second electrode EL2 in the respective associated electrode layer. An interlayer ZL with electrolyte is arranged between these electrodes. The electrolyte is likewise composed of a solid and is substantially permeable to ions, but impermeable to electrons.

It is possible that: at least one of these two electrodes, for example the first electrode EL1 or, as shown in fig. 4, the second electrode EL2, is connected to ground potential. Then, the first electrode EL1 can provide a potential different from the ground potential on the upper side via the via plating V.

Fig. 5 shows the possibility of designing the energy accumulator ES as a stack of five layers. In addition to the first electrode EL1, the interlayer ZL, and the second electrode layer EL2, a first active layer AL1 and a second active layer AL2 are present. The first active layer AL1 is disposed between the electrode layer having the first electrode EL1 and the intermediate layer ZL having the electrolyte E. The second active layer AL2 is disposed between the electrolyte E and the second electrode EL2 in the interlayer ZL. The first active layer and the second active layer are preferably capable of conducting ions. The first active layer and the second active layer may also conduct electrons. However, it is also possible: the first active layer and the second active layer are not capable of conducting electrons.

Fig. 6 shows the possibility of combining different layer stacks of energy accumulators. The first layer stack LS1, the second layer stack LS2 and the third layer stack LS3 are arranged one above the other. Each stack has a first electrode in an electrode layer and a second electrode in a different electrode layer than the first electrode layer. Additionally, each layer stack has an electrolyte between the electrodes. The stacks arranged side by side may share the material of the electrodes. In this way, the first layer stack LS1 and the second layer stack LS2 share the material of the electrodes, i.e. the second electrode EL2 of the first layer stack and the first electrode of the second layer stack LS 2.

Overall, the three layer stacks LS1, LS2, LS3 result in a first block B1. A portion of the electrodes of the different stacks in the first block merge at the first electrode of the block. The remaining electrodes of the stack merge at the second electrode. Through these electrodes of the block B1, the first block B1 provides two different potentials P1, P2.

These three stacks are individual battery elements connected in parallel within the first block B1.

The electrical components EK1, EK2 on the upper side of the printed circuit board LP are connected and wired to the metallization M in the metallization ML in the interior of the carrier substrate TS via the through-hole metallization V. In this way, the electrical energy stored in the energy store can be used to supply electrical components on the upper side of the circuit board LP.

The metallizations of the different metallization layers ML can be electrically separated from one another by the dielectric material of the carrier substrate TS.

Fig. 7 shows the possibility of arranging different blocks in the circuit board. The first block B1 has three different stacks of layers. The second block B2 has three different stacks of layers and the third block B3 has three different stacks of layers. The first block B1 provides two different potentials P3, P4 on its external electrode. The second block B2 provides a voltage on its external electrode that corresponds to the difference between the potentials P3 and P2. The third block B3 supplies a voltage corresponding to the potential difference between the potentials P1 and P2 on its external electrode.

Thus, the three blocks B1, B2, and B3 supply three voltages. These voltages may be added in series.

It is possible that: the electrical components EK3, EK4 on the upper side of the circuit board LP are connected to different electrical potentials via metallization and via plating.

Correspondingly, appropriately arranged layer stacks and blocks can be used for: different voltages and different capacitances are provided for different requirements of different electrical components.

Fig. 8 shows a possibility of arranging the corresponding circuit board LP as part of the electric device EB. In addition to the electrical components EK3, EK4 which can be assigned to the circuit board, further circuit components SK can be connected and wired to the circuit board and take electrical power from an energy store of the circuit board. The housing G can protect the electrical and circuit components on the upper side of the circuit board from harmful external influences.

The circuit board, the electrical component and the method for producing a circuit board are not limited to the exemplary embodiments or the technical details shown. The circuit board may comprise, for example, further layers, layer stacks, blocks and energy stores underneath, in or on the carrier substrate, or may comprise additional electrical or circuit components.

List of reference numerals

AL 1: first active layer

AL 2: second active layer

B1, B2, B3: first, second and third blocks

D: dielectric material

DL: dielectric layer

E: electrolyte

EB: electrical device

EK1, EK 2: first and second electrical components

EK3, EK 4: third and fourth electrical components

EL 1: a first electrode in the first electrode layer

EL 2: a second electrode in the second electrode layer

ES: energy accumulator

G: outer casing

And (3) LP: circuit board

LS1, LS2, LS 3: first, second and third layer stacks

M: metallization

ML: metal spray coating layer

P1, P2, P3, P4: first, second, third, and fourth potentials

SK: circuit assembly

TS: carrier substrate

V: through hole plating and through hole

ZL: intermediate layer