阅读说明：本技术 封装模块及采用该封装模块的压力传感器 (Packaging module and pressure sensor adopting same ) 是由 肖滨 李刚 于 2019-11-11 设计创作，主要内容包括：本发明提供一种封装模块及采用该封装模块的压力传感器,所述封装模块包括：外壳,基板,所述外壳扣合在所述基板上,所述外壳与所述基板形成容纳腔；压力敏感芯片,置于所述容纳腔内,且通过玻璃烧结层固定在所述基板上；调理芯片,置于所述容纳腔内,且固定在所述基板上,所述压力敏感芯片与所述调理芯片电连接,所述调理芯片与所述基板电连接。本发明的优点在于,采用玻璃烧结层将所述压力敏感芯片与所述基板密封连接,大大增强了压力敏感芯片与基板的连接强度,耐压力冲击,耐腐蚀性能好,密封特性好,可以提高传感器的压力量程,可应用于高压传感器,且适用于大量程的压力传感器。(The invention provides a packaging module and a pressure sensor using the same, wherein the packaging module comprises: the shell is buckled on the substrate, and an accommodating cavity is formed by the shell and the substrate; the pressure sensitive chip is arranged in the accommodating cavity and is fixed on the substrate through a glass sintering layer; the conditioning chip is arranged in the accommodating cavity and fixed on the substrate, the pressure sensitive chip is electrically connected with the conditioning chip, and the conditioning chip is electrically connected with the substrate. The pressure sensitive chip and the substrate are hermetically connected by the glass sintering layer, so that the connection strength of the pressure sensitive chip and the substrate is greatly enhanced, the pressure sensitive chip is resistant to pressure impact, good in corrosion resistance and good in sealing property, the pressure range of the sensor can be improved, and the pressure sensitive chip can be applied to a high-pressure sensor and a large-range pressure sensor.)

1. A packaged module, comprising:

the outer shell is provided with a plurality of grooves,

the shell is buckled on the substrate, and an accommodating cavity is formed by the shell and the substrate;

the pressure sensitive chip is arranged in the accommodating cavity and is fixed on the substrate through a glass sintering layer;

the conditioning chip is arranged in the accommodating cavity and fixed on the substrate, the pressure sensitive chip is electrically connected with the conditioning chip, and the conditioning chip is electrically connected with the substrate.

2. The package module according to claim 1, wherein the substrate has a through hole, the pressure sensitive chip is disposed corresponding to the through hole, and an external measuring medium can transmit pressure to the pressure sensitive chip through the through hole.

3. The packaged module of claim 1, wherein the conditioning chip is secured to the substrate by a glass frit layer.

4. The packaged module of claim 1, wherein the substrate is a ceramic substrate.

5. The packaged module of claim 4, wherein the outer bottom surface of the substrate has metal pads for electrical connection with an external structure.

6. A pressure sensor, comprising:

the packaging shell comprises a first connecting end, a second connecting end and an accommodating cavity positioned between the first connecting end and the second connecting end, wherein the first connecting end is provided with a pressure measuring hole which is communicated with the accommodating cavity;

the adapter circuit board is arranged in the accommodating cavity, the bottom surface of the adapter circuit board is hermetically connected with the first connecting end of the packaging shell, and a through hole is formed in the adapter circuit board and corresponds to the pressure measuring hole;

the package module according to any one of claims 1 to 5, disposed in the accommodating cavity, wherein the package module is disposed on the adapting circuit board and electrically connected to the adapting circuit board, and the through hole on the substrate of the package module is disposed corresponding to the through hole on the adapting circuit board;

and the connecting piece is connected with the second connecting end of the packaging shell, and the switching circuit board is electrically connected with the outside through the connecting piece.

7. The pressure sensor of claim 6, wherein the first connecting end of the package housing protrudes to form a protrusion, and the pressure measuring hole penetrates through the protrusion and is communicated with the receiving cavity.

8. The pressure sensor of claim 6, wherein the bottom surface of the transition circuit board is sealed to the first connection end of the package housing by a sealing member.

9. The pressure sensor of claim 6, wherein the connector end outer edge has a projection that abuts a surface of the transition circuit board on which the potting module is disposed.

10. The pressure sensor of claim 9, wherein the second connection end of the package housing is riveted or crimped to fix and seal the connector with the relay circuit board and the package housing at the second connection end of the package housing.

Technical Field

The invention relates to the field of MEMS sensors, in particular to a packaging module and a pressure sensor adopting the packaging module.

Background

The sensor packaging technology is a key technology for realizing the practical application of the pressure sensor. The mutual transmission of electrical signals in different modules in the integrated circuit is realized through packaging, and the packaging needs to reduce the influence on the MEMS chip as much as possible and reduce the influence of the external environment on the MEMS chip. In the packaging module of the MEMS chip, the traditional chip fixing mode adopts an adhesive bonding mode, and the mode can cause the adhesive mode to fail when bearing larger pressure, thereby reducing the connection strength between the MEMS chip and the substrate and reducing the sealing effect.

Disclosure of Invention

The invention aims to provide a packaging module and a pressure sensor adopting the packaging module, which can improve the connection strength of a pressure sensitive chip and a substrate.

In order to solve the above problems, the present invention provides a package module, including: the shell is buckled on the substrate, and an accommodating cavity is formed by the shell and the substrate; the pressure sensitive chip is arranged in the accommodating cavity and is fixed on the substrate through a glass sintering layer; the conditioning chip is arranged in the accommodating cavity and fixed on the substrate, the pressure sensitive chip is electrically connected with the conditioning chip, and the conditioning chip is electrically connected with the substrate.

Furthermore, the substrate is provided with a through hole, the pressure sensitive chip is arranged corresponding to the through hole, and an external measuring medium can transmit pressure to the pressure sensitive chip through the through hole.

Further, the conditioning chip is fixed on the substrate through a glass sintering layer.

Further, the substrate is a ceramic substrate.

Further, the outer bottom surface of the substrate has a metal pad for electrical connection with an external structure.

The present invention also provides a pressure sensor, comprising: the packaging shell comprises a first connecting end, a second connecting end and an accommodating cavity positioned between the first connecting end and the second connecting end, wherein the first connecting end is provided with a pressure measuring hole which is communicated with the accommodating cavity; the adapter circuit board is arranged in the accommodating cavity, the bottom surface of the adapter circuit board is hermetically connected with the first connecting end of the packaging shell, and a through hole is formed in the adapter circuit board and corresponds to the pressure measuring hole; the encapsulation module is arranged in the accommodating cavity, the encapsulation module is arranged on the switching circuit board and is electrically connected with the switching circuit board, and the through hole on the substrate of the encapsulation module is arranged corresponding to the through hole on the switching circuit board; and the connecting piece is connected with the second connecting end of the packaging shell, and the switching circuit board is electrically connected with the outside through the connecting piece.

Furthermore, the first connecting end of the packaging shell protrudes to form a protruding part, and the pressure measuring hole penetrates through the protruding part and then is communicated with the accommodating cavity.

Further, the bottom surface of the adapter circuit board and the first connecting end of the packaging shell are sealed through a sealing element.

Further, the outer edge of the end part of the connecting piece is provided with a protruding part which is abutted against the surface of the adapter circuit board provided with the packaging module.

Further, the second connecting end of the package housing is riveted or crimped at the second connecting end of the package housing to fix and seal the connecting member with the adapting circuit board and the package housing.

The pressure sensitive chip and the substrate are hermetically connected by the glass sintering layer, so that the connection strength of the pressure sensitive chip and the substrate is greatly enhanced, the pressure sensitive chip is resistant to pressure impact, good in corrosion resistance and good in sealing property, the pressure range of the sensor can be improved, and the pressure sensitive chip can be applied to a high-pressure sensor and a large-range pressure sensor.

Drawings

FIG. 1 is a schematic structural diagram of one embodiment of a package module of the present invention;

fig. 2 is a schematic structural diagram of an embodiment of the pressure sensor of the present invention.

Detailed Description

The following describes in detail a specific embodiment of the package module and a pressure sensor using the package module according to the present invention with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an embodiment of a package module according to the present invention. Referring to fig. 1, the package module includes a housing 10, a substrate 11, a pressure sensitive chip 12 and a conditioning chip 13.

The housing 10 is fastened on the substrate 11, and the housing 10 and the substrate 11 form an accommodating cavity 10A. The housing 10 may be bonded to the substrate 11 by an adhesive or solder 100, and sealed to the substrate 11. The housing 10 includes, but is not limited to, a metal housing or a ceramic housing. The shell 10 serves as a protective shell for the pressure sensitive chip 12 and the conditioning chip 13, so that the pressure sensitive chip 12 and the conditioning chip 13 are effectively prevented from being influenced by external impurities.

In the present embodiment, the substrate 11 is a ceramic substrate, such as an alumina ceramic substrate, an aluminum nitride ceramic substrate, or a silicon nitride ceramic substrate. The ceramic substrate has the characteristics of good heat-conducting property, high temperature resistance, corrosion resistance and the like. Further, the thickness of the substrate 11 is 0.5-2mm, which can provide good heat conduction without affecting the volume of the package module.

The pressure sensitive chip 12 is a MEMS chip, which is disposed in the accommodating cavity 10A and fixed on the substrate 11 by a glass frit layer 120. That is, the pressure sensitive chip 12 is bonded to the substrate 11 by sintering glass slurry, and the glass slurry forms the glass sintered layer 120 after the glass sintering process. Compared with the traditional method of bonding the pressure sensitive chip 12 on the substrate 11 by using an adhesive, the method of bonding the pressure sensitive chip 12 on the substrate 11 by using the glass sintering layer 120 enhances the connection strength between the pressure sensitive chip 12 and the substrate 11, has the advantages of pressure impact resistance, corrosion resistance and good sealing property, can improve the pressure range of the sensor, can be applied to a high-pressure sensor, and is suitable for a wide-range pressure sensor.

Further, the substrate 11 has a through hole 11A, the pressure sensitive chip 12 is disposed corresponding to the through hole 11A, and an external measuring medium can transmit pressure to the pressure sensitive chip 12 through the through hole 11A.

The conditioning chip 13 is an ASIC chip, is disposed in the accommodating cavity 10A, and is fixed on the substrate 11. Preferably, the conditioning chip 13 is fixed on the substrate 11 by a glass frit layer 130. That is, the conditioning chip 13 is bonded to the substrate 11 by sintering glass slurry, and the glass slurry forms a glass sintered layer 130 after the glass sintering process. The glass frit layer 130 enhances the bonding strength between the conditioning chip 13 and the substrate 11.

The pressure sensitive chip 12 is electrically connected with the conditioning chip 13, and the conditioning chip 13 is electrically connected with the substrate 11. In this embodiment, the pressure sensitive chip 12 is electrically connected to the conditioning chip 13 through a metal wire 14, and the conditioning chip 13 is electrically connected to the substrate 11 through a metal wire 15.

Further, the outer bottom surface of the substrate 11 has a metal pad 16, the conditioning chip 13 is electrically connected to the metal pad 16 through the substrate 11, and the metal pad 16 is used for electrically connecting the conditioning chip 13 to an external structure. Specifically, when the package module needs to be connected to an external printed circuit board or the like, the metal pads 16 are electrically connected to the printed circuit board, so that the conditioning chip 13 is electrically connected to the printed circuit board, and further, signals are transmitted.

The packaging module adopts the glass sintering layer 120 to hermetically connect the pressure sensitive chip 12 and the substrate 11, so that the connection strength between the pressure sensitive chip 12 and the substrate 11 is greatly enhanced, the packaging module is resistant to pressure impact, good in corrosion resistance and good in sealing property, can improve the pressure range of the sensor, can be applied to a high-pressure sensor, and is suitable for a large-range pressure sensor.

The invention also provides a pressure sensor adopting the packaging module. Fig. 2 is a schematic structural diagram of an embodiment of the pressure sensor of the present invention. Referring to fig. 1 and 2, the pressure sensor includes a package housing 20, an adapting circuit board 21, a package module 22, and a connecting member 23.

The package housing 20 includes, but is not limited to, a metal housing. The package housing 20 includes a first connection end 20A, a second connection end 20B, and an accommodating cavity 20C located between the first connection end 20A and the second connection end 20B.

The first connection end 20A has a pressure measurement hole 24, and the pressure measurement hole 24 is communicated with the accommodation cavity 20C. Further, in the present embodiment, the first connection end 20A of the package housing 20 protrudes to form a protruding portion 25, and the pressure measurement hole 24 penetrates through the protruding portion 25 and then communicates with the accommodating cavity 20C. On the outer side of the projection 25 there is a thread for connecting the pressure sensor to an external part. In particular, the pressure sensor is connected to an external measuring medium line via the projection 25.

The material of the adapting circuit board 21 includes, but is not limited to, ceramic or FR 4. The adapting circuit board 21 is disposed in the accommodating cavity 20C, and the bottom surface of the adapting circuit board 21 is hermetically connected with the first connection end 20A of the package housing 20. Specifically, the area of the first connection end 20A of the package housing 20 not provided with the pressure measurement hole 24 is a carrying surface, and the bottom surface of the adapter circuit board 21 is hermetically connected to the carrying surface through a sealing member 26, so as to prevent the measurement medium from entering the accommodating cavity 20C through a gap between the carrying surface and the adapter circuit board 21. The sealing element 26 may be a sealing ring made of silicone, NBR, ACM, FKM, etc. Or the bottom surface of the adapting circuit board 21 and the carrying surface can be sealed by gluing.

The through circuit board 21 has a through hole 210, and the through hole 210 penetrates through the through circuit board 21. The through hole 210 corresponds to the pressure measurement hole 24, that is, the through hole 210 communicates with the pressure measurement hole 24.

The encapsulation module 22 is disposed in the accommodation cavity 20C. The encapsulation module 22 is disposed on the adaptor circuit board 21 and electrically connected to the adaptor circuit board 21. The metal pads 16 on the package template 22 are electrically connected to the adapting circuit board 21. In the present embodiment, the interposer circuit board 21 has pads, and the pads are matched with the metal pads 16 of the package module in position and size, so that the pads are soldered with the metal pads 16 to fix the package module 22 on the interposer circuit board 21.

The through hole 11A on the substrate 11 of the package module 22 is disposed corresponding to the through hole 210 on the adapting circuit board, and specifically, the through hole 11A on the substrate 11 of the package module 22 is disposed concentrically with the through hole 210 on the adapting circuit board. The external measuring medium transmits pressure to the pressure sensitive chip 12 through the pressure measuring hole 24, the via hole 210 and the through hole 11A on the substrate of the package module 22.

The connector 23 is connected to the second connection end 20B of the package housing 20. In the present embodiment, the outer edge of the end of the connecting member 23 has a protrusion 23A, and the protrusion 23A abuts against the surface of the relay circuit board 21 on which the encapsulation module 22 is disposed. And riveting or crimping the second connection end 20B of the package housing 20 at the second connection end 20B of the package housing 20 to fix and seal the connecting piece 23 with the adapting circuit board 21 and the package housing 20, and the process is simple, the sealing is good, and the assembly stress is low.

Further, the connector 23 includes a pin header 231, the adapting circuit board 21 includes an electronic component 212 for designing a circuit, and the input and output pads are connected to the pin header 231 of the connector 23 through a flexible board or a wire 211 to implement characteristic connection with an external electrical device.

The pressure sensor of the invention encapsulates the pressure sensitive chip in the encapsulation module, thus realizing batch encapsulation production; in addition, the encapsulation module 22 can be encapsulated in the encapsulation shell 20 after being calibrated, the probability of failure of recalibration after being assembled is avoided, the rejection rate of metal shells, plastic connectors and the like is reduced, the purpose of low cost is achieved, batch calibration and test can be realized, mass production is realized, and the production efficiency can be improved. In addition, the pressure sensor adopts a back air inlet mode, so that corrosion of corrosion measuring media to metal bonding pads, wires and the like on the front surface of the MEMS chip can be effectively avoided, and effective medium isolation can be realized.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.