阅读说明：本技术 基板处理装置和基板处理方法 (Substrate processing apparatus and substrate processing method ) 是由 富藤幸雄 辻雅夫 大宅宗明 于 2019-07-03 设计创作，主要内容包括：本发明提供一种基板处理装置以及基板处理方法,向被施加浮起力并搬运的基板良好地涂敷处理液。涂敷装置(1)具有：搬运机构(5),使由浮起工作台部(3)被施加浮起力的浮起基板(W)沿着X方向移动；测量器(72),测量浮起基板(W)的铅垂位置；以及测量器移动部(76),使测量器(72)沿着Y方向移动。测量器(72)通过沿着Y方向移动,测量Y方向的不同的多个地点上的浮起基板W的铅垂位置。(The invention provides a substrate processing apparatus and a substrate processing method, which can well apply processing liquid to a substrate which is applied with floating force and conveyed. A coating device (1) is provided with: a conveyance mechanism (5) for moving the floating substrate (W) to which the floating force is applied by the floating table section (3) in the X direction; a measuring device (72) for measuring the vertical position of the floating substrate (W); and a measuring instrument moving unit (76) for moving the measuring instrument (72) in the Y direction. The measuring instrument (72) measures the vertical positions of the floating substrate W at a plurality of different points in the Y direction by moving along the Y direction.)

1. A substrate processing apparatus for processing a substrate having a first main surface and a second main surface, the substrate processing apparatus comprising:

a floating mechanism for applying a floating force to the substrate with the first main surface facing upward in a vertical direction;

a conveyance mechanism that moves a floating substrate, which is the substrate to which the floating force is applied, in a first direction, the first direction being a horizontal direction;

a nozzle having an ejection port extending in a second direction orthogonal to the first direction, the second direction being a horizontal direction, the nozzle being capable of ejecting the treatment liquid from the ejection port toward the first main surface of the floating substrate;

a measuring device for measuring the vertical position of the floating substrate; and

and a measuring instrument moving mechanism for moving the measuring instrument in the second direction.

2. The substrate processing apparatus according to claim 1,

the measuring instrument moving mechanism moves the measuring instrument in the second direction and upstream and downstream of the first direction.

3. The substrate processing apparatus according to claim 2,

the substrate processing apparatus further includes a buffer unit provided at the following positions: the nozzle is located on an upstream side in the first direction with respect to the nozzle, and overlaps at least a tip end portion of the ejection port of the nozzle in a horizontal direction.

4. The substrate processing apparatus according to claim 3,

the measuring device moving mechanism moves the measuring device in the second direction between a first position at which a vertical position on a horizontal position, which is an attachment horizontal position of the processing liquid from the nozzle of the floating substrate to the floating substrate, can be measured, and a second position at which a vertical position on a horizontal position of the buffer portion when the nozzle of the floating substrate ejects the processing liquid can be measured.

5. The substrate processing apparatus according to any one of claims 1 to 4,

the substrate processing apparatus includes a plurality of the measuring devices, and the plurality of measuring devices measure the vertical position of the floating substrate at different positions in the second direction.

6. The substrate processing apparatus according to claim 5,

the substrate processing apparatus further comprises a connecting means for connecting the plurality of measuring devices,

the measurer moving mechanism moves the connection tool in the second direction.

7. The substrate processing apparatus according to any one of claims 1 to 6,

the floating mechanism includes:

a table having a horizontal plane;

a plurality of ejection ports provided on the horizontal surface, the ejection ports ejecting air toward an upper side in the vertical direction; and

and a plurality of suction ports provided in the horizontal plane and configured to suck air at an upper side in the vertical direction.

8. The substrate processing apparatus according to any one of claims 1 to 7,

the measurement instrument moving mechanism moves the measurement instrument in the second direction in a state where an end portion on the downstream side in the first direction of the floating substrate is disposed at an edge portion on the downstream side in the first direction of a table included in the floating mechanism.

9. A substrate processing method of processing a substrate having a first main surface and a second main surface, wherein the substrate processing method comprises:

a step (a) of applying a floating force to the substrate with the first main surface facing upward in the vertical direction;

a step (b) of moving a floating substrate, which is the substrate to which the floating force is applied in the step (a), in a first direction, the first direction being a horizontal direction; and

and (c) measuring vertical positions of a plurality of points on the floating substrate in a second direction orthogonal to the first direction by moving a measuring device for measuring a vertical position of the floating substrate in the second direction, the second direction being a horizontal direction.

Technical Field

The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a technique for appropriately applying a processing liquid to a substrate that is transferred by applying a floating force. Examples of the substrate to be processed include a semiconductor substrate, a substrate for a Flat Panel Display (FPD) such as a liquid crystal Display device and an organic Electroluminescence (EL) Display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a photomask, a ceramic substrate, and a substrate for a solar cell.

Background

In a manufacturing process of electronic parts such as semiconductor devices and liquid crystal display devices, a coating apparatus is used which applies a coating liquid to a surface of a substrate. As such a coating apparatus, there is known an apparatus including: while conveying a substrate in a state where the substrate is floated by blowing air to the back surface of the substrate, a coating liquid is ejected from a nozzle extending in the width direction of the substrate toward the front surface of the substrate (corresponding to the main surface of the substrate) to coat the substrate with the coating liquid (for example, patent document 1).

In the substrate processing apparatus described in patent document 1, a substrate is lifted in a horizontal posture on a lifting table, a peripheral edge portion of the substrate is held and moved in a horizontal direction, the substrate is conveyed, and a coating liquid is discharged from a slit nozzle disposed above a substrate conveying path.

In the substrate processing apparatus of patent document 1, an optical distance sensor for measuring a floating height of a substrate is provided above the substrate. The coating liquid can be supplied while adjusting the height of the slit nozzle according to the floating height of the substrate.

Patent document 1: japanese patent laid-open publication No. 2012-142583

However, in patent document 1, since the optical distance sensor is fixed to the slit nozzle, the floating height of the substrate can be measured only at a fixed position in the lateral direction (the width direction of the substrate) orthogonal to the conveying direction. Therefore, the distribution of the floating height in the lateral direction of the substrate cannot be obtained. For example, if the floating height of the substrate in the lateral direction varies due to insufficient floating force of the floating table, a coating failure of the processing liquid may occur.

Disclosure of Invention

Accordingly, an object of the present invention is to provide a technique for satisfactorily applying a treatment liquid to a substrate that is transferred by applying a floating force.

In order to solve the above problem, a first aspect is a substrate processing apparatus for processing a substrate having a first main surface and a second main surface, the substrate processing apparatus including: a floating mechanism for applying a floating force to the substrate with the first main surface facing upward in a vertical direction; a conveyance mechanism that moves a floating substrate, which is the substrate to which the floating force is applied, in a first direction, the first direction being a horizontal direction; a nozzle having an ejection port extending in a second direction orthogonal to the first direction, the second direction being a horizontal direction, the nozzle being capable of ejecting the treatment liquid from the ejection port toward the first main surface of the floating substrate; a measuring device for measuring the vertical position of the floating substrate; and a measuring instrument moving mechanism that moves the measuring instrument in the second direction.

A second aspect is the substrate processing apparatus according to the first aspect, wherein the measuring instrument moving mechanism moves the measuring instrument toward upstream and downstream sides in the second direction and the first direction.

A third aspect is the substrate processing apparatus according to the second aspect, further comprising a buffer unit provided at: the nozzle is located on an upstream side in the first direction with respect to the nozzle, and overlaps at least a tip end portion of the ejection port of the nozzle in a horizontal direction.

A fourth aspect is the substrate processing apparatus according to the third aspect, wherein the measuring instrument moving mechanism moves the measuring instrument in the second direction between a first position at which a vertical position on an adhesion horizontal position, which is a horizontal position where the processing liquid from the nozzle of the floating substrate adheres to the floating substrate, can be measured, and a second position at which a vertical position on a horizontal position of the buffer portion when the nozzle of the floating substrate ejects the processing liquid can be measured.

A fifth aspect is the substrate processing apparatus according to any one of the first to fourth aspects, wherein the substrate processing apparatus includes a plurality of the measuring devices, and the plurality of measuring devices measure a vertical position of the floating substrate at different positions in the second direction.

A sixth aspect is the substrate processing apparatus according to the fifth aspect, further comprising a connecting tool that connects the plurality of measuring instruments, wherein the measuring instrument moving mechanism moves the connecting tool in the second direction.

A seventh aspect is the substrate processing apparatus according to any one of the first to sixth aspects, wherein the floating mechanism includes: a table having a horizontal plane; a plurality of ejection ports provided on the horizontal surface, the ejection ports ejecting air toward an upper side in the vertical direction; and a plurality of suction ports provided in the horizontal plane and configured to suck air at an upper side in the vertical direction.

An eighth aspect is the substrate processing apparatus according to any one of the first to seventh aspects, wherein the measuring instrument moving mechanism moves the measuring instrument in the second direction in a state where an end portion on the downstream side in the first direction of the floating substrate is disposed at an edge portion on the downstream side in the first direction of the table.

A ninth aspect is a substrate processing method of processing a substrate having a first main surface and a second main surface, the substrate processing method comprising: a step (a) of applying a floating force to the substrate with the first main surface facing upward in the vertical direction; a step (b) of moving a floating substrate, which is the substrate to which the floating force is applied in the step (a), in a first direction, the first direction being a horizontal direction; and (c) measuring vertical positions of a plurality of points on the floating substrate in a second direction orthogonal to the first direction by moving a measuring device for measuring a vertical position of the floating substrate in the second direction, the second direction being a horizontal direction.

According to the substrate processing apparatus of the first aspect, the vertical position can be measured in the second direction by moving the measuring device in the second direction. Therefore, the vertical position can be measured at a plurality of points along the second direction of the substrate. Thus, since the abnormal floating height of the substrate caused by the floating mechanism can be detected in the second direction, the processing liquid can be favorably applied to the substrate.

According to the substrate processing apparatus of the second aspect, the vertical positions of the plurality of points within the plane of the first main surface of the substrate can be measured by moving the substrate along the first direction and the second direction.

According to the substrate processing apparatus of the third aspect, when foreign matter is present on the substrate, the buffer portion collides with the foreign matter before the discharge port of the nozzle. This can protect the tip of the nozzle from foreign matter.

According to the substrate processing apparatus of the fourth aspect, since the vertical position of the substrate can be measured by the horizontal position of the substrate disposed (opposed) to the buffer portion when the processing liquid is discharged from the nozzle, it is possible to detect an abnormality in the floating height at the position of the buffer portion. Therefore, contact between the substrate and the buffer portion can be reduced during the coating process.

According to the substrate processing apparatus of the fifth aspect, since the vertical position of the floating substrate can be measured at a plurality of points at the same time, the moving distance can be made shorter than in the case where a single measuring device is moved in the Y direction, and the measurement time can be shortened.

According to the substrate processing apparatus of the sixth aspect, the plurality of measuring instruments can be moved integrally. Therefore, the structure of the moving mechanism can be simplified as compared with the case where a plurality of measuring instruments are moved independently.

According to the substrate processing apparatus of the seventh aspect, the substrate can be precisely transported by ejecting air to the substrate to be processed and sucking the air.

According to the substrate processing apparatus of the eighth aspect, since the downstream end portion of the floating substrate is disposed at the downstream edge portion of the table, it is possible to detect an abnormality in the floating height of the substrate due to a blockage of the suction port provided at the downstream end portion of the table.

According to the substrate processing method of the ninth aspect, the vertical position can be measured in the second direction by moving the measuring device in the second direction. Therefore, the vertical position can be measured at a plurality of points along the second direction of the substrate. Thus, since the abnormal floating height of the substrate caused by the floating mechanism can be detected in the second direction, the processing liquid can be favorably applied to the application substrate.

Drawings

Fig. 1 is a side view schematically showing the overall configuration of a coating apparatus 1 as an example of a substrate processing apparatus according to an embodiment.

Fig. 2 is a schematic plan view of the coating apparatus 1 according to the embodiment as viewed from the upper side in the vertical direction.

Fig. 3 is a schematic plan view showing the coating apparatus 1 of the embodiment except for the coating mechanism 6.

Fig. 4 is a schematic cross-sectional view of the coating apparatus 1 at a position along the line a-a shown in fig. 2.

Fig. 5 is a schematic plan view showing a part of the floating table portion 3 according to the embodiment.

Fig. 6 is a schematic plan view showing the nozzle support 601 and the measuring unit 70.

Fig. 7 is a schematic side view showing the nozzle 61, the measuring unit 70, and the buffer 80.

Fig. 8 is a schematic front view showing the nozzle 61, the measuring unit 70, and the buffer 80.

Fig. 9 is a schematic block diagram showing the control unit 9 of the embodiment.

Fig. 10A to 10D are diagrams illustrating respective steps of the vertical position measurement process performed by the coating apparatus 1.

Fig. 11A to 11D are diagrams illustrating respective steps of the vertical position measurement process performed by the coating apparatus 1.

Wherein the reference numerals are as follows:

1 coating device

3 floating workbench part (floating mechanism)

31 entry floating worktable

32 coating workbench

321h spray outlet

322h suction port

33 outlet floating workbench

5 conveying mechanism

6 coating mechanism

601 nozzle support

61 spray nozzle

611 discharge port

63 nozzle moving mechanism

70 measuring cell

72 measuring appliance

72a light projection part

72b light receiving part

74 connecting tool

76 measuring device moving part (measuring device moving mechanism)

80 buffer part

9 control unit

D1 first direction

D2 second direction

L11 coating station

L13 preliminary ejection position

L14 cleaning position

ML1, ML2 position

S11 carrying-in process

S12 and S12a measurement procedures

S13 carrying-out process

S14 coating Process

W substrate and floating substrate

Wf upper face (first main face)

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. The structural members described in the embodiments are merely examples, and the scope of the present invention is not limited thereto. In the drawings, the size or number of each part may be exaggerated or simplified as necessary for easy understanding.

Unless otherwise specified, a term indicating a relative or absolute positional relationship (for example, "parallel", "orthogonal", "central", "concentric", "coaxial", or the like) indicates not only a precise positional relationship but also a state in which an angle or a distance is relatively displaced within a range in which a tolerance or a function of the same degree can be obtained. Unless otherwise specified, expressions indicating equivalent states (for example, "same", "equivalent", "homogeneous", "uniform", and the like) indicate not only equivalent states quantitatively and strictly but also states where there are differences in functions to the extent that tolerances or the same degrees of the differences are obtained. Unless otherwise specified, the expression indicating the shape (for example, "square" or "cylindrical" or the like) indicates not only the shape in terms of geometry but also a shape having, for example, irregularities, chamfers, or the like within a range in which the same degree of effect can be obtained. Unless otherwise noted, the term "on" includes not only a case where two members are in contact but also a case where two members are separated.

< 1. first embodiment >

Fig. 1 is a side view schematically showing the overall configuration of a coating apparatus 1 as an example of a substrate processing apparatus according to an embodiment. Fig. 2 is a schematic plan view of the coating apparatus 1 according to the embodiment as viewed from the upper side in the vertical direction. Fig. 3 is a schematic plan view showing the coating apparatus 1 of the embodiment except for the coating mechanism 6. Fig. 4 is a schematic sectional view of the coating apparatus 1 at a position along the line a-a shown in fig. 2. Fig. 5 is a schematic plan view showing a part of the floating table portion 3 according to the embodiment.

The coating apparatus 1 is a slit coater that conveys a rectangular substrate W in a horizontal posture (posture in which an upper surface Wf (first main surface) and a lower surface (second main surface) of the substrate W are parallel to a horizontal plane (XY plane)), and applies a treatment liquid (coating liquid) to the upper surface Wf of the substrate W. In each drawing, in order to clarify the positional relationship of each part of the coating apparatus 1, the direction parallel to the first direction D1 in which the substrate W is conveyed is defined as the "X direction", the direction from the input conveyor 100 toward the output conveyor 110 is defined as the "+ X direction", and the opposite direction is defined as the "-X direction". The horizontal direction orthogonal to the X direction is set as the "Y direction", the direction toward the near side in fig. 1 is set as the "-Y direction", and the opposite direction is set as the "+ Y direction". The vertical direction orthogonal to the X direction and the Y direction is set as the Z direction, the upward direction toward the coating mechanism 6 side as viewed from the floating table portion 3 is set as the "+ Z direction", and the opposite direction is set as the "— Z direction".

The basic structure and operation principle of the coating apparatus 1 are partially common to or similar to those described in japanese patent application laid-open nos. 2010-227850 and 2010-240550. Therefore, in the present specification, the same configuration as that described in the above-mentioned publicly known document or a configuration that can be easily inferred based on technical common knowledge or the like among the respective configurations of the coating apparatus 1 is appropriately omitted.

The coating apparatus 1 includes an input conveyor 100, an input transfer unit 2, a floating table unit 3, an output transfer unit 4, and an output conveyor 110 in this order along a first direction D1(+ X direction) in which a substrate W is conveyed. These members are disposed close to each other, thereby forming a conveyance path for the substrate W. In the following description, when the positional relationship is expressed in relation to the first direction D1, which is the substrate conveyance direction, the "upstream side in the first direction" may be abbreviated as "upstream side", and the "downstream side in the first direction D1" may be abbreviated as "downstream side". In this example, the-X side is the "upstream side" and the + X side is the "downstream side" as viewed from a certain reference position.

The input conveyor 100 has a roller conveyor 101 and a rotation drive mechanism 102 that rotationally drives the roller conveyor 101. The substrate W is conveyed in a horizontal posture toward the downstream side (+ X side) by the rotation of the roller conveyor 101.

The input transfer unit 2 includes a roller conveyor 21 and a rotation drive mechanism 22 for rotating the roller conveyor 21. The substrate W is transported in the + X direction by the rotation of the roller conveyer 21. The vertical position of the substrate W is changed by the vertical movement of the roller conveyer 21. The substrate W is transferred from the input conveyor 100 to the floating table portion 3 by the operation of the input transfer portion 2.

The floating table section 3 includes three flat plate-like tables in the first direction D1. Specifically, the floating table section 3 includes an inlet floating table 31, a coating table 32, and an outlet floating table 33 in this order in the first direction D1. The upper surfaces of the work tables are positioned on the same plane.

A plurality of discharge ports 31h and 33h for discharging air (compressed air) supplied from the levitation control means 35 are provided in a matrix on the upper surfaces of the inlet and outlet levitation tables 31 and 33. The substrate W is supported in a horizontal posture with the lower surface (second main surface) of the substrate W spaced from the upper surfaces of the tables 31 and 33 by applying a floating force to the substrate W by the compressed air ejected from the plurality of ejection ports 31h and 33 h. The distance between the lower surface of the substrate W and the upper surfaces of the tables 31 and 33 may be, for example, 10 μm (micrometers) to 500 μm.

As shown in fig. 5, a plurality of ejection ports 321h for ejecting air (compressed air) and a plurality of suction ports 322h for sucking gas above the coating table 32 are provided on the upper surface of the coating table 32. On the upper surface of the coating table 32, the ejection port 321h and the suction port 322h are alternately arranged in the X direction and the Y direction. The levitation control mechanism 35 can precisely control the distance between the lower surface of the substrate W and the upper surface of the coating table 32 by controlling the ejection amount of the compressed air from each ejection port 321h and the amount of the gas sucked by each suction port 322h in a balanced manner. Thereby, the vertical position of the upper surface Wf of the substrate W passing above the coating table 32 is controlled to a predetermined value. As the structure of the floating table section 3, the structure described in japanese patent application laid-open No. 2010-227850 can be applied.

The coating stage 32 has an upstream region 32A, an intermediate region 32B, and a downstream region 32C in this order in the + X direction. Here, three regions obtained by dividing the upper surface of the coating table 32 into 1/3 in the X direction are the upstream region 32A, the intermediate region 32B, and the downstream region 32C, respectively, and the intermediate region 32B is a region occupying the center of the upper surface of the coating table 32.

The distribution density (the number per single area) of the ejection ports 321h and the suction ports 322h of the intermediate region 32B becomes larger than that of the upstream region 32A and the downstream region 32C. Therefore, the intermediate region 32B can precisely control the floating amount of the substrate W as compared with the upstream region 32A and the downstream region 32C.

The application position L11 of the nozzle 61 is set above the intermediate region 32B. That is, the processing liquid from the discharge port 611 is supplied to the substrate W to which the floating force is applied from the coating table 32 (hereinafter, referred to as "floating substrate W") in a state where the discharge port 611 of the nozzle 61 is disposed above the intermediate region 32B. Then, the horizontal position, which is the position in the horizontal direction when the processing liquid discharged from the discharge port 611 adheres to the floating substrate W, is also set above the intermediate region 32B. In this way, the processing liquid is supplied to the floating substrate W in the intermediate region 32B in which the floating amount can be precisely controlled, whereby the coating process can be performed satisfactorily.

By the rotation of the roller conveyor 21, the substrate W carried into the floating table portion 3 via the input transfer portion 2 is urged in the + X direction and is conveyed onto the entrance floating table 31. The transfer of the substrate W on the floating table portion 3 is performed by the transfer mechanism 5.

The conveyance mechanism 5 includes a chuck 51 and a suction and movement control mechanism 52. The chuck 51 supports the substrate W from below by abutting against a peripheral portion of a lower surface of the substrate W. The suction and movement control mechanism 52 has a function of applying a negative pressure to a suction pad provided at a support portion to the upper end of the chuck 51 to suction and hold the substrate W to the chuck 51. The suction and movement control mechanism 52 also has a function of linearly reciprocating the chuck 51 in the X direction.

In a state where the chuck 51 holds the substrate W, the lower surface of the substrate W is located on the + Z side of the upper surfaces of the respective tables 31, 32, 33 of the floating table section 3. The substrate W is held by suction by the chuck 51 at its peripheral edge portion, and is maintained in a horizontal posture as a whole by a floating force applied from the floating table portion 3.

The chuck 51 holds the substrate W carried into the floating table section 3 from the input transfer section 2, and in this state, the chuck 51 moves in the + X direction to carry the substrate W from above the inlet floating table 31 to above the outlet floating table 33 via above the coating table 32. The substrate W is transferred to the output transfer unit 4 disposed on the + X side of the outlet floating table 33.

The output transfer unit 4 includes a roller conveyor 41 and a rotation drive mechanism 42 for rotationally driving the roller conveyor 41. The rotation of the roller conveyer 41 applies a pushing force in the + X direction to the substrate W, and the substrate W is conveyed in the first direction D1. The substrates W are transferred from above the outlet floating table 33 to the output conveyor 110 by the operation of the output transfer unit 4.

The output conveyor 110 has a rotation drive mechanism 112 that rotates a roller conveyor 111. The rotation of the roller conveyor 111 transports the substrate W in the + X direction and discharges the substrate W to the outside of the coating apparatus 1. The input conveyor 100 and the output conveyor 110 may be provided as a part of the coating apparatus 1, or may be provided separately from the coating apparatus 1. For example, the input conveyor 100 may be a substrate unloading mechanism of another unit provided upstream of the coating apparatus 1. The output conveyor 110 may be a substrate receiving mechanism of another unit disposed on the downstream side of the coating apparatus 1.

A coating mechanism 6 for coating the processing liquid on the upper surface Wf of the substrate W is provided in the conveyance path of the substrate W. The coating mechanism 6 includes a nozzle unit 60 including a nozzle 61 for discharging the treatment liquid, a nozzle moving mechanism 63 for positioning the nozzle 61, and a maintenance unit 65 for maintaining the nozzle 61.

The nozzle 61 is a member extending in a second direction D2(Y direction) orthogonal to the first direction D1, the second direction D2 being a horizontal direction. The lower end portion of the nozzle 61 extends in the width direction, and has an ejection port 611 opening downward. The treatment liquid is discharged from the discharge port 611.

The nozzle moving mechanism 63 moves the nozzle 61 in the X direction and the Z direction to position the nozzle. The nozzle 61 is positioned at the coating position L11 above the coating table 32 by the operation of the nozzle moving mechanism 63. When the nozzle 61 is positioned at the application position L11, the nozzle 61 discharges the processing liquid onto the upper surface Wf of the substrate W, thereby applying the processing liquid onto the substrate W. Thus, the coating position L11 is the position of the nozzle 61 when coating is performed.

When the treatment liquid is discharged toward the substrate W in a state where the nozzle 61 is disposed at the coating position L11, a coating film of the treatment liquid is formed on the coating target region on the upper surface Wf of the substrate W except for the peripheral edge portion.

The maintenance unit 65 has a tub (vat)651, a preliminary ejection roller 652, a nozzle cleaner 653, and a maintenance control mechanism 654. The tub 651 stores a cleaning liquid for cleaning the nozzle 61. The maintenance control means 654 controls the preliminary ejection rollers 652 and the nozzle cleaner 653. As the structure of the maintenance unit 65, for example, the structure described in japanese patent application laid-open No. 2010-240550 can be applied.

The nozzle moving mechanism 63 positions the nozzle 61 at a preliminary ejection position L13 where the ejection port 611 faces the surface of the preliminary ejection roller 652 above the preliminary ejection roller, i.e., the preliminary ejection position L13. The nozzle 61 discharges the treatment liquid from the discharge port 611 to the surface of the preliminary discharge roller 652 at the preliminary discharge position L13 (preliminary discharge treatment). The nozzle 61 is positioned at the preliminary ejection position L13 before being positioned at the application position L11, and preliminary ejection processing is performed. This stabilizes the discharge of the processing liquid onto the substrate W from the initial stage. When the maintenance control means 654 rotates the preliminary ejection rollers 652, the treatment liquid ejected from the nozzles 61 is mixed with the cleaning liquid stored in the tank 651 and collected.

The nozzle moving mechanism 63 positions the nozzle 61 at a cleaning position L14 where the tip end portion (including the ejection port 611 and the vicinity thereof) of the nozzle 61 faces above the nozzle cleaner 653. In a state where the nozzle 61 is at the cleaning position L14, the nozzle cleaner 653 moves in the width direction (Y direction) of the nozzle 61 while discharging the cleaning liquid, thereby washing away the treatment liquid and the like adhering to the tip end portion of the nozzle 61.

The nozzle moving mechanism 63 may also position the nozzle 61 at a standby position which is a position lower than the washing position L14 and in which the lower end portion of the nozzle 61 is accommodated in the tub 651. When the coating process using the nozzle 61 is not performed in the coating apparatus 1, the nozzle 61 may be positioned at the standby position. Although not shown, a standby chamber for preventing drying of the treatment liquid in the discharge port 611 of the nozzle 61 positioned at the standby position may be provided.

In fig. 1, the nozzle 61 in the preliminary ejection position L13 is indicated by a solid line, and the nozzles 61 in the application position L11, the downstream position L12, and the cleaning position L14 are indicated by a broken line.

The coating mechanism 6 of the present embodiment has only one nozzle 61, but may have a plurality of nozzles 61. A plurality of nozzles 61 may be provided at intervals along the first direction D1. In this case, different processing liquids can be applied to the substrate W by supplying different processing liquids to the plurality of nozzles 61. Further, a nozzle moving mechanism 63 and a maintenance unit 65 may be provided for each nozzle 61. The maintenance unit 65 may be shared by two or more nozzles 61.

As shown in fig. 4, the nozzle unit 60 has a bridging structure including a beam member 631 extending in the Y direction above the floating table section 3 and two column members 632, 633 supporting both side ends of the beam member 631. The pillar members 632 and 633 are erected upward from the base 10. The lifting mechanism 634 is attached to the column member 632, and the lifting mechanism 635 is attached to the column member 633. The lift mechanisms 634, 635 comprise, for example, ball screw mechanisms. The + Y side end of the beam member 631 is attached to the lifting mechanism 634, the-Y side end of the beam member 631 is attached to the lifting mechanism 635, and the beam member 631 is supported by the lifting mechanisms 634 and 635. The lifting mechanisms 634 and 635 are interlocked with each other in accordance with a control command from the control unit 9, whereby the beam member 631 moves in the vertical direction (Z direction) in a horizontal posture.

As shown in the drawing, a nozzle support 601 extending in the Y-axis direction is provided at a central lower portion of the beam member 631. As shown in fig. 7 and 8, an intermediate portion 603 having an L-shape as viewed from the-Y side is attached to a lower portion of the nozzle support 601. The nozzle 61 is attached to a lower portion of the horizontally extending portion of the intermediate portion 603. The nozzle 61 is attached to the nozzle support 601 in a posture in which the discharge port 611 faces downward. The nozzle support 601 and the nozzle 61 are moved in the vertical direction (Z direction) by the operation of the elevating mechanisms 634 and 635.

The column members 632, 633 are movable on the base 10. Two movement guide portions 81L, 81R extending in the X direction are provided on the upper surface of the base 10 at the + Y side end portion and the-Y side end portion. The column member 632 is engaged with the + Y-side movement guide 81L via a slider 636 attached to a lower portion of the column member 632, and the column member 633 is engaged with the-Y-side movement guide 81R via a slider 637 attached to a lower portion of the column member 633. The sliders 636 and 637 are movable in the X direction along the movement guide portions 81L and 81R.

The column members 632, 633 are moved in the X direction by the action of the linear motors 82L, 82R. The linear motors 82L, 82R have a magnet module as a stator and a coil module as a mover. The magnet module is provided on the base 10 and extends in the X direction. The coil modules are mounted on lower portions of the column members 632, 633, respectively. The movers of the linear motors 82L and 82R operate in accordance with a control command from the control unit 9, and the entire nozzle unit 60 moves in the X direction. This realizes movement of the nozzle 61 in the X direction (first direction D1). The X-direction positions of the column members 632, 633 are detected by linear scales 83L, 83R provided near the sliders 636, 637.

In this way, the nozzle support 601 and the nozzle 61 are moved in the Z direction by the operation of the elevating mechanisms 634 and 635, and moved in the X direction by the operation of the linear motors 82L and 82R. That is, the control unit 9 controls the elevating mechanisms 634 and 635 and the linear motors 82L and 82R to position the nozzle 61 at the respective stop positions L11 to L14. Therefore, the elevating mechanisms 634 and 635 and the linear motors 82L and 82R function as the nozzle moving mechanism 63.

As the maintenance unit 65, the apparatus described in japanese patent application laid-open No. 2010-240550 may be adopted. The tub 651 is supported by a beam member 661 extending in the Y direction. One of both end portions of the beam member 661 is supported by the pillar member 662, and the other end portion is supported by the pillar member 663. The pillar members 662, 663 are attached to the Y-direction both end portions of the plate 664 extending in the Y-direction, respectively.

Two movement guide portions 84L, 84R extending in the X direction are provided below the respective end portions of the plate 664. Two movement guide portions 84L, 84R are provided on the upper surface of the base 10. A slider 666 is provided on the + Y side end portion of both ends in the Y direction of the lower surface of the plate 664, and a slider 667 is provided on the-Y side end portion. The sliders 666 and 667 are engaged with the movement guides 84L and 84R and are movable in the X direction.

A linear motor 85 is provided below the plate 664. The linear motor 85 includes a stator, i.e., a magnet module, and a mover, i.e., a coil module. The magnet module is provided on the base 10 and extends in the X direction. The coil module is disposed at a lower portion of the maintenance unit 65 (here, the plate 664).

The linear motor 85 operates in accordance with a control command from the control unit 9, and the entire maintenance unit 65 moves in the X direction. The X-direction position of the maintenance unit 65 is detected by the linear scale 86 provided near the sliders 666 and 667.

As shown in fig. 4, the chuck 51 has two chuck members 51L, 51R. The chuck members 51L, 51R have shapes symmetrical to each other with respect to the XZ plane, and are disposed apart from each other in the Y direction.

The chuck member 51L disposed on the + Y side is supported by a movement guide 87L provided on the base 10 and extending in the X direction. The chuck member 51L has a base portion 512, and the base portion 512 includes two horizontal plate portions disposed at different positions in the X direction and a connecting portion (see fig. 2) connecting the plate portions. One slider 511 is provided at the lower part of each of the two plate parts of the base part 512. The slider 511 is engaged with the movement guide portion 87L, whereby the chuck member 51L can move in the X direction along the movement guide portion 87L.

One support 513 is provided on each of the upper portions of the two plate portions of the base portion 512. The support 513 extends upward, and an adsorption pad (not shown) is provided at an upper end thereof. When the base part 512 moves in the X direction along the movement guide part 87L, the two supports 513 move in the X direction integrally therewith. The two plate portions of the base portion 512 are separated from each other, and these plate portions move while keeping a certain distance in the X direction, so that the base portion can function as an integral base portion in appearance. By setting the distance according to the length of the substrate, substrates having various lengths can be handled.

The chuck member 51L is moved in the X direction by the linear motor 88L. The linear motor 88 has a stator, i.e., a magnet module, and a mover, i.e., a coil module. The magnet module is provided on the base 10 and extends in the X direction. The coil module is disposed at a lower portion of the chuck member 51L. The linear motor 88L operates in accordance with a control command from the control unit 9, and the chuck member 51L moves in the X direction. The X-direction position of the chuck member 51L is detected by a linear scale 89L provided near the movement guide 87L.

The chuck member 51R provided on the-Y side has a base portion 512 and two supports 513 and 513, as in the chuck member 51L. Further, the shape of the chuck member 51R is symmetrical to the chuck member 51L with respect to the XZ plane. One slider 511 is provided at each lower portion of the two plate portions of the base portion 512 of the chuck member 51R. The slider 511 is engaged with the movement guide portion 87R, whereby the chuck member 51R can move along the movement guide portion 87R in the X direction.

The chuck member 51R can be moved in the X direction by the linear motor 88R. The linear motor 88R includes a magnet module as a stator, which extends in the X direction and is provided on the base 10, and a coil module as a mover, which is provided at a lower portion of the chuck member 51R. The linear motor 88R operates in accordance with a control command from the control unit 9, and the chuck member 51R moves in the X direction. The X-direction position of the chuck member 51R is detected by a linear scale 89R provided near the movement guide 87R.

The control unit 9 controls the positions of the chuck members 51L, 51R so that both are always at the same position in the X direction. Thereby, the pair of chuck members 51L, 51R moves as the integrated chuck 51 in appearance. As compared with the case of mechanically coupling the chuck members 51L, 51R, the chuck 51 and the floating table portion 3 can be easily prevented from interfering with each other.

As shown in fig. 3, four support portions 513 are provided corresponding to the four corners of the held substrate W. That is, the two support portions 513 of the chuck member 51L hold the + Y-side peripheral edge portion of the substrate W, i.e., the upstream-side end portion and the downstream-side end portion in the first direction D1, respectively. The two support portions 513, 513 of the chuck member 51R respectively hold the-Y-side peripheral portion of the substrate W, i.e., the upstream-side end portion and the downstream-side end portion in the first direction D1. If necessary, the four corners of the substrate W are sucked and held from below by the chuck 51 by supplying a negative pressure to the suction pads of the respective support portions 513.

The chuck 51 moves in the X direction while holding the substrate W, and conveys the substrate W. In this way, a mechanism (not shown) for supplying a negative pressure to the linear motors 88L and 88R and the respective support portions 513 functions as the suction and movement control mechanism 52 shown in fig. 1.

As shown in fig. 1 and 4, the chuck 51 holds the substrate W so as to be spaced upward from the upper surfaces of the inlet floating table 31, the coating table 32, and the outlet floating table 33. The chuck 51 holds the lower surface of the substrate W and conveys the substrate W. The chuck 51 holds only a part of the peripheral edge portion of the substrate W on the outer side in the Y direction than the central portion facing the tables 31, 32, and 33. Therefore, the central portion of the substrate W is bent downward with respect to the peripheral portion. The levitation table section 3 applies a levitation force to the center portion of the substrate W in this state, thereby controlling the vertical position of the substrate W and maintaining the substrate W in a horizontal posture.

< measurement cell 70 >

Fig. 6 is a schematic plan view showing the nozzle support 601 and the measuring unit 70. Fig. 7 is a schematic side view showing the nozzle 61, the measuring unit 70, and the buffer 80. Fig. 8 is a schematic front view showing the nozzle 61, the measuring unit 70, and the buffer 80.

The coating apparatus 1 includes a measuring unit 70. The measuring unit 70 includes a plurality of (three in this case) measuring instruments 72. Each of the measuring devices 72 measures the vertical position of the upper surface Wf of the substrate W to which the floating force is applied by the floating table portion 3. Specifically, the measuring device 72 measures the vertical position of the upper surface Wf by measuring the distance from a predetermined reference position in the vertical direction to the vertical position of the upper surface Wf. The height of the upper surface Wf can be determined based on the height (vertical position) of the upper surface of the coating table 32 from the vertical position of the upper surface Wf measured by the measuring device 72. Then, based on the height of the upper surface Wf and the thickness of the substrate W, the floating amount of the substrate W (the distance from the upper surface of the coating table 32 to the lower surface of the floating substrate W) can be determined.

Each measuring device 72 includes a light projecting unit 72a and a light receiving unit 72b (see fig. 9), the light projecting unit 72a having a light projecting unit 72a that outputs light of a predetermined wavelength, and the light receiving unit 72b including an optical sensor (e.g., a linear sensor) that detects light output from the light projecting unit 72a and reflected on the substrate W. The light receiving unit 72b is an example of a reflection type sensor that measures the vertical position of the upper surface Wf in a non-contact manner. Further, the vertical position of the upper surface Wf may be measured using ultrasonic waves instead of light. In this case, each measuring device 72 may include an output unit that outputs ultrasonic waves and a detection unit that detects ultrasonic waves reflected by the upper surface Wf.

The measuring unit 70 includes a connecting tool 74 for connecting the three measuring instruments 72 to each other. The joining tool 74 is a plate-like member extending in the Y direction, and each measuring device 72 is attached to the upstream side (the (-X side) of the joining tool 74. Here, the three measuring instruments 72 are attached to the connecting tool 74 with intervals in the second direction (Y direction).

The measurement unit 70 includes a measurement instrument moving unit 76 (measurement instrument moving mechanism). The measurement instrument moving unit 76 is connected to the + X side surface of the connection tool 74. The measuring instrument moving unit 76 includes a driving mechanism such as a linear motor mechanism or a ball screw mechanism. The measuring instrument moving unit 76 moves in the Y direction along a guide rail unit 78 (see fig. 8) provided at the center of the-X side surface of the nozzle support 601 and extending in the Y direction. When the measuring instrument moving unit 76 moves in the Y direction, the three measuring instruments 72 move integrally in the Y direction (second direction D2) by moving the joining tool 74 in the Y direction.

As shown in fig. 8, when the three measuring instruments 72 are moved in the Y direction, the measurement range RY1 in the Y direction of the measuring instrument 72 located on the most + Y side measures the vertical position of the floating substrate W, the measurement range RY2 in the Y direction of the measuring instrument 72 located at the center in the Y direction measures the vertical position of the floating substrate W, and the measurement range RY3 in the Y direction of the measuring instrument 72 located on the-Y side measures the vertical position of the floating substrate W. As shown in fig. 8, the respective measurement ranges RY1, RY2, RY3 may have overlapping ranges in the Y direction, but are not limited thereto.

Three measuring devices 72 are provided on the upstream side (-X side) with respect to the nozzle 61. Each measuring device 72 is connected to the nozzle support 601, and therefore moves together with the nozzle 61 attached to the nozzle support 601. That is, when the nozzle 61 is moved in the X direction and the Z direction by the nozzle moving mechanism 63, each measuring device 72 also moves in the same direction following the nozzle 61.

< buffer part 80 >

As shown in fig. 7 and 8, a buffer 80 is attached to the center of the side surface of the nozzle support 601 on the-X side. The buffer portion 80 is a plate-shaped member extending in the Y-axis direction (second direction D2), and is arranged parallel to the YZ plane. The buffer 80 is provided at a position overlapping the discharge port 611 (the lower end of the nozzle 61) in the first direction D1.

The buffer 80 is disposed upstream of the nozzle 61 in the conveyance direction, i.e., the first direction D1. Therefore, when foreign matter having a height that can contact the ejection port 611 adheres to the upper portion of the floating substrate W, the foreign matter contacts the buffer portion 80 before the foreign matter contacts the ejection port 611. This foreign matter adheres to the buffer portion 80 and is removed from the floating substrate W, and therefore, the foreign matter can be reduced from contacting the discharge port 611. Further, the vibration sensor that detects contact of foreign matter with the cushioning portion 80 may be provided at the cushioning portion 80. When the vibration sensor detects contact with a foreign object, the control unit 9 may control the conveyance mechanism 5 to stop conveyance of the floating substrate W.

Fig. 9 is a schematic block diagram showing the control unit 9 of the embodiment. The coating apparatus 1 includes a control unit 9 for controlling the operation of each unit. The hardware configuration of the control unit 9 may be the same as that of a general computer. The control unit 9 includes a CPU91 that performs various types of calculation processing, a ROM that is a read-only memory that stores basic programs, a read-write-free memory 92 that stores various types of information, and a display unit 93 that includes a display that displays various types of information. The memory 92 includes a fixed disk that stores an application program (program) for control, data, and the like, in addition to a main storage device (RAM). The control unit 9 may have an interface unit that performs information exchange with a user and an external device, and a reading device that reads information (program) stored in a portable storage medium (optical medium, magnetic medium, semiconductor memory, or the like).

< vertical position measurement processing >

The coating apparatus 1 performs an inspection for obtaining a distribution of vertical positions of the substrate W on the coating table 32 (hereinafter referred to as vertical position measurement processing). As described above, in the coating table 32, the suction port 322h sucks the gas, and therefore, foreign matter may be sucked. In this case, since the suction port 322h is clogged, there is a possibility that an abnormality may occur in the levitating height due to, for example, insufficient levitation height of the levitated substrate W. The vertical position measurement process is performed to detect such an abnormality of the floating height. The vertical position measurement process may be performed at an appropriate timing according to a manufacturing schedule of the substrate W in the coating apparatus 1. For example, the coating process may be performed at the time of performing the coating process on the first substrate of the lot, the first substrate of the day, and the first substrate of the afternoon of the day, or may be performed at all the times of performing the coating process on the substrates W.

The vertical position measurement process may be performed using a substrate W that is a coating target to which the process liquid is actually applied, or may be performed using a substrate W that is a non-coating target to which the process liquid is not applied (hereinafter, referred to as "substitute substrate W"). The dummy substrate W preferably has no pattern such as a wiring pattern formed on the upper surface Wf. When the upper surface Wf of the substrate W has a pattern, the light from the light emitter 72a of the measuring device 72 is reflected by the pattern and directed in a direction different from the direction of the light receiver 72b, and therefore the reflected light from the upper surface Wf may not be detected. Therefore, by using the dummy substrate W having no pattern on the upper surface Wf, the measurement device 72 can detect the reflected light from the upper surface Wf satisfactorily. Therefore, the measurement of the vertical position can be appropriately detected.

Fig. 10A to 10D are diagrams illustrating respective steps of the vertical position measurement process performed by the coating apparatus 1. Fig. 10A to 10D show the vertical position measurement process performed on the substitute substrate W. When the vertical position measurement process is started, the control unit 9 performs a carry-in step S11. In the carrying-in step S11, the control unit 9 controls the conveyance mechanism 5 to convey the substrate (floating substrate) W to which the floating force is applied from the floating table section 3, to the downstream side (+ X direction) in the first direction D1.

The loading step S11 includes a stop step S111. The stop step S111 is a step in which the control unit 9 controls the transfer mechanism 5 to transfer the floating substrate W to the predetermined position LW1 and then stops the floating substrate W at the predetermined position LW1, as shown in fig. 10B. When the floating substrate W is disposed at the predetermined position LW1, the horizontal position of the downstream end (front end) of the floating substrate W is the same as or slightly upstream of the horizontal position of the downstream end (edge) of the coating table 32.

The control unit 9 performs the measuring process S12 after the stop stage S111. The measurement step S12 is a step of detecting the vertical position of the floating substrate W at a plurality of points on the upper region 32UR of the coating table 32 by using the three measuring instruments 72 arranged in the Y direction. The upper region 32UR is a region above the entire intermediate region 32B, and in this example, is a region above a portion on the upstream side of the intermediate region 32B (a portion of the upstream region 32A) and a portion on the downstream side of the intermediate region 32B (a portion of the downstream region 32C).

In the measurement step S12, as shown in fig. 10B, the control unit 9 controls the conveyance mechanism 5 to place the three measuring devices 72 at horizontal positions slightly upstream of the downstream end of the floating substrate W located at the predetermined position LW 1. Thus, the three measuring instruments 72 are in a state capable of measuring the vertical position of the floating substrate W at a horizontal position slightly upstream of the downstream end. In this state, the control unit 9 controls the measuring instrument moving unit 76 to move the three measuring instruments 72 in the Y direction (second direction D2). During this Y-direction movement, the control unit 9 causes each of the three measuring instruments 72 to measure the vertical position of the floating substrate W at predetermined intervals. Thus, the vertical positions of the floating substrate W at a plurality of points on a straight line extending in the Y direction are measured. By the Y-direction movement of the three measuring devices 72, the vertical position of the floating substrate W can be detected not only for the region corresponding to the coating target region on the upper surface Wf of the alternative floating substrate W but also for the portions extending from the region to the + Y side and the-Y side.

When the Y-direction movement of the three measuring instruments 72 is completed, the control unit 9 controls the nozzle moving mechanism 63 to move the measuring unit 70 toward the upstream side (X-side) in the first direction D1 (X-direction movement). The amount of movement of the three measuring devices 72 at this time is a distance by which the three measuring devices 72 are moved by a distance smaller than the dimension of the coating table 32 in the X direction, and more preferably a distance smaller than the dimension of the intermediate region 32B in the X direction, that is, an amount of 1 pitch (pitch). Then, the control unit 9 causes the three measuring devices 72 to measure the vertical positions of the floating substrate W at a plurality of points in the Y direction while causing the three measuring devices 72 to move in the Y direction again.

In this way, the control unit 9 alternately performs the X-direction movement and the Y-direction movement of the three measuring instruments 72, thereby moving the three measuring instruments 72 in the Y-direction and the X-direction in a zigzag manner. Thus, as shown in fig. 10C, the control unit 9 measures vertical positions of the floating substrate W at a plurality of points in the upper region 32UR of the coating table 32. In the measurement step S12, the control unit 9 obtains the distribution of the vertical positions of the floating substrate W coated on the upper region 32UR of the table 32.

After the measurement step S12 or during the measurement step S12, the control unit 9 may determine whether or not each of the measured vertical positions is normal. The determination may be made by comparing the measured value to a threshold value. When determining that the vertical position is abnormal, the control unit 9 may notify the abnormality to the outside through a predetermined output means (the display unit 93, a lamp, a speaker, or the like). Further, when determining that the vertical position is abnormal, the control unit 9 may stop the operation of the coating apparatus 1.

When the control unit 9 completes the measurement step S12, the control unit 9 performs a carry-out step S13. The substrate W used in the measurement step S12 is a substitute substrate W that is not to be coated. Therefore, in the carrying-out step S13, as shown in fig. 10D, the control unit 9 controls the transfer mechanism 5 to move the floating substrate W to the downstream side. Thereby, the floating substrate W is carried out to the downstream side from the coating table 32. This makes it possible to carry the next substrate W to be coated into the coating table 32.

The vertical position measurement process shown in fig. 10A can be performed using a substrate W to be coated. In this case, after the measurement step S12 shown in fig. 10C, the control unit 9 controls the movement mechanism 63 to move the nozzle 61 to the application position L11. The application position L11 is a position of the nozzle 61 when the horizontal position of the processing liquid when the processing liquid is discharged from the nozzle 61 and attached to the floating substrate W is inside the intermediate region 32B. The control unit 9 moves the floating substrate W upstream to a position at which coating is started. When the movement of the nozzle 61 and the floating substrate W is completed, the control unit 9 controls the coating mechanism 6 to discharge the treatment liquid from the nozzle 61 and controls the transfer mechanism 5 to move the floating substrate W to the downstream side. Thereby, the treatment liquid is applied to the coating target region of the floating substrate W on the intermediate region 32B of the coating table 32.

In the present embodiment, the vertical positions of a plurality of points in the Y direction can be measured by moving the measuring instrument 72 in the Y direction (second direction D2). Accordingly, since the distribution of the vertical positions of the floating substrate W in the Y direction can be obtained, an abnormality in the floating height of the floating substrate W can be detected favorably. By further moving the measuring device 72 in the X direction (the first direction D1), the distribution of the vertical positions of the floating substrate W on the upper region 32UR of the coating table 32 can be obtained. This makes it possible to favorably measure an abnormality in the floating height of the floating substrate W in the region where the coating may be affected. Thus, the coating process can be appropriately performed.

As shown in fig. 10B, the downstream end of the floating substrate W is disposed at the downstream end (edge) of the coating table 32. Thus, the floating substrate W is hardly affected by the floating force from the outlet floating table 33 located on the upstream side of the coating table 32. Therefore, it is possible to detect an abnormality in the floating height of the floating substrate W due to the clogging of the suction port 322h provided at the downstream end of the coating table 32.

Fig. 11A to 11D show respective steps of the vertical position measurement process performed by the coating apparatus 1. Fig. 11A to 11D show the vertical position measurement process performed on the floating substrate W to be coated. When the vertical position measurement process is started, the control unit 9 performs a loading step S11 as shown in fig. 11A. The loading step S11 is the same as the loading step shown in fig. 10A.

The loading step S11 includes a stop stage S111 a. The stop stage S111a is a stage in which, as shown in fig. 11B, the control unit 9 controls the transfer mechanism 5 to transfer the floating substrate W to the predetermined position LW2, and then stops the floating substrate W at the predetermined position LW 2. When the floating substrate W is disposed at the predetermined position LW2, the horizontal position of the downstream end of the floating substrate W is disposed above the downstream region 32C. The horizontal position of the downstream end portion at this time may be set above the intermediate region 32B of the coating table 32, or may be set on the boundary between the intermediate region 32B and the downstream region 32C.

After the stop stage S111a, the control unit 9 performs a measurement process S12 a. The measurement step S12a is a step of measuring the vertical position of the floating substrate W at a plurality of points on the upper region 321UR of the coating table 32 by three measuring instruments 72 arranged in the Y direction, similarly to the measurement step S12. The upper region 321UR is a region including the intermediate region 32B to which the treatment liquid is applied and an upper region of a portion on the upstream side of the intermediate region 32B (a portion of the upstream region 32A).

In the measurement step S12a, as shown in fig. 11B, the control unit 9 controls the conveyance mechanism 5 to place the three measuring devices 72 at horizontal positions slightly upstream of the downstream end of the floating substrate W located at the predetermined position LW 2. Thus, the three measuring instruments 72 are in a state capable of measuring the vertical position of the floating substrate W at a horizontal position slightly upstream of the downstream end. In this state, the control unit 9 controls the measuring instrument moving unit 76 to move the three measuring instruments 72 in the Y direction (second direction D2).

During this Y-direction movement, the control unit 9 causes each of the three measuring instruments 72 to measure the vertical position of the floating substrate W at predetermined intervals. Thus, the vertical positions of the floating substrate W at a plurality of points on a straight line extending in the Y direction are measured.

When the Y-direction movement of the three measuring instruments 72 is completed, the control unit 9 controls the moving mechanism 63 to move the measuring unit 70 toward the upstream side (X-side) in the first direction D1 (X-direction movement). The amount of movement of the three measuring devices 72 at this time is an amount by which the three measuring devices 72 are moved by a distance smaller than the dimension of the coating table 32 in the X direction, more preferably, by 1 pitch, which is the dimension of the intermediate region 32B in the X direction. Then, the control unit 9 causes the three measuring devices 72 to measure the vertical positions of the floating substrate W at a plurality of points in the Y direction while causing the three measuring devices 72 to move in the Y direction again.

In this way, the control unit 9 alternately performs the X-direction movement and the Y-direction movement of the three measuring instruments 72, thereby moving the three measuring instruments 72 zigzag in the Y-direction and the X-direction. Thus, as shown in fig. 11C, the control unit 9 measures vertical positions of the floating substrate W at a plurality of points in the upper region 321UR of the coating table 32. In the measurement step S12a, the control unit 9 obtains the distribution of the vertical positions of the floating substrate W on the upper region 321UR of the coating table 32.

After the measurement step S12a or during the measurement step S12a, the control unit 9 may determine whether or not each of the measured vertical positions is normal. The determination may be made by comparing the measured value to a threshold value. When determining that the vertical position is abnormal, the control unit 9 may notify the abnormality to the outside through a predetermined output means (the display unit 93, a lamp, a speaker, or the like). Further, when determining that the vertical position is abnormal, the control unit 9 may stop the operation of the coating apparatus 1.

When the control unit 9 completes the measurement step S12a, the coating step S14 is performed. In the coating step S14, the control unit 9 controls the movement mechanism 63 to move the nozzle 61 to the coating position L11. Further, at the completion time of the measurement step S12a, the X-direction movement of each measurement instrument 72 or the setting of the distance between the nozzle 61 and the measurement instrument 72 may be performed so that the nozzle 61 comes to the application position L11. In this case, after the measurement step S12a, the movement of the nozzle 61 in the transition to the coating step S14 can be omitted. The control unit 9 controls the transfer mechanism 5 to move the floating substrate W to a predetermined supply start position at which the processing liquid is supplied from the nozzle 61 at the application position L11 to the upstream end of the application target region. When the predetermined position LW2 coincides with the supply start position, the floating substrate W can be omitted from moving. When the movement of the nozzle 61 and the floating substrate W is completed, the control unit 9 controls the coating mechanism 6 to discharge the treatment liquid from the nozzle 61 and controls the transfer mechanism 5 to move the floating substrate W to the downstream side. Thereby, the treatment liquid is applied to the coating target region of the floating substrate W on the intermediate region 32B of the coating table 32.

According to the vertical position measurement processing shown in fig. 11A to 11D, the distribution of the vertical position of the floating substrate W in the Y direction can be obtained in the intermediate region 32B of the coating table 32 where the coating processing is performed. This enables the floating substrate W to be well identified in the Y direction at a position where there is an abnormality in the floating amount, thereby reducing the occurrence of coating failure. Further, since the upper region 321UR in which the vertical position distribution is obtained is smaller than the upper region 32UR corresponding to the substantially entire surface of the coating table 32, the measurement time can be shortened.

In the example shown in fig. 11A to 11D, each measuring tool 72 is moved in the measuring process S12a in a range including the measuring position ML1 to the measuring position ML 2. The horizontal positions of the measuring instruments 72 can be measured when the processing liquid from the nozzle 61 adheres to the vertical position of the floating substrate W on the horizontal position of the floating substrate W. The measurement position ML2 is a horizontal position of each of the measuring instruments 72 when the vertical position of the floating substrate W is at the horizontal position of the buffer 80 when the nozzle 61 discharges the processing liquid (that is, when the nozzle 61 is disposed at the application position L11). Since the vertical position of the floating substrate W at the horizontal position of the buffer unit 80 when the nozzle 61 is disposed at the application position L11 can be measured by disposing the respective measuring devices 72 at the measurement position ML2, an abnormality in the floating height at the horizontal position of the buffer unit 80 can be detected. Therefore, the floating substrate W can be prevented from contacting the buffer portion 80 during the coating process.

< 2. modification example >

The embodiments have been described above, but the present invention is not limited to the above embodiments and various modifications are possible.

The measuring unit 70 does not need to be provided with three measuring instruments 72. For example, the measuring unit 70 may include two or more measuring devices 72. The measurement unit 70 may be provided with a single measurement device 72. However, the plurality of measuring instruments 72 are disposed at intervals along the Y direction, and thus the vertical position of the floating substrate W can be measured at a plurality of different positions along the Y direction. This can shorten the moving distance of each measuring device 72 compared to the case where a single measuring device 72 is provided, and thus can shorten the measurement time.

The measurement instrument moving unit 76 (measurement instrument moving mechanism) does not need to move the three measurement instruments 72 in the Y direction integrally. For example, a measuring instrument moving mechanism may be provided for moving each of the three measuring instruments 72 in the Y direction. However, by integrally moving the plurality of measuring instruments 72, the structure for moving the measuring instruments 72 can be simplified.

The measuring unit 70 does not need to be moved in the X direction integrally with the nozzle 61 by the moving mechanism 63. For example, a measuring instrument moving mechanism that moves the measuring unit 70 in the X direction independently of the nozzle 61 may be provided. However, by moving the plurality of measuring instruments 72 integrally with the nozzle 61, the structure for moving the measuring instruments 72 can be simplified.

The measuring unit 70 may include two or more measuring instruments 72 at a constant interval in the X direction. In this case, the vertical positions of the floating substrates W on the two straight lines can be measured simultaneously by the Y-direction movement of each measuring device 72.

Instead of mounting the measuring unit 70 on the nozzle support 601, another bridge structure may be provided separately, and the measuring unit 70 may be mounted on the bridge structure. Further, since the maintenance unit 65 is a bridge structure, the measurement unit 70 may be attached to the tub 651 of the maintenance unit 65 so as to be movable in the Y direction and the X direction. In this case, the measurement unit 70 may be moved manually without providing a driving unit.

The present invention has been described in detail, but the above description is illustrative in all aspects, and the present invention is not limited thereto. It is understood that numerous variations not illustrated can be devised without departing from the scope of the invention. The respective configurations described in the above embodiments and modifications can be appropriately combined or omitted unless contradicted with each other.