阅读说明：本技术 一种集成电路板生产系统 (Integrated circuit board production system ) 是由 曹祚 曹恒 于 2019-10-15 设计创作，主要内容包括：本公开提供了一种集成电路板生产系统,包括光刻蚀装置,其被配置为对导电基体进行预设版图光刻蚀；导电基体由两层相互隔离的导体构成；其中一层导体上的预设版图为标识信息；清洗装置,其被配置为对光刻蚀后的导电基体进行清洗；清洗装置包括顶部密封的清洗腔,清洗腔一端与臭氧水输入管相连,另一端与臭氧水输出管相连；臭氧水输入管与第一臭氧水容器相连,臭氧水输入管还用于对由第一臭氧水容器传输至清洗腔的臭氧水进行加热；臭氧水输出管与第二臭氧水容器相连,第二臭氧水容器用于接收清洗导电基体后的臭氧水；测试装置,其被配置为对清洗后的导电基体进行导电测试；包装装置,其被配置为对导电测试成功的导电基体进行封装,形成集成电路板。(The present disclosure provides an integrated circuit board production system, comprising a photo-etching device configured to perform a preset layout photo-etching on a conductive substrate; the conductive substrate is composed of two layers of mutually isolated conductors; the preset layout on one layer of conductor is identification information; a cleaning device configured to clean the photo-etched conductive base; the cleaning device comprises a cleaning cavity with a sealed top, one end of the cleaning cavity is connected with the ozone water input pipe, and the other end of the cleaning cavity is connected with the ozone water output pipe; the ozone water input pipe is connected with the first ozone water container and is also used for heating the ozone water transmitted to the cleaning cavity from the first ozone water container; the ozone water output pipe is connected with a second ozone water container, and the second ozone water container is used for receiving ozone water after the conductive substrate is cleaned; a testing device configured to conduct a conductivity test on the cleaned conductive substrate; and the packaging device is configured to package the conductive base body with successful conductive test to form the integrated circuit board.)

1. An integrated circuit board production system, comprising:

a photoetching device configured to perform preset layout photoetching on the conductive base body; the conductive substrate is composed of two layers of conductors which are mutually isolated; the preset layout on one layer of conductor is identification information;

a cleaning device configured to clean the photo-etched conductive base; the cleaning device comprises a cleaning cavity with a sealed top, one end of the cleaning cavity is connected with the ozone water input pipe, and the other end of the cleaning cavity is connected with the ozone water output pipe; the ozone water input pipe is connected with the first ozone water container and is also used for heating the ozone water transmitted to the cleaning cavity from the first ozone water container; the ozone water output pipe is connected with a second ozone water container, and the second ozone water container is used for receiving ozone water after the conductive substrate is cleaned;

a testing device configured to conduct a conductivity test on the cleaned conductive substrate;

and the packaging device is configured to package the conductive base body with successful conductive test to form the integrated circuit board.

2. The system of claim 1, wherein the testing apparatus comprises a chip clock controller and a pulse debugging circuit, the chip clock controller is used for generating a corresponding output clock according to an input clock for testing the circuit under test; the pulse debugging circuit is used for generating a pulse record according to the pulse number of the output clock pulse, and the pulse record is used for indicating whether the test state associated with the output clock pulse is normal or not.

3. The system of claim 2, wherein the test apparatus further comprises a buffer circuit for storing and outputting the pulse record according to a stable clock.

4. The integrated circuit board production system of claim 1, wherein the ozone water input pipe and the ozone output pipe are provided with a first valve and a second valve respectively.

5. The integrated circuit board production system of claim 1, wherein the inner wall of the ozone water inlet pipe is provided with thread-like grooves, the thread-like grooves are parallel to each other, the pitch of the thread-like grooves is arranged in a decreasing manner according to an arithmetic progression from the first ozone water container to the cleaning chamber, and a continuous and uninterrupted heating element is laid in the thread-like grooves and used for heating the ozone water in the heating pipe.

6. The integrated circuit board production system of claim 1, wherein a first pump is provided in the first ozone water container; the cleaning cavity is internally provided with a second pump which is used for discharging ozone water in the cleaning cavity into a second ozone water container.

7. The integrated circuit board production system of claim 1, wherein the first ozone water container is further connected to an ozone water mixing device.

8. The integrated circuit board production system according to claim 7, wherein the ozone water mixing apparatus comprises:

a water filtering device for outputting filtered water of a preset purity;

the bottom of the ozone water mixer is provided with a water filling port, one end of the water filling port is connected with the output end of the water filtering device, and the other end of the water filling port is also connected with the atomizing spray head; at least two ozone gas inlets are arranged around the water filling port; the ozone inlet is connected with an ozone source; the bottom of the ozone-water mixer is also provided with an ozone-water outlet.

9. The integrated circuit board production system of claim 8, wherein the water filtering means comprises a pre-stage filtering means, a regenerating means, a trash removing tank, a post-stage filtering means, a reverse osmosis means, and a fine mixing bed which outputs filtered water of a predetermined purity, which are connected in series.

10. The system for producing an integrated circuit board according to claim 8, wherein a pressure sensor is disposed in the ozone-water mixer, the pressure sensor is used for monitoring the pressure in the ozone-water mixer in real time and transmitting the pressure to a microprocessor, the microprocessor is connected to a pressure regulating valve, and the pressure regulating valve is disposed on the top of the ozone-water mixer.

Technical Field

The disclosure belongs to the field of integrated circuit board production equipment, and particularly relates to an integrated circuit board production system.

Background

The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.

The integrated circuit board is made by using semiconductor manufacturing process, and many transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by multilayer wiring or tunnel wiring. When an integrated circuit needs to identify its own features or implement functions such as physical unclonable, the integrated circuit usually needs to set its own identification information.

The inventor finds that the production efficiency of the integrated circuit board is influenced finally due to the fact that the mark setting implementation process is complex, the cleaning effect is poor, the testing process is complex in the production process of the integrated circuit board.

Disclosure of Invention

In order to solve the above problems, the present disclosure provides an integrated circuit board production system, which improves cleaning efficiency, and ultimately improves integrated circuit board production efficiency.

In order to achieve the purpose, the following technical scheme is adopted in the disclosure:

an integrated circuit board production system comprising:

a photoetching device configured to perform preset layout photoetching on the conductive base body; the conductive substrate is composed of two layers of conductors which are mutually isolated; the preset layout on one layer of conductor is identification information;

a cleaning device configured to clean the photo-etched conductive base; the cleaning device comprises a cleaning cavity with a sealed top, one end of the cleaning cavity is connected with the ozone water input pipe, and the other end of the cleaning cavity is connected with the ozone water output pipe; the ozone water input pipe is connected with the first ozone water container and is also used for heating the ozone water transmitted to the cleaning cavity from the first ozone water container; the ozone water output pipe is connected with a second ozone water container, and the second ozone water container is used for receiving ozone water after the conductive substrate is cleaned;

a testing device configured to conduct a conductivity test on the cleaned conductive substrate;

and the packaging device is configured to package the conductive base body with successful conductive test to form the integrated circuit board.

In one embodiment, the testing apparatus includes a chip clock controller and a pulse debugging circuit, wherein the chip clock controller is used for generating a corresponding output clock according to an input clock for testing a circuit under test; the pulse debugging circuit is used for generating a pulse record according to the pulse number of the output clock pulse, and the pulse record is used for indicating whether the test state associated with the output clock pulse is normal or not;

in one embodiment, the test apparatus further includes a buffer circuit for storing and outputting the pulse record according to a stable clock.

In one embodiment, the ozone water input pipe and the ozone output pipe are respectively provided with a first valve and a second valve.

In one embodiment, the inner wall of the ozone water input pipe is provided with thread-shaped grooves, the thread-shaped grooves are parallel to each other, the distance between the thread-shaped grooves is arranged in an equidifferent series decreasing manner from the first ozone water container to the cleaning cavity, and a continuous and uninterrupted heating element is laid in the thread-shaped grooves and used for heating the ozone water in the heating pipe.

In one embodiment, a first pump is arranged in the first ozone water container; the cleaning cavity is internally provided with a second pump which is used for discharging ozone water in the cleaning cavity into a second ozone water container.

In one embodiment, the first ozone water container is further connected to an ozone water mixing device.

As an embodiment, the ozonated water mixing apparatus includes:

a water filtering device for outputting filtered water of a preset purity;

the bottom of the ozone water mixer is provided with a water filling port, one end of the water filling port is connected with the output end of the water filtering device, and the other end of the water filling port is also connected with the atomizing spray head; at least two ozone gas inlets are arranged around the water filling port; the ozone inlet is connected with an ozone source; the bottom of the ozone-water mixer is also provided with an ozone-water outlet.

As an implementation mode, the water filtering device comprises a front-stage filtering device, a regenerating device, an impurity removing tank, a rear-stage filtering device, a reverse osmosis device and a fine mixing bed which are connected in sequence, wherein the fine mixing bed outputs filtered water with preset purity.

As an implementation mode, an air pressure sensor is arranged in the ozone-water mixer, the air pressure sensor is used for monitoring the air pressure in the ozone-water mixer in real time and transmitting the air pressure to a microprocessor, the microprocessor is connected with a pressure regulating valve, and the pressure regulating valve is arranged at the top of the ozone-water mixer.

The beneficial effects of this disclosure are:

the integrated circuit board production system comprises a photoetching device, a cleaning device, a testing device and a packaging device; performing preset layout photoetching on a conductive base body formed by two layers of mutually isolated conductors through a photoetching device; the preset layout on one layer of conductor is identification information, so that the identification realization efficiency is improved; meanwhile, the ozone water input pipe is adopted in the cleaning device to heat the ozone water transmitted to the cleaning cavity from the first ozone water container, and the heated ozone water is used for cleaning the conductive base body, so that the cleaning efficiency is improved, and the production efficiency of the integrated circuit board is finally improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and are not to limit the disclosure.

Fig. 1 is a schematic structural diagram of an integrated circuit board production system according to an embodiment of the present disclosure.

Detailed Description

The present disclosure is further described with reference to the following drawings and examples.

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

In the present disclosure, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only relational terms determined for convenience in describing structural relationships of the parts or elements of the present disclosure, and do not refer to any parts or elements of the present disclosure, and are not to be construed as limiting the present disclosure.

In the present disclosure, terms such as "fixedly connected", "connected", and the like are to be understood in a broad sense, and mean either a fixed connection or an integrally connected or detachable connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present disclosure can be determined on a case-by-case basis by persons skilled in the relevant art or technicians, and are not to be construed as limitations of the present disclosure.

As shown in fig. 1, the integrated circuit board production system of this embodiment includes a photolithography device, a cleaning device, a testing device, and a packaging device, which are connected in sequence.

Wherein:

(1) a photoetching device configured to perform preset layout photoetching on the conductive base body; the conductive base is formed by two layers of mutually isolated conductors.

In specific implementation, the photoetching device can be realized by adopting laser etching equipment, and the model of the photoetching device can be specifically selected according to actual conditions.

It should be noted that the conductor constituting the conductive substrate may be specifically a metal or a semiconductor, that is, the conductor may be specifically prepared in a metal material or a semiconductor material, and the specific material of the conductor is determined according to the specific situation, and is not specifically limited in this embodiment.

(2) A cleaning device configured to clean the photo-etched conductive base; the cleaning device comprises a cleaning cavity with a sealed top, one end of the cleaning cavity is connected with the ozone water input pipe, and the other end of the cleaning cavity is connected with the ozone water output pipe; the ozone water input pipe is connected with the first ozone water container and is also used for heating the ozone water transmitted to the cleaning cavity from the first ozone water container; the ozone water output pipe is connected with a second ozone water container, and the second ozone water container is used for receiving ozone water after the conductive substrate is cleaned.

In one embodiment, the ozone water input pipe and the ozone output pipe are respectively provided with a first valve and a second valve.

In one embodiment, the inner wall of the ozone water input pipe is provided with thread-shaped grooves, the thread-shaped grooves are parallel to each other, the distance between the thread-shaped grooves is arranged in an equidifferent series decreasing manner from the first ozone water container to the cleaning cavity, and a continuous and uninterrupted heating element is laid in the thread-shaped grooves and used for heating the ozone water in the heating pipe.

In one embodiment, a first pump is arranged in the first ozone water container; the cleaning cavity is internally provided with a second pump which is used for discharging ozone water in the cleaning cavity into a second ozone water container.

In one embodiment, the first ozone water container is further connected to an ozone water mixing device.

As an embodiment, the ozonated water mixing apparatus includes:

a water filtering device for outputting filtered water of a preset purity;

the bottom of the ozone water mixer is provided with a water filling port, one end of the water filling port is connected with the output end of the water filtering device, and the other end of the water filling port is also connected with the atomizing spray head; at least two ozone gas inlets are arranged around the water filling port; the ozone inlet is connected with an ozone source; the bottom of the ozone-water mixer is also provided with an ozone-water outlet.

As an implementation mode, the water filtering device comprises a front-stage filtering device, a regenerating device, an impurity removing tank, a rear-stage filtering device, a reverse osmosis device and a fine mixing bed which are connected in sequence, wherein the fine mixing bed outputs filtered water with preset purity.

As an implementation mode, an air pressure sensor is arranged in the ozone-water mixer, the air pressure sensor is used for monitoring the air pressure in the ozone-water mixer in real time and transmitting the air pressure to a microprocessor, the microprocessor is connected with a pressure regulating valve, and the pressure regulating valve is arranged at the top of the ozone-water mixer.

(3) And the testing device is configured to conduct a conductivity test on the cleaned conductive substrate.

In one embodiment, the testing apparatus includes a chip clock controller and a pulse debugging circuit, wherein the chip clock controller is used for generating a corresponding output clock according to an input clock for testing a circuit under test; the pulse debugging circuit is used for generating a pulse record according to the pulse number of the output clock pulse, and the pulse record is used for indicating whether the test state associated with the output clock pulse is normal or not.

In a specific implementation, the chip clock controller may specifically select a corresponding chip to implement according to actual conditions, such as an FPGA or other programmable logic chip.

In an alternative embodiment, the pulse debugging circuit comprises at least two shift registers connected in series for determining whether the chip clock controller sends at least two full-speed clock pulses. Each of the shift registers may be implemented by a D-type flip-flop or its equivalent. Each shift register makes the output value Q equal to the input value D according to the triggering of the output clock (for example: the rising edge of the output clock) of the chip clock controller, wherein the input value D of the first shift register is a given value (for example: 1), and the input value D of the second shift register is the output value Q of the first shift register; in addition, the shift register is reset according to a reset signal, such as an inverted signal of a scan enable signal or an equivalent signal thereof.

In one embodiment, the test apparatus further includes a buffer circuit for storing and outputting the pulse record according to a stable clock.

In one embodiment, the cache circuit may include a plurality of multiplexers and a plurality of shift registers.

(4) And the packaging device is configured to package the conductive base body with successful conductive test to form the integrated circuit board.

The integrated circuit board production system of the embodiment comprises a photoetching device, a cleaning device, a testing device and a packaging device; performing preset layout photoetching on a conductive base body formed by two layers of mutually isolated conductors through a photoetching device; the preset layout on one layer of conductor is identification information, so that the identification realization efficiency is improved; meanwhile, the ozone water input pipe is adopted in the cleaning device to heat the ozone water transmitted to the cleaning cavity from the first ozone water container, and the heated ozone water is used for cleaning the conductive base body, so that the cleaning efficiency is improved, and the production efficiency of the integrated circuit board is finally improved.

The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.