阅读说明：本技术 一种高速装片刻印机 (High-speed mounting imprinter ) 是由 周颖 于 2019-10-16 设计创作，主要内容包括：本发明涉及一种高速装片刻印机,通过将硅片装入切换装料装置料盒内,吸盘装置将硅片吸取到吸料移送装置,硅片传送到多片剔除装置,多片剔除装置感应将多余的硅片剔除,硅片传送到视觉定位装置定位和打码,硅片传送到视觉或读码器识别装置进行扫码识别将打码不良品剔除,硅片传送到装片移送装置,装片升降装置正转将进空花篮装置上的空花篮装夹好后,移动到与传送到装片移送装置对应位置进行装片,当花篮装满后通过装片升降装置反转将满花篮送出,能有效提高硅片的装片效率和质量,还能有效避免不良品的装入,另外通过读取识别码信息,来追溯每片硅片的装入信息,以便及时发现装片步骤中的错误情况,并进行及时处理,从而避免装片出现不良品。(The invention relates to a high-speed loading imprinter, which is characterized in that silicon wafers are loaded into a material box of a switching loading device, a sucker device sucks the silicon wafers into a material sucking and transferring device, the silicon wafers are conveyed to a multi-wafer removing device, the multi-wafer removing device is used for removing redundant silicon wafers in a sensing manner, the silicon wafers are conveyed to a visual positioning device for positioning and coding, the silicon wafers are conveyed to a visual or code reader recognition device for scanning and recognizing to remove coding defective products, the silicon wafers are conveyed to a loading and transferring device, a wafer loading lifting device rotates forwards to clamp an empty basket on the empty basket device, the silicon wafers are moved to a position corresponding to the wafer loading and transferring device for loading, a full basket is conveyed out by the reverse rotation of the wafer loading lifting device after the basket is full, the wafer loading efficiency and quality of the silicon wafers can be effectively improved, the loading of defective products can be effectively avoided, in addition, the loading information of each silicon wafer is traced by reading the, so as to find the error condition in the step of loading in time and process in time, thereby avoiding the defective products in the loading.)

1. A high-speed mounted imprinter, characterized in that: the automatic flower picking machine comprises a frame, wherein a material sucking assembly, a material picking assembly, a piece loading assembly and a basket assembly are sequentially arranged on the frame, the material sucking assembly comprises a material sucking and transferring device arranged at the upper end of the frame, a switching charging device is arranged on one side of the material sucking and transferring device, a sucker device is arranged above the material sucking and transferring device, a material sucking station and a multi-piece detection station are arranged on the material sucking and transferring device, the material picking assembly comprises a multi-piece removing device, a visual positioning device and a visual or code reader identification device arranged at the upper end of the frame, the piece loading assembly comprises a piece loading and transferring device arranged at the upper end of the frame, a piece loading and lifting device is arranged at the output end of the piece loading and transferring device, a radio frequency identifier is arranged at one end of the piece loading and lifting device, and the basket assembly comprises a full flower basket device and an empty.

2. A high speed die bonder as claimed in claim 1, wherein: inhale material transfer device and include two parallel arrangement transfer the frame, transfer and be equipped with belt and belt pulley on the frame, transfer the frame below and be equipped with first transmission motor, two transfer and be equipped with the transmission shaft between the frame, the output of first transmission motor with through belt and belt pulley connection between the transmission shaft.

3. A high speed die bonder as claimed in claim 1, wherein: the switching charging device comprises a sliding block which is fixed at the upper end of the rack and provided with a sliding groove, a sliding plate is arranged on the sliding block, a sliding rail which is in fit connection with the sliding groove is arranged at the bottom end of the sliding plate, a first material box and a second material box are arranged on the sliding plate, a switching motor is arranged between the sliding plate and the rack, two sides of the sliding plate correspond to the first material box, a charging support frame is arranged at the position of the first material box, a limiting block which is used for limiting the height of the upper end of the first material box and the height of the upper end of the second material box are arranged on the charging support frame, a material pushing motor is arranged at the position of the.

4. A high speed die-cut imprinter according to claim 3, wherein: the switching charging device further comprises a transition material box correspondingly arranged on one side of the sucker device, two sides of the transition material box are arranged on the charging support frame, and a limiting block used for limiting the height of the upper end of the transition material box is arranged on the charging support frame.

5. A high speed die bonder as claimed in claim 1, wherein: the sucking disc device is including locating the sucking disc support frame of inhaling material transfer device one end, sucking disc support frame lower extreme is equipped with swing motor, sucking disc support frame upper end is equipped with the driving pulley with swing motor coupling and locates the driven pulleys of the sucking disc support frame other end, driving pulley passes through the belt with driven pulleys and is connected, driven pulleys is connected with the swing arm through the connecting axle, the swing arm other end is connected with the sucking disc.

6. A high speed die bonder as claimed in claim 1, wherein: the multi-disc removing device comprises a fixing frame, the fixing frame is hinged with a multi-disc removing frame through an articulated shaft, a second transmission motor connected with the articulated shaft through a belt is arranged on the lower portion of the fixing frame, a multi-disc removing cylinder is obliquely arranged on the lower portion of the other end of the multi-disc removing frame, a base plate is obliquely arranged below the visual positioning device, a slide way is arranged on the base plate, a multi-disc removing box is arranged on the slide way in a matched mode, and a multi-disc removing motor is arranged between the multi-disc removing box and the base plate.

7. A high speed die bonder as claimed in claim 6, wherein: the visual positioning device comprises two conveying frames which are transversely arranged in parallel, a belt and a belt pulley are arranged on each conveying frame, a third transmission motor is arranged below each conveying frame, a transmission shaft is arranged between the two conveying frames, the output end of the third transmission motor is connected with the transmission shaft through the belt and the belt pulley, an empty station, a visual positioning station, a code printing station and an identification station are arranged on each conveying frame, a laser engraving machine used for engraving identification codes on silicon wafers is arranged above the visual positioning station and the code printing station, a visual positioner is arranged below the visual positioning station and the code printing station, a visual or code reader identification device is arranged above the identification station, positioning adjusting plates are arranged on the two sides of the conveying frames corresponding to the empty station, adjusting rollers are uniformly distributed on the upper ends of the positioning adjusting plates, and positioning adjusting cylinders are arranged at the outer ends of the lower parts of the positioning adjusting plates, the vision or code reader identification device comprises a longitudinal support, belts and belt pulleys are arranged at two ends of the longitudinal support, a defective product eliminating motor connected with the belt pulleys at two ends is arranged in the middle of the longitudinal support, and a defective product blanking box is correspondingly arranged on one side of the longitudinal support.

8. A high speed die bonder as claimed in claim 1, wherein: the mounting and transferring device comprises two parallel mounting and transferring frames, wherein both sides of each mounting and transferring frame are provided with a belt and a belt pulley, a fourth transmission motor is arranged below each mounting and transferring frame, a transmission shaft connected with the belt pulleys on the mounting and transferring frames is arranged between the two mounting and transferring frames, a mounting plate is arranged at the output end of each mounting and transferring frame, and a mounting inductor is arranged on the mounting plate.

9. A high speed die bonder as claimed in claim 1, wherein: the chip mounting and lifting device comprises a lifting support frame, a lifting guide plate and a lifting slider are arranged at the rear portion of the lifting support frame, a lifting motor is arranged at the top end of the lifting guide plate, the lifting guide plate is connected with a lifting rod, the lifting bottom end of the lifting support frame is connected with a device frame, a belt and a belt pulley are arranged on two sides of the device frame, one end of the device frame is provided with a forward and reverse rotating motor connected with the belt pulley in a shaft connection mode, a clamping cylinder and a clamping inductor are arranged at the top end of the lifting support frame, and the other end of.

10. A high speed die bonder as claimed in claim 1, wherein: the full-flower basket output device and the empty-flower basket input device comprise an output flower basket frame and an input flower basket frame which are respectively arranged at the upper part and the lower part of the rack, belts and belt pulleys are respectively arranged at two ends of the output flower basket frame and the input flower basket frame, an output motor and an input motor which are in shaft connection with the belt pulleys are respectively arranged at one end of the output flower basket frame and one end of the input flower basket frame, and full-flower baskets and empty-flower baskets are respectively arranged on the output flower basket frame and the input flower basket frame.

Technical Field

The invention relates to the technical field of silicon wafer processing equipment, in particular to a high-speed wafer loading imprinter.

Background

At present, the manufacturing process of the solar cell comprises a plurality of procedures, such as silicon wafer cleaning, texturing and the like, wherein the silicon wafers are required to be loaded into a basket and replaced with a material box in the procedures. In the prior art, the method is always operated manually, and the problems of high fragment rate, large pollution to silicon wafers, low efficiency and the like easily occur in the method.

Regarding the above problems, there are publications in the prior art: CN2065429U discloses a high-speed chip loader, which comprises a sucker moving component, a silicon chip carrying box moving component and a basket moving component; the sucker moving assembly comprises a double-sucker structure and a sucker left-right moving mechanism; the double-sucker structure is connected with the sucker left-right movement mechanism; the silicon wafer bearing box moving assembly comprises a bearing box silicon wafer jacking mechanism, a silicon wafer bearing box sliding table mechanism and a silicon wafer conveying mechanism; the basket tool movement assembly comprises a basket tool lifting mechanism, a basket tool positioning mechanism, a basket tool guiding device and a basket tool belt conveying line; each group of suckers sucks two silicon wafers, the moving range of each group of suckers is four directions of up, down, left and right, the silicon wafer buffer mechanism is also included, the structure of the type can achieve the aims of low fragmentation rate, small pollution to the silicon wafer and effective improvement of the working efficiency in the process of loading the silicon wafer, however, as shown in the figure, the double-sucker structure and the sucker left-right movement mechanism respectively suck the silicon wafer up and down and left-right movement mechanism, generally the double-sucker structure sucks the silicon wafer, when no silicon wafer is in the silicon wafer bearing box corresponding to the double-sucker structure, the silicon wafer is sucked by the sucker left-right movement mechanism, because the double-sucker structure and the left-right movement mechanism can achieve the adsorption effect only by lifting when absorbing the silicon wafer, therefore, the lifting type sucker can shake, the silicon wafer is easily damaged and broken, the action process of lifting and sucking the silicon wafer is long, and the sucking efficiency is influenced; and its two sucking disc structures and side-to-side motion can produce the condition of pausing disconnected material at the switching in-process, and because the silicon chip is thinner, can make the sucking disc absorb the quantity of silicon chip at every turn and differ, nevertheless detect the silicon chip figure that the sucking disc was absorbed because of it can not, so be not convenient for automatic with silicon chip automatic device in the basket, whole dress piece process is from sending into the silicon chip and bearing box, sucking disc absorption silicon chip to with device in the basket in addition, every step can all appear for example: absorb the bad phenomenon of silicon chip etc. more, but its every step all does not set up corresponding defective products processing apparatus, so the silicon chip of last loading has great probability to be the defective products, and the loading process to the defective products is unclear to can not adjust the machine according to concrete step, can not in time discover the defective products and be not convenient for the subsequent processing of defective products.

Disclosure of Invention

The invention aims to provide a high-speed chip mounting imprinter which not only can effectively improve the chip mounting efficiency and quality of silicon chips, but also can effectively avoid the mounting of defective products, and in addition, the mounting information of each silicon chip is traced back by reading identification code information so as to find the error condition in the chip mounting step in time and process the error condition in time, thereby avoiding the defect product during chip mounting.

In order to solve the technical problem, the invention is solved by the following technical scheme:

a high-speed mounted imprinter comprises a frame, wherein a material suction assembly, a material picking assembly, a mounted assembly and a basket assembly are sequentially arranged on the frame, the material sucking component comprises a material sucking and transferring device arranged at the upper end of the frame, a switching charging device is arranged at one side of the material sucking and transferring device, a sucker device is arranged above the material sucking and transferring device, a material sucking station and a plurality of detection stations are arranged on the material sucking and transferring device, the material rejecting assembly comprises a plurality of rejecting devices arranged at the upper end of the frame, a visual positioning device and a visual or code reader identification device, the chip loading assembly comprises a chip loading and transferring device arranged at the upper end of the frame, the output end of the chip loading and transferring device is provided with a chip loading lifting device, and one end of the loading lifting device is provided with a radio frequency identifier, and the basket assembly comprises a full flower basket outlet device and an empty flower basket inlet device which are respectively arranged at the upper end and the lower end of the rack.

Preferably, inhale material transfer device and include two parallel arrangement transfer the frame, transfer and be equipped with belt and belt pulley on the frame, transfer the frame below and be equipped with first transmission motor, two transfer and be equipped with the transmission shaft between the frame, the output of first transmission motor with connect through belt and belt pulley between the transmission shaft.

Preferably, the switching charging device comprises a sliding block fixed at the upper end of the rack and provided with a sliding groove, a sliding plate is arranged on the sliding block, a sliding rail matched and connected with the sliding groove is arranged at the bottom end of the sliding plate, a first material box and a second material box are arranged on the sliding plate, a switching motor is arranged between the sliding plate and the rack, two sides of the sliding plate correspond to the first material box, a charging support frame is arranged at the position of the first material box, a limiting block used for limiting the height of the upper end of the first material box and the height of the upper end of the second material box are arranged on the charging support frame, a material pushing motor is arranged at the position of the first material box below the rack, a material.

Further preferably, the switching charging device further comprises a transition material box correspondingly arranged on one side of the sucker device, two sides of the transition material box are arranged on the charging support frame, and a limit block used for limiting the height of the upper end of the transition material box is arranged on the charging support frame.

Further preferably, the sucking disc device is including locating the sucking disc support frame of inhaling material transfer device one end, sucking disc support frame lower extreme is equipped with swing motor, sucking disc support frame upper end is equipped with the driving pulley with swing motor coupling and locates the driven pulleys of the sucking disc support frame other end, driving pulley passes through the belt with driven pulleys and is connected, driven pulleys is connected with the swing arm through the connecting axle, the swing arm other end is connected with the sucking disc.

Preferably, the multi-disc removing device comprises a fixing frame, the fixing frame is hinged to a multi-disc removing frame through an articulated shaft, a second transmission motor connected with the articulated shaft through a belt is arranged on the lower portion of the fixing frame, a multi-disc removing cylinder is obliquely arranged on the lower portion of the other end of the multi-disc removing frame, a base plate is obliquely arranged below the visual positioning device, a slide way is arranged on the base plate, a multi-disc removing box is cooperatively arranged on the slide way, and the multi-disc removing motor is arranged between the multi-disc removing box and the base plate.

Further preferably, the vision positioning device comprises two conveying frames which are transversely arranged in parallel, a belt and a belt pulley are arranged on each conveying frame, a third transmission motor is arranged below each conveying frame, a transmission shaft is arranged between the two conveying frames, the output end of the third transmission motor is connected with the transmission shaft through the belt and the belt pulley, an idle station, a vision positioning and code printing station and an identification station are arranged on each conveying frame, a laser engraving machine used for engraving identification codes on silicon wafers is arranged above the vision positioning and code printing station, a vision positioner is arranged below the vision positioning and code printing station, the vision or code reader identification device is arranged above the identification station, positioning adjusting plates are arranged on the two sides of the conveying frames corresponding to the idle station, adjusting rollers are uniformly distributed on the upper ends of the positioning adjusting plates, and positioning adjusting cylinders are arranged at the outer ends of the lower parts of the positioning adjusting plates, the vision or code reader identification device comprises a longitudinal support, belts and belt pulleys are arranged at two ends of the longitudinal support, a defective product eliminating motor connected with the belt pulleys at two ends is arranged in the middle of the longitudinal support, and a defective product blanking box is correspondingly arranged on one side of the longitudinal support.

Further preferably, the loading and transferring device comprises two parallel loading and transferring frames, belts and belt pulleys are arranged on two sides of each loading and transferring frame, a fourth transmission motor is arranged below each loading and transferring frame, a transmission shaft connected with the belt pulleys on the two loading and transferring frames is arranged between the two loading and transferring frames, a loading plate is arranged at the output end of each loading and transferring frame, and a loading inductor is arranged on each loading plate.

Further preferably, the chip mounting and lifting device comprises a lifting support frame, a lifting guide plate and a lifting slider are arranged at the rear portion of the lifting support frame, a lifting motor is arranged at the top end of the lifting guide plate, the lifting guide plate is connected with a lifting rod, the lifting bottom end is connected with a device frame, belts and belt pulleys are arranged on two sides of the device frame, a forward and reverse rotating motor connected with the belt pulleys in a shaft connection mode is arranged at one end of the device frame, a clamping cylinder and a clamping inductor are arranged at the top end of the lifting support frame, and a radio frequency identifier is arranged at the other end of the device.

Preferably, the full-flower basket discharging device and the empty-flower basket feeding device comprise an output flower basket frame and an input flower basket frame which are respectively arranged at the upper part and the lower part of the rack, belts and belt pulleys are respectively arranged at two ends of the output flower basket frame and the input flower basket frame, an output motor and an input motor which are in shaft connection with the belt pulleys are respectively arranged at one end of the output flower basket frame and one end of the input flower basket frame, and the full-flower basket and the empty-flower basket are respectively arranged on the output flower basket frame and the input flower basket frame.

The invention has the beneficial effects that: the silicon wafer picking and loading machine comprises a rack, wherein a material sucking assembly, a material picking assembly, a wafer loading assembly and a basket assembly are sequentially arranged on the rack, the material sucking assembly comprises a material sucking and transferring device arranged at the upper end of the rack, a switching and loading device is arranged on one side of the material sucking and transferring device, a sucker device is arranged above the material sucking and transferring device, a material sucking station and a plurality of detection stations are arranged on the material sucking and transferring device, the material picking assembly comprises a plurality of wafer picking devices arranged at the upper end of the rack, a visual positioning device and a visual or code reader identification device, the wafer loading assembly comprises a wafer loading and transferring device arranged at the upper end of the rack, a wafer loading and lifting device is arranged at the output end of the wafer loading and transferring device, a radio frequency identifier is arranged at one end of the wafer loading and lifting device, the basket assembly comprises a full flower basket discharging device and an empty flower basket feeding device which are respectively arranged at the, sucking the silicon wafers to a suction material transfer device through a sucker device, conveying the silicon wafers to a multi-wafer removing device through the suction material transfer device, removing redundant silicon wafers when the multi-wafer removing device senses a plurality of silicon wafers, conveying the silicon wafers to a visual positioning device for positioning and code printing, continuously conveying the silicon wafers to a visual or code reader identification device for code scanning identification, removing the coded defective products, conveying the silicon wafers to a wafer loading transfer device, clamping empty flower baskets fed into the empty flower basket device through forward rotation of a wafer loading lifting device, moving the silicon wafers to a position corresponding to the wafer loading transfer device for wafer loading, conveying full flower baskets through reverse rotation of the wafer loading lifting device after the flower baskets are full, effectively improving the wafer loading efficiency and quality of the silicon wafers, effectively avoiding loading of defective products, and tracing the loading information of each silicon wafer through reading identification code information so as to find out the error condition in the wafer loading step in time, and timely processing is carried out, so that defective products during chip mounting are avoided.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is another schematic structural diagram of the present invention.

Fig. 3 is a schematic structural view of the suction assembly of the present invention.

Fig. 4 is another schematic structural view of the suction assembly of the present invention.

FIG. 5 is a schematic view of the rejecting assembly according to the present invention.

FIG. 6 is another schematic view of the rejecting assembly of the present invention.

Fig. 7 is a schematic structural view of the die bonding assembly of the present invention.

FIG. 8 is another schematic view of the chip mounting assembly of the present invention.

Reference numerals

1. A frame, 2, a material sucking and transferring device, 3, a switching and charging device, 4 and a sucker device,

5. a material suction station 6, a multi-chip detection station 7, a multi-chip removing device 8 and a visual positioning device,

9. a visual or code reader identification device 10, a loading and conveying device 11, a loading and lifting device,

12. a radio frequency identifier 13, a full flower basket outlet device 14, an empty flower basket inlet device,

21. a transfer rack 22, a first transmission motor 31, a sliding plate 32, a first material box,

33. a second material box 34, a material loading support frame 35, a limit block 36, a material pushing motor,

37. a material pushing rod 38, a transition material box 41, a sucker supporting frame 42 and a swing motor,

43. a swing arm 44, a suction cup 71, a fixed frame 72, a multi-sheet removing frame,

73. a second transmission motor 74, a multi-chip removing cylinder 75, a backing plate 76 and a multi-chip removing box,

81. a conveying frame 82, a third transmission motor 83, a laser engraving machine 84 and a visual positioner,

85. a positioning adjusting plate 86, an adjusting roller 87, a positioning adjusting cylinder 88 and a longitudinal support,

89. defective product removing motor 810, defective product blanking box 101, loading and transferring frame,

102. a fourth transmission motor 103, a chip mounting plate 104, a chip mounting sensor 111, a lifting support frame,

112. a lifting motor 113, a lifting rod 114, a device frame 115 and a positive and negative rotation motor,

116. a clamping cylinder 117, a clamping sensor 131, an output flower basket frame 132, an output motor,

133. a full flower basket 141, an input flower basket frame 142, an input motor 143 and an empty flower basket.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples.

As shown in fig. 1-8, a high-speed loading imprinter comprises a frame 1, wherein a material sucking component, a material picking component, a loading component and a basket component are sequentially arranged on the frame 1, the material sucking component comprises a material sucking and transferring device 2 arranged at the upper end of the frame 1, a switching and loading device 3 is arranged at one side of the material sucking and transferring device 2, a suction cup device 4 is arranged above the material sucking and transferring device 2, a material sucking station 5 and a multi-sheet detection station 6 are arranged on the material sucking and transferring device 2, the material picking component comprises a multi-sheet removing device 7, a visual positioning device 8 and a visual or code reader identification device 9 arranged at the upper end of the frame 1, the loading component comprises a loading and transferring device 10 arranged at the upper end of the frame 1, an output end of the loading and transferring device 10 is provided with a loading lifting device 11, one end of the loading and lifting device 11 is provided with a radio frequency identifier, the basket assembly comprises a full flower basket 133 outlet device 13 and an empty flower basket 143 inlet device 14 which are respectively arranged at the upper end and the lower end of the frame 1, when the full flower basket 133 cleaning device and the empty flower basket 143 inlet device 14 work, silicon wafers are loaded into a material box of the switching loading device 3, the silicon wafers are sucked into the material sucking and transferring device 2 through the sucker device 4, the material sucking and transferring device 2 transfers the silicon wafers to the multi-wafer removing device 7, when the multi-wafer removing device 7 senses a plurality of silicon wafers, redundant silicon wafers are removed, then the silicon wafers are transferred to the visual positioning device 8 for positioning and code printing, the silicon wafers are continuously transferred to the visual or code reader recognition device 9 for code scanning and recognition, defective products with code printing are removed, the silicon wafers are transferred to the wafer loading and transferring device 10, after the empty flower basket 143 on the empty flower basket 143 inlet device 14 is clamped through forward rotation of the wafer loading and lifting device 11 is moved to the position corresponding to the wafer loading and transferring device 10 for loading, after the flower basket is full, the loading efficiency and quality of the silicon wafers can be effectively improved, the loading of defective products can be effectively avoided, the loading information of each silicon wafer is traced through reading identification code information, so that the error condition in the loading step can be found in time, the processing is carried out in time, and the defective products are avoided.

As shown in fig. 3 and 4, in this embodiment, the material sucking and transferring device 2 includes two parallel transferring frames 21, a belt and a belt pulley are disposed on the transferring frames 21, a first transmission motor 22 is disposed below the transferring frames 21, a transmission shaft is disposed between the two transferring frames 21, an output end of the first transmission motor 22 is connected to the transmission shaft through the belt and the belt pulley, and when in use, the first transmission motor 22 drives the belt pulley and the belt to rotate, so as to transfer the silicon wafer to a next station.

As shown in fig. 3 and 4, in this embodiment, the switching charging device 3 includes a slider fixed at the upper end of the frame 1 and provided with a sliding slot, the slider is provided with a sliding plate 31, the bottom end of the sliding plate 31 is provided with a sliding rail cooperatively connected with the sliding slot, the sliding plate 31 is provided with a first magazine 32 and a second magazine 33, a switching motor is arranged between the sliding plate 31 and the frame 1, two sides of the sliding plate 31 are provided with charging supports 34 corresponding to the first magazine 32, the charging supports 34 are provided with stoppers 35 for limiting the heights of the upper ends of the first magazine 32 and the second magazine 33, a pushing motor 36 is arranged below the frame 1 and corresponding to the first magazine 32, the pushing motor 36 is provided with a pushing rod 37, the pushing rod 37 is provided with a pushing plate at the upper end, when in use, a silicon wafer is firstly placed in the first magazine 32 and the second magazine 33, the pushing motor 36 is used for controlling the pushing rod 37 and the pushing plate to push the silicon wafer in the first material box 32 to the position where the upper part of the first material box 32 is flush with the bottom end of the sucking disc 44, the silicon wafer is sucked to the belt of the material sucking and transferring device 2 through the sucking disc device 4, after the silicon wafer in the first material box 32 is sucked, the sliding plate 31 is driven through the switching motor, the second material box 33 is moved to the position of the original first material box 32, and therefore the phenomenon that the silicon wafer cannot be sucked by the sucking disc device 4 can be prevented.

As shown in fig. 3 and 4, in this embodiment, the switching charging device 3 further includes a transition material box 38 correspondingly disposed on one side of the suction cup device 4, two sides of the transition material box 38 are disposed on the charging support frame 34, a limit block 35 for limiting the height of the upper end of the transition material box 38 is disposed on the charging support frame 34, the transition material box 38 absorbs the silicon wafer in the first material box 32, the second material box 33 moves to the gap time of the position of the original first material box 32, so that the suction cup 44 can absorb the silicon wafer in the transition material box 38, and the phenomenon that the suction cup device 4 cannot absorb the silicon wafer can be further prevented.

As shown in fig. 3 and 4, in this embodiment, the suction cup device 4 includes a suction cup support 41 disposed at one end of the suction and transfer device 2, a swing motor 42 is disposed at a lower end of the suction cup support 41, a driving pulley coupled to the swing motor 42 and a driven pulley disposed at the other end of the suction cup support 41 are disposed at an upper end of the suction cup support 41, the driving pulley and the driven pulley are connected by a belt, the driven pulley is connected by a swing arm 43 via a connecting shaft, a suction cup 44 is connected to the other end of the swing arm 43, when in use, the swing motor 42 drives the swing arm 43 and the suction cup 44 to swing back and forth, silicon wafers in the magazine are sucked by the suction cup 44 and then placed on the belt of the suction and transfer device 2, when switching between the first magazine 32 and the second magazine 33, the swing motor 42 drives the swing arm 43 and the suction cup 44 to swing left and right between, the suction cup 44 swings in a plane with a fixed height, so that the silicon wafer is not required to be sucked in a lifting way, and the silicon wafer is not shaken when being sucked, so that the efficiency of sucking the silicon wafer can be effectively improved, and the silicon wafer is not damaged.

As shown in fig. 5 and 6, in this embodiment, the multi-slice removing device 7 includes a fixing frame 71, the fixing frame 71 is hinged to a multi-slice removing frame 72 through a hinge shaft, a second transmission motor 73 connected to the hinge shaft through a belt is disposed at a lower portion of the fixing frame 71, a multi-slice removing cylinder 74 is disposed at a lower portion of the other end of the multi-slice removing frame 72 in an inclined manner, a backing plate 75 is disposed at a lower portion of the visual positioning device 8 in an inclined manner, a slide way is disposed on the backing plate 75, a multi-slice removing box 76 is disposed on the slide way in a matching manner, a multi-slice removing motor is disposed between the multi-slice removing box 76 and the backing plate 75, when a silicon slice is conveyed to the belt of the multi-slice removing frame 72, a multi-slice sensor on the multi-slice removing frame 72 senses the silicon slice, when more than one, the excessive silicon wafers are obliquely driven to the multi-wafer removing box 76, when the number of the silicon wafers does not exceed one, the multi-wafer removing cylinder 74 does not work, and the silicon wafers are normally conveyed to the visual positioning device 8 through a belt.

As shown in fig. 5 and 6, in this embodiment, the vision positioning device 8 includes two conveying frames 81 arranged in parallel in a transverse direction, a belt and a belt pulley are arranged on the conveying frame 81, a third transmission motor 82 is arranged below the conveying frame 81, a transmission shaft is arranged between the two conveying frames 81, an output end of the third transmission motor 82 is connected with the transmission shaft through the belt and the belt pulley, an idle station, a vision positioning and coding station and an identification station are arranged on the conveying frame 81, a laser engraving machine 83 for engraving identification codes on silicon wafers is arranged above the vision positioning and coding station, a vision positioner 84 is arranged below the vision positioning and coding station, the vision or code reader identification device 9 is arranged above the identification station, positioning adjusting plates 85 are arranged on two sides of the conveying frame 81 corresponding to the idle station, adjusting rollers 86 are uniformly distributed on the upper ends of the positioning adjusting plates 85, the outer end of the lower part of the positioning adjusting plate 85 is provided with a positioning adjusting cylinder 87, the vision or code reader recognition device 9 comprises a longitudinal support 88, two ends of the longitudinal support 88 are both provided with a belt and a belt pulley, the middle part of the longitudinal support is provided with a defective product eliminating motor 89 which is simultaneously connected with the belt pulleys at the two ends, one side of the longitudinal support 88 is correspondingly provided with a defective product blanking box 810, a silicon wafer firstly enters the idle station and then enters a vision positioning and coding station, then the station is controlled by a vision positioner 84 to drive the positioning adjusting plate 85 to position and adjust the silicon wafer by the positioning adjusting cylinder 87 at the two sides of the conveying frame 81, when the position of the silicon wafer is right below the laser engraving machine 83, the laser engraving machine 83 carries out laser engraving and coding on the silicon wafer, then the coded silicon wafer moves to a recognition station, and code scanning recognition is carried out by the vision or code reader recognition device 9, when the code on the silicon wafer is wrong, the silicon wafer is moved to a belt on the longitudinal support 88, the defective silicon wafer is sent into the defective product blanking box 810 by a driving belt of the defective product removing motor 89, and when the code on the silicon wafer is qualified, the qualified silicon wafer is conveyed to the wafer loading and conveying device 10.

As shown in fig. 7 and 8, in this embodiment, the loading and transferring device 10 includes two loading and transferring frames 101 arranged in parallel, two sides of the loading and transferring frame 101 are both provided with a belt and a belt pulley, a fourth transmission motor 102 is arranged below the loading and transferring frame 101, a transmission shaft connected with the belt pulley on the two loading and transferring frames 101 is arranged between the two loading and transferring frames 101, an output end of the two loading and transferring frames 101 is provided with a loading plate 103, a loading sensor 104 is arranged on the loading plate 103, and when in use, the fourth transmission motor 102 drives the belt pulley and the belt to rotate, so as to transfer the silicon wafer to the loading lifting device 11.

As shown in fig. 7 and 8, in this embodiment, the sheet loading lifting device 11 includes a lifting support frame 111, a lifting guide plate and a lifting slider are disposed at the rear portion of the lifting support frame 111, a lifting motor 112 is disposed at the top end of the lifting guide plate, the lifting guide plate is connected with a lifting rod 113, the lifting bottom end is connected with a device frame 114, a belt and a belt pulley are disposed on both sides of the device frame 114, a forward and reverse rotation motor 115 coupled to the belt pulley is disposed at one end of the device frame 114, a clamping cylinder 116 and a clamping sensor 117 are disposed at the top end of the lifting support frame 111, the radio frequency identifier 12 is disposed at the other end of the device frame 114, when in use, the lifting motor 112 controls the lifting rod 113, the device frame 114, the forward and reverse rotation motor 115, the clamping cylinder 116 and the clamping sensor to descend together to a position corresponding to the empty basket 143 entering device 14, the empty basket 143 is transferred by the empty basket 143 entering device 14 and the forward and, then when the clamping sensor 117 senses that the device frame 114 is internally provided with the empty flower basket 143, the clamping cylinder 116 is controlled to fix the empty flower basket 143, then the empty flower basket 143 is lifted to a position corresponding to the position between the loading plate 103 and the device 13 for discharging the full flower basket 133, then the fourth transmission motor 102 drives the belt pulley and the belt to rotate, silicon wafers are loaded in each layer of loading grooves in the empty flower basket 143, each layer of silicon wafers is loaded, the lifting cylinder drives the device frame 114 and the flower basket to descend one layer of position until the empty flower basket 143 is fully loaded, then the full flower basket 133 is conveyed to the device 13 for discharging the full flower basket 133 through the belt at the lower end of the device frame 114 by rotating the forward and backward motor 115.

As shown in fig. 1 and 2, in this embodiment, the full flower basket 133 output device 13 and the empty flower basket 143 input device 14 include an output flower basket frame 131 and an input flower basket 141 respectively disposed at the upper portion and the lower portion of the frame 1, two ends of the output flower basket frame 131 and the input flower basket 141 are both provided with a belt and a belt pulley, one end of the output flower basket frame 131 and one end of the input flower basket frame 141 are respectively provided with an output motor 132 and an input motor 142 coupled to the belt pulley, the output flower basket frame 131 and the input flower basket 141 are respectively provided with a full flower basket 133 and an empty flower basket 143, the input motor 142 drives the empty flower basket 143 to move towards the lower portion of the device frame 114, and the output motor 132 drives the full flower basket 133 filled with silicon chips to move out at one side of the device frame 114.

The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.