阅读说明：本技术 一种蓝宝石晶片加工载具 (Sapphire wafer processing carrier ) 是由 陈炳寺 戴磊 于 2019-10-25 设计创作，主要内容包括：本发明公开了一种蓝宝石晶片加工载具,包括底座、支撑柱、载物盘、扇叶、电机、电机盒、支撑板、横板、支撑杆、横杆、振动马达、连接杆、轴杆、进料口、转接口、壳体、导管、固定杆和固定架。本发明结构简单,设置设置有进料口、导管、振动马达以及载物盘,通过驱动振动马达从而带动进料口以及导管振动,能够完成对待加工蓝宝石晶片的进料,载物盘上开设有限位槽可以放置待加工的蓝宝石晶片；通过设置电机、电机盒以及扇叶,驱动电机带动扇叶转动,从而实现对蓝宝石晶片加工时产生的粉尘进行清理,整个装置结构紧凑,增加了实用性。(The invention discloses a sapphire wafer processing carrier which comprises a base, a support column, a carrying disc, fan blades, a motor box, a support plate, a transverse plate, a support rod, a transverse rod, a vibrating motor, a connecting rod, a shaft rod, a feed inlet, an adapter, a shell, a guide pipe, a fixed rod and a fixed frame. The feeding device is simple in structure and provided with the feeding hole, the guide pipe, the vibrating motor and the carrying disc, the feeding of the sapphire wafers to be processed can be completed by driving the vibrating motor to drive the feeding hole and the guide pipe to vibrate, and the carrying disc is provided with the limiting groove for placing the sapphire wafers to be processed; through setting up motor, motor box and flabellum, driving motor drives the flabellum and rotates to the realization is processed the dust that produces and is cleared up the sapphire wafer man-hour, and whole device compact structure has increased the practicality.)

1. A sapphire wafer processing carrier is characterized in that: the device comprises a base (1) and a carrying disc (3), wherein the upper surface of the base (1) is fixedly connected with a supporting column (2), the other end of the supporting column (2) is fixedly connected with the carrying disc (3), the side edge of the base (1) is fixedly connected with a transverse plate (8), the other end of the transverse plate (8) is fixedly connected with a supporting plate (7), the top end of the supporting plate (7) is fixedly connected with a motor box (6), the other side edge of the base (1) is fixedly connected with a fixed frame (19), the other end of the fixed frame (19) is fixedly connected with a shell (16), a vibrating motor (11) is fixedly connected in the shell (16), the output end of the vibrating motor (11) is fixedly connected with a connecting rod (12), the side edge of the top end of the connecting rod (12) is fixedly connected with a fixed rod (18), the other end of the, the upper end of the adapter (15) is in threaded connection with the feed inlet (14), and the lower end of the adapter (15) is in threaded connection with the guide pipe (17).

2. The sapphire wafer processing carrier of claim 1, wherein: the motor box is characterized in that a support frame is fixedly connected to the bottom end inside the motor box (6), the support frame is fixedly connected with a motor (5), an output shaft of the motor (5) penetrates through the side edge of the motor box (6), and fan blades (4) are fixedly connected to the tail end of the output shaft of the motor (5).

3. The sapphire wafer processing carrier of claim 1, wherein: the support rod (9) is fixedly connected to the bottom end inside the shell (16), a cross rod (10) is fixedly connected to the side edge of the top end of the support rod (9), a vibration motor (11) is fixedly connected to the other end of the cross rod (10), and an output shaft of the vibration motor (11) penetrates through the side wall of the shell (16).

4. The sapphire wafer processing carrier of claim 1, wherein: feed inlet (14) are hopper-shaped, just feed inlet (14) bottom lateral wall is equipped with the external screw thread, switching mouth (15) are the ring form.

5. The sapphire wafer processing carrier of claim 1, wherein: the guide pipe (17) is a hollow cylinder with two through ends, and the center line of the guide pipe (17) and the center line of the object carrying disc (3) are on the same straight line.

6. The sapphire wafer processing carrier of claim 1, wherein: the carrying plate (3) is disc-shaped, and a limiting groove is formed in the center of the carrying plate (3).

7. The sapphire wafer processing carrier of claim 2, wherein: the number of the supporting rods (9) and the number of the cross rods (10) are two, and one of the supporting rods (9) and one of the cross rods (10) are symmetrically distributed on two sides of the vibration motor (11) in a group.

Technical Field

The invention relates to a processing carrier, in particular to a sapphire wafer processing carrier, and belongs to the technical field of sapphire wafer processing equipment.

Background

Sapphire has excellent characteristics of high temperature resistance, wear resistance, good thermal conductivity, excellent electrical insulation, stable chemical performance, high hardness, high strength, wide light-transmitting frequency band and the like, so that the sapphire is widely applied to military and civil fields such as high-speed integrated circuits, laser chip communication, LEDs, high-speed missile cowlings, mobile phone screens, optical elements, medical sapphire blades, high-temperature high-strength structural elements and the like; in the applications, the surfaces of sapphire parts need to be processed precisely or even ultraprecisely, particularly, sapphire is used as an LED substrate and a window material, and the surfaces of workpieces are required to achieve ultra-smoothness and no damage; however, sapphire is a typical hard and brittle material, which has a hardness second to diamond, a mohs hardness of 9, is very difficult to process, easily causes processing damage during processing, and has very low processing efficiency, particularly, requires a long time for polishing processing.

The grinding is a process in the sapphire wafer processing, the device is required to bear the sapphire wafer to be processed when grinding, and dust can be generated when the sapphire wafer is ground. Therefore, a sapphire wafer processing carrier is proposed to solve the above problems.

Disclosure of Invention

The present invention is directed to a sapphire wafer processing carrier to solve the above problems.

The sapphire wafer processing carrier comprises a base and a carrying disc, wherein a supporting column is fixedly connected to the upper surface of the base, the other end of the supporting column is fixedly connected with the carrying disc, a transverse plate is fixedly connected to the side edge of the base, a supporting plate is fixedly connected to the other end of the transverse plate, a motor box is fixedly connected to the top end of the supporting plate, a fixing frame is fixedly connected to the other side edge of the base, the other end of the fixing frame is fixedly connected with a shell, a vibrating motor is fixedly connected into the shell, the output end of the vibrating motor is fixedly connected with a connecting rod, a fixing rod is fixedly connected to the side edge of the top end of the connecting rod, the other end of the fixing rod is fixedly connected with a shaft rod, the tail end of the shaft rod is fixedly connected with a.

Preferably, the inside bottom fixed connection support frame of motor box, support frame fixed connection motor, the motor output shaft runs through motor box side, just motor output shaft end fixed connection flabellum.

Preferably, the bottom end of the inside of the shell is fixedly connected with a supporting rod, the side edge of the top end of the supporting rod is fixedly connected with a cross rod, the other end of the cross rod is fixedly connected with a vibration motor, and an output shaft of the vibration motor penetrates through the side wall of the shell.

Preferably, the feed inlet is leaks hopper-shaped, just feed inlet bottom lateral wall is equipped with the external screw thread, the switching mouth is the ring form.

Preferably, the guide pipe is a hollow cylinder with two through ends, and the central line of the guide pipe and the central line of the object carrying disc are on the same straight line.

Preferably, the object carrying plate is disc-shaped, and a limiting groove is formed in the center of the object carrying plate.

Preferably, the number of the supporting rods and the number of the cross rods are two, and one supporting rod and one cross rod are symmetrically distributed on two sides of the vibration motor in a group.

The invention has the beneficial effects that:

1. the sapphire wafer processing carrier is simple in structure and convenient to operate, is provided with a feeding hole, a guide pipe, a vibration motor and a carrying disc, can complete feeding of a sapphire wafer to be processed by driving the vibration motor to drive the feeding hole and the guide pipe to vibrate, and is provided with a limiting groove for placing the sapphire wafer to be processed;

2. this kind of sapphire wafer processing carrier is through setting up motor, motor box and flabellum, and driving motor drives the flabellum and rotates to the realization is cleared up the dust that produces when processing sapphire wafer, whole device compact structure, and convenient to use is fit for using widely.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic view of the overall structure of the present invention

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a schematic side view of the present invention.

In the figure: 11. the base, 2, support column, 3, carry thing dish, 4, flabellum, 5, motor, 6, motor box, 7, backup pad, 8, diaphragm, 9, bracing piece, 10, horizontal pole, 11, vibrating motor, 12, connecting rod, 13, axostylus axostyle, 14, feed inlet, 15, switching mouth, 16, casing, 17, pipe, 18, dead lever, 19, mount.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Referring to fig. 1-3, a sapphire wafer processing carrier includes a base 1 and a carrier 3, the upper surface of the base 1 is fixedly connected with a support column 2, the other end of the support column 2 is fixedly connected with the carrier 3, the side of the base 1 is fixedly connected with a transverse plate 8, the other end of the transverse plate 8 is fixedly connected with a support plate 7, the top end of the support plate 7 is fixedly connected with a motor box 6, the other side of the base 1 is fixedly connected with a fixed frame 19, the other end of the fixed frame 19 is fixedly connected with a housing 16, a vibration motor 11 is fixedly connected in the housing 16, the output end of the vibration motor 11 is fixedly connected with a connecting rod 12, the side of the top end of the connecting rod 12 is fixedly connected with a fixed rod 18, the other end of the fixed rod 18 is fixedly connected with a shaft rod 13, the tail end of the, the lower end of the adapter 15 is connected with a conduit 17 in a threaded manner.

The bottom end in the motor box 6 is fixedly connected with a support frame, the support frame is fixedly connected with a motor 5, an output shaft of the motor 5 penetrates through the side edge of the motor box 6, and the tail end of the output shaft of the motor 5 is fixedly connected with a fan blade 4, so that the motor 5 can be fixed and the fan blade 4 can be driven by the driving motor 5 to rotate; the bottom end of the interior of the shell 16 is fixedly connected with a supporting rod 9, the side edge of the top end of the supporting rod 9 is fixedly connected with a cross rod 10, the other end of the cross rod 10 is fixedly connected with a vibration motor 11, an output shaft of the vibration motor 11 penetrates through the side wall of the shell 16, the number of the supporting rods 9 and the number of the cross rods 10 are two, one supporting rod 9 and one cross rod 10 are distributed on two sides of the vibration motor 11 in a group and are symmetrically distributed, so that the vibration motor 11 can be driven to drive the feeding port 14 to vibrate, and; the feed port 14 is funnel-shaped, an external thread is arranged on the outer side wall of the bottom end of the feed port 14, and the adapter 15 is annular; the guide pipe 17 is a hollow cylinder with two through ends, and the central line of the guide pipe 17 and the central line of the object carrying disc 3 are on the same straight line, so that the object carrying disc 3 can conveniently receive the sapphire wafer dropped through the guide pipe 17; the object carrying plate 3 is disc-shaped, and a limiting groove is formed in the center of the object carrying plate 3, so that the object carrying plate is convenient to hold sapphire wafers to be processed.

When the device is used, electrical elements appearing in the application are externally connected with a power supply and a control switch when in use, firstly, all parts in the device are well installed, sapphire wafers to be processed are poured into the feeding hole 14, the vibration motor 11 is started, the vibration motor 11 vibrates to drive the connecting rod 12, the shaft rod 13 and the fixed rod 18 to vibrate, then the feeding hole 14 and the guide pipe 17 are driven to vibrate, the sapphire wafers in the feeding hole 14 fall into a limiting groove on the object carrying disc 3 below the guide pipe 17 through the guide pipe 17 under the vibration effect, the motor 5 is started, the motor 5 drives the fan blades 4 to rotate, and therefore dust generated by the processed sapphire wafers is cleaned.

The motor 5 may be of the type 6IK120GU-CF manufactured by Ningbo Med Intelligent drive, Inc. and its associated power supply and circuitry.

The vibration motor 11 may be of the type Z03 manufactured by kunshanchen macro electromechanical devices, inc.

It is well within the skill of those in the art to implement and protect the present invention without undue experimentation and without undue experimentation that the present invention is directed to software and process improvements.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.