阅读说明：本技术 一种相控阵多波束射频接收组件 (Phased array multi-beam radio frequency receiving assembly ) 是由 唐嘉浩 康宏毅 周琪 王志宇 张兵 郁发新 于 2019-08-02 设计创作，主要内容包括：本发明公开了一种相控阵多波束射频接收组件,包括：接收射频信号的第一射频同轴连接器；将射频信号放大的射频板；将放大后的射频信号并合成波束的射频多层混压板；接收射频多层混压板输出的波束的第二射频同轴连接器。本发明具有在高集成度板材同时接收多个波束进行合成处理的特点,多个波束间射频走线的交叉引入同轴微带线垂直互联结构,在射频板内层分层传输,保证了多波束可同时接收处理,且保证接收波束微波性能良好且互不干扰影响。该结构对相控阵TR组件的高度集成化和组件多波束实现具有重要的应用价值。(The invention discloses a phased array multi-beam radio frequency receiving assembly, which comprises: a first radio frequency coaxial connector for receiving radio frequency signals; a radio frequency board amplifying the radio frequency signal; the radio frequency multilayer mixed plate is used for combining the amplified radio frequency signals into beams; and the second radio frequency coaxial connector is used for receiving the wave beams output by the radio frequency multilayer mixed pressing plate. The invention has the characteristic that a high-integration-level plate simultaneously receives a plurality of wave beams for synthesis processing, the cross of radio frequency wiring among the wave beams introduces a coaxial microstrip line vertical interconnection structure, and the wave beams are transmitted in a layered mode in the inner layer of the radio frequency plate, so that the simultaneous receiving processing of the multi-wave beams is ensured, and the good microwave performance of the received wave beams is ensured without mutual interference influence. The structure has important application value for high integration of the phased array TR component and multi-beam realization of the component.)

1. A phased array multi-beam radio frequency receiving assembly, comprising:

a first radio frequency coaxial connector for receiving radio frequency signals;

the radio frequency board is used for receiving the radio frequency signal transmitted by the radio frequency coaxial connector and amplifying the radio frequency signal;

the radio frequency multilayer mixed pressing plate receives the amplified radio frequency signals sent by the radio frequency double-layer plate and synthesizes beams;

and the second radio frequency coaxial connector is used for receiving the wave beam output by the radio frequency multilayer mixed pressure plate.

2. The phased array multibeam radio frequency receive assembly of claim 1, wherein said radio frequency board is a double layer board.

3. The phased array multi-beam radio frequency receive assembly of claim 1 wherein the radio frequency multilayer hybrid board comprises: the first glass fiber epoxy resin copper-clad plate, the second glass fiber epoxy resin copper-clad plate, the first Rogers plate and the second Rogers plate are sequentially arranged;

the first glass fiber epoxy resin copper-clad plate and the second glass fiber epoxy resin copper-clad plate respectively comprise a substrate and metal layers arranged on two sides of the substrate;

the first Rogers board and the second Rogers board respectively comprise a Rogers substrate and metal layers arranged on two sides of the Rogers substrate.

4. The phased array multi-beam radio frequency receive assembly of claim 3 wherein the first metal layer of the first fiberglass epoxy copper clad laminate is grounded;

the second metal layer of the first glass fiber epoxy resin copper-clad plate is used as a control signal layer;

the first metal layer of the second glass fiber epoxy resin copper-clad plate is used as a second control signal layer;

the second metal layer of the second glass fiber epoxy resin copper-clad plate is used as a power signal layer;

the first metal layer of the first Rogers plate is used as a floor laying layer;

the second metal layer of the first Rogers plate is used as a strip line radio frequency layer;

the first metal layer of the second Rogers plate is used as a second floor;

and the second metal layer of the second Rogers board is used as a microstrip line radio frequency layer.

5. The phased array multi-beam radio frequency receiving assembly of claim 4 wherein the second metal layer of the second Rogers plate has a first power divider chip disposed thereon.

6. The phased array multi-beam radio frequency receiving assembly according to claim 4 wherein the second metal layer of the second Rogers plate and the second metal layer of the first Rogers plate are provided with first blind holes.

7. The phased array multibeam radio frequency receive assembly of claim 6, wherein the first blind holes have a radius of 0.15mm, and wherein there are 6 first through holes uniformly disposed at a circumference of 1mm from the center of the first blind holes.

8. The phased array multi-beam radio frequency receive assembly of claim 7 wherein the first blind hole is provided with a circular metal ring at the second metal layer of the first Rogers plate and the first blind hole is provided with a circular metal ring at the second metal layer of the second Rogers plate.

9. The phased array multibeam radio frequency receive assembly of claim 8, wherein a blind slot is disposed between the second metal layer of the second Rogers plate and the second metal layer of the first Rogers plate, and a bottom strip line of the blind slot is exposed to form a microstrip line;

and a second power divider chip is arranged in the blind slot.

10. The phased array multi-beam radio frequency reception assembly according to claim 1, wherein the second metal layer of the second Rogers board and the second metal layer of the first fiberglass epoxy copper clad laminate are provided with second blind vias;

and a second through hole is formed in the second metal layer of the second Rogers plate and the first metal layer of the first glass fiber epoxy resin copper-clad plate.

Technical Field

The invention relates to the technical field of radio frequency receiving devices, in particular to a phased array multi-beam radio frequency receiving assembly.

Background

The radio frequency receiving component is a receiving path part between the intermediate frequency of a wireless receiving and transmitting system and an antenna, and is the core of an active phased array radar, and airborne and shipborne radar systems have high requirements on the size, the electrical property and the reliability of the receiving component, so that the realization of high performance and miniaturization of the multi-beam receiving component has important practical significance.

One of the most critical technologies for improving the integration level and realizing miniaturization of the multi-chip module is radio frequency vertical interconnection, the most common technologies in the multi-layer hybrid board are vertical interconnection from a strip line to a strip line and vertical interconnection from a microstrip line to a strip line, and the radio frequency interconnection from the microstrip line to the strip line in the module adopts a quasi-coaxial through hole type vertical interconnection structure and has the advantages of small insertion loss, wide working frequency band and small size.

The multi-beam radio frequency receiving assembly is used for simultaneously receiving and processing radio frequency signals of a plurality of different beams, the multi-beam is mainly applied to receiving and transmitting of a phased array radar, and the phased array radar has the biggest characteristic that the multi-beam can be formed simultaneously so as to realize rapid scanning detection, and the beam shape can be flexibly controlled according to the practical application environment, so that a plurality of rapidly moving targets can be effectively tracked. The invention can realize multi-beam in the radio frequency receiving channel by using phase shifter chip.

Disclosure of Invention

The invention provides a phased array multi-beam radio frequency receiving assembly, which ensures that multi-beams can be received and processed simultaneously and that the microwave performance of the received beams is good and does not interfere with each other through a radio frequency multilayer mixed pressing plate with a specific structure.

A phased array multi-beam radio frequency receiving assembly comprising:

a first radio frequency coaxial connector for receiving radio frequency signals;

the radio frequency board is used for receiving the radio frequency signal transmitted by the radio frequency coaxial connector and amplifying the radio frequency signal;

the radio frequency multilayer mixed pressing plate receives the amplified radio frequency signals sent by the radio frequency double-layer plate and synthesizes beams;

and the second radio frequency coaxial connector is used for receiving the wave beam output by the radio frequency multilayer mixed pressure plate.

The first radio frequency coaxial connector and the second radio frequency coaxial connector are SMP (Super Miniature Push-in) radio frequency coaxial connectors.

The radio frequency board adopts a double-layer board.

The radio frequency multilayer mixed pressing plate comprises: the first glass fiber epoxy resin copper-clad plate, the second glass fiber epoxy resin copper-clad plate, the first Rogers plate and the second Rogers plate are sequentially arranged.

The glass fiber epoxy resin copper-clad plate is divided into two layers, and is specifically made of FR4 board.

The Rogers board is two layers, and Roggers4350 is specifically adopted as the Rogers board.

The first glass fiber epoxy resin copper-clad plate and the second glass fiber epoxy resin copper-clad plate respectively comprise a substrate and metal layers arranged on two sides of the substrate, namely a first metal layer and a second metal layer;

the first Rogers board and the second Rogers board respectively comprise a Rogers substrate and metal layers arranged on two sides of the Rogers substrate, namely a first metal layer and a second metal layer.

The first metal layer of the first glass fiber epoxy resin copper-clad plate is grounded;

the second metal layer of the first glass fiber epoxy resin copper-clad plate is used as a control signal layer;

the first metal layer of the second glass fiber epoxy resin copper-clad plate is used as a second control signal layer;

the second metal layer of the second glass fiber epoxy resin copper-clad plate is used as a power signal layer;

the first metal layer of the first Rogers plate is used as a floor laying layer;

the second metal layer of the first Rogers plate is used as a strip line radio frequency layer;

the first metal layer of the second Rogers plate is used as a second floor;

the second metal layer of the second Rogers board is used as a microstrip line radio frequency layer;

and a first power divider chip is arranged on the second metal layer of the second Rogers plate and used for beam combining transmission.

And the second metal layer of the second Rogers board and the second metal layer of the first Rogers board are provided with first blind holes, so that the microstrip line radio-frequency layer and the strip line radio-frequency layer can be conducted.

The radius of the first blind hole is 0.15mm, 6 first through holes are uniformly arranged at the circumference of 1mm away from the circle center of the first blind hole, and the distance between the circle center of the first through hole and the circle center of the first blind hole is 1 mm.

The characteristic impedance of the quasi-coaxial vertical interconnection structure is qualitatively analyzed according to a theoretical formula, and in combination with consideration of an additional parasitic effect generated by a bonding pad in the vertical interconnection structure, a circular metal ring with the inner radius of 0.25mm is arranged at the second metal layer (namely a strip line radio frequency layer) of the first Rogers board in the first blind hole, and a circular metal ring with the radius of 0.3mm is arranged at the second metal layer (namely a microstrip line radio frequency layer) of the second Rogers board in the first blind hole, so that the radio frequency transmission performance of the first blind hole is improved.

A blind slot is arranged between the second metal layer of the second Rogers board and the second metal layer of the first Rogers board, a strip line at the bottom of the blind slot is exposed to form a microstrip line, and the size of the blind slot is 5mm multiplied by 5 mm. After the blind slot is opened, a microstrip line is actually formed on the strip line of the second metal layer of the first Rogers board at the blind slot, so that the power divider chip is connected to perform beam combining transmission.

And the blind slot is internally provided with 1 second power divider chip for beam combining transmission.

Expose at radio frequency multilayer thoughtlessly pressing board blind slot department inlayer stripline, the excessive structure of design notch cuttype (stripline that the bottom surface of blind slot is not exposed and the microstrip line that the blind slot bottom surface is exposed), the width of the microstrip line that the bottom surface of blind slot is exposed be 0.54mm, the width of the stripline that the bottom surface of blind slot is not exposed be 0.19mm, with the stripline ladder of inlayer linewidth 0.19mm excessively be 0.54 mm's microstrip line of linewidth, realize being connected with the power divider chip under the good condition of assurance radio frequency performance.

In the invention, a radio frequency multilayer mixed pressure plate receives radio frequency signals amplified by a radio frequency double-layer plate, a first power divider chip of a plurality of amplified radio frequency signals on a second metal layer (namely a microstrip radio frequency layer) of a second Rogers plate performs beam combining to form a first beam and outputs the first beam, meanwhile, a plurality of amplified radio frequency signals perform beam combining on the second metal layer (namely the microstrip radio frequency layer) of the second Rogers plate, when combining paths are crossed, the amplified radio frequency signals are transmitted to the second metal layer (namely a strip line radio frequency layer) of the first Rogers plate through a first blind hole, the amplified radio frequency signals are combined through a second power divider chip in a blind slot, then the amplified radio frequency signals are combined through a step-type transition structure (comprising a strip line which is not exposed at the bottom of the blind slot and a microstrip line which is exposed at the bottom of the blind slot), and finally the amplified radio frequency signals are transmitted back to the second metal layer (namely the microstrip radio frequency layer) of the second Rogers plate through the first blind hole, the multi-beam simultaneous receiving processing is ensured, and the receiving beam microwave performance is ensured to be good and not to interfere with each other.

And a second blind hole is formed in the second metal layer of the second Rogers plate and the second metal layer of the first glass fiber epoxy resin copper-clad plate, so that the power signal layer, the control signal layer and the control signal layer can be conducted.

And a second through hole is formed in the second metal layer of the second Rogers plate and the first metal layer of the first glass fiber epoxy resin copper-clad plate, and a connecting conductive metal is arranged on the pipe wall of the through hole, so that the second metal layer of the second Rogers plate can be grounded.

Compared with the prior art, the invention has the beneficial effects that:

in the invention, a radio frequency multilayer mixed pressure plate receives radio frequency signals amplified by a radio frequency double-layer plate, a first power divider chip of a plurality of amplified radio frequency signals on a second metal layer (namely a microstrip radio frequency layer) of a second Rogers plate performs beam combining to form a first beam and outputs the first beam, meanwhile, a plurality of amplified radio frequency signals perform beam combining on the second metal layer (namely the microstrip radio frequency layer) of the second Rogers plate, when combining paths are crossed, the amplified radio frequency signals are transmitted to the second metal layer (namely a strip line radio frequency layer) of the first Rogers plate through a first blind hole, the amplified radio frequency signals are combined through a second power divider chip in a blind slot, then the amplified radio frequency signals are combined through a step-type transition structure (comprising a strip line which is not exposed at the bottom of the blind slot and a microstrip line which is exposed at the bottom of the blind slot), and finally the amplified radio frequency signals are transmitted back to the second metal layer (namely the microstrip radio frequency layer) of the second Rogers plate through the first blind hole, the multi-beam simultaneous receiving processing is ensured, and the receiving beam microwave performance is ensured to be good and not to interfere with each other.

The invention realizes the multi-beam phase shift attenuation by the highly integrated control of the multifunctional chip, and brings more convenience for the miniaturization and integration of the multi-beam component. The invention has the characteristic that a high-integration-level plate simultaneously receives a plurality of wave beams for synthesis processing, the cross of radio frequency wiring among the wave beams introduces a coaxial microstrip line vertical interconnection structure, and the wave beams are transmitted in a layered mode in the inner layer of the radio frequency plate, so that the simultaneous receiving processing of the multi-wave beams is ensured, and the good microwave performance of the received wave beams is ensured without mutual interference influence. The structure has important application value for high integration of the phased array TR component and multi-beam realization of the component.

Drawings

Fig. 1 is a schematic structural diagram of a phased array multi-beam rf receiving assembly according to the present invention;

FIG. 2 is a schematic diagram of the internal structure of the RF multilayer hybrid board according to the present invention;

fig. 3 is a schematic diagram of cross transmission of two beams of the first blind hole, the first through via hole, and the circular metal ring according to the present invention.

Detailed Description

The phased array multi-beam radio frequency receiving assembly of the present invention will be further described with reference to the accompanying drawings and embodiments.

As shown in fig. 1, a phased array multi-beam rf receiving assembly includes:

a housing;

the antenna comprises a plurality of first radio frequency coaxial connectors 1 for receiving radio frequency signals, specifically SMP (symmetrical multi-processing) joints with 16 antenna ports, wherein the first radio frequency coaxial connectors 1 are multiple;

a radio frequency board 7 for receiving the radio frequency signal transmitted by the radio frequency coaxial connector 1 and amplifying the radio frequency signal, wherein the radio frequency board 7 is a double-layer board, also called a radio frequency double-layer board;

a radio frequency multilayer mixing board 6 for receiving the radio frequency signals amplified by the radio frequency board 7 (radio frequency double-layer board) and synthesizing beams;

the second radio frequency coaxial connector 2 is used for receiving the wave beams output by the radio frequency multilayer hybrid board 6, and the second radio frequency coaxial connector 2 is an output SMP connector of 4 wave beams;

and a first power divider chip 15 disposed on the radio frequency multilayer hybrid board 6.

The first rf coaxial connector 1 and the second rf coaxial connector 2 are SMP (Super Miniature Push-in) rf coaxial connectors. The first radio frequency coaxial connector 1 is arranged on one side in the shell, and the second radio frequency coaxial connector 2 is arranged on the other side in the shell.

The phased array multi-beam radio frequency receiving component is input by a low-frequency connector control port 3 to be controlled and powered, a coupling port SMP connector 4 outputs a monitoring receiving state, and cavity penetrating transmission is completed by cavity penetrating insulator multi-row pin headers 5. Two wave beams are respectively contained in the cavity on the front side and the cavity on the back side of the shell, and the cross transmission between the two wave beams is completed in the radio frequency multilayer mixed pressing plate 6.

The radio frequency multilayer hybrid board 6 includes: the first glass fiber epoxy resin copper-clad plate 8, the glue layer 12, the second glass fiber epoxy resin copper-clad plate 9, the glue layer 13, the first Rogers plate 10, the glue layer 14 and the second Rogers plate 11 are sequentially arranged.

The first glass fiber epoxy resin copper-clad plate 8 and the second glass fiber epoxy resin copper-clad plate 9 are made of FR4 plates.

Roggers4350 is specifically adopted as the first Roggers sheet material 10 and the second Roggers sheet material 11.

The first glass fiber epoxy resin copper-clad plate 8 comprises a substrate 83, metal layers arranged on two sides of the substrate 83, a first metal layer 81 and a second metal layer 82;

the second glass fiber epoxy resin copper-clad plate 9 comprises a substrate 93, metal layers arranged on two sides of the substrate 93, a first metal layer 91 and a second metal layer 92;

the first rogers board 10 comprises a rogers substrate 103, metal layers arranged on two sides of the rogers substrate 103, a first metal layer 101 and a second metal layer 102;

the second rogers board 11 comprises a rogers substrate 113 and metal layers arranged at two sides of the rogers substrate 113, a first metal layer 111 and a second metal layer 112;

the first metal layer 81 of the first glass fiber epoxy resin copper-clad plate 8 is grounded;

the second metal layer 82 of the first glass fiber epoxy resin copper-clad plate 8 is used as a control signal layer;

the first metal layer 91 of the second glass fiber epoxy resin copper-clad plate 9 is used as a second control signal layer;

a second metal layer 92 of the second glass fiber epoxy resin copper-clad plate 9 is used as a power signal layer;

the first metal layer 101 of the first rogers panel 10 acts as a flooring layer;

the second metal layer 102 of the first rogue board 10 serves as a strip line radio frequency layer;

the first metal layer 111 of the second rocky jews panel 11 serves as a second layer of flooring;

the second metal layer 112 of the second rogers board 11 is used as a microstrip radio frequency layer;

the second metal layer 112 of the second rogers plate 11 is provided with a first power divider chip 15 for beam combining transmission.

The second metal layer 112 of the second rogers board 11 and the second metal layer 102 of the first rogers board 10 are provided with first blind holes 16, so that the microstrip radio frequency layer and the stripline radio frequency layer can be conducted.

The radius of the first blind hole 16 is 0.15mm, 6 first through holes 18 are uniformly arranged at the circumference of 1mm away from the center of the first blind hole 16, and the distance between the center of the first through hole 18 and the center of the first blind hole 16 is 1 mm.

According to the theoretical formula, the characteristic impedance of the quasi-coaxial vertical interconnection structure is qualitatively analyzed, and in combination with consideration of an additional parasitic effect generated by a pad in the vertical interconnection structure, a circular metal ring with an inner radius of 0.25mm is arranged at the second metal layer 102 (namely, a strip line radio frequency layer) of the first rogowski 10 of the first blind hole 16, and a circular metal ring 17 with an inner radius of 0.3mm is arranged at the second metal layer 112 (namely, a microstrip line radio frequency layer) of the second rogowski 11 of the first blind hole 16, so as to improve the radio frequency transmission performance of the first blind hole 17.

A blind slot 19 is arranged between the second metal layer 112 of the second rogers plate 11 and the second metal layer 102 of the first rogers plate 10, a microstrip line is formed by exposing a strip line on the bottom surface of the blind slot 19, the size of the blind slot 19 is 5mm × 5mm, and the depth is from the second metal layer 112 of the second rogers plate 11 to the second metal layer 102 of the first rogers plate 10. After the blind slot 19 is opened, the strip line of the second metal layer 102 of the first rogers plate 10 actually forms a microstrip line at the blind slot 19, so as to connect the power divider chip for beam combining transmission.

The blind slot 19 is provided with 1 second power divider chip 20 for beam combining transmission.

The inner layer strip line is exposed at the blind slot 19 of the radio frequency multilayer mixed pressing plate 6, a step type transition structure is designed (comprising the strip line which is not exposed at the bottom of the blind slot 19 and the microstrip line which is exposed at the bottom of the blind slot 19), the width of the microstrip line which is exposed at the bottom of the blind slot 19 is 0.54mm, the width of the microstrip line which is not exposed at the bottom of the blind slot 19 is 0.19mm, the inner layer strip line with the line width of 0.19mm is transited to the microstrip line with the line width of 0.54mm, and the connection with the second power divider chip 20 is realized under the condition of good radio frequency performance.

The second metal layer 112 of the second rogers board 11 and the second metal layer 82 of the first glass fiber epoxy resin copper-clad plate 8 are provided with second blind holes 21, so that the power signal layer, the control signal layer and the control signal layer can be conducted.

The second metal layer 112 of the second rogers board 11 and the first metal layer 81 of the first glass fiber epoxy resin copper clad plate 8 are provided with a second through hole 22, and the pipe wall of the second through hole 22 is provided with a connecting conductive metal, so that the second metal layer 112 of the second rogers board 11 can be grounded.

The multi-beam receiving assembly belongs to a brick type structure, a plurality of first radio frequency coaxial connectors 1(16 antenna port SMP joints) are arranged on one side of a shell to receive radio frequency signals, the signals are received and processed by a radio frequency plate 7 (double layers) in a separation cavity, then transmitted to a radio frequency multilayer mixed pressing plate 6 assembled in the cavity of the shell, and finally output by a plurality of second radio frequency coaxial connectors 2(4 beam output SMP joints) arranged on the other side of the shell.

The multi-beam receiving component is input by a low-frequency connector control port 3 to be controlled and powered, a coupling port SMP connector 4 outputs a monitoring receiving state, and cavity penetrating transmission is completed by cavity penetrating insulator multi-row pin headers 5. Two wave beams are respectively contained in the cavity on the front side and the back side of the shell, and the cross transmission between the two wave beams is completed in the radio frequency multilayer mixed pressing plate.

The radio frequency multilayer mixed pressing plate 6 assembled in the cavity of the front shell and the back shell is formed by pressing multiple layers of Roggers4350 and multiple layers of FR4 board layers, blind holes and through holes are formed in a plug hole laminating mode during preparation, and the radio frequency multilayer mixed pressing plate 6 is further realized based on special processes such as blind grooves 19 and metal wrapping edges.

A radio frequency multilayer mixed pressing plate 6 which is formed by mixing and pressing two layers of Roggers4350 and multiple layers of FR4 is arranged in the assembly cavity, a microstrip line structure is formed by the first layer of Roggers4350 medium and surface metal thereof, and the line width of the microstrip line structure is 0.54 mm; the metal between the two layers of Roggers4350 dielectric forms a strip line structure, and the line width of the strip line structure is 0.19 mm; two beam radio frequency signals are respectively transmitted in the microstrip line structure and the strip line structure, and power supply and control signals are transmitted in the multilayer FR 4.

Radio frequency signals of the two beams are transmitted in the microstrip line and the strip line respectively, through-layer interconnection between the two beams is realized by using a quasi-coaxial via hole type vertical interconnection structure, the problem of radio frequency transmission crossing of the two beams during power division is solved, the strip line and the microstrip line at the vertical interconnection position respectively use circular metal with the radius of 0.25mm and 0.3mm for microstrip line width transition, and radio frequency connection is realized through a hole with the diameter of 0.15 mm; 6 grounding holes (namely 6 first through holes 18) are uniformly arranged at a position 1mm away from the center of the circle, and the performance of the vertical interconnection through layer structure is improved.

Combining with the actual PCB plate making process, metal edge covering processing is carried out on all ground nets of the mixed pressing plate, a radio frequency device positioned at the edge of the mixed pressing plate is directly bonded to a receiving channel carrier plate matched with the mixed pressing plate through a gold wire at an output end, and the metal at the edge of the radio frequency mixed pressing plate 6 ensures that a reliable metal ground exists below the gold wire without suspending and influencing the radio frequency transmission performance.

Combining with the actual PCB plate making process, a blind groove 19 with the size of 5mm x 5mm is formed at the position where the two layers of Roggers4350 and the second power divider chip 20 at the inner layer of the multilayer FR4 mixed compression plate are placed, so that the problem of placing the second power divider chip 20 required by inner layer strip line radio frequency transmission is solved

And exposing the inner layer strip line at the blind slot 19 of the radio frequency multilayer mixed pressing plate 6, designing a stepped transition structure, and enabling the inner layer strip line with the line width of 0.19mm to be stepped into a microstrip line with the line width of 0.54mm, so that gold wire bonding connection with the second power divider chip 20 is realized under the condition of ensuring good radio frequency performance.

The first wave beam of the assembly is synthesized in a shunt way on the surface layer of the radio frequency multilayer mixed pressing plate 6 in a microstrip line mode, the second wave beam is transmitted in a strip line mode after being converted to the inner layer through a quasi-coaxial through hole type vertical interconnection structure, is converted back to the microstrip line through a stepped transition structure after avoiding the intersection with the first wave beam, and is synthesized in a shunt way at the structure of a blind slot 19 of the radio frequency multilayer mixed pressing plate 6; and repeating the steps when the wave beams are crossed every time, and finally outputting the second wave beam after being converted into a microstrip line through the quasi-coaxial through hole type vertical interconnection structure.

In the invention, a radio frequency multilayer hybrid board 6 receives an amplified radio frequency signal sent by a radio frequency board 7 (i.e. a radio frequency double-layer board), a plurality of amplified radio frequency signals are combined into a first beam by a first power divider chip 15 on a second metal layer 112 (i.e. a microstrip line radio frequency layer) of a second rogue board 11, and then output, a plurality of amplified radio frequency signals are combined into a beam by a second metal layer 112 (i.e. a microstrip line radio frequency layer) of the second rogue board 11, and when the combining paths are crossed, the amplified radio frequency signals are transmitted to a second metal layer 102 (i.e. a strip line radio frequency layer) of a first rogue board 10 through a first blind hole 16, combined into a second power divider chip 20 in a blind slot 19, and transmitted to a step-type transition structure (comprising a strip line which is not exposed at the bottom of the blind slot 19 and a microstrip line which is exposed at the bottom of the blind slot 19), and finally transmitted back to the second metal layer 112 (i.e. a radio frequency layer) of the second rogue board, and the beam combining is carried out to form a second beam and output the second beam, so that the simultaneous receiving processing of multiple beams is ensured, and the microwave performance of the received beams is ensured to be good and not interfered with each other.