阅读说明：本技术 一种多节点芯片连接系统 (Multi-node chip connecting system ) 是由 杨存永 杨英 于 2018-09-25 设计创作，主要内容包括：本发明公开了一种多节点芯片连接系统,所述系统包括PCB板、信号线和多个节点芯片,将PCB板划分为多个目标区域；所述多个节点芯片中的每个节点芯片具有2种工作模式,所述多个节点芯片在每种工作模式下多个管脚中的至少一个对应的管脚作用是不同的；所述PCB板布设有信号线,所述信号线在所述PCB板的表面往复环回衔接所述上下位置相邻的所述目标区域中安装的边缘两个节点芯片；所述目标区域中的所述节点芯片依次通过信号线连接；第一节点芯片的命令输出单元连接相邻的第二节点芯片的命令输入管脚；所述第二节点芯片的运算数据输出单元连接所述第一节点芯片的运算数据输入单元；所述第一节点芯片的时钟输出单元连接相邻的第二节点芯片的时钟输入单元。(The invention discloses a multi-node chip connecting system, which comprises a PCB (printed circuit board), a signal wire and a plurality of node chips, wherein the PCB is divided into a plurality of target areas; each node chip in the plurality of node chips has 2 working modes, and the corresponding pin action of at least one of the plurality of pins of the plurality of node chips in each working mode is different; the PCB is provided with a signal wire, and the signal wire is in reciprocating loopback connection with two node chips at the edge mounted in the target area adjacent to the upper position and the lower position on the surface of the PCB; the node chips in the target area are connected sequentially through signal lines; the command output unit of the first node chip is connected with the command input pin of the adjacent second node chip; the operation data output unit of the second node chip is connected with the operation data input unit of the first node chip; and the clock output unit of the first node chip is connected with the clock input unit of the adjacent second node chip.)

1. A multi-node chip connection system, the system comprising a PCB board, a signal line, and a plurality of node chips, wherein:

dividing a PCB into a plurality of parallel target areas from top to bottom, wherein the target areas are used for mounting part of the plurality of node chips; wherein each of the plurality of node chips has two modes of operation, the plurality of node chips differing in at least one corresponding pin role among a plurality of pins in each mode of operation;

the node chips in the target areas adjacent to each other at the upper and lower positions have different working modes, and the node chips installed in the same target area have the same working mode;

the PCB is provided with a signal wire, and the signal wire is used for mounting two node chips at the edge in the target area which is adjacent to the upper position and the lower position in a reciprocating loopback connection mode on the surface of the PCB;

the node chips in the target area are connected sequentially through signal lines;

the command output unit of the first node chip is connected with the command input pin of the adjacent second node chip;

the operation data output unit of the second node chip is connected with the operation data input unit of the first node chip;

the clock output unit of the first node chip is connected with the clock input unit of the adjacent second node chip;

thereby enabling single-layer wiring connections of the node chipset within the target area.

2. The system of claim 1, wherein the number of node chips of the target area is at least three.

3. The system of claim 1, wherein the number of node chips for the plurality of target regions is the same.

4. The system of claim 1, wherein the number of node chips for the plurality of target regions is different.

Technical Field

The present invention relates to the field of chip connection technology, and more particularly, to a multi-node chip connection system.

Background

The printed Circuit board (pcb) is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. In order to realize the circuit function of the PCB, the PCB generally needs to be wired, that is, the PCB is wired to connect the wires between the components, the wires are wired first, and the wires pass through the holes of the pins electrically connected to each other, so that the components can be welded and connected to each other, and the circuit function of the PCB is realized.

In the field of large computation amounts such as artificial intelligence, safety operation and the like, data processing is generally performed by using a special chip, in order to improve the processing speed and the processing capacity of data, N node chips are generally connected in sequence, the N node chips form a node chipset, the node chipset receives a data processing task through an external interface on a first node chip, performs calculation processing on the data processing task through more than one node chip in the node chipset, and returns a data processing result obtained through the calculation processing through the external interface.

Because a plurality of special chips are connected in series on the PCB and the special chips are coordinated to work, a plurality of connecting wires are distributed on the PCT board, so that the PCT board is required to have a multilayer structure, and related wiring is carried out in each layer, so that the PCB is difficult to design and generate, and the problem of waste boards is easy to occur in the generating process.

Therefore, a configuration technology of connection of chips is required to realize single-layer wiring connection of a plurality of chips on a PCB board.

Disclosure of Invention

The invention provides a multi-node chip connecting system, which aims to solve the problem of how to perform single-layer wiring connection on a plurality of chips on a PCB.

The invention provides a multi-node chip connecting system, which comprises a PCB (printed circuit board), a signal wire and a plurality of node chips, wherein:

dividing a PCB into a plurality of parallel target areas from top to bottom, wherein the target areas are used for mounting part of the plurality of node chips; wherein each node chip of the plurality of node chips has 2 operating modes, and the role of at least one corresponding pin of a plurality of pins of the plurality of node chips in each operating mode is different;

the node chips in the target areas adjacent to each other at the upper and lower positions have different working modes, and the node chips installed in the same target area have the same working mode;

the PCB is provided with a signal wire, and the signal wire is in reciprocating loopback connection with two node chips at the edge mounted in the target area adjacent to the upper position and the lower position on the surface of the PCB;

the node chips in the target area are connected sequentially through signal lines;

the command output unit of the first node chip is connected with the command input pin of the adjacent second node chip;

the operation data output unit of the second node chip is connected with the operation data input unit of the first node chip;

the clock output unit of the first node chip is connected with the clock input unit of the adjacent second node chip;

thereby enabling single-layer wiring connections of the node chipset within the target area.

Preferably, the number of the node chips of the target area is at least three.

Preferably, the number of node chips of the plurality of target regions is the same.

Preferably, the number of node chips of the plurality of target regions is different.

According to the technical scheme, the target area containing the node chip set on the PCB is determined according to the functional structure of the target equipment. Determining the working mode of each node chip in a plurality of node chips in the node chip group according to the region attribute of the target region, and determining the connection relation of the plurality of node chips according to the position attribute of the target region and the working mode of each node chip. And determining the wiring mode of a connecting line in the target area according to the connection relation of the node chips, and determining the position of each node chip in the node chips in the target area according to the wiring mode of the connecting line, so that the single-layer wiring connection of the node chip group is realized in the target area. The technical scheme of the invention solves the problem that when a plurality of chips are connected in series on the PCB, a plurality of connecting wires need to be arranged on the PCB, and the PCB is required to be provided with a multilayer structure. According to the technical scheme, single-layer wiring connection of a plurality of chips on the PCB is realized, and the problem that a multi-layer PCB is difficult to design and generate is solved.

Drawings

A more complete understanding of exemplary embodiments of the present invention may be had by reference to the following drawings in which:

FIG. 1 is a flow chart of a method for configuring a chip connection scheme in accordance with a preferred embodiment of the present invention;

FIG. 2 is a schematic diagram of a chip structure according to a preferred embodiment of the present invention;

FIG. 3 is a diagram illustrating a functional multiplexing structure of a chip pin in different operation modes according to a preferred embodiment of the present invention;

FIG. 4 is a diagram illustrating a pin connection relationship of a plurality of chips according to a preferred embodiment of the present invention;

FIG. 5 is a diagram illustrating the connection relationship of multiple chip pins during multiplexing according to the preferred embodiment of the present invention;

FIG. 6 is a diagram illustrating the connection relationship of multiple chip pins during multiplexing according to the preferred embodiment of the present invention;

fig. 7 is a system configuration diagram for configuring a chip connection manner according to a preferred embodiment of the present invention.

Detailed Description

The exemplary embodiments of the present invention will now be described with reference to the accompanying drawings, however, the present invention may be embodied in many different forms and is not limited to the embodiments described herein, which are provided for complete and complete disclosure of the present invention and to fully convey the scope of the present invention to those skilled in the art. The terminology used in the exemplary embodiments illustrated in the accompanying drawings is not intended to be limiting of the invention. In the drawings, the same units/elements are denoted by the same reference numerals.

Unless otherwise defined, terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Further, it will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense.

Fig. 1 is a flowchart of a method for configuring a chip connection scheme according to a preferred embodiment of the present invention. According to the method for configuring the chip connection mode provided by the embodiment of the invention, a preset data processing standard associated with a target device is obtained, and a node chip group consisting of a plurality of node chips required for meeting the data processing standard is determined, wherein each node chip in the plurality of node chips can work according to any working mode in a plurality of working modes. The working mode of each chip of the node chip group can be converted. And dividing the layout area according to the functional structure of the target equipment to determine a target area for accommodating the node chip set. According to the functional structure of the target equipment, the target area containing the node chip set on the PCB is determined. The method and the device determine the working mode of each node chip in a plurality of node chips in a node chip set according to the region attribute of the target region, and determine the connection relation of the plurality of node chips according to the position attribute of the target region and the working mode of each node chip. The wiring method of the connecting line in the target area is determined according to the connection relation of the node chips, and the position of each node chip in the node chips in the target area is determined according to the wiring method of the connecting line, so that single-layer wiring connection of the node chip set is achieved in the target area. As shown in fig. 1, a method 100 for configuring a chip connection scheme includes:

preferably, in step 101: the method comprises the steps of acquiring a preset data processing standard associated with a target device, and determining a node chip group consisting of a plurality of node chips required for meeting the data processing standard, wherein each node chip in the plurality of node chips can work according to any working mode in a plurality of working modes.

Preferably, the data processing criteria include: data computation speed, data processing throughput, and task processing time. Preferably, a data processing standard associated with the target device, which is preset according to an application scenario of the target device, is further included.

Preferably, when each node chip operates according to a different one of the plurality of operating modes, at least one of the plurality of pins of each node chip is functionally multiplexed. Preferably, at least one of the plurality of pins of each node chip has a different function in different modes of operation.

In this application, a preset data processing standard associated with a target device needs to be obtained, where the data processing standard includes: data computation speed, data processing throughput, and task processing time. Due to the difference of data processing standards, the node chip set which is formed by a plurality of node chips and corresponds to configuration is determined so as to meet preset data processing standards, wherein each node chip in the plurality of node chips can work according to any working mode in a plurality of working modes, and when each node chip works according to different working modes in the plurality of working modes, at least one pin in the plurality of pins of each node chip is subjected to function multiplexing, and at least one pin in the plurality of pins of each node chip has different functions in different working modes. For example, a pin of a test function unit, when the voltage of the pin is 0, the chip is in a normal working mode; when the voltage of the pin is 1, the chip is in a test working mode. According to the method and the device, the working modes of the chips in the chip set are selected, so that the intersection of circuit design among pins is avoided, and the chip set in the target area is arranged on the PCB in a single layer.

Preferably, at step 102: and dividing the layout area according to the functional structure of the target equipment to determine a target area for accommodating the node chip set. Preferably, the functional structure of the target device comprises: power supply functions, input/output functions, clock control functions, and data processing functions. In the present application, the layout area of the PCB board is divided according to the functional structure of the target device, such as according to the power supply function, the input/output function, the clock control function, and the data processing function of the target device, and the target area for accommodating the node chipset is determined.

Preferably, in step 103: determining the working mode of each node chip in a plurality of node chips in the node chip group according to the region attribute of the target region, and determining the connection relation of the plurality of node chips according to the position attribute of the target region and the working mode of each node chip. Preferably, the region attribute of the target region includes a region shape and a region size. Preferably, wherein determining the operating mode of each node chip of the plurality of node chips in the node chipset according to the region attribute of the target region comprises: the arrangement sequence of the plurality of node chips in the node chip set is determined according to the region shape and the region size of the target region, and the working mode of each node chip is determined according to the arrangement sequence. In the present application, the area attribute of the target area in the PCB includes an area shape and an area size, for example, the area shape may be T-shaped, L-shaped, and the like, and the size of each area. Determining the working mode of each node chip in a plurality of node chips in the node chip group according to the region attribute of the target region, and determining the connection relation of the plurality of node chips according to the position attribute of the target region and the working mode of each node chip. In the present application, the position attribute of the target area is positioning of the target area. In the application, the arrangement sequence of a plurality of node chips in a node chip set is determined according to the region shape and the region size of a target region, and the working mode of each node chip is determined according to the arrangement sequence.

Preferably, the location attribute of the target area is a location adjacency with the functional structure of the target device. Preferably, the positional adjacency includes: an adjacency to one or more of power supply functions, input/output functions, clock control functions, and data processing functions. In the present application, the position attribute of the target area is an adjacent relationship with one or more of the power supply function, the input/output function, the clock control function, and the data processing function, for example, the target area is at the upper left of the power supply function, at the lower right of the input/output function, and the like.

Preferably, at step 104: and determining the wiring mode of the connecting line in the target area according to the connection relation of the plurality of node chips. Preferably, the determining the connection relationship of the plurality of node chips according to the position attribute of the target area and the working mode of each node chip includes: and determining the connection relation of the plurality of node chips according to the position adjacency relation of the target area and the functional structure of the target equipment and the working mode of each node chip, wherein the connection relation comprises a pin connection mode between the node chips. In the application, the connection relations of the plurality of node chips are determined according to the position adjacency relation of the target area and the functional structure of the target device and the working mode of each node chip, wherein the connection relations comprise pin connection modes among the node chips, and the wiring mode of the connection lines in the target area is determined according to the connection relations of the plurality of node chips.

Preferably, at step 105: and determining the position of each node chip in the plurality of node chips in the target area according to the wiring mode of the connecting line, thereby realizing the single-layer wiring connection of the node chip group in the target area. Preferably, the plurality of node chips are connected in a serial manner. Preferably, the single-layer wiring connection is a wiring connection at a single layer of the printed circuit board to provide connection of a plurality of node chips. Preferably, the node chipset receives the data processing task through an external interface of a head-of-line node chip of the plurality of node chips, and performs calculation processing on the data processing task through the plurality of node chips of the node chipset. Preferably, the calculation result of the data processing task obtained through the calculation processing is returned through an external interface of the head-of-line node chip. In the application, the plurality of node chips are connected in a serial manner, the node chipset receives the data processing task through an external interface of a head-of-line node chip in the plurality of node chips, and the data processing task is calculated and processed through the plurality of node chips in the node chipset. And determining the position of each node chip in the plurality of node chips in the target area according to the wiring mode of the connecting line, thereby realizing the single-layer wiring connection of the node chip group in the target area. The single-layer wiring connection is to perform wiring connection on a single layer of the printed circuit board to provide connection of a plurality of node chips, so that crossing of wiring is avoided.

According to the method and the device, different modes of the chip and the position attribute of the target area where the node chip is located are set, and part of pins of the chip are subjected to function multiplexing, so that the plurality of chips can be connected by wiring on a single surface of a PCT board.

Fig. 2 is a schematic diagram of a chip structure according to a preferred embodiment of the present invention. The present application takes a dedicated data processing chip as an example, and illustrates a method for configuring a chip connection manner according to an embodiment of the present invention. The data processing chip in the application can execute deep learning of a neural network, special operation chips such as Hash operation and the like, and mainly comprises an interface unit, namely an I/O interface, an operation unit and the like. The special data processing chip of the application can also internally comprise other devices such as a processor, a memory, an FPGA and the like. In the application, the pins of the same chip have different functions according to different modes, and function multiplexing of at least one pin can be realized.

The chip pins and the function of the pins in fig. 2 are explained as follows:

the IO11 supplies power for the left input/output I/O interface;

the IO12 supplies power for the right input/output I/O interface;

an IO13 test pin, wherein when the voltage of the pin is 0, the chip is in a normal working mode, and when the voltage of the pin is 1, the chip is in a test mode;

the voltage input end of the IO14 chip phase-locked loop;

the IO16 chip phase-locked loop voltage ground terminal;

an IO15 IO17 chip internal working state checking pin, through which parameters such as chip internal temperature can be checked;

an IO18 (MODE MODE) chip working MODE setting pin, when 0, the chip is in IO18l 0 (MODE 0); 1, at IO18l 1 (mode 1);

in the application, the functions of the pins at the same position in the chip are different when the data processing chip is in different working modes;

the functions of the IO119 and the IO121, the IO120 and the IO126, the IO123 and the IO127, and the IO129 and the IO131 are the same.

Fig. 3 is a schematic diagram of a functional multiplexing structure of a chip pin in different operating modes according to a preferred embodiment of the invention. For example, the first pin in column 1, in the mode 0 operating mode, clocks the input cell function for IO 115; in mode 1 mode of operation, the unit is busy for IO 132. The second pin in column 1, in the mode 0 mode of operation, operates the data output unit function for IO 117; in the mode 1 operation mode, the signal output unit is reset for the IO 130. In the application, the functions of the pins of the chip are different in different working modes. This application has realized carrying out the single face wiring in order to carry out the connection of a plurality of chips on the PCB board through multiplexing the function of managing, has simplified the multilayer structure's of PCB board wiring mode.

Fig. 4 is a schematic diagram of a plurality of chip pin connections according to a preferred embodiment of the present invention. As shown in fig. 4, when the IO112 is in the 0 operating mode and the AAR0 is in the 0 operating mode, the IO120 assisted operation data output unit is electrically connected to the input/output I/O interface; the IO121 auxiliary command input unit and the IO123 reset signal input unit are connected with the input/output I/O interface in a power supply mode; the IO131 auxiliary busy information input unit is connected with the input/output I/O interface grounding unit; the IO120 operation data output unit, the IO119 command input unit, the IO129 busy information input unit and the IO127 reset signal input unit are connected with the corresponding signal function units.

When the IO112 is in the 1 operating mode and the AAR0 is in the 1 operating mode, the IO120 auxiliary operation data output unit is connected with the corresponding signal functional unit; the IO121 auxiliary command input unit, the IO127IO123 reset signal input unit and the IO131 auxiliary busy information input unit are connected with the corresponding signal function units; the IO120 operation data output unit, the IO119 command input unit and the IO127 reset signal input unit are connected with the input/output I/O interface power supply functional unit; the IO129 busy information input unit is connected to the IOVSS functional unit.

Fig. 5 and 6 are schematic diagrams of connection relations when a plurality of chip pin functions are multiplexed according to a preferred embodiment of the invention. As shown in fig. 5, chips 1, 2 and 3 operate in mode 0, chips 4, 5 and 6 operate in mode 1, and chips 7, 8 and 9 operate in mode 0. An external clock signal is input to the chip 1 through the chip 1IO115 clock input unit pin, and the IO118 time output unit pin of the chip 1 transmits the clock signal to the IO115 clock input unit pin of the chip 2. An external command signal is input to the chip 1 through the IO121 auxiliary command input cell pin of the chip 1, and the IO128 command output cell pin of the chip 1 transmits a command signal to the IO121 auxiliary command input cell pin of the chip 2. An external reset signal is input to the chip 1 through the chip 1IO123 reset signal input unit pin, and the IO130 reset signal output unit pin of the chip 1 transmits a command signal to the chip 2 IO123 reset signal input unit pin. The IO132 busy signal output unit pin of the chip 1 outputs a busy signal to the IO131 auxiliary busy information input unit pin of the chip 2. The chip 2 receives the calculation data returned by the IO117 operation data output unit pin of the chip 3 through the IO126 auxiliary operation data output unit pin, the chip 2 sends the calculation data to the IO126 auxiliary operation data output unit pin of the chip 1 through the IO117 operation data output unit pin, and the chip 1 returns the calculation data through the IO117 operation data output unit pin. Since the chip 4 is located below the chip 3 and the operation mode thereof is 1, the circuits between the pins do not intersect, and therefore the wiring of the plurality of chips can be on one side of the PCB board, reducing the complexity of PCB board design and generation.

Fig. 7 is a system configuration diagram for configuring a chip connection manner according to a preferred embodiment of the present invention. As shown in fig. 7, a system for configuring a chip connection manner includes:

the acquiring unit 701 acquires a preset data processing standard associated with a target device, and determines a node chip set composed of a plurality of node chips required to satisfy the data processing standard, wherein each of the plurality of node chips is capable of operating in any of a plurality of operating modes. Preferably, the data processing criteria include: data computation speed, data processing throughput, and task processing time. Preferably, the device further comprises a setting unit, configured to preset the data processing standard associated with the target device according to the application scenario of the target device. Preferably, when each node chip operates according to a different one of the plurality of operating modes, at least one of the plurality of pins of each node chip is functionally multiplexed. Preferably, at least one of the plurality of pins of each node chip has a different function in different modes of operation.

In this application, a preset data processing standard associated with a target device needs to be obtained, where the data processing standard includes: data computation speed, data processing throughput, and task processing time. Due to the difference of data processing standards, the node chip set which is formed by a plurality of node chips and corresponds to configuration is determined so as to meet preset data processing standards, wherein each node chip in the plurality of node chips can work according to any working mode in a plurality of working modes, and when each node chip works according to different working modes in the plurality of working modes, at least one pin in the plurality of pins of each node chip is subjected to function multiplexing, and at least one pin in the plurality of pins of each node chip has different functions in different working modes. For example, a pin of a test function unit, when the voltage of the pin is 0, the chip is in a normal working mode; when the voltage of the pin is 1, the chip is in a test working mode. According to the method and the device, the working modes of the chips in the chip set are selected, so that the intersection of circuit design among pins is avoided, and the chip set in the target area is arranged on the PCB in a single layer.

A dividing unit 702, configured to divide the layout area according to the functional structure of the target device to determine a target area for accommodating the node chipset. Preferably, the functional structure of the target device comprises: power supply functions, input/output functions, clock control functions, and data processing functions. In the present application, the layout area of the PCB board is divided according to the functional structure of the target device, such as according to the power supply function, the input/output function, the clock control function, and the data processing function of the target device, and the target area for accommodating the node chipset is determined.

The processing unit 703 determines a working mode of each of the plurality of node chips in the node chipset according to the area attribute of the target area, and determines a connection relationship of the plurality of node chips according to the position attribute of the target area and the working mode of each node chip. Preferably, the region attribute of the target region includes a region shape and a region size. Preferably, the processing unit determines an arrangement order of the plurality of node chips in the node chip set according to a region shape and a region size of the target region, and determines an operation mode of each node chip according to the arrangement order. In the present application, the area attribute of the target area in the PCB includes an area shape and an area size, for example, the area shape may be T-shaped, L-shaped, and the like, and the size of each area. Determining the working mode of each node chip in a plurality of node chips in the node chip group according to the region attribute of the target region, and determining the connection relation of the plurality of node chips according to the position attribute of the target region and the working mode of each node chip. In the present application, the position attribute of the target area is positioning of the target area. In the application, the arrangement sequence of a plurality of node chips in a node chip set is determined according to the region shape and the region size of a target region, and the working mode of each node chip is determined according to the arrangement sequence.

Preferably, the location attribute of the target area is a location adjacency with the functional structure of the target device. Preferably, the positional adjacency includes: an adjacency to one or more of power supply functions, input/output functions, clock control functions, and data processing functions. In the present application, the position attribute of the target area is an adjacent relationship with one or more of the power supply function, the input/output function, the clock control function, and the data processing function, for example, the target area is at the upper left of the power supply function, at the lower right of the input/output function, and the like.

And the wiring unit 704 determines the wiring mode of the connecting line in the target area according to the connection relation of the plurality of node chips, and determines the position of each node chip in the plurality of node chips in the target area according to the wiring mode of the connecting line, so that the single-layer wiring connection of the node chipset is realized in the target area. Preferably, the processing unit determines the connection relations of the plurality of node chips according to the position adjacency relation of the target area and the functional structure of the target device and the working mode of each node chip, wherein the connection relations comprise pin connection modes between the node chips. In the application, the connection relations of the plurality of node chips are determined according to the position adjacency relation of the target area and the functional structure of the target device and the working mode of each node chip, wherein the connection relations comprise pin connection modes among the node chips, and the wiring mode of the connection lines in the target area is determined according to the connection relations of the plurality of node chips.

Preferably, the plurality of node chips are connected in a serial manner. Preferably, the single-layer wiring connection is a wiring connection at a single layer of the printed circuit board to provide connection of a plurality of node chips. Preferably, the node chipset receives the data processing task through an external interface of a head-of-line node chip of the plurality of node chips, and performs calculation processing on the data processing task through the plurality of node chips of the node chipset. Preferably, the calculation result of the data processing task obtained through the calculation processing is returned through an external interface of the head-of-line node chip. In the application, the plurality of node chips are connected in a serial manner, the node chipset receives the data processing task through an external interface of a head-of-line node chip in the plurality of node chips, and the data processing task is calculated and processed through the plurality of node chips in the node chipset. And determining the position of each node chip in the plurality of node chips in the target area according to the wiring mode of the connecting line, thereby realizing the single-layer wiring connection of the node chip group in the target area. The single-layer wiring connection is to perform wiring connection on a single layer of the printed circuit board to provide connection of a plurality of node chips, so that crossing of wiring is avoided.

The invention has been described with reference to a few embodiments. However, other embodiments of the invention than the one disclosed above are equally possible within the scope of the invention, as would be apparent to a person skilled in the art from the appended patent claims.

Generally, all terms used in the claims are to be interpreted according to their ordinary meaning in the technical field, unless explicitly defined otherwise herein. All references to "a/an/the [ device, component, etc ]" are to be interpreted openly as referring to at least one instance of said device, component, etc., unless explicitly stated otherwise. The steps of any method disclosed herein do not have to be performed in the exact order disclosed, unless explicitly stated.