阅读说明：本技术 一种制作挠性板盲槽结构的工艺 (Process for manufacturing flexible plate blind groove structure ) 是由 李旋 吴传亮 熊俊杰 关志锋 于 2019-08-12 设计创作，主要内容包括：本发明公开了一种制作挠性板盲槽结构的工艺,所述挠性板包括内层芯板和外层芯板,所述内层芯板的上表面设有内层线路,所述外层芯板上表面设有外层线路；所述外层芯板上方还设有盲槽盖板,所述盲槽盖板可拆卸地安装于所述外层芯板上方；所述工艺包括以下步骤：从正反两面分别通过激光控深铣穿盲槽盖板：压合前沿盲槽位置激光反面控深铣盖板,压合后沿盲槽位置激光正面控深铣盖板；揭盖后即得带有盲槽结构的挠性板；其中,反面控深深度为所述盲槽盖板厚度的3/5～4/5之间；正面加工过程中,激光的能量为能够铣穿盲槽盖板的能量。本发明方案填补了挠性板盲槽加工工艺的空白,对盲槽挠性板加工具有指导作用。(The invention discloses a process for manufacturing a flexible plate blind slot structure, wherein the flexible plate comprises an inner core plate and an outer core plate, an inner layer circuit is arranged on the upper surface of the inner core plate, and an outer layer circuit is arranged on the upper surface of the outer core plate; a blind groove cover plate is also arranged above the outer core plate and is detachably arranged above the outer core plate; the process comprises the following steps: the blind slot cover plate is deeply milled through laser control from the front surface and the back surface respectively: pressing a front blind groove position laser back side depth control milling cover plate, and pressing a back blind groove position laser front side depth control milling cover plate; the flexible plate with the blind groove structure is obtained after the cover is uncovered; wherein the depth control depth of the back surface is 3/5-4/5 of the thickness of the blind groove cover plate; in the front processing process, the energy of the laser is the energy capable of milling through the blind slot cover plate. The scheme of the invention fills the blank of the blind groove processing technology of the flexible plate and has a guiding function on the processing of the blind groove flexible plate.)

1. A process for manufacturing a flexible plate blind groove structure is characterized by comprising the following steps: the flexible board comprises an inner core board and an outer core board, wherein an inner circuit is arranged on the upper surface of the inner core board, and an outer circuit is arranged on the upper surface of the outer core board; a blind groove cover plate is also arranged above the outer core plate and is detachably arranged above the outer core plate;

the process comprises the following steps: the blind slot cover plate is deeply milled through laser control from the front surface and the back surface respectively: pressing a front blind groove position laser back side depth control milling cover plate, and pressing a back blind groove position laser front side depth control milling cover plate; the flexible plate with the blind groove structure is obtained after the cover is uncovered; wherein the depth control depth of the back surface is 3/5-4/5 of the thickness of the blind groove cover plate; in the front processing process, the energy of the laser is the energy capable of milling through the blind slot cover plate.

2. The process for making a blind groove structure in a flexible sheet according to claim 1, wherein: the process also comprises repeating the operation of penetrating the blind groove cover plate on the front surface and the back surface respectively through laser control deep milling at least twice.

3. The process for making a blind groove structure in a flexible sheet according to claim 2, wherein: the number of the milling-through operations is odd and not less than three, wherein the laser path at the middle position is manufactured along the shape of the blind slot to be processed.

4. The process for making a blind groove structure in a flexible sheet according to claim 1, wherein: and a gap is reserved between two adjacent laser paths on the same surface of the blind groove cover plate.

5. The process for making a blind groove structure in a flexible sheet according to claim 4, wherein: the gap is twice the width of the laser path.

6. The process for making a blind groove structure in a flexible sheet according to claim 5, wherein: when the laser paths of the front side and the back side of the blind groove cover plate are both 1mil, the gap is 2 mils.

7. The process for making a blind groove structure in a flexible sheet according to claim 1, wherein: and the alignment error between the adjacent laser paths of the front surface and the back surface of the blind slot cover plate is not more than 3 mil.

8. The process for making a blind groove structure in a flexible sheet according to claim 7, wherein: the alignment error is not greater than 2 mil.

9. Process for making a blind groove structure in flexible sheets according to any one of claims 1 to 8, characterized in that: the process also comprises the step of respectively carrying out surface treatment on the outer layer circuit and the inner layer circuit.

10. Process for making a blind groove structure in flexible sheets according to any one of claims 1 to 8, characterized in that: the size of the blind groove is 1 mil.

Technical Field

The invention relates to the technical field of processing and manufacturing of circuit boards, in particular to a process for manufacturing a flexible plate blind groove structure.

Background

The Flexible Board is a short name for a Flexible Printed Circuit Board (FPC), and may also be referred to as a Flexible Printed Circuit Board or a Flexible Printed Circuit Board. According to the definition of the international electronic industry connection Institute (IPC), the flexible printed circuit is a product which is designed and manufactured by printing a circuit pattern on a flexible substrate, has the characteristics of small product volume and light weight, greatly reduces the volume of the device, is suitable for the development of electronic products towards the directions of high density, miniaturization, light weight, thinness and high reliability, and can be freely bent to achieve the aim of assembly and lead connection integration.

Recently, with the development of a flexible plate, a flexible plate with a blind groove structure is developed, the flexible plate is designed to be in the blind groove structure, circuits are arranged inside and outside the blind groove, meanwhile, the surface treatment of the circuits inside and outside the blind groove is different or the same surface treatment has different requirements, and the prior art does not have a precedent for manufacturing the flexible blind groove plate in the industry. The processing requirements of the flexible board are similar to that of one of the blind grooves of the rigid board in the industry, except that the base material is different, the base material of the rigid board is usually a glass cloth + resin system, and the base material of the flexible board is usually a PI + pure glue system.

The process for manufacturing the rigid plate blind slot generally comprises the following 3 steps: 1) manufacturing an inner-layer core board (copper-clad core board), wherein the inner-layer core board 1 is composed of a base material and inner-layer circuits 2, the inner-layer circuits 2 are manufactured firstly, and then surface treatment (such as soft gold plating) is carried out on corresponding positions of the inner layer; 2) the inner core board and the outer core board 3 are pressed, the bonding sheet 4 at the blind groove position (which plays a role of bonding and curing when different core boards are pressed, when the temperature is over the glass transition temperature during pressing, resin can be converted into a flowable colloidal substance to fill the circuit gaps between different core boards) is milled to be empty, the milling empty position is filled with PI (polyimide) tape 5 (or silica gel) and the like to avoid pressure loss or prevent the bonding sheet 4 from overflowing to the circuit in the blind groove during pressing, the inner circuit 2 is protected by the outer core board 3 after pressing, the graph of the inner circuit 2 cannot be influenced when the surface treatment (such as hard gold plating) is carried out on the outer circuit 6 after pressing, and the structural principle is shown in figure 2; 3) depth control mechanical or laser milling (as shown in figure 3) is carried out on the contour lines along the contour 7 of the blind groove after surface treatment, the depth control cannot damage the graph of the inner layer line 2, the outer layer core plate 3 used for protecting the graph of the line in the blind groove is uncovered after the depth control milling is finished, the silica gel filler is taken out, the inner layer line 2 in the blind groove is finally exposed, and the manufacture of the blind groove structure is realized, as shown in figure 4. The top view of the rigid panel after uncovering is shown in fig. 5.

For the flexible blind slot plate, due to the nature of the flexible plate, if the blind slot cover plate is not milled completely when the blind slot is uncovered to expose the inner layer circuit 2, the blind slot cover plate is difficult to uncover or burr protrusion is formed on the edge of the blind slot after the blind slot cover plate is uncovered, and the welding and appearance of devices of downstream enterprises are affected. The manufacturing process of the rigid blind groove plate is directly applied to the processing of the flexible blind groove plate, and the obtained product is shown in fig. 6 and 7, wherein fig. 6 is a top appearance view of the blind groove; fig. 7 is a side view of the slice. It is obvious from the figure that the processing of the flexible plate by directly using the process can cause burr protrusion at the edge of the blind groove, thereby indicating that the flexible blind groove plate can not be directly processed by the rigid blind groove plate, and the improvement is carried out according to the characteristics of the flexible plate.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the process can be specially used for processing the blind slot structure of the flexible plate, and fills the blank of the flexible plate in the field of processing the blind slot structure in the prior art.

In order to solve the technical problems, the invention adopts the technical scheme that: a process for manufacturing a flexible plate blind slot structure comprises the steps that the flexible plate comprises an inner core plate and an outer core plate, wherein an inner circuit is arranged on the upper surface of the inner core plate, and an outer circuit is arranged on the upper surface of the outer core plate; a blind groove cover plate is also arranged above the outer core plate and is detachably arranged above the outer core plate;

the process comprises the following steps: the blind slot cover plate is deeply milled through laser control from the front surface and the back surface respectively: pressing a front blind groove position laser back side depth control milling cover plate, and pressing a back blind groove position laser front side depth control milling cover plate; the flexible plate with the blind groove structure is obtained after the cover is uncovered; wherein the depth control depth of the back surface is 3/5-4/5 of the thickness of the blind groove cover plate; in the front processing process, the energy of the laser is the energy capable of milling through the blind slot cover plate.

Further, the process also comprises repeating the operation of deeply milling the front surface and the back surface through laser control through the blind slot cover plate at least twice.

Preferably, the number of the milling-through operations is odd and not less than three, wherein the laser path at the middle position is manufactured along the shape of the blind slot to be processed.

Furthermore, a gap is reserved between two adjacent laser paths on the same surface of the blind groove cover plate.

Further, the gap is twice the laser path width.

Further, when the laser paths of the front side and the back side of the blind slot cover plate are both 1mil, the gap is 2 mils.

Furthermore, the alignment error between the adjacent laser paths of the front side and the back side of the blind slot cover plate is not more than 3 mil; preferably, the alignment error is no greater than 2 mils.

Further, the process also comprises the step of respectively carrying out surface treatment on the outer layer circuit and the inner layer circuit.

Preferably, the surface treatment of the outer layer circuit is hard gold plating.

Preferably, the surface treatment of the inner layer circuit is soft gold plating.

Further, the size of the blind groove is 1 mil.

The invention has the beneficial effects that: the scheme of the invention firstly provides a process for processing the blind slot of the flexible plate, fills the blank of the processing process of the blind slot of the flexible plate in the prior art, and has a guiding function on the processing of the blind slot flexible plate; the technical scheme of the invention has simple operation flow and low production cost, is suitable for processing various flexible plate blind groove structures, successfully cuts the blind groove cover plate off by a laser cutting process from the front and back surfaces, and avoids burr protrusion when the cover is uncovered.

Drawings

FIG. 1 is a schematic structural view of a rigid core board in the prior art;

FIG. 2 is a schematic diagram of a prior art rigid plate;

FIG. 3 is a schematic structural view of a rigid plate with blind grooves during a prior art machining process;

FIG. 4 is a side view of a prior art rigid plate with blind grooves formed therein after uncovering;

FIG. 5 is a top view of a prior art rigid plate with blind grooves formed therein after uncovering;

FIG. 6 is a top view of a flexible plate manufactured according to the blind groove rigid plate manufacturing process;

FIG. 7 is a cut-away side view of a flexible plate machined according to the blind groove rigid plate machining process;

FIG. 8 is a schematic structural diagram of forward and backward laser paths on a blind via cover plate in embodiments 1-2 of the present invention;

FIG. 9 is a front view of a flexible sheet with a blind groove structure manufactured according to example 1 of the present invention;

FIG. 10 is a rear view of a flexible sheet with a blind groove structure according to example 1 of the present invention.

Description of reference numerals:

1. an inner core board; 2. an inner layer circuit; 3. an outer core board; 4. a bonding sheet; 5. PI adhesive tapes; 6. an outer layer circuit; 7. a blind slot to be processed; 8. a front side laser path; 9. a reverse laser path.

Detailed Description

In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

The first embodiment of the invention is as follows: a process for manufacturing a blind slot structure of a flexible plate has no signal requirement on a circuit pattern in a blind slot, the flexible plate comprises an inner core plate 1 and an outer core plate 3, an inner circuit 2 is arranged on the upper surface of the inner core plate 1, and an outer circuit 6 is arranged on the upper surface of the outer core plate 3; a blind groove cover plate is also arranged above the outer core plate 3 and is detachably arranged above the outer core plate 3; the process comprises the following steps:

s1, deeply milling blind slot cover plates through laser control in the forward and backward directions: pressing a front blind groove position laser back side depth control milling cover plate, and pressing a back blind groove position laser front side depth control milling cover plate; the depth of the reverse side controlled depth is 3/5 of the thickness of the blind groove cover plate; in the front processing process, the energy of the laser is the energy which can just mill through the blind slot cover plate.

And S2, repeating the above operations twice, wherein gaps are respectively reserved between two adjacent laser paths (with the size of 1mil) on the front surface and the back surface of the blind groove cover plate (the interval between two adjacent front laser paths 8 and two adjacent back laser paths 9 is 2 mils), as shown in FIG. 8, the laser path in the middle position is manufactured along the appearance of the blind groove 7 to be processed, and the flexible plate with the blind groove structure is obtained after uncovering (as shown in FIGS. 9 and 10).

When the width of the laser path is 1mil, the interval between the laser paths is also 2 mils, and if the alignment error is also 2 mils, the influence of the laser alignment error can be eliminated; when the alignment error of the laser is within 2mil, if the alignment error is 1mil, the laser paths of the positive and negative laser are tangent and do not coincide exactly; if the alignment error is 0, the positive and negative laser paths are overlapped; when the alignment error is within 3mil, the uncovering is not affected.

The second embodiment of the invention is as follows: a process for manufacturing a blind slot structure of a flexible plate has no signal requirement on a circuit pattern in a blind slot, the flexible plate comprises an inner core plate 1 and an outer core plate 3, an inner circuit 2 is arranged on the upper surface of the inner core plate 1, and an outer circuit 6 is arranged on the upper surface of the outer core plate 3; a blind groove cover plate is also arranged above the outer core plate 3 and is detachably arranged above the outer core plate 3; the process comprises the following steps:

s1, deeply milling blind slot cover plates through laser control in the forward and backward directions: pressing a front blind groove position laser back side depth control milling cover plate, and pressing a back blind groove position laser front side depth control milling cover plate; the depth of the reverse side controlled depth is 4/5 of the thickness of the blind groove cover plate; in the front processing process, the energy of the laser is the energy which can just mill through the blind slot cover plate.

And S2, repeating the above operation twice, wherein gaps are respectively reserved between two adjacent laser paths (the size is 1mil) on the front surface and the back surface of the blind groove cover plate (the interval between two adjacent front laser paths 8 and two adjacent back laser paths 9 is 2mil), as shown in FIG. 8, the laser path in the middle position is manufactured along the appearance of the blind groove 7 to be processed, and the flexible plate with the blind groove structure is obtained after uncovering.

When the width of the laser path is 1mil, the interval between the laser paths is also 2 mils, and if the alignment error is also 2 mils, the influence of the laser alignment error can be eliminated; when the alignment error of the laser is within 2mil, if the alignment error is 1mil, the laser paths of the positive and negative laser are tangent and do not coincide exactly; if the alignment error is 0, the positive and negative laser paths are overlapped; when the alignment error is within 3mil, the uncovering is not affected.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.